JP7447551B2 - busbar module - Google Patents

Description

The present invention relates to a busbar module that is used as a wiring member for batteries or automobiles and is equipped with a temperature sensor.

2. Description of the Related Art Bus bars used as wiring members for batteries and automobiles are known to have a temperature sensor attached thereto to detect the temperature of the bus bar.
Previously, a finished temperature sensor was attached to the busbar, but the temperature sensor was fixed using a resin coat that covered the entire busbar, which had the disadvantage of increasing heat capacity and reducing responsiveness. . Furthermore, since there were variations in the amount of resin fixed, there were variations in heat capacity and responsiveness.
Furthermore, when the temperature sensor is attached to the bus bar using a locking mechanism, the structure becomes complicated and costs increase, and if the locking mechanism comes off, the fixation becomes insufficient and measurement accuracy deteriorates. In addition, there was a problem in that contact was poor due to deviations in tolerance, and heat absorption from the bus bar was poor.
Therefore, a structure in which a temperature sensor storage case is attached to a bus bar has been proposed as a structure for attaching a temperature sensor without using a resin coat or a locking mechanism.

Conventionally, for example, in Patent Document 1, a storage case formed into an L-shape with the tip thereof bent downward is inserted into a temperature sensor insertion space of a busbar module attached to a part to be measured, and a thermistor is inserted into the storage case. describes a temperature sensor mounting structure in which a temperature detection wire with a lead wire and an electric wire is stored along the shape of a storage case, and the thermistor, lead wire, and part of the electric wire are covered with a metal heat collecting member. has been done.

Japanese Patent Application Publication No. 2018-151349

The above conventional techniques still have the following problems.
In other words, with the above conventional technology, heat absorption and heat transfer deteriorate due to poor contact between the storage case and the bus bar (due to tolerances, warping, sink marks, etc.) and poor installation of the storage case, resulting in a decrease in responsiveness. There was a problem in that the accuracy of temperature measurement also deteriorated.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a busbar module that has excellent responsiveness and can measure the temperature of a busbar with high accuracy.

The present invention employs the following configuration to solve the above problems. That is, a busbar module according to a first aspect of the present invention includes a busbar, a resin case part molded from resin on a part of the busbar, and a temperature sensor installed in the resin case part, and includes at least the resin case part. The temperature sensor has an inner wall configured to have a storage space capable of housing the temperature sensor, and the temperature sensor includes an element body having a heat-sensitive element provided at a tip thereof, and a pair of lead wires connected to the heat-sensitive element. The element body is inserted into the storage space, and an insulating adhesive resin is filled between the element body and the resin case portion.

In this busbar module, a part of the busbar is equipped with a resin case part molded from resin, and has a storage space in which the inner wall is made up of at least the resin case part and can accommodate a temperature sensor, and the element body is inserted into the storage space. Since an insulating adhesive resin is filled between the element body and the resin case part, the element body is resin-sealed into the resin case part which is integrated with the bus bar by insert molding. It collects heat well and can provide high responsiveness.
In other words, the element body is embedded with adhesive resin in a resin case integrated with the bus bar, and is fixed and positioned to the bus bar that is the object to be measured, making it possible to obtain high temperature measurement accuracy and high-speed response. . Furthermore, by positioning the element body within the resin case portion, variations in responsiveness can be suppressed. Furthermore, since the resin case part is directly integrated with the bus bar by insert molding without separately preparing separate parts such as a storage case, the resin case part can be made as small as possible, reducing heat capacity and reducing costs. It becomes possible to achieve this goal. Note that since the adhesive resin is injected only into the gap between the element body and the storage space and is limited to a small amount, it is possible to suppress an increase in heat capacity and also to suppress variations in heat capacity and responsiveness. .

A busbar module according to a second invention is characterized in that, in the first invention, an inner wall of the storage space is constituted by the resin case portion and the busbar.
That is, in this busbar module, the inner wall of the storage space is composed of the resin case part and the busbar, so the metal surface formed by the busbar becomes part of the inner wall, and the resin case part of the heat receiving surface can be omitted. By shortening the distance to the element body, heat conduction to the element body becomes even better, and faster response can be achieved.

A busbar module according to a third invention is characterized in that, in the first or second invention, a part of the resin case part covers a part of the outer surface of the busbar.
In other words, in this busbar module, a part of the resin case part covers a part of the outer surface of the busbar, so the contact surface between the resin case part and the busbar increases, and more of the contact area from the busbar to the resin case part increases. Heat collection becomes possible.

In the busbar module according to a fourth aspect of the invention, in any one of the first to third aspects, the busbar has a first extension part and a second extension part extending parallel to the first extension part. and a connecting portion that connects the tip of the first extending portion and the tip of the second extending portion, and the first extending portion, the connecting portion, and the first extending portion are connected to each other. The storage space is characterized in that three of the inner walls of the storage space are constituted by the two extension parts.
That is, in this busbar module, since the first extension part, the connecting part, and the second extension part constitute three surfaces of the inner wall of the storage space, the metal surfaces formed by the busbar constitute three surfaces of the inner wall. By doing so, higher responsiveness and temperature measurement accuracy can be obtained.

A busbar module according to a fifth aspect of the present invention is a busbar module according to any one of the first to third inventions, in which the busbar has a first extending portion and a first extending portion. and a second extending part extending in a direction perpendicular to the first extending part from the distal end of the part, and the first extending part and the second extending part combine to form the second extending part. It is characterized in that two of the inner walls of the storage space are configured.
That is, in this bus bar module, since the first extension part and the second extension part constitute two surfaces of the inner wall of the storage space, the metal surfaces formed by the bus bar constitute two surfaces of the inner wall. Higher responsiveness and temperature measurement accuracy can be obtained.

A busbar module according to a sixth invention is characterized in that, in any one of the first to fifth inventions, all the inner walls of the storage space are constituted by the inner surface of the resin case part.
In other words, in this busbar module, all the inner walls of the storage space are made up of the inner surface of the resin case part, so the shape of the storage space can be arbitrarily set by molding the resin case part, and the storage space can be configured as desired. It becomes easy to form a storage space that corresponds to the size and shape of the element body, etc.

In the busbar module according to a seventh aspect of the invention, in any one of the first to sixth aspects, the temperature sensor includes a pair of electric wires connected to the pair of lead wires, and the temperature sensor includes a pair of electric wires connected to the lead wires from the element main body. It is characterized in that up to the connection part with the electric wire is inserted into the storage space.
In other words, in this busbar module, since the element body to the connection part between the lead wire and the electric wire is inserted into the storage space, the element body can be fixed more firmly and the entire lead wire can be placed inside the storage space. By embedding the sensor, even higher responsiveness and temperature measurement accuracy can be obtained.

According to the present invention, the following effects are achieved.
That is, according to the busbar module according to the present invention, a part of the busbar is provided with a resin case portion molded from resin, the inner wall is constituted by at least the resin case portion, and there is a storage space capable of accommodating a temperature sensor. The main body is inserted into the storage space, and insulating adhesive resin is filled between the element main body and the resin case part, so the element body is resin-sealed inside the resin case part that is integrated with the bus bar by insert molding. By stopping the heat from the busbar, heat can be collected from the busbar and high responsiveness can be obtained.
As described above, the busbar module of the present invention has high thermal responsiveness and little variation in thermal responsiveness, making it possible to measure the temperature of the busbar with high precision.

FIG. 1 is a perspective view showing a first embodiment of a busbar module according to the present invention. FIG. 3 is a sectional view showing a busbar module in the first embodiment. FIG. 3 is a perspective view showing a bus bar in the first embodiment. FIG. 3 is a right side view showing the busbar module before the temperature sensor is attached in the first embodiment. FIG. 2 is a perspective view showing a state in which a busbar module is attached to a motor in the first embodiment. It is a perspective view showing a 2nd embodiment of the busbar module concerning the present invention. FIG. 7 is a perspective view from the right side showing the busbar module before the temperature sensor is attached in the second embodiment. FIG. 3 is a perspective view showing a third embodiment of a busbar module according to the present invention. FIG. 7 is a perspective view from the right side showing the busbar module before the temperature sensor is attached in the third embodiment.

Hereinafter, a first embodiment of a busbar module according to the present invention will be described with reference to FIGS. 1 to 5. Note that in some of the drawings used in the following explanation, the scale is changed as necessary to make each part recognizable or easy to recognize.

As shown in FIGS. 1 to 5, the busbar module 1 of this embodiment includes a busbar 2, a resin case part 14 molded from resin into a part of the busbar 2, and a temperature-controlled part installed inside the resin case part 14. It is equipped with a sensor 3.
The busbar module 1 of this embodiment has a storage space S whose inner wall is constituted by at least the resin case portion 14 and can accommodate the temperature sensor 3.
Note that in FIG. 4, the resin case portion 14 is hatched for easier viewing. Hereinafter, hatching is applied to FIGS. 7 and 9 in the same manner.

As shown in FIG. 2, the temperature sensor 3 includes an element body 4 having a heat-sensitive element 4a provided at its tip, a pair of lead wires 5 connected to the heat-sensitive element 4a, and a pair of lead wires 5 connected to the element body 4. A pair of electric wires 6 are provided.
The element body 4 is inserted into the storage space S, and an insulating adhesive resin 7 is filled between the element body 4 and the resin case portion 14.

As shown in FIG. 4, the bus bar 2 includes a first extending portion 8, a second extending portion 9 extending parallel to the first extending portion 8, and a distal end portion of the first extending portion 8. The first extending part 8, the connecting part 10, and the second extending part 9 are connected to the inner wall of the storage space S. Of these, three sides are composed.

That is, the inner wall of the storage space S is constituted by the resin case portion 14 and the bus bar 2.
Three of the inner walls of the storage space S are constituted by the inner surfaces of the first extension part 8, the connecting part 10, and the second extension part 9, and two of the inner walls of the storage space S ( The upper and lower surfaces) are constituted by the inner surface of the resin case portion 14.

Further, a portion of the resin case portion 14 covers a portion of the outer surface of the bus bar 2.
That is, the resin case portion 14 includes a first protrusion 14a that covers the outer surface of the first extension portion 8, a second protrusion 14b that covers the outer surface of the second extension portion, and an outer surface of the connection portion 10. The third protrusion 14c covers the side surface.

Furthermore, a portion from the element body 4 to a connecting portion 5a between the lead wire 5 and the electric wire 6 is inserted into the storage space S.
The connecting portion 5a connects the lead wire 5 and the electric wire 6 by laser welding.

The bus bar 2 is provided with two protruding parts 8a on the sides of the first extending part 8 for attachment and connection to an on-vehicle battery, motor, or the like.
Further, the bus bar 2 is made of metal such as Cu.
The element body 4 includes a heat sensitive element 4a such as a chip thermistor, a sealing glass part 4b covering the heat sensitive element 4a with glass, and a resin coating part 4c covering the sealing glass part 4b with resin. There is.

The resin coated portion 4c is also formed to cover the pair of lead wires 5.
The electric wire 6 includes a wire core wire 6a and a wire sheathing portion 6b covering the wire core wire 6a.
As the adhesive resin 7, an insulating resin such as a silicone resin or an epoxy resin can be used, and a resin with good thermal conductivity is particularly preferable.

FIG. 5 shows a state in which the busbar module 1 of this embodiment is attached to a motor M.
In FIG. 5, the busbar module 1 is attached by welding the protrusion 8a to the side surface of the coil portion of the motor M.

As described above, in the busbar module 1 of this embodiment, the busbar 2 is provided with the resin case part 14 molded from resin, and has a storage space S in which the inner wall is constituted by at least the resin case part 14 and can accommodate the temperature sensor 3. , the element body 4 is inserted into the storage space S, and the insulating adhesive resin 7 is filled between the element body 4 and the resin case part 14, so that the resin is integrated with the bus bar 2 by insert molding. By resin-sealing the element body 4 within the case portion 14, heat can be collected from the bus bar 2 well and high responsiveness can be obtained.

That is, the element main body 4 is embedded with adhesive resin 7 in the resin case part 14 integrated with the bus bar 2, and is fixed and positioned to the bus bar 2, which is the object to be measured, thereby achieving high temperature measurement accuracy and high speed response. can be obtained. Further, by positioning the element body 4 within the resin case portion 14, variations in responsiveness can be suppressed.

Furthermore, since the resin case part 14 is directly integrated with the bus bar 2 by insert molding without separately preparing a separate member such as a storage case, the resin case part 14 can be set as small as possible, and the heat capacity and heat capacity can be reduced. It becomes possible to reduce costs. Note that since the adhesive resin 7 is injected only into the gap between the element body 4 and the storage space S and is limited to a small amount, it is possible to suppress an increase in heat capacity, and also suppress variations in heat capacity and responsiveness. be able to.

Furthermore, since the inner wall of the storage space S is composed of the resin case section 14 and the bus bar 2, the metal surface formed by the bus bar 2 becomes a part of the inner wall, and the resin case section 14, which is the heat receiving surface, can be omitted. By shortening the distance to the element body 4, heat conduction to the element body 4 is further improved, and faster response can be achieved.
Further, since a part of the resin case part 14 covers a part of the outer surface of the bus bar 2, the contact surface between the resin case part 14 and the bus bar 2 increases, and the contact area from the bus bar 2 to the resin case part 14 increases. heat collection becomes possible.

In addition, since the first extending portion 8, the connecting portion 10, and the second extending portion 9 constitute three surfaces of the inner wall of the storage space S, the metal surfaces formed by the bus bar 2 constitute three surfaces of the inner wall. By doing so, higher responsiveness and temperature measurement accuracy can be obtained.
Furthermore, since the part from the element body 4 to the connection part 5a between the lead wire 5 and the electric wire 6 is inserted into the storage space S, the element body 4 can be fixed more firmly, and the entire lead wire 5 can be inserted into the storage space S. By embedding the temperature inside the sensor, even higher responsiveness and temperature measurement accuracy can be obtained.

Next, second and third embodiments of the busbar module according to the present invention will be described below with reference to FIGS. 6 to 9. In addition, in the following description of each embodiment, the same reference numerals are attached to the same components described in the above embodiment, and the description thereof will be omitted.

The difference between the second embodiment and the first embodiment is that in the first embodiment, the bus bar 2 has a U-shape, whereas in the bus bar module 21 of the second embodiment, the bus bar 2 has a U-shape as shown in FIGS. 6 and 7. The bus bar 22 is L-shaped.
That is, the bus bar 22 of the second embodiment includes the first extending portion 20 and the second extending portion 29 extending from the base end of the first extending portion 20 in a direction perpendicular to the first extending portion 20. As shown in FIG. 7, the first extending portion 20 and the second extending portion 29 constitute two of the inner walls of the storage space S. As shown in FIG.
In the third embodiment, the distal end portion 20a of the first extending portion 20 is a protruding portion for attaching and connecting to an on-vehicle battery, motor, or the like.

In the second embodiment, as shown in FIG. 7, two surfaces of the inner wall of the storage space S are constituted by the first extension part 20, the second extension part 29, and each inner surface, and the storage space S Three surfaces (the upper and lower surfaces and the surface facing the first extension part 20) of the inner wall are constituted by the inner surface of the resin case part 24.
In this way, in the busbar module 21 of the second embodiment, two of the inner walls of the storage space S are configured by the first extension part 20 and the second extension part 29, so that the metal surface formed by the busbar 22 is By configuring two inner walls, higher responsiveness and temperature measurement accuracy can be obtained.

Next, the difference between the third embodiment and the first embodiment is that in the first embodiment, the first extending part 8, the connecting part 10, and the second extending part 9 form part of the inner wall of the storage space S. In contrast, in the bus bar module 31 of the second embodiment, as shown in FIGS. 8 and 9, all the inner walls of the storage space S are composed of the inner surface of the resin case part 34. The point is that there is.
In this way, in the bus bar module 31 of the third embodiment, all the inner walls of the storage space S are constituted by the inner surface of the resin case part 34, so the shape of the storage space S can be arbitrarily changed by molding the resin case part 34. This makes it easy to form a storage space S that corresponds to the size and shape of the element body 4 and the like to be stored.

Note that the technical scope of the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention.

For example, in each of the above embodiments, a chip thermistor is used as the heat-sensitive element, but a thin film thermistor, a pyroelectric element, or the like may also be used.
Further, in each of the above embodiments, the resin case portion is insert-molded into a U-shaped or L-shaped bus bar, but the resin case portion may be insert-molded into a bus bar having another shape. For example, the resin case portion may be insert molded into an I-shaped bus bar. In this case, one of the inner walls of the storage space of the resin case portion can be configured with a bus bar.

DESCRIPTION OF SYMBOLS 1, 21, 31...Busbar module, 2,22...Busbar, 3...Temperature sensor, 4...Element body, 4a...Thermosensitive element, 5...Lead wire, 5a...Connection part, 6...Electric wire, 7...Adhesive resin, 8, 20...First extension part, 9, 29...Second extension part, 10...Connection part, 14, 24, 34...Resin case part, S...Storage space

Claims (5)

bus bar and
a resin case part molded from resin on a part of the bus bar;
and a temperature sensor installed in the resin case part,
having a storage space in which an inner wall is configured by at least the resin case portion and can accommodate the temperature sensor;
The temperature sensor includes an element body having a heat-sensitive element provided at the tip;
a pair of lead wires connected to the heat-sensitive element,
The element body is inserted into the storage space, and an insulating adhesive resin is filled between the element body and the resin case part,
The bus bar includes a first extending portion;
a second extending portion extending parallel to the first extending portion;
It is U-shaped and includes a connecting portion that connects the distal end of the first extending portion and the distal end of the second extending portion,
The bus bar module, wherein the first extending portion, the connecting portion, and the second extending portion constitute three of the inner walls of the storage space. bus bar and
a resin case part molded from resin on a part of the bus bar;
and a temperature sensor installed in the resin case part,
having a storage space in which an inner wall is configured by at least the resin case portion and can accommodate the temperature sensor;
The temperature sensor includes an element body having a heat-sensitive element provided at the tip;
a pair of lead wires connected to the heat-sensitive element,
The element body is inserted into the storage space, and an insulating adhesive resin is filled between the element body and the resin case part,
The bus bar includes a first extending portion;
L-shaped, including a second extending portion extending from a tip end of the first extending portion in a direction perpendicular to the first extending portion;
A bus bar module, wherein two surfaces of the inner wall of the storage space are constituted by the first extension part and the second extension part. The busbar module according to claim 1 or 2 ,
A bus bar module characterized in that an inner wall of the storage space is constituted by the resin case portion and the bus bar. The busbar module according to any one of claims 1 to 3 ,
A bus bar module, wherein a part of the resin case part covers a part of an outer surface of the bus bar. The busbar module according to any one of claims 1 to 4 ,
The temperature sensor includes a pair of electric wires connected to the pair of lead wires,
A bus bar module characterized in that a portion from the element body to a connecting portion between the lead wire and the electric wire is inserted into the storage space.

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