JP7408017B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP7408017B2 JP7408017B2 JP2023529450A JP2023529450A JP7408017B2 JP 7408017 B2 JP7408017 B2 JP 7408017B2 JP 2023529450 A JP2023529450 A JP 2023529450A JP 2023529450 A JP2023529450 A JP 2023529450A JP 7408017 B2 JP7408017 B2 JP 7408017B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- main surface
- vehicle
- heat transfer
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61C—LOCOMOTIVES; MOTOR RAILCARS
- B61C17/00—Arrangement or disposition of parts; Details or accessories not otherwise provided for; Use of control gear and control systems
- B61C17/04—Arrangement or disposition of driving cabins, footplates or engine rooms; Ventilation thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20881—Liquid coolant with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Automation & Control Theory (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/022795 WO2022264301A1 (ja) | 2021-06-16 | 2021-06-16 | 電子機器 |
| JPPCT/JP2021/022795 | 2021-06-16 | ||
| PCT/JP2021/047825 WO2022264460A1 (ja) | 2021-06-16 | 2021-12-23 | 電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264460A1 JPWO2022264460A1 (https=) | 2022-12-22 |
| JPWO2022264460A5 JPWO2022264460A5 (https=) | 2023-08-22 |
| JP7408017B2 true JP7408017B2 (ja) | 2024-01-04 |
Family
ID=84525986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529450A Active JP7408017B2 (ja) | 2021-06-16 | 2021-12-23 | 電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240206132A1 (https=) |
| JP (1) | JP7408017B2 (https=) |
| DE (1) | DE112021007818T5 (https=) |
| WO (2) | WO2022264301A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023144914A1 (ja) * | 2022-01-26 | 2023-08-03 | 三菱電機株式会社 | 電子機器 |
| JPWO2025224805A1 (https=) * | 2024-04-22 | 2025-10-30 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000161880A (ja) | 1998-11-26 | 2000-06-16 | Toshiba Corp | ヒートパイプ式冷却器 |
| JP2001118976A (ja) | 1999-10-20 | 2001-04-27 | Hitachi Ltd | 電子部品の冷却装置 |
| JP2016107983A (ja) | 2014-12-03 | 2016-06-20 | アルストム トランスポート テクノロジーズ | 鉄道車両要素用の冷却エアローリック装置及び対応する鉄道車両 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174501A (ja) * | 1987-01-14 | 1988-07-19 | Toshiba Corp | 電気車の制御装置 |
| JPH01139019U (https=) * | 1988-03-18 | 1989-09-22 | ||
| JP3094780B2 (ja) * | 1994-04-05 | 2000-10-03 | 株式会社日立製作所 | 電子装置 |
| JP3469475B2 (ja) * | 1998-09-10 | 2003-11-25 | 株式会社東芝 | 鉄道車両用半導体冷却装置 |
| JP2003079164A (ja) * | 2001-08-31 | 2003-03-14 | Toshiba Transport Eng Inc | 電力変換装置 |
| JP5466073B2 (ja) * | 2010-04-23 | 2014-04-09 | 株式会社日立製作所 | 電力変換装置および鉄道車両 |
| JP6097648B2 (ja) * | 2013-07-10 | 2017-03-15 | 株式会社日立製作所 | 電力変換装置及びこれを搭載した鉄道車両 |
| US20160255746A1 (en) * | 2015-02-27 | 2016-09-01 | Laird Technologies, Inc. | Heat sinks including heat pipes and related methods |
| JP6494384B2 (ja) * | 2015-04-09 | 2019-04-03 | 三菱電機株式会社 | 車両用変圧器 |
| CN105845648A (zh) * | 2016-05-10 | 2016-08-10 | 成都中微电微波技术有限公司 | 一种微电子器件树形散热器 |
| JP7045457B2 (ja) * | 2017-12-08 | 2022-03-31 | ケーエムダブリュ・インコーポレーテッド | 電装素子の放熱装置 |
| JP2021022795A (ja) | 2019-07-26 | 2021-02-18 | キヤノン株式会社 | 画像読取装置 |
| KR20210061682A (ko) * | 2019-11-20 | 2021-05-28 | 주식회사 브이씨텍 | 하이브리드 냉각 구조를 갖는 철도 차량용 인버터 스택 |
-
2021
- 2021-06-16 WO PCT/JP2021/022795 patent/WO2022264301A1/ja not_active Ceased
- 2021-12-23 US US18/555,891 patent/US20240206132A1/en active Pending
- 2021-12-23 WO PCT/JP2021/047825 patent/WO2022264460A1/ja not_active Ceased
- 2021-12-23 DE DE112021007818.6T patent/DE112021007818T5/de active Granted
- 2021-12-23 JP JP2023529450A patent/JP7408017B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000161880A (ja) | 1998-11-26 | 2000-06-16 | Toshiba Corp | ヒートパイプ式冷却器 |
| JP2001118976A (ja) | 1999-10-20 | 2001-04-27 | Hitachi Ltd | 電子部品の冷却装置 |
| JP2016107983A (ja) | 2014-12-03 | 2016-06-20 | アルストム トランスポート テクノロジーズ | 鉄道車両要素用の冷却エアローリック装置及び対応する鉄道車両 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022264301A1 (ja) | 2022-12-22 |
| US20240206132A1 (en) | 2024-06-20 |
| WO2022264460A1 (ja) | 2022-12-22 |
| JPWO2022264460A1 (https=) | 2022-12-22 |
| DE112021007818T5 (de) | 2024-03-28 |
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