JP7430767B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP7430767B2 JP7430767B2 JP2022192024A JP2022192024A JP7430767B2 JP 7430767 B2 JP7430767 B2 JP 7430767B2 JP 2022192024 A JP2022192024 A JP 2022192024A JP 2022192024 A JP2022192024 A JP 2022192024A JP 7430767 B2 JP7430767 B2 JP 7430767B2
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- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 25
- 229910052738 indium Inorganic materials 0.000 claims description 20
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 20
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 8
- 230000001788 irregular Effects 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 24
- 238000000034 method Methods 0.000 description 21
- 239000010409 thin film Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 11
- 229910021529 ammonia Inorganic materials 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- -1 hafnium nitride Chemical class 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- 229910052735 hafnium Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 6
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
In2O3+2NH3→N2+3H2O+2In
200 回路素子層
310 第1電極
320 発光素子
330 第2電極
340 バンク
400 封止層
410 第1絶縁層
420 第1金属層
421 第1透明導電層
422 第1ナノレンズパターン
430 第2絶縁層
440 第2金属層
331、441 第2透明導電層
332、442 第2ナノレンズパターン
450 第3絶縁層
600 平坦化層
700 カラーフィルター
800 第2基板
Claims (11)
- 第1基板と、
前記第1基板上に備えられた第1電極と、
前記第1電極上に備えられた発光層と、
前記発光層上に備えられた第2電極と、
前記第2電極上に備えられた封止層と、を含み、
前記封止層は第1金属層を含み、
前記第1金属層は、第1ナノレンズパターン及び前記第1ナノレンズパターンを取り囲む第1透明導電層を含み、
複数の第1ナノレンズパターンのそれぞれは、前記第1透明導電層を挟んで互いに離隔して配置されている、表示装置。 - 前記封止層は第1絶縁層をさらに含み、
前記第1金属層は前記第1絶縁層上に形成され、
前記第1ナノレンズパターンのそれぞれの下面は前記第1絶縁層と接する、請求項1に記載の表示装置。 - 前記第2電極は、第2ナノレンズパターン及び前記第2ナノレンズパターンを取り囲む第2透明導電層を含む、請求項1に記載の表示装置。
- 前記封止層は、第1金属層上に備えられた第2絶縁層及び前記第2絶縁層上に備えられた第2金属層をさらに含み、
前記第2金属層は、第2ナノレンズパターン及び前記第2ナノレンズパターンを取り囲む第2透明導電層を含む、請求項1に記載の表示装置。 - 第1基板と、
前記第1基板上に備えられた第1電極と、
前記第1電極上に備えられた発光層と、
前記発光層上に備えられた第2電極と、
前記第2電極上に備えられた封止層と、
前記封止層上に備えられたカラーフィルターと、
前記カラーフィルター上に備えられた第2基板と、を含み、
前記封止層は、前記カラーフィルターの下部に形成された第1金属層を含み、
前記第1金属層は、第1ナノレンズパターン及び前記第1ナノレンズパターンを取り囲む第1透明導電層を含み、
複数の第1ナノレンズパターンのそれぞれは、前記第1透明導電層を挟んで互いに離隔して配置されている、表示装置。 - 前記第1ナノレンズパターンのそれぞれの下面は前記カラーフィルターと接する、請求項5に記載の表示装置。
- 前記第2電極は、第2ナノレンズパターン及び前記第2ナノレンズパターンを取り囲む第2透明導電層を含む、請求項5に記載の表示装置。
- 前記封止層は、前記第1金属層下部に備えられた第2絶縁層及び前記第2絶縁層の下部に備えられた第2金属層をさらに含み、
前記第2金属層は、第2ナノレンズパターン及び前記第2ナノレンズパターンを取り囲む第2透明導電層を含む、請求項5に記載の表示装置。 - 前記第1ナノレンズパターン及び前記第2ナノレンズパターンはインジウム(Indium)を含んでなる、請求項3、4、7または8のいずれか一項に記載の表示装置。
- 前記第1ナノレンズパターンまたは前記第2ナノレンズパターンのそれぞれの大きさは不規則である、請求項3、4、7または8のいずれか一項に記載の表示装置。
- 前記第1透明導電層及び前記第2透明導電層はITO(Indium Tin Oxide)を含んでなる、請求項3、4、7または8のいずれか一項に記載の表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210189848A KR20230100167A (ko) | 2021-12-28 | 2021-12-28 | 표시 장치 |
KR10-2021-0189848 | 2021-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023098630A JP2023098630A (ja) | 2023-07-10 |
JP7430767B2 true JP7430767B2 (ja) | 2024-02-13 |
Family
ID=86693704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022192024A Active JP7430767B2 (ja) | 2021-12-28 | 2022-11-30 | 表示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230209878A1 (ja) |
JP (1) | JP7430767B2 (ja) |
KR (1) | KR20230100167A (ja) |
CN (1) | CN116406185A (ja) |
DE (1) | DE102022132766A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003288983A (ja) | 2002-01-24 | 2003-10-10 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法、及び製造装置 |
JP2006023683A (ja) | 2004-07-09 | 2006-01-26 | Seiko Epson Corp | マイクロレンズの製造方法及び有機エレクトロルミネッセンス素子の製造方法 |
JP2006147205A (ja) | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 発光デバイスおよびその製造方法 |
US20150014660A1 (en) | 2013-07-15 | 2015-01-15 | Samsung Display Co., Ltd. | Organic light emitting display panel and organic light emitting display device having the same |
JP2019110118A (ja) | 2017-12-19 | 2019-07-04 | エルジー ディスプレイ カンパニー リミテッド | 有機発光表示装置 |
WO2020053692A1 (ja) | 2018-09-14 | 2020-03-19 | 株式会社半導体エネルギー研究所 | 表示装置、表示モジュール、及び電子機器 |
WO2021100406A1 (ja) | 2019-11-22 | 2021-05-27 | ソニー株式会社 | 発光素子、表示装置及び面発光装置 |
-
2021
- 2021-12-28 KR KR1020210189848A patent/KR20230100167A/ko unknown
-
2022
- 2022-11-23 US US17/993,647 patent/US20230209878A1/en active Pending
- 2022-11-24 CN CN202211481174.5A patent/CN116406185A/zh active Pending
- 2022-11-30 JP JP2022192024A patent/JP7430767B2/ja active Active
- 2022-12-09 DE DE102022132766.3A patent/DE102022132766A1/de active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003288983A (ja) | 2002-01-24 | 2003-10-10 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法、及び製造装置 |
JP2006023683A (ja) | 2004-07-09 | 2006-01-26 | Seiko Epson Corp | マイクロレンズの製造方法及び有機エレクトロルミネッセンス素子の製造方法 |
JP2006147205A (ja) | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 発光デバイスおよびその製造方法 |
US20150014660A1 (en) | 2013-07-15 | 2015-01-15 | Samsung Display Co., Ltd. | Organic light emitting display panel and organic light emitting display device having the same |
JP2019110118A (ja) | 2017-12-19 | 2019-07-04 | エルジー ディスプレイ カンパニー リミテッド | 有機発光表示装置 |
WO2020053692A1 (ja) | 2018-09-14 | 2020-03-19 | 株式会社半導体エネルギー研究所 | 表示装置、表示モジュール、及び電子機器 |
WO2021100406A1 (ja) | 2019-11-22 | 2021-05-27 | ソニー株式会社 | 発光素子、表示装置及び面発光装置 |
Also Published As
Publication number | Publication date |
---|---|
DE102022132766A1 (de) | 2023-06-29 |
TW202326648A (zh) | 2023-07-01 |
CN116406185A (zh) | 2023-07-07 |
US20230209878A1 (en) | 2023-06-29 |
JP2023098630A (ja) | 2023-07-10 |
KR20230100167A (ko) | 2023-07-05 |
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