JP7418050B2 - 光学系装置 - Google Patents

光学系装置 Download PDF

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Publication number
JP7418050B2
JP7418050B2 JP2022563212A JP2022563212A JP7418050B2 JP 7418050 B2 JP7418050 B2 JP 7418050B2 JP 2022563212 A JP2022563212 A JP 2022563212A JP 2022563212 A JP2022563212 A JP 2022563212A JP 7418050 B2 JP7418050 B2 JP 7418050B2
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JP
Japan
Prior art keywords
light
optical element
lens
distance
pitch
Prior art date
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JP2022563212A
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English (en)
Japanese (ja)
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JPWO2023026987A1 (https=
JPWO2023026987A5 (https=
Inventor
晃史 縄田
智宣 中村
覚 田中
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Scivax Corp
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Scivax Corp
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Publication of JPWO2023026987A5 publication Critical patent/JPWO2023026987A5/ja
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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0037Arrays characterized by the distribution or form of lenses
    • G02B3/0056Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • H01S5/423Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Lenses (AREA)
JP2022563212A 2021-08-25 2022-08-19 光学系装置 Active JP7418050B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021137560 2021-08-25
JP2021137560 2021-08-25
PCT/JP2022/031411 WO2023026987A1 (ja) 2021-08-25 2022-08-19 光学系装置

Publications (3)

Publication Number Publication Date
JPWO2023026987A1 JPWO2023026987A1 (https=) 2023-03-02
JPWO2023026987A5 JPWO2023026987A5 (https=) 2023-08-01
JP7418050B2 true JP7418050B2 (ja) 2024-01-19

Family

ID=85322146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022563212A Active JP7418050B2 (ja) 2021-08-25 2022-08-19 光学系装置

Country Status (4)

Country Link
EP (1) EP4394458A4 (https=)
JP (1) JP7418050B2 (https=)
CN (1) CN118103738A (https=)
WO (1) WO2023026987A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023090435A1 (ja) * 2021-11-19 2023-05-25 Scivax株式会社 光学系装置および光学素子製造方法
CN115224583B (zh) * 2022-06-21 2026-01-06 嘉兴驭光光电科技有限公司 基于微透镜阵列的激光投射模组
TW202424537A (zh) 2022-08-05 2024-06-16 日商Scivax股份有限公司 光學元件、光學系統裝置以及光學系統裝置的製造方法
WO2025057909A1 (ja) * 2023-09-11 2025-03-20 Scivax株式会社 光学系装置
WO2025220552A1 (ja) * 2024-04-16 2025-10-23 Scivax株式会社 光学系装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017131585A1 (en) 2016-01-26 2017-08-03 Heptagon Micro Optics Pte. Ltd. Multi-mode illumination module and related method
JP2018511034A (ja) 2015-01-29 2018-04-19 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. パターン化された照射を生成するための装置
WO2020222704A1 (en) 2019-04-29 2020-11-05 Ams Sensors Asia Pte. Ltd. Illumination apparatus
US11085609B1 (en) 2021-02-08 2021-08-10 Himax Technologies Limited Illumination device
WO2021230324A1 (ja) 2020-05-13 2021-11-18 Scivax株式会社 光学系装置および光学素子製造方法
CN115224583A (zh) 2022-06-21 2022-10-21 嘉兴驭光光电科技有限公司 基于微透镜阵列的激光投射模组

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859326B2 (en) 2002-09-20 2005-02-22 Corning Incorporated Random microlens array for optical beam shaping and homogenization

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018511034A (ja) 2015-01-29 2018-04-19 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. パターン化された照射を生成するための装置
WO2017131585A1 (en) 2016-01-26 2017-08-03 Heptagon Micro Optics Pte. Ltd. Multi-mode illumination module and related method
WO2020222704A1 (en) 2019-04-29 2020-11-05 Ams Sensors Asia Pte. Ltd. Illumination apparatus
WO2021230324A1 (ja) 2020-05-13 2021-11-18 Scivax株式会社 光学系装置および光学素子製造方法
JP7061823B2 (ja) 2020-05-13 2022-05-02 Scivax株式会社 光学系装置および光学素子製造方法
US11085609B1 (en) 2021-02-08 2021-08-10 Himax Technologies Limited Illumination device
CN115224583A (zh) 2022-06-21 2022-10-21 嘉兴驭光光电科技有限公司 基于微透镜阵列的激光投射模组

Also Published As

Publication number Publication date
EP4394458A4 (en) 2025-08-20
CN118103738A (zh) 2024-05-28
JPWO2023026987A1 (https=) 2023-03-02
EP4394458A1 (en) 2024-07-03
WO2023026987A1 (ja) 2023-03-02

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