JP7447303B2 - 熱可塑性-熱硬化性ハイブリッド樹脂、方法、およびその使用 - Google Patents
熱可塑性-熱硬化性ハイブリッド樹脂、方法、およびその使用 Download PDFInfo
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- JP7447303B2 JP7447303B2 JP2022557786A JP2022557786A JP7447303B2 JP 7447303 B2 JP7447303 B2 JP 7447303B2 JP 2022557786 A JP2022557786 A JP 2022557786A JP 2022557786 A JP2022557786 A JP 2022557786A JP 7447303 B2 JP7447303 B2 JP 7447303B2
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Description
熱硬化性物質および熱可塑性物質は、異なる分類のポリマーであり、熱の存在下でのそれらの挙動に基づいて互いに区別される。具体的には、ポリエチレン(PE)、ポリカーボネート(PC)およびポリエーテルエーテルケトン(PEEK)などの熱可塑性物質は、熱を加えると柔軟に、または成形可能になる(冷却すると固化する)一方、エポキシ、ベンゾオキサジンおよびビスマレイミドなどの熱硬化性物質は、硬化すると不可逆的に固まり、加熱しても溶融および再成形することができない。したがって、熱可塑性材料は、それらが流動し始める溶融温度(融点)を有する一方、熱硬化性製品は、一度硬化すると、それらの構造的な完全性を失うことなく、より高い温度に耐えることができる。
本要約は、詳細な説明において以下でさらに説明されるコンセプトを選抜したものを紹介するために提供される。本要約は、特許請求される主題の重要な、または本質的な特徴を特定することを意図するものではなく、特許請求される主題の範囲を限定する助けとして使用されることを意図するものでもない。
図1~3は、本開示の実施形態に記載のベンゾオキサジン-熱可塑性樹脂の形成のための反応スキームを示す。
本明細書に開示される実施形態は概して、ハイブリッド樹脂組成物に関し、具体的には、熱、紫外線照射、マイクロ波照射、水分などから選択される外部刺激によって活性化される架橋性基および/または硬化性基を有する熱可塑性樹脂組成物に関する。1つ以上の実施形態において、熱可塑性ポリマーが、ポリマー主鎖の少なくとも一部を形成してもよい。当該ポリマー主鎖は、1つのエンドキャップもしくは2つのエンドキャップ、または熱可塑性主鎖内に架橋性基を有するモノマー単位のうちいずれかとして、架橋性基を有してもよい。本開示のハイブリッド樹脂組成物は、熱硬化性物質および熱可塑性物質が単独では達成できない特性の組み合わせを提供することができる。例えば、ハイブリッド樹脂中の架橋性基は、高温での重合によって架橋構造を形成することができる;しかしながら、そのような架橋以前には、ハイブリッド樹脂組成物の特性は熱可塑性成分を大きく反映することができる(そして、溶融/成形および再溶融/再成形することができる)。有利には、1つ以上の実施形態において、ハイブリッド樹脂組成物を成形するための溶融加工温度は、熱可塑性物質単独の溶融加工温度よりも低いことがあり、熱硬化性物質の硬化温度よりもまた低いことがあることが見出された。したがって、ハイブリッド樹脂組成物は、その温度点では熱硬化性単位の架橋が誘発され得る高い架橋温度に達する前に、または外部刺激によって活性化される前に成形することができる温度範囲を有することがある。さらに、熱可塑性主鎖を含むことによって、架橋された物品は、熱可塑性物質と熱硬化性物質との間の1つ以上の特性であって、いずれか単独では達成できない特性を有することができるようになる。例えば、熱可塑性物質は、所定の熱可塑性物質に関する溶融加工温度を超える温度に曝されると、従来通りに軟化または再溶融し、そのようなポリマーを高温用途の物品には不適当なものにする。一方、ハイブリッド熱可塑性-熱硬化性樹脂は、物品を形成するときに架橋され得るため、熱可塑性物質に対して通常起こり得る軟化または再溶融を防止する。
Claims (16)
- ハイブリッド熱可塑性-熱硬化性樹脂組成物であって:
ポリイミド、ポリエーテルイミド、ポリアリールエーテルケトン、ポリフェニレンスルフィド、ポリスルホン、ポリアミド-イミド、およびそれらの組み合わせからなる群から選択される熱可塑性単位から形成されたポリマー主鎖と、
前記熱可塑性単位に結合した少なくとも1つの架橋性ベンゾオキサジン基と、を含み、
前記少なくとも1つの架橋性ベンゾオキサジン基は、前記熱可塑性単位上に少なくとも1つのエンドキャップを形成し、
前記少なくとも1つの架橋性ベンゾオキサジン基は、前記ポリマー主鎖と前記少なくとも1つの架橋性ベンゾオキサジン基との構造が下記構造のうち1つに対応するように、前記熱可塑性単位上に少なくとも1つのエンドキャップを形成し、
Rは独立して、水素原子、炭化水素基、置換炭化水素基、または官能基から選択され、PEIはポリエーテルイミドである、
樹脂組成物。 - 前記ポリマー主鎖と前記少なくとも1つの架橋性ベンゾオキサジン基との構造が下記構造のうち1つに対応するように、熱可塑性単位を互いに架橋する前記少なくとも1つの架橋性ベンゾオキサジン基をさらに含み、
Rは、炭化水素基または置換炭化水素基であり、PEIはポリエーテルイミドである、
請求項1に記載の樹脂組成物。 - 前記樹脂組成物は、500~400,000の分子量を有する、
請求項1に記載の樹脂組成物。 - 前記熱可塑性単位の分子量は、500~20,000である、
請求項1に記載の樹脂組成物。 - 熱可塑性単位それぞれの分子量は、500~20,000である、
請求項2に記載の樹脂組成物。 - UV硬化性またはマイクロ波硬化性官能基をさらに含む、
請求項1に記載の樹脂組成物。 - 前記少なくとも1つの架橋性ベンゾオキサジン基は、UV硬化性またはマイクロ波硬化性官能基である、
請求項1に記載の樹脂組成物。 - 前記UV硬化性またはマイクロ波硬化性基は、前記少なくとも1つの架橋性ベンゾオキサジン基と反応する、
請求項6に記載の樹脂組成物。 - ハイブリッド熱可塑性-熱硬化性樹脂組成物を形成する方法であって:
熱可塑性物質を反応させて架橋性ベンゾオキサジン基を導入し、前記熱可塑性-熱硬化性樹脂組成物を形成する工程を含み、
前記架橋性ベンゾオキサジン基は、熱可塑性単位と結合し、
前記架橋性ベンゾオキサジン基は、前記熱可塑性単位上に少なくとも1つのエンドキャップを形成し、
前記架橋性ベンゾオキサジン基は、ポリマー主鎖と前記架橋性ベンゾオキサジン基との構造が下記構造のうち1つに対応するように、前記熱可塑性単位上に少なくとも1つのエンドキャップを形成し、
Rは独立して、水素原子、炭化水素基、置換炭化水素基、または官能基から選択され、PEIはポリエーテルイミドである、
方法。 - 前記熱可塑性物質は、アミンまたはフェノール末端官能基を含み、ホルムアルデヒド、および前記熱可塑性物質と比較してアミンまたはフェノール反応物質のうちもう一方と反応する、
請求項9に記載の方法。 - 前記アミンまたはフェノール反応物質は、単官能性である、
請求項10に記載の方法。 - 前記アミンまたはフェノール反応物質は、二官能性である、
請求項10に記載の方法。 - UV硬化性またはマイクロ波硬化性官能基を含むように、前記熱可塑性物質を改質する工程をさらに含む、
請求項10に記載の方法。 - 硬化ハイブリッド熱可塑性-熱硬化性樹脂を形成する方法であって:
請求項1に記載のハイブリッド熱可塑性-熱硬化性樹脂組成物を準備する工程;および、
外部刺激によって前記ハイブリッド熱可塑性-熱硬化性樹脂組成物を硬化させ、前記硬化ハイブリッド熱可塑性-熱硬化性樹脂を形成する工程、を含む、
方法。 - 前記外部刺激は、熱、紫外線照射、マイクロ波照射および水分からなる群から選択される、
請求項14に記載の方法。 - 前記ハイブリッド熱可塑性-熱硬化性樹脂組成物は、UV硬化性またはマイクロ波硬化性官能基をさらに含み、前記外部刺激は、紫外線照射またはマイクロ波照射を含む、
請求項15に記載の方法。
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