JP7445138B2 - ウェーハストッカ - Google Patents
ウェーハストッカ Download PDFInfo
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- JP7445138B2 JP7445138B2 JP2020557711A JP2020557711A JP7445138B2 JP 7445138 B2 JP7445138 B2 JP 7445138B2 JP 2020557711 A JP2020557711 A JP 2020557711A JP 2020557711 A JP2020557711 A JP 2020557711A JP 7445138 B2 JP7445138 B2 JP 7445138B2
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- 235000012431 wafers Nutrition 0.000 claims description 418
- 238000012546 transfer Methods 0.000 claims description 138
- 238000004891 communication Methods 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 59
- 238000000034 method Methods 0.000 description 46
- 230000008569 process Effects 0.000 description 46
- 238000010926 purge Methods 0.000 description 24
- 239000011261 inert gas Substances 0.000 description 21
- 230000007246 mechanism Effects 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 238000012545 processing Methods 0.000 description 12
- 239000000428 dust Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 9
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 239000011295 pitch Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000003032 molecular docking Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0485—Check-in, check-out devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/02—Ducting arrangements
- F24F13/06—Outlets for directing or distributing air into rooms or spaces, e.g. ceiling air diffuser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
Description
2 ローディング装置
3 ウェーハカセット棚
4 ウェーハ搬送ロボット
4S ウェーハ搬送室(ウェーハ搬送空間)
5 ウェーハカセット移載装置
5S ウェーハカセット搬送室(ウェーハカセット搬送空間)
8 ファンフィルタユニット
10 FOUP(搬送容器)
X ウェーハストッカ
Claims (3)
- 筐体と、
前記筐体の前面に設けられた、複数のウェーハを収容可能な搬送容器が載置されるローディング装置と、
前記筐体内に配置された、前記複数のウェーハを多段式に収納可能な複数のウェーハカセットを多段式に格納可能なウェーハカセット棚と、
前記ローディング装置に載置され且つ前記筐体の外側に配置された前記搬送容器の内部空間と、前記筐体の内部空間とが連通した状態で、前記搬送容器と前記ウェーハカセット棚に格納されたウェーハカセットとの間でウェーハを出し入れするウェーハ搬送ロボットと、
前記ウェーハカセット棚の前記複数の段のうち所定の段に格納された前記ウェーハカセットを少なくとも前記所定の段とは異なる高さの段に移動させるウェーハカセット移載装置と、
前記筐体内の、前記ウェーハ搬送ロボットが配置されたウェーハ搬送空間及び前記ウェーハカセット移載装置が配置されたウェーハカセット搬送空間に層流を発生させるファンフィルタユニットと、を備えることを特徴とするウェーハストッカ。 - 前記ウェーハ搬送ロボットは、
前記ローディング装置に載置された前記搬送容器と、前記ウェーハカセット棚の前記複数の段のうち前記搬送容器と前後方向において向かい合う高さの段に配置された前記ウェーハカセットと、の間でウェーハを受け渡しすることを特徴とする請求項1に記載のウェーハストッカ。 - 前記筐体内に、前記ウェーハ搬送空間及び前記ウェーハカセット搬送空間を含む、気体を循環させるための循環経路が形成され、
前記循環経路は、前記気体の流れる方向において前記ウェーハ搬送空間及び前記ウェーハカセット搬送空間の下流側且つ前記ファンフィルタユニットの上流側に配置されたリターン空間を含み、
前記筐体の内部において、前記筐体の前記前面側から順に、前記ウェーハ搬送空間、前記ウェーハカセット搬送空間及び前記リターン空間が並べて配置されていることを特徴とする請求項1又は2に記載のウェーハストッカ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018222883 | 2018-11-28 | ||
JP2018222883 | 2018-11-28 | ||
PCT/JP2019/046033 WO2020111013A1 (ja) | 2018-11-28 | 2019-11-25 | ウェーハストッカ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020111013A1 JPWO2020111013A1 (ja) | 2021-11-25 |
JP7445138B2 true JP7445138B2 (ja) | 2024-03-07 |
Family
ID=70853022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020557711A Active JP7445138B2 (ja) | 2018-11-28 | 2019-11-25 | ウェーハストッカ |
Country Status (6)
Country | Link |
---|---|
US (2) | US11610797B2 (ja) |
JP (1) | JP7445138B2 (ja) |
KR (1) | KR20210093911A (ja) |
CN (1) | CN113169103A (ja) |
TW (1) | TWI830825B (ja) |
WO (1) | WO2020111013A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114326314B (zh) * | 2020-09-29 | 2023-05-30 | 上海微电子装备(集团)股份有限公司 | 一种片库装置 |
US11854851B2 (en) * | 2021-03-05 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interface tool |
CN114084565B (zh) * | 2021-11-30 | 2022-08-19 | 重庆机电智能制造有限公司 | 一种具备惰性气体保护的自动存取立体库 |
Citations (8)
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JP2004303835A (ja) | 2003-03-28 | 2004-10-28 | Fasl Japan 株式会社 | 基板保管装置 |
JP2008100805A (ja) | 2006-10-18 | 2008-05-01 | Ihi Corp | 基板保管庫 |
JP4186861B2 (ja) | 2004-04-06 | 2008-11-26 | ブラザー工業株式会社 | インクジェット装置の駆動回路及びインクジェットプリンタ |
JP2009545141A (ja) | 2006-07-26 | 2009-12-17 | テック・セム アーゲー | 電子部品製造分野由来の対象物を保存するための装置 |
JP2011241020A (ja) | 2010-05-17 | 2011-12-01 | Hitachi Plant Technologies Ltd | カセットストッカ |
WO2013157462A1 (ja) | 2012-04-16 | 2013-10-24 | ローツェ株式会社 | 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー |
JP2017121987A (ja) | 2016-01-06 | 2017-07-13 | 株式会社ダイフク | 物品収納棚、及び、それを備えた物品収納設備 |
WO2018150698A1 (ja) | 2017-02-20 | 2018-08-23 | 村田機械株式会社 | パージストッカ |
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2019
- 2019-11-25 KR KR1020217015597A patent/KR20210093911A/ko active Search and Examination
- 2019-11-25 CN CN201980078149.2A patent/CN113169103A/zh active Pending
- 2019-11-25 JP JP2020557711A patent/JP7445138B2/ja active Active
- 2019-11-25 WO PCT/JP2019/046033 patent/WO2020111013A1/ja active Application Filing
- 2019-11-25 US US17/297,509 patent/US11610797B2/en active Active
- 2019-11-27 TW TW108143116A patent/TWI830825B/zh active
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2023
- 2023-02-28 US US18/115,044 patent/US11823934B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004303835A (ja) | 2003-03-28 | 2004-10-28 | Fasl Japan 株式会社 | 基板保管装置 |
JP4186861B2 (ja) | 2004-04-06 | 2008-11-26 | ブラザー工業株式会社 | インクジェット装置の駆動回路及びインクジェットプリンタ |
JP2009545141A (ja) | 2006-07-26 | 2009-12-17 | テック・セム アーゲー | 電子部品製造分野由来の対象物を保存するための装置 |
JP2008100805A (ja) | 2006-10-18 | 2008-05-01 | Ihi Corp | 基板保管庫 |
JP2011241020A (ja) | 2010-05-17 | 2011-12-01 | Hitachi Plant Technologies Ltd | カセットストッカ |
WO2013157462A1 (ja) | 2012-04-16 | 2013-10-24 | ローツェ株式会社 | 収納容器、収納容器のシャッター開閉ユニット、及びこれらを用いたウエハストッカー |
JP2017121987A (ja) | 2016-01-06 | 2017-07-13 | 株式会社ダイフク | 物品収納棚、及び、それを備えた物品収納設備 |
WO2018150698A1 (ja) | 2017-02-20 | 2018-08-23 | 村田機械株式会社 | パージストッカ |
Also Published As
Publication number | Publication date |
---|---|
TW202029387A (zh) | 2020-08-01 |
KR20210093911A (ko) | 2021-07-28 |
CN113169103A (zh) | 2021-07-23 |
TWI830825B (zh) | 2024-02-01 |
US20230207367A1 (en) | 2023-06-29 |
US20220037184A1 (en) | 2022-02-03 |
JPWO2020111013A1 (ja) | 2021-11-25 |
US11610797B2 (en) | 2023-03-21 |
WO2020111013A1 (ja) | 2020-06-04 |
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