JP7418927B2 - processing equipment - Google Patents

Description

The present invention includes a holding unit that holds a workpiece, a processing unit that processes the workpiece held in the holding unit, and a feeding unit that relatively moves the holding unit and the processing unit. Regarding processing equipment.

When manufacturing device chips to be mounted on electronic equipment, first, multiple dividing lines that intersect with each other are set on the surface of a semiconductor wafer, and ICs (Integrated Circuits) and LSIs ( (Large Scale Integration) and other devices. Thereafter, the wafer is ground from the back side using a grinding device to thin the wafer, and the wafer is divided along the planned dividing line using a cutting device, a laser processing device, or the like. Then, individual device chips are obtained.

Processing devices such as grinding devices, cutting devices, and laser processing devices have a holding unit that holds a workpiece, a processing unit that processes the workpiece held in the holding unit, and a relative position between the holding unit and the processing unit. and a feeding unit for moving. Furthermore, the processing apparatus includes a display with a touch panel that serves both as a display unit that displays information and as an input interface, and a control unit that controls each component. This processing device processes a workpiece under flexible processing conditions (see Patent Document 1).

JP2008-279526A

For example, an operation screen including movement keys for relatively moving the holding unit and the processing unit is displayed on the touch panel display. Then, the operator of the processing device can input an instruction to relatively move the holding unit and the processing unit to the control unit by touching a movement key included in the operation screen. When accurately moving the holding unit and the processing unit to a predetermined position, the operator may touch the movement key without looking at the operation screen while watching the holding unit and the processing unit.

In the final stage of the work, so-called frame-by-frame movement is performed in which the movement is performed by a distance of only about 1 μm with one touch of the movement key. While performing frame-by-frame movement, the relative positions of the holding unit and the processing unit change by a very small amount, and it may be difficult for even the operator himself to recognize that movement is being performed. In frame-by-frame movement, the position of the operator's finger may deviate from the movement key while the operator repeatedly touches the movement key without looking at the operation screen.

That is, an operator who performs frame-by-frame movement may unintentionally touch a position other than the movement key. However, since the change in relative position is extremely small, it is difficult for the operator to notice operational errors, which is a factor that reduces work efficiency. For example, erroneous operations can be reduced by checking the movement keys one by one while proceeding with the work, but this requires the operator to repeatedly move his or her line of sight, which is still a factor that reduces work efficiency.

The present invention has been made in view of this problem, and allows the operator to detect whether or not movement instructions have been properly input even if the holding unit and the processing unit are relatively moved without looking at the operation screen. The purpose is to provide processing equipment that can.

According to one aspect of the present invention, a holding unit that holds a workpiece, a processing unit that processes the workpiece held in the holding unit, and a feeder that relatively moves the holding unit and the processing unit. unit, a display with a touch panel, and a working unit including a drive source, the display with a touch panel operates the feeding unit to relatively move the holding unit and the processing unit a predetermined distance. An operation screen including a movement key used for inputting a movement command can be displayed, and when the movement key displayed on the touch panel display is touched, the feeding unit is actuated to move the holding unit and the processing unit. There is provided a processing device characterized in that the processing device itself is given a slight vibration by relatively moving the predetermined distance and activating the drive source of the working unit.

Preferably, the work unit is a cleaning unit that includes a spinner table rotated by the drive source and cleans the workpiece placed on the spinner table, and the microvibration is caused by the spinner table rotated by the drive source. This is caused by the rotating and stopping movements of the table.

A processing device according to one aspect of the present invention includes a working unit including a drive source in addition to a feeding unit that relatively moves a holding unit and a processing unit. When the movement key displayed on the display with a touch panel is touched, the feeding unit is operated to relatively move the holding unit and the processing unit a predetermined distance. At this time, slight vibrations are applied to the processing device itself by activating the drive source of the work unit.

Therefore, the operator who touches the display with a touch panel can confirm that the touch of the movement key has been successful and that the command has been properly received, without moving his/her line of sight, by feeling the slight vibration in his/her finger. Since this micro-vibration can be generated by one of the various work units included in the processing device, there is no need to incorporate a new vibration source into the processing device to generate the micro-vibration. Therefore, the operator's work efficiency can be improved at extremely low cost.

Therefore, according to one aspect of the present invention, there is provided a processing device that allows an operator to detect whether a movement instruction has been properly input even when the holding unit and processing unit are relatively moved without looking at the operation screen. Ru.

FIG. 2 is a perspective view schematically showing a cutting device (processing device). FIG. 2 is a perspective view schematically showing the internal structure of the cutting device. FIG. 2 is a perspective view schematically showing a cleaning unit. FIG. 3 is a cross-sectional view schematically showing a cleaning unit. FIG. 2 is a plan view schematically showing a display with a touch panel that displays an operation screen.

Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. The processing apparatus according to this embodiment is a processing apparatus that processes a workpiece such as a semiconductor wafer. First, the workpiece to be processed will be explained. The workpiece is a substantially disk-shaped substrate, and is, for example, a wafer made of a material such as a semiconductor such as silicon, SiC (silicon carbide), or GaN (gallium nitride). Note that the workpiece may be made of a material such as sapphire, glass, or quartz.

FIG. 3 includes a perspective view schematically showing the workpiece 1 processed by the processing device. A plurality of dividing lines called streets that intersect with each other are set on the surface of the workpiece 1, and devices 5 such as ICs and LSIs are formed in each area partitioned by the plural dividing lines. ing. The workpiece 1 is divided into a plurality of device chips by being processed along the planned dividing line. On the workpiece 1 processed by the processing device, processing marks 3 are formed along the planned dividing line.

When processing the workpiece 1, for example, a tape 7 having a diameter larger than that of the workpiece 1 is attached to the back side of the workpiece 1. Tape 7 is called a dicing tape. The tape 7 has a flexible film-like base material. The base material layer is formed of PO (polyolefin), PET (polyethylene terephthalate), PVC (polyvinyl chloride), PS (polystyrene), or the like. An adhesive layer (glue layer) is provided on one side of the base layer.

The adhesive layers are each made of an ultraviolet curable silicone rubber, an acrylic material, an epoxy material, or the like. This adhesive layer is attached to the back side of the workpiece 1. By attaching the tape 7 to the workpiece 1, the impact on the workpiece 1 during cutting, transportation, etc. can be alleviated, and damage to the workpiece 1 can be reduced.

The inner circumference of a ring frame 9 made of metal such as aluminum or stainless steel is attached to the outer circumference of the tape 7. The ring frame 9 has an opening 9a having a diameter larger than the diameter of the workpiece 1. The frame unit 11 is formed by pasting the tape 7 on the back side of the workpiece 1 and one side of the ring frame 9 with the workpiece 1 positioned approximately at the center of the opening 9a of the ring frame 9. Ru.

The workpiece 1, which is integrated with the tape 7 and the ring frame 9 and becomes a part of the frame unit 11, is processed by a processing device. FIG. 1 is a perspective view schematically showing a cutting device 2, which is an example of a processing device according to the present embodiment. However, the processing device is not limited to the cutting device 2. Note that in FIG. 1, some of the constituent elements are simplified and shown as blocks.

As shown in FIG. 1, a cassette mounting table 6 on which a cassette 13 is placed is provided at a corner of the base 4 of the cutting device 2. The cassette mounting table 6 can be raised and lowered in the vertical direction (Z-axis direction) by a lifting mechanism (not shown). In FIG. 1, the outline of the cassette 13 placed on the cassette mounting table 6 is shown by a two-dot chain line.

At a position adjacent to the cassette mounting table 6 on the upper surface of the base 4, a temporary guide rail 8 including a pair of guide rails 8 that approaches and separates from each other while maintaining a parallel state in the Y-axis direction (left-right direction, indexing feed direction) is provided. A placing table 10 is provided. Further, at a position adjacent to the temporary table 10 on the upper surface of the base 4, there is provided an unloading unit 12 for unloading the frame unit 11 housed in the cassette 13 placed on the cassette mounting table 6 from the cassette 13. There is. The carry-out unit 12 has a grip portion on the front surface that can grip the ring frame 9.

When carrying out the frame unit 11 housed in the cassette 13, the carry-out unit 12 is moved toward the cassette 13, the ring frame 9 is gripped by the gripping part, and then the carry-out unit 12 is moved in the direction away from the cassette 13. move it to Then, the frame unit 11 is pulled out from the cassette 13 onto the temporary table 10. At this time, the frame unit 11 is positioned at a predetermined position by moving the pair of guide rails 8 in conjunction with each other in the X-axis direction and sandwiching the ring frame 9 between the pair of guide rails 8.

An opening 4a that is long in the X-axis direction (back and forth direction, processing feed direction) is formed at a position adjacent to the cassette mounting table 6 on the upper surface of the base 4. A ball screw type X-axis moving mechanism (processing feed unit) and a bellows-shaped dustproof and drip-proof cover 26 that covers the top of the X-axis moving mechanism are disposed within the opening 4a.

The X-axis moving mechanism is connected to the lower part of the X-axis moving table 16, and has a function of moving this X-axis moving table 16 in the X-axis direction. For example, the X-axis moving table 16 moves between a loading/unloading area close to the cassette mounting table 6 and a processing area below the cutting unit 32, which will be described later.

A table base 18 and a holding unit (chuck table) 20 mounted on the table base 18 are provided on the X-axis moving table 16. A porous plate (not shown) made of a porous member is provided on the upper part of the holding unit 20. One end of a suction path (not shown) formed within the holding unit 20 is connected to the porous plate.

A suction source (not shown) such as an ejector is connected to the other end of the suction path. When the suction source is operated, a negative pressure is generated on the surface of the porous plate. Thereby, the surface of the porous plate functions as a holding surface that attracts and holds the base material layer side of the tape 7.

A rotation drive mechanism (not shown) that rotates the holding unit 20 around a predetermined rotation axis is provided below the holding unit 20. Furthermore, a clamp 24 for gripping the ring frame 9 is provided on the radially outer side of the holding unit 20. The holding unit 20 is moved in the X-axis direction by the above-mentioned X-axis movement mechanism.

The frame unit 11 is transported from the temporary table 10 to the holding unit 20 by a first transport unit 14 provided at a position adjacent to the temporary table 10 on the upper surface of the base 4 and the opening 4a. The first conveyance unit 14 includes a shaft part that protrudes upward from the top surface of the base 4 and is movable and rotatable, an arm part that extends horizontally from the top end of the shaft part, and a lower end of the arm part. and a holding section provided therein.

When the first transport unit 14 transports the frame unit 11 from the temporary table 10 to the holding unit 20, the X-axis moving table 16 is moved to position the holding unit 20 in the carry-in/out area. Then, the ring frame 9 of the frame unit 11 temporarily placed on the temporary table 10 is held by the holding part, the frame unit 11 is lifted up, and the shaft part is rotated to move the frame unit 11 above the holding unit 20. move it to

Thereafter, the frame unit 11 is lowered and placed on the holding surface 22 of the holding unit 20. Then, the ring frame 9 is fixed by the clamp 24, and the workpiece 1 is suction-held by the holding unit 20 via the tape 7 of the frame unit 11.

The cutting device 2 includes a support structure 28 disposed above the movement path of the X-axis moving table 16 from the loading/unloading area to the processing area so as to cross the opening 4a. Further, the support structure 28 is provided with an imaging unit 30 facing downward. The imaging unit 30 images the surface of the workpiece 1 that is suction-held by the holding unit 20 that moves to the processing area below the cutting unit 32, and detects the position and orientation of the dividing line set on the surface.

A cutting unit (processing unit) 32 that cuts (processes) the workpiece 1 of the frame unit 11 held by the holding unit 20 is provided in the processing area. The cutting unit 32 includes a cutting blade 34 having an annular grindstone portion on its outer periphery, and a spindle 36 having the cutting blade 34 attached to its tip and extending along the Y-axis direction, which serves as the rotation axis of the cutting blade 34.

A rotational drive source (not shown) such as a motor is connected to the base end side of the spindle 36 . When the rotating cutting blade 34 cuts into the workpiece 1 included in the frame unit 11 held by the holding unit 20, the workpiece 1 can be cut (processed). When the workpiece 1 is cut along all the dividing lines, the workpiece 1 is divided into individual device chips.

More specifically, when cutting the workpiece 1 with the cutting unit 32, the holding unit 20 is rotated so that the direction of the detected dividing line is aligned with the X-axis direction (processing feed direction). Then, the cutting unit 32 is moved along the Y-axis direction (index feed direction) to position the cutting blade 34 on the planned dividing line, the cutting unit 32 is lowered to a predetermined height position, and the holding unit 20 is moved along the X-axis. Processing feed along the direction. Then, the rotating cutting blade 34 comes into contact with the workpiece 1, and the workpiece 1 is cut.

Here, the feeding unit that relatively moves the holding unit 20 and the cutting unit (processing unit) 32 will be described in detail. FIG. 2 is a perspective view schematically showing the internal structure of the cutting device 2. As shown in FIG. As shown in FIG. 2, an X-axis moving mechanism (feeding unit) 54 is provided below the holding unit 20. The X-axis moving mechanism 54 includes a pair of X-axis guide rails 56 provided on the upper surface of the base 4a and parallel to the X-axis direction. An X-axis moving table 58 is slidably disposed on the X-axis guide rail 56 .

A nut portion (not shown) is provided on the back side (lower side) of the X-axis moving table 58, and an X-axis ball screw 60 parallel to the X-axis guide rail 56 is screwed into this nut portion. An X-axis pulse motor 62 is connected to one end of the X-axis ball screw 60 . When the X-axis ball screw 60 is rotated by the X-axis pulse motor 62, the X-axis moving table 58 moves in the X-axis direction along the X-axis guide rail 56.

Adjacent to the X-axis moving mechanism 54, a Y-axis moving mechanism (feeding unit) 64 is provided that moves the cutting unit 32 in the indexing and feeding direction (Y-axis direction). The Y-axis moving mechanism 64 includes a pair of Y-axis guide rails 66 provided on the upper surface of the base 4a and parallel to the Y-axis direction.

A Y-axis moving table 68 is slidably installed on the Y-axis guide rail 66 . The Y-axis moving table 68 includes a base 68a in contact with the Y-axis guide rail 66, and a wall 68b standing upright from the base 68a. A nut portion (not shown) is provided on the back side (lower side) of the base 68a of the Y-axis moving table 68, and a Y-axis ball screw 70 parallel to the Y-axis guide rail 66 is screwed into this nut portion. will be combined.

A Y-axis pulse motor 72 is connected to one end of the Y-axis ball screw 70 . When the Y-axis ball screw 70 is rotated by the Y-axis pulse motor 72, the Y-axis moving table 68 moves in the Y-axis direction along the Y-axis guide rail 66.

A Z-axis moving mechanism (feed unit) 74 that moves the cutting unit 32 in the vertical direction (Z-axis direction) is provided on the wall 68b of the Y-axis moving table 68. The Z-axis moving mechanism 74 includes a pair of Z-axis guide rails 76 provided on the side surface of the wall portion 68b and parallel to the Z-axis direction.

A Z-axis moving plate 78 is slidably installed on the Z-axis guide rail 76 . A nut portion (not shown) is provided on the back side (wall portion 68b side) of the Z-axis moving plate 78, and a Z-axis ball screw (not shown) parallel to the Z-axis guide rail 76 is screwed into this nut portion. will be combined.

A Z-axis pulse motor 80 is connected to one end of the Z-axis ball screw. When the Z-axis ball screw is rotated by the Z-axis pulse motor 80, the Z-axis moving plate 78 moves in the Z-axis direction along the Z-axis guide rail 76. The cutting unit 32 is supported by the Z-axis moving plate 78 via an arm portion 82 .

Note that the cutting device (processing device) 2 according to the present embodiment is not limited to this, and the holding unit 20 may move along the Y-axis direction and the Z-axis direction, and the cutting unit 32 may move along the X-axis direction. You may move it. As described above, the cutting device (processing device) 2 includes a feeding unit (X-axis moving mechanism 54, Y-axis moving mechanism 64, and Z-axis moving mechanism 54, Y-axis moving mechanism 64, and A moving mechanism 74) is provided.

The cutting device (processing device) 2 according to this embodiment will be further explained with reference to FIG. After the workpiece 1 is cut by the cutting unit 32, the holding unit 20 is moved to the loading/unloading area.

An opening 4b is formed on the upper surface of the base 4 at a position adjacent to the temporary table 10 and the opening 4a, and a cleaning unit 38 for cleaning the frame unit 11 after processing is housed in the opening 4b. The cleaning unit 38 includes a spinner table that holds the frame unit 11. A rotation drive source that rotates the spinner table at a predetermined speed is connected to the lower part of the spinner table.

FIG. 3 is a partially cutaway perspective view schematically showing the cleaning unit 38. As shown in FIG. In FIG. 3, a part of the structure of the cleaning unit 38 is omitted for convenience of explanation. Moreover, FIG. 4 is a sectional view schematically showing the cleaning unit 38. The cleaning unit 38 will be explained using FIGS. 3 and 4. The cleaning unit 38 includes a spinner table mechanism 84, a cleaning water receiving mechanism 86 surrounding the spinner table mechanism 84, a cleaning mechanism 116 for cleaning the workpiece 1, and a drying mechanism for drying the cleaned workpiece 1. A mechanism 108 is provided.

The spinner table mechanism 84 includes a spinner table 88, a motor 90 that rotates the spinner table 88 around an axis perpendicular to the upper surface, and a support mechanism 92 that supports the motor 90 so as to be movable in the vertical direction. has. At the top of the spinner table 88, a porous member 88a exposed upward is provided. Inside the spinner table 88, a suction path (not shown) is provided, one end of which is connected to a suction source (not shown), and the other end of which is connected to the porous member 88a.

When the workpiece 1 is placed on the spinner table 88 and the suction source is activated to apply negative pressure to the workpiece 1 through the suction path and the porous member 88a, the workpiece 1 is placed on the spinner table 88. Suction is held. That is, the upper surface of the spinner table 88 becomes a holding surface.

The lower end of the spinner table 88 is connected to the upper end of an output shaft 94, and the lower end of the output shaft 94 is connected to the motor 90. Output shaft 94 transmits the rotational force generated by motor 90 to spinner table 88 .

Motor 90 is supported by support mechanism 92 . The support mechanism 92 includes a plurality of air cylinders 98 attached to the motor 90, and a support leg 96 is connected to the lower part of each air cylinder 98. When each air cylinder 98 is actuated simultaneously, the motor 90 and spinner table 88 can be raised and lowered.

When loading/unloading the workpiece 1, the support mechanism 92 is operated to raise the spinner table 88 to a predetermined loading/unloading position, and when cleaning the workpiece 1, the spinner table 88 is lowered to a prescribed cleaning position. FIG. 4 schematically shows the cleaning unit 38 with the spinner table 88 raised to the loading/unloading position.

The wash water receiving mechanism 86 includes a cylindrical outer peripheral wall 100a, an annular bottom wall 100b extending radially inward from the lower part of the outer peripheral wall 100a, and an inner wall 100b extending upward from the inner peripheral side of the bottom wall 100b. A surrounding wall 100c is provided. The inside of the inner circumferential wall 100c is a through hole 102, and the output shaft 94 is passed through the through hole 102. A cover member 126 having a size that surrounds the inner peripheral wall 100c from the outer peripheral side is provided on the outer periphery of the output shaft 94.

A drain port 104 is provided in the bottom wall 100b, and a drain channel 106 is connected to the drain port 104. When the cleaning liquid falls into the cleaning water receiving mechanism 86, the cleaning liquid is discharged to the outside through the drain port 104 and the drain channel 106. When the spinner table 88 is lowered to the cleaning position, the inner circumferential wall 100c is surrounded by the cover member 126, so that scattering of the cleaning liquid toward the motor 90 through the through hole 102 is suppressed.

A pipe-shaped shaft portion 114 of the drying mechanism 108 passes through the bottom wall 100b. The shaft portion 114 is a pipe-shaped member that extends outside the spinner table 88 in a direction perpendicular to the top surface of the spinner table 88, reaches a position higher than the height of the top surface of the spinner table 88, and has an arm at the top end. 112 is connected. A motor 114a (see FIG. 4) for rotating the shaft portion 114 is connected to the base end side of the shaft portion 114, and the shaft portion 114 is rotated by the motor 114a.

The arm portion 112 is a pipe-shaped member that extends in a direction perpendicular to the direction in which the shaft portion 114 extends with a length corresponding to the distance from the shaft portion 114 to the center of the spinner table 88 . A drying nozzle 110 facing downward is provided at the tip of the arm 112. The drying mechanism 108 includes an air supply source (not shown), and blows air from the drying nozzle 110 through the shaft portion 114 and the arm portion 112 toward the workpiece 1 held on the spinner table 88. It has the function of removing cleaning liquid adhering to the surface.

A pipe-shaped shaft portion 122 of the cleaning mechanism 116 is further penetrated through the bottom wall 100b. The shaft portion 122 is a pipe-shaped member that extends outside the spinner table 88 in a direction perpendicular to the top surface of the spinner table 88, reaches a position higher than the height of the top surface of the spinner table 88, and is attached to the top end. Arm portion 120 is connected. A motor 122a (see FIG. 4) for rotating the shaft portion 122 is connected to the base end side of the shaft portion 122, and the shaft portion 122 is rotated by the motor 122a.

The arm portion 120 is a pipe-shaped member that extends in a direction perpendicular to the direction in which the shaft portion 122 extends with a length corresponding to the distance from the shaft portion 122 to the center of the spinner table 88 . A cleaning nozzle 118 facing downward is provided at the tip of the arm 120. The cleaning mechanism 116 includes a cleaning liquid supply source (not shown), and sprays cleaning liquid from the cleaning nozzle 118 through the shaft portion 122 and the arm portion 120 toward the workpiece 1 held on the spinner table 88, thereby spraying the cleaning liquid onto the workpiece 1. It has the function of removing attached machining debris, etc.

A clamp 124 for holding the ring frame 9 of the frame unit 11 is disposed on the outer peripheral side of the upper part of the spinner table 88. The clamp 124 grips the ring frame 9 by causing the lower weight portion to move toward the outer circumference due to the centrifugal force generated by the rotation of the spinner table 88, so that the upper gripping portion automatically falls toward the inner circumference.

As shown in FIG. 1, the cutting device 2 includes a second transport unit 40 that transports the frame unit 11 from the holding unit 20 positioned in the carry-in/out area to the cleaning unit 38. The second transport unit 40 has an arm movable along the Y-axis direction and a holding section provided below the tip of the arm.

When the second transport unit 40 transports the frame unit 11 from the holding unit 20 to the cleaning unit 38, the frame unit 11 is first held by the holding section. Then, the arm portion is moved along the Y-axis direction and the frame unit 11 is placed on the spinner table 88 of the cleaning unit 38. Thereafter, the frame unit 11 is held by the spinner table 88 and the workpiece 1 is cleaned.

When cleaning the workpiece 1 in the cleaning unit 38, a cleaning liquid (typically a mixture of water and air) is directed toward the workpiece 1 from the cleaning nozzle 118 while rotating the spinner table 88 at high speed. (fluid). After that, dry air is injected onto the workpiece 1 from the drying nozzle 110 to remove the cleaning liquid. The frame unit 11 cleaned by the cleaning unit 38 is housed in the cassette 13 placed on the cassette mounting table 6.

When storing the frame unit 11 in the cassette 13, the first transport unit 14 is used to transport the frame unit 11 from the cleaning unit 38 to the temporary table 10. Then, the carry-out unit 12 is moved toward the cassette 13 and the frame unit 11 is pushed into the cassette 13.

In this way, in the cutting device 2, the frame unit 11 is carried out from the cassette 13, the frame unit 11 is suction-held by the holding unit 20, and the workpiece 1 included in the frame unit 11 is processed by the cutting unit 32. Thereafter, the frame unit 11 is cleaned by the cleaning unit 38 and placed in the cassette 13 again. In the cutting device 2, the frame units 11 are carried out one after another from the cassette 13, and the workpieces 1 are cut one after another by the cutting unit 32 on the holding unit 20.

The cutting device 2 includes a display unit on the surface of the casing that can display various types of information. The display unit is composed of, for example, a liquid crystal display or an organic EL panel. Furthermore, the cutting device 2 includes an input interface used for inputting various commands. The input interface is, for example, a touch panel superimposed on the front surface of the display unit. That is, the cutting device 2 includes a display 42 with a touch panel that functions as both a display unit and an input interface.

The cutting device 2 also includes a control unit 44 that controls each component. The control unit 44 is configured by a computer including a processing device such as a CPU (Central Processing Unit) and a storage device such as a flash memory. By operating the processing device according to software such as a program stored in the storage device, the control unit 44 functions as a concrete means in which the software and the processing device (hardware resources) cooperate.

At times such as maintenance of the cutting device (processing device) 2, the operator may adjust the positions by relatively moving the holding unit 20 and the cutting unit 32. As described above, the relative movement of the holding unit 20 and the cutting unit 32 is performed by the feeding units (X-axis moving mechanism 54, Y-axis moving mechanism 64, and Z-axis moving mechanism 74). For example, the touch panel display 42 can display an operation screen including movement keys. Then, the operator can operate the feeding unit using the operation screen.

FIG. 5 schematically shows a touch panel display 42 that displays an operation screen 128. The operation screen 128 includes a movement key 132 used to input a command to operate the feed unit and relatively move the holding unit 20 and the cutting unit 32 a predetermined distance. Further, the operation screen 128 may include a screen explanation 130 indicating that the operation screen 128 is displayed on the touch panel display 42, and an information display 134 indicating various information.

The movement keys 132 included in the operation screen 128 will be explained. The movement keys 132 include, for example, a plurality of direction keys 132a, 132b, 132c, and 132d used to input movement commands in mutually different directions. When the touch panel display 42 is touched with a finger at a location where the direction keys 132a, 132b, 132c, and 132d are displayed, the feeding unit is activated to relatively move the holding unit 20 and the cutting unit 32 in a predetermined direction. do.

For example, once the movement key 132 is touched (tapped), a relative movement of a predetermined distance is performed by the feeding unit. Further, if the movement key 132 is continued to be touched, the holding unit 20 and the cutting unit 32 continue to move relatively in a predetermined direction.

The moving speed when operating the feeding unit using the operation screen 128 may be arbitrarily selectable by the operator. For example, in the initial stage of adjusting the positions of the holding unit 20 and the cutting unit 32, it is preferable that the moving speed can be increased so that the positions can be brought very close to the target predetermined positional relationship. Further, when approaching the predetermined positional relationship, it is preferable to reduce the moving speed so that the holding unit 20 and the cutting unit 32 can be moved precisely.

For example, the movement speed may be changed by changing the relative movement distance by the feeding unit when the movement key 132 is touched once. Alternatively, the relative movement speed of the holding unit 20 and the cutting unit 32 when the movement key 132 is continuously touched may be changed. In the final stage of position adjustment, the moving speed is set to be extremely low, and for example, the minimum moving distance when the moving key 132 is touched once is about 1 μm.

Here, the operator who performs the position adjustment work touches the movement key 132 with his finger without looking at the operation screen 128 while watching the holding unit 20 and the cutting unit 32 in the final stage. When the movement key 132 is touched, the feed unit is activated and relative movement is performed, but the change in the relative positions of the holding unit 20 and the cutting unit 32 is difficult to notice from the outside.

Then, while performing the operation, the position of the operator's finger may move away from the movement key 132 without being noticed. If the movement key 132 is a physical operation button provided on the casing of the cutting device 2, the operator can tactilely understand that the finger has shifted from the movement key 132. However, since the surface of the touch panel is flat and there is no change in the tactile sensation even if the finger is displaced from the movement key 132, it is difficult to notice the displacement of the finger unless the user is looking at the operation screen 128.

Even if the operator touches the touch panel in this state, the feed unit will not operate and no relative movement will occur. It takes time for the operator to realize that there is no such thing. Therefore, it is conceivable that the operator visually check the operation screen 128 every time the movement key 132 is touched to prevent the finger from shifting. decreases.

Therefore, in the cutting device (processing device) 2 according to the present embodiment, when the movement key 132 displayed on the display 42 with a touch panel is touched, the feed unit is operated to perform relative movement, and the processing device itself Gives a slight vibration. When the slight vibration is transmitted to the finger of the operator who touched the movement key 132, the operator can confirm that the feed unit has operated properly. Here, microvibration refers to vibration that ends in a short time (for example, one second or less).

Note that the slight vibration is generated by a working unit included in the cutting device 2. Here, the work unit refers to a unit that is equipped with a drive source and performs predetermined work other than the relative movement of the holding unit 20 and the cutting unit (processing unit) 32 performed by the feeding unit. A unit equipped with some kind of drive source can be used as a working unit that generates the microvibrations.

For example, the work unit includes a cassette mounting table 6 equipped with a driving source for lifting and lowering, an unloading unit 12 movable in the front and back direction, a temporary table 10 equipped with a pair of guide rails 8 that move toward and away from each other, and a rotating driving source. The first transport unit 14 and the like provided therein. Furthermore, the working unit may be a second transport unit 40 that can move in the front-back direction, a cleaning unit 38 that has various drive sources, or the like.

That is, the cutting device (processing device) 2 according to the present embodiment does not require a dedicated drive source for generating micro-vibrations, but generates micro-vibrations by using these work units having some kind of drive source. . Therefore, the cost of installing a dedicated drive source is unnecessary.

The configuration of the control unit 44 that controls the work unit so as to generate slight vibrations in the drive source of the work unit will be described. As described above, the functions of the control unit 44 are realized by functions such as software stored in advance in the storage section of the control unit 44.

As shown in FIG. 1, the control unit 44 includes, for example, an operation screen display section 46 that displays an operation screen 128 on the display 42 with a touch panel. When operating the feeding unit using the operation screen 128 to relatively move the holding unit 20 and the cutting unit 32, the operator inputs a command to the control unit 44 to display the operation screen 128 on the touch panel display 42. At this time, the operation screen display section 46 sends the operation screen 128 to the touch panel display 42 for display.

The control unit 44 includes a touch detection section 48 that detects that the operator touches the touch panel of the display 42 with a touch panel. When the operator's finger touches the touch panel, the touch panel display 42 sends information regarding the position touched by the finger to the control unit 44. Then, the touch detection unit 48 determines which direction key 132a, 132b, 132c, 132d of the movement keys 132 displayed on the operation screen 128 has been touched, based on the received information.

The control unit 44 includes a movement instruction section 50 that controls the feeding unit to relatively move the holding unit 20 and the cutting unit 32. The touch detection unit 48 transmits information regarding the touched direction keys 132a, 132b, 132c, 132d or the operation details of the feeding unit indicated by the touched direction keys 132a, 132b, 132c, 132d to the movement instruction unit 50. . Then, the movement instruction section 50 controls the feeding unit to perform relative movement in a predetermined direction.

Further, the control unit 44 includes a vibration instructing section 52 that controls the drive source of the work unit including the drive source provided in the cutting device (processing device) 2 to apply slight vibrations to the cutting device (processing device) 2 itself. The touch detection section 48 receives information from the touch detection section 48 or the movement instruction section 50 that the relative movement by the feeding unit will be performed. The vibration instruction unit 52 causes the drive source to generate a slight vibration that is transmitted to the operator's finger touching the touch panel display 42.

For example, the vibration instruction section 52 instructs the cleaning unit 38 as a working unit to generate slight vibrations to be applied to the cutting device 2 itself. As described above, the cleaning unit 38 includes a motor 90 that rotates the spinner table 88, and the motor 90 can be used to generate the micro vibrations. For example, motor 90 may rotate spinner table 88 in the forward direction for one moment, rotate spinner table 88 in the opposite direction the next moment, and then stop spinner table 88. Then, a slight vibration is generated in the cutting device 2 that can be transmitted to the operator's fingers.

Therefore, the operator can understand that the touch on the movement key 132 has been detected by the control unit 44 of the cutting device 2, and can confirm that the holding unit 20 and the cutting unit 32 are being moved relative to each other. Further, when the operator's finger touches the touch panel at a position away from the movement key 132, the cutting device 2 does not generate slight vibrations, so the operator notices that the position of the finger has shifted. In this case, the operator can operate the feed unit as desired by returning his or her finger to an appropriate position while viewing the operation screen 128.

Note that slight vibrations may be generated by a drive source other than the motor 90 included in the cleaning unit 38. For example, the cleaning unit 38 uses drive sources such as a motor 114a that rotates the shaft 114 of the drying mechanism 108, a motor 122a that rotates the shaft 122 of the cleaning mechanism 116, a motor 90, and an air cylinder 98 that raises and lowers the spinner table 88. Be prepared. The slight vibration may be generated by the motor 114a, the motor 122a, the air cylinder 98, or the like.

As described above, when the movement key 132 displayed on the touch panel display 42 is touched, the cutting device (processing device) 2 according to the present embodiment operates the feeding unit to move the holding unit 20 and the cutting unit ( (processing unit) 32 is relatively moved a predetermined distance. At this time, a slight vibration is applied to the cutting device (processing device) 2 itself by activating the drive source of the work unit.

Therefore, the operator who has touched the touch panel display 42 can confirm that the touch of the movement key 132 has been successful and that the command has been properly received without moving his/her line of sight by feeling the slight vibration in his/her finger. Since this micro-vibration can be generated by one of the various work units included in the cutting device (processing device) 2, there is no need to incorporate a new vibration source into the processing device to generate the micro-vibration. Therefore, the operator's work efficiency can be improved at extremely low cost.

In addition, the structure, method, etc. according to the above embodiments can be modified and implemented as appropriate without departing from the scope of the objective of the present invention. In the above embodiment, the case where the processing device that processes the workpiece 1 is the cutting device 2 that cuts the workpiece 1 has been described as an example, but the processing device is not limited to this. That is, the processing device may be a grinding device that grinds the workpiece 1 from the back side, or a laser processing device that processes the workpiece 1 with a laser along the planned dividing line.

In addition, the structure, method, etc. according to the above embodiments can be modified and implemented as appropriate without departing from the scope of the objective of the present invention.

1 Workpiece 3 Machining trace 5 Device 7 Tape 9 Ring frame 9a Opening 11 Frame unit 13 Cassette 2 Cutting device 4 Base 4a, 4b Opening 6 Cassette mounting table 8 Guide rail 10 Temporary table 12 Carrying out unit 14, 40 Transport Unit 16 X-axis moving table 18 Table base 20 Holding unit 22 Holding surface 24 Clamp 26 Dust-proof and drip-proof cover 28 Support structure 30 Imaging unit 32 Cutting unit 34 Cutting blade 36 Spindle 38 Cleaning unit 42 Display with touch panel 44 Control unit 46 Operation screen display Section 48 Touch detection section 50 Movement instruction section 52 Vibration instruction section 54, 64, 74 Movement mechanism 56, 66, 76 Guide rail 58, 68 Movement table 60, 70 Ball screw 62, 72, 80 Pulse motor 68a Base 68b Wall section 78 Z Axis moving plate 82 Arm portion 84 Spinner table mechanism 86 Cleaning water receiving mechanism 88 Spinner table 88a Porous member 90 Motor 92 Support mechanism 94 Output shaft 96 Support leg 98 Air cylinder 100a Outer wall 100b Bottom wall 100c Inner wall 102 Through hole 104 Drainage Mouth 106 Drain channel 108 Drying mechanism 110 Drying nozzle 112, 120 Arm 114, 122 Shaft 114a, 122a Motor 116 Cleaning mechanism 118 Cleaning nozzle 124 Clamp 126 Cover member 128 Operation screen 130 Screen explanation 132 Movement key 132a, 132b, 132 c, 132d Direction key 134 Information display

Claims (2)

A holding unit that holds a workpiece, a processing unit that processes the workpiece held in the holding unit, a feeding unit that relatively moves the holding unit and the processing unit, a display with a touch panel, and a drive. A processing device comprising: a working unit including a source;
The display with a touch panel can display an operation screen including movement keys used for inputting a command to operate the feeding unit and relatively move the holding unit and the processing unit by a predetermined distance,
When the movement key displayed on the touch panel display is touched, the feeding unit is actuated to relatively move the holding unit and the processing unit by the predetermined distance, and the driving source of the working unit is actuated. A processing device that is characterized by applying slight vibrations to the processing device itself. The work unit is a cleaning unit that includes a spinner table rotated by the drive source and cleans the workpiece placed on the spinner table,
2. The processing apparatus according to claim 1, wherein the micro-vibration is caused by rotation and stopping of the spinner table by the drive source.

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