JP2023028219A - Processing device - Google Patents

Abstract

To provide a new cover member that can be replaced with a bellows-shape cover member in order to prevent processed wastes pinched resulting from expansion/retraction motion from breaking the bellows-shape cover member or the like.SOLUTION: A processing device is provided with: a holding table 20 that holds a work-piece thereon; a processing unit that applies processing to the work-piece held by the holding table 20 while supplying water to the work-piece; a moving mechanism that moves the holding table 20 along a predetermined direction; and sheets 40 and 42 made of rubber, provided in a movement area of the holding table 20 along the predetermined direction, which prevent processing water from intruding into a predetermined area in the processing device and have stretching properties along the predetermined direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to a processing apparatus comprising a holding table that holds a workpiece, and a machining unit that performs machining while supplying machining water to the workpiece held by the holding table.

Semiconductor device chips are mounted on electronic devices such as mobile phones. A semiconductor device chip is formed, for example, by grinding and thinning the back side of a semiconductor wafer on which a device such as an IC (Integrated Circuit) is formed on the front side, and then dividing the semiconductor wafer by a cutting machine. .

Further, the electronic equipment may be mounted with a semiconductor package (that is, a semiconductor device) such as a CSP (Chip Size Package) or a QFN (Quad Flat Non-leaded Package). A CSP is formed by dividing a semiconductor wafer on which bumps and the like are provided on a device with a cutting machine, and a QFN is formed by dividing a strip-shaped semiconductor package substrate with a cutting machine.

The cutting device has a cutting unit. The cutting unit has a spindle housing in which a portion of the spindle is rotatably accommodated. A cutting blade is attached to one end of the spindle (see Patent Document 1, for example).

A cutting water supply nozzle for supplying cutting water such as pure water during cutting is arranged near the cutting blade. A disc-shaped chuck table (holding table) for sucking and holding a workpiece such as a semiconductor wafer is arranged below the cutting unit.

A rectangular table cover is arranged below the holding table. The holding table and table cover are movable along the processing feed direction by a moving mechanism provided below the table cover.

On both sides of the table cover in the processing feed direction, bellows-like cover members are provided that can expand and contract following the movement of the holding table and the table cover along the processing feed direction (see, for example, Patent Document 2).

The bellows-shaped cover member has a shape in which peaks and valleys are repeated along the feed direction. When the cover member extends along the processing feed direction, the interval between the peaks increases, and when the cover member contracts along the processing feed direction, the interval between the peaks decreases.

When cutting a workpiece, while supplying cutting water such as pure water to the contact point between the cutting blade rotating at high speed and the workpiece, the holding table sucking and holding the workpiece is held by the cutting blade. Send for processing.

During cutting, cutting water containing cutting waste such as scraps and cutting waste falls near the holding table, but the table cover and the bellows-shaped cover member prevent the cutting water from falling in a predetermined area (for example, a moving mechanism) inside the cutting device. cutting water is prevented from entering the

JP-A-2000-87282 JP-A-2001-135593

However, if the cover member is contracted in the direction of feed in a state in which processing waste such as offcuts and cutting waste is accumulated in the trough portion of the bellows-shaped cover member, the trough portion sandwiches the processing waste, causing the cover member to collapse. is damaged or destroyed.

In particular, offcuts are likely to damage or break the cover member. If the cover member is damaged, cutting water will leak from the damaged portion of the cover member, leading to failure of the cutting device, and replacement of the cover member will cost money.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems. It is an object of the present invention to provide a cover member.

According to one aspect of the present invention, there is provided a holding table that holds a workpiece, a machining unit that performs machining while supplying machining water to the workpiece held by the holding table, and the holding table that is oriented in a predetermined direction. and a moving mechanism provided in a movement area of the holding table along the predetermined direction to prevent the processing water from entering a predetermined area in the processing apparatus and have elasticity along the predetermined direction. A sheet of rubber is provided.

Preferably, the predetermined area includes an area where the moving mechanism is provided.

Preferably, the sheets include a first sheet arranged on one side of the holding table in the predetermined direction and a second sheet arranged on the other side of the holding table in the predetermined direction. include.

Further, preferably, the sheets include a third sheet arranged on the one side of the first sheet in the predetermined direction and a fourth sheet arranged on the other side of the second sheet in the predetermined direction. a sheet, wherein the first sheet is more durable than the third sheet, and the second sheet is more durable than the fourth sheet.

Also, preferably, the third sheet has higher stretchability than the first sheet, and the fourth sheet has higher stretchability than the second sheet.

Further, preferably, the second sheet is arranged in a direction in which the processing water scatters in the predetermined direction from the position of the holding table, and the second sheet is more durable than the first sheet. highly sexual.

Also, preferably, the sheet is provided over the entire movement area.

A processing apparatus according to an aspect of the present invention includes a rubber sheet provided in a movement area of a holding table along a predetermined direction, instead of the bellows-shaped cover member. The sheet prevents processing water from entering a predetermined area in the processing apparatus and has stretchability along a predetermined direction.

Unlike the bellows-shaped cover member, the rubber sheet does not form a trough when it is stretched along the predetermined direction of movement of the holding table, or even when it is shrunk along the predetermined direction. Therefore, it is possible to prevent damage or breakage due to pinching of processing waste.

It is a perspective view of a cutting device. It is a figure which shows the inside of a cutting apparatus. Fig. 2 is a perspective view of the seat and drain pan; It is a partial cross-sectional side view of drain pan etc. FIG. FIG. 5(A) is a diagram showing the holding table arranged in the carry-in/out area, and FIG. 5(B) is a diagram showing the holding table arranged in the processing area. FIG. 6A is a top view of a sheet or the like according to a first modification, and FIG. 6B is a top view of a sheet or the like according to a second modification. FIG. 11 is a top view of a sheet or the like according to a third modified example; FIG. 10 is a perspective view of a seat and a drain pan according to a second embodiment; FIG. 9(A) is a diagram showing the holding table arranged in the carry-in/out area, and FIG. 9(B) is a diagram showing the holding table arranged in the processing area. 1 is a perspective view of a grinding device; FIG.

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a cutting device (processing device) 2 according to the first embodiment. In addition, in FIG. 1, some of the components of the cutting device 2 are shown as functional blocks.

The X-axis direction (predetermined direction), Y-axis direction (front-rear direction), and Z-axis direction (vertical direction) shown in FIG. 1 are directions orthogonal to each other. The X-axis direction is parallel to the +X and -X directions, the Y-axis direction is parallel to the +Y and -Y directions, and the Z-axis direction is parallel to the +Z and -Z directions.

An operation panel 4 functioning as an input device is provided on the front (+Y direction) side wall of the casing of the cutting device 2 . The operator can set the cutting conditions for the cutting device 2 by performing predetermined inputs via the operation panel 4, for example.

A monitor 6 functioning as a display device is provided on the front side surface of the housing. The monitor 6 displays a guidance screen that guides the operator in operations, an image captured by an imaging unit 60, which will be described later, and the like. The monitor 6 may be a touch panel that functions as a display device and an input device. In this case, the operation panel 4 is omitted.

The cutting device 2 cuts (processes) a wafer (workpiece) 11 made of, for example, a semiconductor material such as silicon. However, the wafer 11 may be formed of a compound semiconductor such as silicon carbide (SiC) or gallium nitride (GaN), or may be formed of other materials.

On the front surface 11a side of the wafer 11, a plurality of dividing lines (not shown) are set in a grid pattern. A device (not shown) such as an IC (Integrated Circuit) is formed in each region partitioned by a plurality of planned dividing lines.

A circular dicing tape 13 made of resin is adhered to the back surface 11 b side of the wafer 11 . A wafer 11 is attached to the central portion of the dicing tape 13 , and one surface of an annular frame 15 made of metal is attached to the outer peripheral portion of the dicing tape 13 .

Thus, a wafer unit 17 in which the wafer 11 is supported by the frame 15 via the dicing tape 13 is formed. A plurality (for example, 25) of wafer units 17 are housed in a rectangular cassette 8 .

A cassette 8 containing a plurality of wafer units 17 is placed on a rectangular cassette table 10 positioned at a front corner of the cutting device 2 . An elevator 12 for moving the cassette table 10 up and down is provided below the cassette table 10 .

A push-pull arm 14 is provided behind the cassette table 10 (in the -Y direction). The push-pull arm 14 carries out the uncut wafer 11 from the cassette 8 while gripping the frame 15 , and carries the cut wafer 11 into the cassette 8 by pushing the frame 15 .

A pair of rail-like positioning members 16 for adjusting the position of the wafer unit 17 in the X-axis direction are provided on both sides of the movement path of the push-pull arm 14 . A first transfer unit 18 for transferring the wafer unit 17 from the pair of positioning members 16 is provided near the pair of positioning members 16 .

The first transport unit 18 has a substantially L-shaped arm when viewed from above. A suction mechanism for sucking the frame 15 by negative pressure is provided at the distal end of the arm, and a turning mechanism for turning the arm is provided at the proximal end of the arm.

The first transfer unit 18 rotates its arm while holding the frame 15 to transfer the wafer unit 17 to a disk-shaped holding table (chuck table) 20 arranged near the cassette table 10 . .

The holding table 20 is arranged in a rectangular opening 4a formed in a part of the housing. The holding table 20 is movable along the X-axis direction, and is arranged in a loading/unloading area A1 positioned near the cassette table 10 in the X-axis direction when the wafer unit 17 is loaded or unloaded.

The holding table 20 has a frame made of metal. The frame has a bottomed cylindrical shape with a sufficiently large diameter compared to its height. A plurality of flow paths are radially formed on the bottom surface of the recess of the frame.

A central flow path is formed in the frame so as to penetrate the center of the bottom surface of the concave portion of the frame. One end of the central channel is connected to a plurality of radially formed channels, and the other end of the central channel is connected to a suction source (not shown) such as a vacuum pump or an ejector.

A disk-shaped porous plate made of porous ceramics is fixed to the concave portion of the frame. When the suction source is operated, negative pressure is generated on the upper surface of the porous plate. The upper surface of the frame and the upper surface of the porous plate are flush with each other, forming a substantially flat holding surface 20a.

A plurality of clamp units 20 b are provided on the outer periphery of the holding table 20 . After placing the wafer unit 17 on the holding surface 20a so that the front surface 11a faces upward, the rear surface 11b side is suction-held by the holding surface 20a through the dicing tape 13, and the frame 15 is clamped by each clamp unit 20b.

A rectangular table cover 24 made of metal such as stainless steel is provided below the holding table 20 . A cylindrical θ table 26 (see FIG. 2) is provided under the table cover 24 .

FIG. 2 is a diagram showing the inside of the cutting device 2. As shown in FIG. The .theta. table 26 supports the holding table 20 so that the holding table 20 can rotate around a rotation axis substantially parallel to the Z-axis direction. An X-axis direction moving mechanism 28 is provided below the θ table 26 to move the holding table 20 along the X-axis direction (predetermined direction).

The X-axis movement mechanism 28 has an X-axis movement plate 30 that supports the θ table 26 . The X-axis movement plate 30 is slidably mounted on a pair of X-axis guide rails 32 arranged substantially parallel to the X-axis direction.

A ball screw 34 is arranged between the pair of X-axis guide rails 32 along the X-axis direction. A nut portion (not shown) is provided on the lower surface of the X-axis movement plate 30, and the ball screw 34 is rotatably connected to the nut portion.

One end of the ball screw 34 is connected to a drive source 36 such as a stepping motor for rotating the ball screw 34 . When the drive source 36 is driven, the X-axis direction moving plate 30 moves along the X-axis direction together with the table cover 24, the θ table 26, the holding table 20, and the like.

The X-axis movement plate 30 moves in the +X direction or the -X direction depending on the rotation direction of the ball screw 34 . According to the movement of the X-axis direction moving plate 30, the holding table 20 moves in the movement area A3 (see FIG. 1, etc.) including the loading/unloading area A1 and the processing area A2 along the X-axis direction.

The holding table 20 moves from a predetermined position on the -X direction side of the loading/unloading area A1 to a predetermined position on the +X direction side of the processing area A2. In one example, the movement distance (stroke length) that the holding table 20 moves along the X-axis direction is 400 mm.

During cutting of the wafer 11, the holding table 20 repeats the processing feed operation in the +X direction and the return operation in the -X direction multiple times in the processing area A2. That is, the holding table 20 reciprocates along the X-axis direction in the processing area A2.

A rubber sheet B (see FIG. 3) having elasticity along the X-axis direction is provided in the moving area A3 of the holding table 20 . Sheet B includes a first sheet 40 and a second sheet 42 made of rubber having elasticity along the X-axis direction.

The first sheet 40 and the second sheet 42 each have a substantially rectangular shape when viewed from above. As shown in FIG. 3, the first sheet 40 is arranged on the -X direction side of the table cover 24 (that is, one side of the holding table 20 in the X-axis direction).

The +X direction end of the first sheet 40 is fixed to the −X direction end of the table cover 24 . Although not shown in FIG. 3, for example, the +X direction end of the first sheet 40 is bent in the -Z direction, and the bent region is fixed to the table cover 24 with a fixing member such as a bolt.

The -X direction end of the first sheet 40 is fixed to a first inner peripheral wall _56a1 of the drain pan 56, which will be described later. For example, the -X direction end of the first sheet 40 is bent in the -Z direction and placed outside the first inner peripheral wall _56a1 , and then the bent region is secured to the first inner peripheral wall by a fixing member such as a bolt. Secure to 56a ₁ . However, the fixing method is not limited to this example.

As shown in FIG. 3, the second sheet 42 is arranged on the +X direction side of the table cover 24 (that is, the other side of the holding table 20 in the X-axis direction).

The −X direction end of the second sheet 42 is fixed to the +X direction end of the table cover 24 . The +X direction end of the second sheet 42 is fixed to the second inner peripheral wall 56 _{a 2} of the drain pan 56 . Although not shown in FIG. 3, the second seat 42 is also fixed to the table cover 24 and the second inner peripheral wall _56a2 in the same manner as the first seat 40. As shown in FIG.

The first sheet 40 and the second sheet 42 are, for example, latex rubber sheets having relatively high elasticity. The term "rubber" as used herein refers to a polymeric substance having rubber elasticity at room temperature, and includes elastomers.

Since the latex rubber sheet stretches about five times its natural length, for example, when the stroke length is 400 mm, each length in the X-axis direction of the first sheet 40 and the second sheet 42 is set to 80 mm.

However, the first sheet 40 and the second sheet 42 are not limited to latex rubber, and may be made of other materials. For example, the first sheet 40 and the second sheet 42 are made of candy rubber.

A sheet made of candy rubber has a high stretchability that stretches about 7 to 8 times its natural length. is 50 mm or more and 60 mm or less.

Also, the first sheet 40 and the second sheet 42 may be made of silicone rubber. Since the silicone rubber sheet stretches about four times its natural length, for example, when the stroke length is 400 mm, each length in the X-axis direction of the first sheet 40 and the second sheet 42 is set to 100 mm.

In particular, the silicone rubber sheet has higher durability than the latex rubber sheet and candy rubber sheet described above. That is, even if the sheet made of silicone rubber is exposed to the cutting water 54 (see FIG. 4) or the like, deterioration such as discoloration and deterioration is relatively unlikely to occur.

Therefore, a sheet made of silicone rubber may be used in the area of the sheet B where a relatively large amount of processing waste such as mill ends and cutting waste and cutting water 54 scatter. As described above, the material of the sheet B may be selected from the viewpoint of elasticity, stretchability, durability, and the like.

The first sheet 40 and the second sheet 42 have sufficient stretchability to follow the movement of the table cover 24 within the movement area A3. The sheet 40 and the second sheet 42 are less likely to be sagging, wrinkled, or the like.

Returning to FIG. 1, a cutting unit (processing unit) 44 is provided above the processing area A2. The cutting unit 44 has a cylindrical spindle housing 46 whose longitudinal direction is arranged along the Y-axis direction.

A part of a cylindrical spindle 48 (see FIG. 4) is rotatably accommodated in the spindle housing 46 . A rotational drive source (not shown) such as a motor is provided at the proximal end of the spindle 48 , and a cutting blade 50 is attached to the distal end of the spindle 48 .

A blade cover 52 is provided at the tip of the spindle housing 46 so as to cover the cutting blade 50 from above. The blade cover 52 is provided with a cutting water supply unit 58 including nozzles and the like.

When cutting the wafer 11, the wafer 11 is cut while supplying cutting water (processing water) 54 (see FIG. 4) such as pure water to the wafer 11, the cutting blade 50, and the like held by suction on the holding surface 20a. Therefore, the cutting water 54 containing scraps and chips scatters on the table cover 24, the first sheet 40, the second sheet 42, and the like.

The table cover 24, the first sheet 40, and the second sheet 42 have the function of preventing the cutting water 54 from entering the predetermined area C (see FIGS. 2 and 3) in the cutting device 2. As shown in FIG. In this embodiment, the predetermined region C is provided with the above-described X-axis direction moving mechanism 28 .

The first sheet 40 and the second sheet 42 are different from the conventional bellows-shaped cover member, and the first sheet 40 and the second sheet 42 contract along the X-axis direction as well as extend along the X-axis direction along which the holding table 20 moves. It is difficult to form a valley portion even in this state.

Therefore, the first sheet 40 and the second sheet 42 are prevented from being damaged or broken due to sandwiching scraps or chips. The used cutting water 54 containing scraps and chips flows through the table cover 24 , the first sheet 40 and the second sheet 42 to the drain pan 56 .

3 is a perspective view of the sheet B (the first sheet 40 and the second sheet 42) and the drain pan 56, and FIG. 4 is a partial cross-sectional side view of the drain pan 56 and the like. In addition to the first inner peripheral wall 56a- ₁ and the second inner peripheral wall 56a- ₂ , the drain pan 56 has a rectangular third inner peripheral wall 56a _-3 and a fourth inner peripheral wall 56a whose longitudinal direction is arranged along the X-axis direction. ₄ .

The inner side surfaces of the first inner peripheral wall 56a ₁ , the second inner peripheral wall 56a ₂ , the third inner peripheral wall 56a ₃ and the fourth inner peripheral wall 56a ₄ define a central opening 56e of the drain pan 56 . The central opening 56e is filled with clean dry air from which particles of a predetermined size or less (that is, dust) are removed and dried.

An inner peripheral portion of a rectangular ring-shaped bottom plate _56b is connected to the outside of each of the bottom portions of the first inner peripheral wall 56a1 to _{the fourth} inner peripheral wall 56a4. The bottoms of rectangular first outer wall 56c ₁ , second outer wall 56c ₂ , third outer wall 56c ₃ , and fourth outer wall 56c ₄ are connected to the outer wall of bottom plate 56b.

An outer side of a rectangular first top plate _56d1 is connected to the upper end of the first outer peripheral wall _56c1 , and a second rectangular top plate is connected to the upper end of the _second outer peripheral wall 56c2. The outer edge of _56d2 is connected.

Similarly, the upper end of the third outer peripheral wall 56c- ₃ is connected to one side of the outside of the rectangular third top plate 56d- ₃ , and the upper end of the fourth outer peripheral wall 56c- ₄ is connected to the rectangular third top plate 56d-3. 4 Top plate 56d ₄ is connected to the outer side.

As shown in FIG. 4, the upper surface of the first sheet 40 is arranged at a position lower than the third top plate _56d3 and the fourth top plate _56d4 . The upper surface of the second sheet 42 is similarly arranged at a position lower than the third top plate _56d3 and the fourth top plate _56d4 .

By the way, in FIG. 4, the first sheet 40 is arranged substantially horizontally. It may be tilted so that the upper surface is lowered as it progresses in the +Y direction. Also, the first sheet 40 and the second sheet 42 may be tilted so that the upper surfaces thereof are lowered as they move in the -Y direction.

Further, by lowering the −X direction end of the first sheet 40 more than the +X direction end of the first sheet 40, the first sheet 40 is lowered so that the upper surface of the first sheet 40 is lowered as it advances in the −X direction. The seat 40 may be tilted.

Similarly, by lowering the +X-direction end of the second sheet 42 below the -X-direction end of the second sheet 42, the second sheet 42 is lowered so that the upper surface of the second sheet 42 is lowered as it advances in the +X direction. The seat 42 may be tilted.

Furthermore, the tilt in the X-axis direction and the tilt in the Y-axis direction may be combined. By appropriately setting the inclinations of the upper surfaces of the first sheet 40 and the second sheet 42, cutting water and the like can be dropped to the drain pan 56 more reliably than when the upper surfaces are not inclined.

FIG. 5A is a diagram showing the holding table 20 arranged in the loading/unloading area A1. In FIG. 5A, the first sheet 40 is shrunk compared to when the holding table 20 is in the processing area A2 (FIG. 5B), and has a length corresponding to its natural length, for example. On the other hand, the second sheet 42 is in a stretched state.

FIG. 5B is a diagram showing the holding table 20 arranged in the processing area A2. In FIG. 5(B), the second sheet 42 is shrunk compared to the case where the holding table 20 is in the carry-in/carry-out area A1 (FIG. 5(A)), and has a length corresponding to its natural length, for example. In contrast, the first sheet 40 is in a stretched state.

Returning to FIG. 2, other components of the cutting device 2 will be described. An imaging unit 60 is provided on the side of the spindle housing 46 in the -X direction so as to face the holding surface 20a. The imaging unit 60 is a microscope camera unit including a predetermined optical system and an imaging device such as a CCD image sensor or a CMOS image sensor.

The imaging unit 60, for example, captures an image of the front surface 11a side of the wafer 11 held by the holding surface 20a to obtain an image of the front surface 11a side. The acquired image is used for alignment and the like during cutting.

Spindle housing 46 is held by travel block 62 . The moving block 62 is movable along the Z-axis direction by a ball screw type Z-axis direction moving mechanism 64 . The Z-axis movement mechanism 64 adjusts, for example, the height position (cutting position) of the lower end of the cutting blade 50 .

The Z-axis direction moving mechanism 64 has a Z-axis direction moving plate including a nut portion, a pair of guide rails, a ball screw, and a drive source such as a stepping motor, and is substantially the same as the X-axis direction moving mechanism 28. Since it operates by mechanism, detailed explanation is omitted.

The Z-axis direction moving mechanism 64 is provided on the +X direction side surface of the vertical wall of the substantially L-shaped Y-axis direction moving block 66 . Y-axis movement block 66 includes a horizontal plate connected to the bottom of the vertical wall.

The horizontal plate can be moved along the Y-axis direction by a ball screw type Y-axis direction moving mechanism 68 . For example, the position of the cutting blade 50 in the Y-axis direction (index feed position) is adjusted by the Y-axis direction moving mechanism 68 .

The Y-axis direction moving mechanism 68 has a Y-axis direction moving plate including a nut portion, a pair of guide rails, a ball screw, and a drive source such as a stepping motor, and is substantially the same as the X-axis direction moving mechanism 28. Since it operates by mechanism, detailed explanation is omitted.

Returning to FIG. 1 , the cutting device 2 has a second transport unit 70 . The second transport unit 70 has an arm provided with an elevating mechanism such as an actuator at its tip. A suction mechanism for sucking the frame 15 is provided at the bottom of the lifting mechanism.

A Y-axis direction moving mechanism (not shown) for moving the arm along the Y-axis direction is provided at the base end of the arm. The second transport unit 70 unloads the wafer 11 arranged in the loading/unloading area A1 from the holding table 20 after the cutting is finished.

Specifically, the second transport unit 70 moves from the holding table 20 arranged in the loading/unloading area A1 to the spinner cleaning device provided in the -Y direction of the opening 4a while the frame 15 is adsorbed by the adsorption mechanism. Transfer the wafer unit 17 to the mechanism 72 .

The wafer 11 cleaned by the spinner cleaning mechanism 72 is transferred from the spinner cleaning mechanism 72 to the pair of positioning members 16 by the first transfer unit 18 and then transferred to the cassette 8 by the push-pull arm 14 .

A control unit 74 controls the operation of each component of the cutting device 2 . The control unit 74 is, for example, a computer that includes a processor (processing device) represented by a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory. It is composed by

Software including a predetermined program is stored in the auxiliary storage device. The functions of the control unit 74 are realized by operating the processor and the like according to this software.

Here, a method for cutting the wafer 11 using the cutting device 2 will be described. First, the rear surface 11b side is held by the holding surface 20a so that the front surface 11a is exposed, and the frame 15 is held by the clamp unit 20b (holding step).

After the holding step, the imaging unit 60 picks up an image of the surface 11a side, and the orientation of the holding table 20 is adjusted so that the planned division line (not shown) specified based on the obtained image is substantially parallel to the X-axis direction. adjust (orientation adjustment process).

After the orientation adjustment step, the rotating cutting blade 50 is positioned on the extension line of one planned dividing line, and the lower end of the cutting blade 50 is positioned between the back surface 11b and the holding surface 20a.

Then, the wafer 11 is cut along one dividing line by moving the holding table 20 while supplying the cutting water 54 . After cutting the wafer 11 along one planned division line, the cutting unit 44 is indexed and fed along the Y-axis direction to position the cutting blade 50 on the extension line of another planned division line.

Then, the wafer 11 is cut along other dividing lines. Similarly, after cutting the wafer 11 along the remaining dividing lines, the wafer 11 is rotated 90 degrees on the XY plane. Then, the wafer 11 is similarly cut along the dividing line along the X-axis direction (cutting step).

In the cutting process, cutting water 54 containing offcuts and cutting waste scatters onto the first sheet 40, the second sheet 42, and the like. As described above, in the first sheet 40 and the second sheet 42, it is difficult to form a trough like a bellows-like cover member in the stretched state and contracted state along the X-axis direction. Therefore, it is possible to prevent damage or breakage caused by pinching scraps or chips.

Next, various modifications of the first embodiment will be described. FIG. 6A is a top view of the seat B and the like according to the first modified example. The seat B includes a first seat 40 arranged in the −X direction of the table cover 24 and a third seat 80 arranged in the −X direction side (one side) of the first seat 40 .

In particular, the first sheet 40 of the first modified example is made of a material having higher durability than the third sheet 80 . For example, the first sheet 40 is a silicone rubber sheet having relatively high durability.

On the other hand, the third sheet 80 is made of a material having higher stretchability than the first sheet 40 . For example, the third sheet 80 is a sheet made of candy rubber having relatively high elasticity.

The seat B further includes a second seat 42 arranged in the +X direction of the table cover 24 and a fourth seat 82 arranged on the +X direction side (the other side) of the second seat 42 .

In particular, the second sheet 42 of the first modified example is made of a material having higher durability than the fourth sheet 82 . For example, the second sheet 42 is a silicone rubber sheet having relatively high durability.

On the other hand, the fourth sheet 82 is made of a material having higher stretchability than the second sheet 42 . For example, the fourth sheet 82 is a sheet made of candy rubber having relatively high elasticity.

In the first modified example, the durability of the first sheet 40 and the second sheet 42 located near the holding table 20 where the cutting water 54 is likely to scatter is made relatively high. Therefore, the durability of the sheet B can be increased as compared with the case where the entire sheet B is formed of, for example, a sheet made of candy rubber.

Furthermore, in the first modified example, the stretchability of the third sheet 80 and the fourth sheet 82 is relatively high. Therefore, the stretchability of the sheet B can be increased as compared with the case where the entire sheet B is formed of, for example, a silicone rubber sheet. Therefore, both durability and stretchability can be achieved.

Next, a second modified example will be described. FIG. 6B is a top view of the seat B etc. according to the second modification. In the second modification, the sheet B is composed of the first sheet 40 and the second sheet 42 as in the first embodiment, but the materials of the first sheet 40 and the second sheet 42 are different.

In the cutting process, when the holding table 20 is fed in the +X direction and the wafer 11 is cut by a so-called down-cut, the cutting water 54 containing processing waste is swirled up by the cutting blade 50, and the position of the holding table 20 is lowered. It may scatter mainly in the +X direction.

Therefore, in the second modification, a rubber sheet made of a material having durability higher than that of the first sheet 40 is used as the second sheet 42 . For example, the second sheet 42 is a silicone rubber sheet, and the first sheet 40 is a candy rubber sheet.

As a result, the durability of the sheet B can be improved as compared with the case where the entire sheet B is formed of, for example, a candy rubber sheet, and further, compared with the case where the entire sheet B is formed with, for example, a silicone rubber sheet. , the stretchability of the sheet B can be increased. Therefore, both durability and stretchability can be achieved.

Next, the 3rd modification is demonstrated. FIG. 7 is a top view of the seat B etc. according to the third modification. In the third modification, one sheet B is provided over the entire movement area A3 of the holding table 20 without providing the table cover 24 .

In this way, even when a single sheet B is used to prevent the cutting water 54 from entering the predetermined region C in the cutting device 2, unlike the bellows-like cover member, it can be prevented by sandwiching scraps and chips. Damage or breakage of the sheet B can be prevented. Of course, the material of the rubber sheet forming the sheet B, the natural length in the X-axis direction, and the like are appropriately selected.

Next, a second embodiment will be described. FIG. 8 is a perspective view of the seat B and the drain pan 56 according to the second embodiment. The sheet B of the second embodiment has a first sheet 40 and a second sheet 42 as in the first embodiment.

However, the first sheet 40 has bent portions on both sides in the Y-axis direction. Specifically, the first sheet 40 has a first bent portion 40a bent in the -Z direction at the +Y direction end, and a second bent portion 40b bent in the -Z direction at the -Y direction end. It has it on the end.

Similarly, the second sheet 42 has a first bent portion 42a bent in the -Z direction at the +Y direction end, and a second bent portion 42b bent in the -Z direction at the -Y direction end. have in

The first bent portions 40a, 42a are located between the fourth inner peripheral wall _56a4 and the fourth outer peripheral wall _56c4 , and the second bent portions 40b, 42b are located between the third inner peripheral wall _56a3 and the third outer peripheral wall. It is located between wall _56c3 .

The first bent portions 40 a , 42 a and the second bent portions 40 b , 42 b have the function of guiding the cutting water 54 smoothly to the drain pan 56 . Note that, as in the first embodiment, each upper surface of the first sheet 40 and the second sheet 42 may be inclined in the X-axis direction and/or the Y-axis direction.

Although the first top plate _56d1 and the second top plate _56d2 are omitted in FIG. 8, the first top plate _56d1 and the second top plate _56d2 are provided as in the example shown in FIG. may

FIG. 9A is a diagram showing the holding table 20 arranged in the loading/unloading area A1. In FIG. 9A, the first sheet 40 is shrunk compared to when the holding table 20 is in the processing area A2 (FIG. 9B), and has a length corresponding to its natural length, for example. On the other hand, the second sheet 42 is in a stretched state.

FIG. 9B is a diagram showing the holding table 20 arranged in the processing area A2. In FIG. 9(B), the second sheet 42 is shrunk compared to the case where the holding table 20 is in the carry-in/carry-out area A1 (FIG. 9(A)), and has a length corresponding to its natural length, for example. In contrast, the first sheet 40 is in a stretched state.

In the second embodiment as well, the first sheet 40 and the second sheet 42 are not only stretched along the X-axis direction in which the holding table 20 moves, but also contracted along the X-axis direction. is less likely to be formed, damage or breakage due to sandwiching scraps or chips can be prevented.

Note that the first to third modifications of the above-described first embodiment may also be applied to the second embodiment. Next, a third embodiment will be described. FIG. 10 is a perspective view of a manual grinding device (processing device) 84 according to the third embodiment.

The X-axis direction (predetermined direction), the Y-axis direction (horizontal direction), and the Z-axis direction (vertical direction) shown in FIG. 10 are directions orthogonal to each other. The X-axis direction is parallel to the +X and -X directions, the Y-axis direction is parallel to the +Y and -Y directions, and the Z-axis direction is parallel to the +Z and -Z directions.

The grinding device 84 has a base 86 that supports each component. A rectangular opening 86a is formed in the upper portion of the base 86 so that the long side extends along the X-axis direction. A holding table (chuck table) 88 is arranged in the opening 86a.

The holding table 88 has a frame made of non-porous ceramics. The frame has a bottomed cylindrical shape with a sufficiently large diameter compared to its height. A plurality of flow paths are radially formed on the bottom surface of the recess of the frame. A central flow path is formed in the frame so as to penetrate the center of the bottom surface of the concave portion of the frame.

One end of the central channel is connected to a plurality of radially formed channels, and the other end of the central channel is connected to a suction source (not shown) such as a vacuum pump or an ejector. A disk-shaped porous plate made of porous ceramics is fixed to the concave portion of the frame.

When the suction source is operated, negative pressure is generated on the upper surface of the porous plate. The upper surface of the frame and the upper surface of the porous plate form a substantially flush holding surface 88a. The surface 11a side of the wafer 11 to which the protective tape 19 is adhered is held by suction on the holding surface 88a.

The holding surface 88a is not flat, but has a conical shape in which the central portion protrudes slightly compared to the outer peripheral portion. The wafer 11 sucked and held by the holding surface 88a is elastically deformed following the shape of the holding surface 88a.

The same table cover 24 as in the first embodiment is provided below the holding table 88 . A rotary drive source (not shown) such as a motor is arranged below the table cover 24 . The rotary drive source has a drive pulley, and an endless belt is stretched over the drive pulley.

The endless belt is stretched over a driven pulley (not shown) located at the lower end of the rotating shaft of the holding table 88 . The holding table 88 rotates around the rotation axis as the driven pulley rotates by receiving power from the rotation drive source.

The rotation axis of the holding table 88 is tilted with respect to the Z-axis direction so that the lower surface of the grinding wheel 100b, which will be described later, and a part of the holding surface 88a are substantially parallel to each other. The inclination of the rotating shaft of the holding table 88 is adjusted by an inclination adjusting mechanism (not shown).

Further, the rotating shaft and driven pulley of the holding table 88, the rotational drive source, and the tilt adjusting mechanism are supported by the X-axis direction moving plate 30 (see FIG. 4) and the drain pan 56 (see FIG. 4). is located in the central opening 56e of the.

The holding table 88, the table cover 24, the rotary drive source, etc. are integrally moved along the X-axis direction (predetermined direction) by the X-axis direction moving mechanism 28 (see FIG. 4). As shown in FIG. 10, the holding table 88 moves along the X-axis direction within a movement area A3 including the loading/unloading area A1 and the processing area A2.

The wafer 11 is loaded/unloaded onto the holding table 88 arranged in the loading/unloading area A1. Further, in the processing area A2, the wafer 11 held by suction on the holding surface 88a is ground.

A rubber sheet B having elasticity along the X-axis direction is provided in the movement area A3. The sheet B includes a first sheet 40 and a second sheet 42 each having a rectangular shape and made of rubber having elasticity along the X-axis direction.

The first sheet 40 is arranged on the -X direction side of the table cover 24 (that is, one side of the holding table 88) in the X-axis direction. In addition, the second sheet 42 is arranged on the +X direction side of the table cover 24 (that is, the other side of the holding table 88) in the X-axis direction.

Although the first sheet 40 and the second sheet 42 shown in FIG. 10 have bent portions on both sides in the Y-axis direction as in the second embodiment, they may be configured in the same manner as in the first embodiment. .

A grinding unit (processing unit) 90 is provided above the processing area A2. The grinding unit 90 has a cylindrical spindle housing 92 whose longitudinal direction is arranged along the Z-axis direction.

A part of a cylindrical spindle 94 is rotatably accommodated in the spindle housing 92 . A rotation drive source 96 such as a motor is provided at the upper end of the spindle 94 , and an annular grinding wheel 100 is attached to the lower end of the spindle 94 via a disk-shaped mount 98 .

The grinding wheel 100 has an annular wheel base 100a made of metal such as an aluminum alloy. A plurality of grinding wheels 100b are fixed at approximately equal intervals along the circumferential direction of the wheel base 100a on the lower surface side of the wheel base 100a.

During grinding of the wafer 11, for example, grinding water (processing water) such as pure water (not shown) is supplied to the grinding wheel 100b through a channel (not shown) formed in the spindle 94, the mount 98 and the grinding wheel 100. is supplied.

The spindle housing 92 is fixed to a Z-axis movement plate 106 of a Z-axis movement mechanism 104 via a fixing member 102 . The Z-axis movement plate 106 is slidably attached to a pair of guide rails 108 arranged along the Z-axis direction.

A ball screw 110 is arranged along the Z-axis direction between the pair of guide rails 108 . The ball screw 110 is rotatably connected to a nut portion (not shown) provided on the side surface of the Z-axis direction moving plate 106 in the +X direction.

A drive source 112 such as a stepping motor is provided at the upper end of the ball screw 110 . When the drive source 112 is driven, the Z-axis direction moving plate 106 moves along the Z-axis direction together with the grinding unit 90 .

When grinding the wafer 11, first, the holding table 88 is arranged in the loading/unloading area A1. Then, the wafer 11 is arranged on the holding surface 88a so that the back surface 11b faces upward (loading step). Thereafter, the wafer 11 is held by suction on the holding surface 88a (holding step).

Then, the holding table 88 is arranged in the processing area A2. Next, the holding table 88 is rotated around a predetermined rotation axis. Further, while supplying grinding water to the wafer 11, the spindle 94 is rotated, and the grinding unit 90 is moved in the -Z direction at a predetermined speed (ie, fed for grinding).

When the bottom surface side of the grinding wheel 100b comes into contact with the back surface 11b side, the back surface 11b side is ground (grinding step). In the grinding process, the holding table 88 does not move along the X-axis direction. 40, the second sheet 42 and the like.

After grinding the back surface 11b side of the wafer 11 to a predetermined thickness, the grinding unit 90 is lifted, the holding table 88 is returned to the loading/unloading area A1, and the wafer 11 is unloaded from the holding surface 88a (unloading step).

The first sheet 40, the second sheet 42, and the like have a function of preventing grinding water from entering a predetermined region C (see FIG. 3) in the grinding device 84. As shown in FIG. Also in this embodiment, the predetermined area C is provided with the above-described X-axis direction moving mechanism 28 .

When the first sheet 40 and the second sheet 42 expand and contract along the X-axis direction in which the holding table 88 moves, it is difficult for a valley to be formed. Therefore, from the carry-in process to the carry-out process, the first sheet 40 and the second sheet 42 are prevented from being damaged or broken due to pinching processing scraps such as offcuts and grinding scraps.

The used grinding water containing offcuts, chips, etc. flows through the table cover 24, the first sheet 40 and the second sheet 42 to the drain pan 56 (see FIGS. 3 and 4). Also in the third embodiment, various modifications are possible by applying the first to third modifications of the above-described first embodiment.

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. For example, the structures of the table cover 24, the first sheet 40, the second sheet 42, etc. in the grinding device 84 can also be applied to a wet polishing device (not shown) that polishes the wafer 11 while supplying slurry.

In the above description, an example in which the bellows-shaped cover portion is not used at all is described. may use a conventional bellows-like cover member.

2: cutting device (processing device), 4: operation panel, 4a: opening, 6: monitor 8: cassette, 10: cassette table, 12: elevator 11: wafer (workpiece), 11a: front surface, 11b: back surface 13 : dicing tape 15: frame 17: wafer unit 14: push-pull arm 16: positioning member 18: first transport unit 19: protective tape 20: holding table 20a: holding surface 20b: clamp unit 24: Table cover 26: θ table 28: X-axis direction movement mechanism 30: X-axis direction movement plate 32: X-axis guide rail 34: Ball screw 36: Drive source 40: First sheet 40a: First bend 40b: second bent portion 42: second sheet 42a: first bent portion 42b: second bent portion 44: cutting unit (processing unit)
46: Spindle housing, 48: Spindle, 50: Cutting blade 52: Blade cover, 54: Cutting water (processing water)
56: drain pan 56a ₁ : first inner peripheral wall 56a ₂ : second inner peripheral wall 56a ₃ : third inner peripheral wall 56a ₄ : fourth inner peripheral wall 56b: bottom plate 56c ₁ : first outer peripheral wall 56c ₂ : second Outer peripheral wall 56c ₃ : third outer peripheral wall 56c ₄ : fourth outer peripheral wall 56d ₁ : first top plate 56d ₂ : second top plate 56d ₃ : third top plate 56d ₄ : fourth top plate 56e: center Opening 58: Cutting water supply unit 60: Imaging unit 62: Moving block 64: Z-axis direction moving mechanism 66: Y-axis direction moving block 68: Y-axis direction moving mechanism 70: Second transport unit 72: Spinner cleaning mechanism 74: Control unit 80: Third seat 82: Fourth seat 84: Grinding device (processing device)
86: Base, 86a: Opening, 88: Holding table, 88a: Holding surface 90: Grinding unit (processing unit), 92: Spindle housing, 94: Spindle 96: Rotation drive source, 98: Mount 100: Grinding wheel, 100a : Wheel base 100b: Grinding wheel 102: Fixed member 104: Z-axis direction moving mechanism 106: Z-axis direction moving plate 108: Guide rail 110: Ball screw 112: Drive source A1: Loading/unloading area A2 : working area, A3: moving area, B: sheet, C: predetermined area

Claims (7)

a holding table that holds the workpiece;
a machining unit that carries out machining while supplying machining water to the workpiece held by the holding table;
a moving mechanism for moving the holding table along a predetermined direction;
a rubber sheet that is provided in a movement area of the holding table along the predetermined direction, prevents the processing water from entering a predetermined area in the processing apparatus, and has elasticity along the predetermined direction;
A processing device comprising: 2. The processing apparatus according to claim 1, wherein said predetermined area includes an area where said moving mechanism is provided. The sheet is
a first sheet arranged on one side of the holding table in the predetermined direction;
3. The processing apparatus according to claim 1, further comprising a second sheet arranged on the other side of said holding table in said predetermined direction. The sheet is
a third sheet arranged on the one side of the first sheet in the predetermined direction;
a fourth sheet arranged on the other side of the second sheet in the predetermined direction;
The first sheet has higher durability than the third sheet,
4. The processing apparatus according to claim 3, wherein the second sheet has higher durability than the fourth sheet. The third sheet has higher stretchability than the first sheet,
5. The processing apparatus according to claim 4, wherein said fourth sheet has higher stretchability than said second sheet. The second sheet is arranged in a direction in which the processing water scatters in the predetermined direction from the position of the holding table,
4. The processing apparatus according to claim 3, wherein the second sheet has higher durability than the first sheet. 3. The processing apparatus according to claim 1, wherein the sheet is provided over the entire movement area.

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