JP7418328B2 - ハイパワーのレーザグリッド構造 - Google Patents
ハイパワーのレーザグリッド構造 Download PDFInfo
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- JP7418328B2 JP7418328B2 JP2020530452A JP2020530452A JP7418328B2 JP 7418328 B2 JP7418328 B2 JP 7418328B2 JP 2020530452 A JP2020530452 A JP 2020530452A JP 2020530452 A JP2020530452 A JP 2020530452A JP 7418328 B2 JP7418328 B2 JP 7418328B2
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- 238000000034 method Methods 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 49
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 33
- 238000003491 array Methods 0.000 claims description 30
- 229910021389 graphene Inorganic materials 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 27
- 230000001427 coherent effect Effects 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 82
- 229910052751 metal Inorganic materials 0.000 description 75
- 239000002184 metal Substances 0.000 description 75
- 238000013461 design Methods 0.000 description 44
- 230000003647 oxidation Effects 0.000 description 44
- 238000007254 oxidation reaction Methods 0.000 description 44
- 230000008569 process Effects 0.000 description 32
- 239000007943 implant Substances 0.000 description 31
- 238000007747 plating Methods 0.000 description 30
- 239000000463 material Substances 0.000 description 25
- 238000000206 photolithography Methods 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 20
- 238000005530 etching Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 14
- 239000011295 pitch Substances 0.000 description 13
- 150000002500 ions Chemical class 0.000 description 12
- 238000002955 isolation Methods 0.000 description 9
- 238000004380 ashing Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 230000004044 response Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 229910004205 SiNX Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 229910017090 AlO 2 Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910015844 BCl3 Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000002178 crystalline material Substances 0.000 description 2
- 230000007123 defense Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000008713 feedback mechanism Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001151 AlNi Inorganic materials 0.000 description 1
- 241000115929 Anabolia appendix Species 0.000 description 1
- -1 GaAs removal Chemical compound 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
- G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1021—Coupled cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1025—Extended cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18341—Intra-cavity contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
- H01S5/2063—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by particle bombardment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762543972P | 2017-08-11 | 2017-08-11 | |
| US62/543,972 | 2017-08-11 | ||
| PCT/US2018/046556 WO2019033120A1 (en) | 2017-08-11 | 2018-08-13 | HIGH POWER LASER GRID STRUCTURE |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020530666A JP2020530666A (ja) | 2020-10-22 |
| JP2020530666A5 JP2020530666A5 (enExample) | 2021-09-24 |
| JP7418328B2 true JP7418328B2 (ja) | 2024-01-19 |
Family
ID=65272675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020530452A Active JP7418328B2 (ja) | 2017-08-11 | 2018-08-13 | ハイパワーのレーザグリッド構造 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP3665753A4 (enExample) |
| JP (1) | JP7418328B2 (enExample) |
| AU (1) | AU2018314281B2 (enExample) |
| CA (1) | CA3072763A1 (enExample) |
| WO (1) | WO2019033120A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7583266B2 (ja) | 2021-02-12 | 2024-11-14 | 日亜化学工業株式会社 | 発光装置 |
| GB2614300B (en) * | 2021-12-23 | 2025-02-19 | Toshiba Kk | A photon source and method of fabricating a photon source |
| US20250062597A1 (en) * | 2023-08-17 | 2025-02-20 | Ii-Vi Delaware, Inc. | Semiconductor Laser Assembly with Thin Film Lithium Compound Waveguide |
| US20250347781A1 (en) * | 2024-05-08 | 2025-11-13 | Aurora Operations, Inc. | Manufacturing Process for Semiconductor Optical Device for LIDAR Sensor System |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001083460A (ja) | 1999-09-14 | 2001-03-30 | Hamamatsu Photonics Kk | レーザ装置 |
| US20030026303A1 (en) | 1998-07-22 | 2003-02-06 | Toshihiko Ouchi | Apparatus with an optical functional device having a special wiring electrode and method for fabricating the same |
| JP2007173393A (ja) | 2005-12-20 | 2007-07-05 | Denso Corp | レーザ装置 |
| JP2013541854A (ja) | 2010-11-03 | 2013-11-14 | コーニンクレッカ フィリップス エヌ ヴェ | 垂直外部キャビティ面発光レーザに対する光学素子 |
| US20140079088A1 (en) | 2009-12-19 | 2014-03-20 | Trilumina Corporation | System and method for combining laser arrays for digital outputs |
| US20150171375A1 (en) | 2012-03-08 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| US20160164261A1 (en) | 2009-02-17 | 2016-06-09 | Trilumina Corp. | Compact multi-zone infrared laser illuminator |
| JP2016519436A (ja) | 2013-04-22 | 2016-06-30 | トリルミナ コーポレーション | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
| US20170033535A1 (en) | 2015-07-30 | 2017-02-02 | Optipulse Inc. | Rigid High Power and High Speed Lasing Grid Structures |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978408A (en) * | 1997-02-07 | 1999-11-02 | Xerox Corporation | Highly compact vertical cavity surface emitting lasers |
| US20060023757A1 (en) * | 2004-07-30 | 2006-02-02 | Aram Mooradian | Apparatus, system, and method for wavelength conversion of mode-locked extended cavity surface emitting semiconductor lasers |
| US10038304B2 (en) * | 2009-02-17 | 2018-07-31 | Trilumina Corp. | Laser arrays for variable optical properties |
| US9946089B2 (en) * | 2015-10-21 | 2018-04-17 | Princeton Optronics, Inc. | Generation of coded structured light patterns using VCSEL arrays |
-
2018
- 2018-08-13 EP EP18843018.5A patent/EP3665753A4/en active Pending
- 2018-08-13 WO PCT/US2018/046556 patent/WO2019033120A1/en not_active Ceased
- 2018-08-13 JP JP2020530452A patent/JP7418328B2/ja active Active
- 2018-08-13 CA CA3072763A patent/CA3072763A1/en active Pending
- 2018-08-13 AU AU2018314281A patent/AU2018314281B2/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030026303A1 (en) | 1998-07-22 | 2003-02-06 | Toshihiko Ouchi | Apparatus with an optical functional device having a special wiring electrode and method for fabricating the same |
| JP2001083460A (ja) | 1999-09-14 | 2001-03-30 | Hamamatsu Photonics Kk | レーザ装置 |
| JP2007173393A (ja) | 2005-12-20 | 2007-07-05 | Denso Corp | レーザ装置 |
| US20160164261A1 (en) | 2009-02-17 | 2016-06-09 | Trilumina Corp. | Compact multi-zone infrared laser illuminator |
| US20140079088A1 (en) | 2009-12-19 | 2014-03-20 | Trilumina Corporation | System and method for combining laser arrays for digital outputs |
| JP2013541854A (ja) | 2010-11-03 | 2013-11-14 | コーニンクレッカ フィリップス エヌ ヴェ | 垂直外部キャビティ面発光レーザに対する光学素子 |
| US20150171375A1 (en) | 2012-03-08 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| JP2016519436A (ja) | 2013-04-22 | 2016-06-30 | トリルミナ コーポレーション | 高周波動作のための光電子装置のマルチビームアレイ用マイクロレンズ |
| US20170033535A1 (en) | 2015-07-30 | 2017-02-02 | Optipulse Inc. | Rigid High Power and High Speed Lasing Grid Structures |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2018314281A1 (en) | 2020-04-02 |
| EP3665753A4 (en) | 2021-04-21 |
| EP3665753A1 (en) | 2020-06-17 |
| JP2020530666A (ja) | 2020-10-22 |
| AU2018314281B2 (en) | 2024-02-01 |
| WO2019033120A1 (en) | 2019-02-14 |
| CA3072763A1 (en) | 2019-02-14 |
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