JP7396435B2 - Vapor chamber and vapor chamber mounting board - Google Patents

Description

The present invention relates to a vapor chamber having a sealed space in which a working fluid is sealed, a vapor chamber mounting board, and a vapor chamber metal sheet.

Vapor chambers (also called heat pipes) are used to cool devices that generate heat, such as central processing units (CPUs) used in mobile terminals such as mobile terminals and tablet terminals (for example, as described in patent documents (see 1). A working fluid is sealed in the vapor chamber, and this working fluid cools the device by absorbing heat from the device and releasing it to the outside.

More specifically, the working fluid in the vapor chamber receives heat from the device in a portion close to the device (evaporation section) and evaporates into vapor, and then the vapor moves to a position away from the evaporation section. It is cooled and condensed into a liquid. The liquefied working fluid passes through a flow path in the vapor chamber, is transported to the evaporation section, receives heat again in the evaporation section, and evaporates. In this way, the working fluid circulates in the vapor chamber while undergoing phase changes, that is, repeating evaporation and condensation, thereby transferring heat in the device and increasing heat transport efficiency.

Japanese Patent Application Publication No. 2007-315745

By the way, in the vapor chamber, a housing member that constitutes a part of the housing of a mobile terminal or the like is attached to the surface opposite to the surface to which the device is attached. The heat received by the metal sheet constituting the vapor chamber is released to the outside air via this housing member. This limits the cooling of the metal sheet, making it difficult to improve the heat transport efficiency of the vapor chamber.

The present invention has been made in consideration of these points, and an object of the present invention is to provide a vapor chamber, a vapor chamber mounting substrate, and a vapor chamber metal sheet that can improve heat transport efficiency.

The present invention
A vapor chamber that cools a cooled device mounted on a board,
A chamber body that receives heat from the device to be cooled and has a sealed space in which a working fluid is sealed, and a mounting surface that is attached to a surface of the device to be cooled that is opposite to a surface that is mounted on the substrate. , a vapor chamber comprising: a heat conduction part that conducts heat of the chamber body to the substrate;
I will provide a.

In addition, in the vapor chamber mentioned above, the said heat conduction part may be formed separately from the said chamber main body.

Moreover, in the vapor chamber described above, the heat conductive part may be formed integrally with the chamber main body.

Further, in the vapor chamber described above, the heat conductive portion may be formed in a frame shape around the mounting surface.

Further, in the vapor chamber described above, the heat conduction part may be provided outside the chamber main body in a plan view, and a bent part may be interposed between the heat conduction part and the chamber main body. good.

Moreover, the present invention
The vapor chamber described above;
the substrate;
a vapor chamber mounting board, comprising: the cooled device mounted on the board;
I will provide a.

Moreover, the present invention
A vapor chamber metal sheet for a vapor chamber having a sealed space filled with a working fluid and cooling a cooled device mounted on a substrate,
a sheet body having a mounting surface attached to a surface opposite to a surface of the device to be cooled that is mounted on the substrate, and receiving heat from the device to be cooled;
A metal sheet for a vapor chamber, comprising: a heat conduction part that conducts heat of the sheet body to the substrate;
I will provide a.

According to the present invention, heat transport efficiency can be improved.

FIG. 1 is a sectional view showing a vapor chamber mounting board according to a first embodiment of the present invention. FIG. 2 is a top view showing the vapor chamber of FIG. 1. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 4 is a sectional view taken along line BB in FIG. 2. FIG. 5 is a sectional view taken along line CC in FIG. FIG. 6 is a diagram for explaining the step of preparing the lower metal sheet in the method for manufacturing the vapor chamber of FIG. 2. FIG. 7 is a diagram for explaining the half-etching process of the lower metal sheet in the vapor chamber manufacturing method of FIG. 2. FIG. 8 is a diagram for explaining the wick attachment step in the vapor chamber manufacturing method of FIG. 2. FIG. 9 is a diagram for explaining a temporary fixing step in the vapor chamber manufacturing method of FIG. 2. FIG. 10 is a diagram for explaining the diffusion bonding step in the vapor chamber manufacturing method of FIG. 2. FIG. 11 is a diagram for explaining a step of sealing in a hydraulic fluid in the method for manufacturing the vapor chamber shown in FIG. 2. FIG. 12 is a diagram illustrating a step of attaching a heat conductive part in the vapor chamber manufacturing method of FIG. 2. FIG. 13 is a diagram for explaining a mounting process of mounting the vapor chamber of FIG. 2 onto a substrate. 14 is a top view showing a modification of the lower metal sheet of the vapor chamber of FIG. 2. FIG. 15 is a bottom view showing a modification of the upper metal sheet of the vapor chamber of FIG. 2. FIG. FIG. 16 is a sectional view of a vapor chamber in which the lower metal sheet of FIG. 14 and the upper metal sheet of FIG. 15 are joined. FIG. 17 is a sectional view showing a vapor chamber mounting board according to a second embodiment of the present invention. FIG. 18 is a sectional view showing a vapor chamber mounting board according to a third embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings attached to this specification, for convenience of illustration and ease of understanding, the scale, vertical and horizontal dimension ratios, etc. are appropriately changed and exaggerated from those of the actual drawings.

(First embodiment)
A vapor chamber, a vapor chamber mounting board, and a vapor chamber metal sheet in a first embodiment of the present invention will be described with reference to FIGS. 1 to 16. Here, the vapor chamber mounting board according to this embodiment means a board on which a vapor chamber for cooling a device to be cooled mounted on the board is mounted. Among these, the cooled device is an object to be cooled in the vapor chamber, and refers to a device that generates heat, such as a central processing unit (CPU) used in a mobile terminal such as a mobile terminal or a tablet terminal. The vapor chamber has a sealed space filled with a working fluid, and is a device for cooling a device to be cooled by repeatedly changing the phase of the working fluid in the sealed space. The vapor chamber is generally formed into a thin flat plate shape.

First, a vapor chamber mounting board 100 according to a first embodiment will be described using FIG.

As shown in FIG. 1, the vapor chamber mounting board 100 includes a board 101, a device 102 (cooled device) mounted on the board 101, a vapor chamber 1 mounted on the device 102 and cooling the device 102, It is equipped with

A thermally conductive sheet 103 is interposed between the device 102 and the vapor chamber 1. This thermally conductive sheet 103 is in close contact with the device 102 and the vapor chamber 1 to reduce the thermal resistance between the device 102 and the vapor chamber 1. By providing this heat conductive sheet 103, the heat generated in the device 102 can be efficiently conducted to the vapor chamber 1. Note that the thermally conductive sheet 103 is formed into a sheet shape from a material with good thermal conductivity. Thermal grease with good thermal conductivity can also be used instead of this thermally conductive sheet 103.

As shown in FIGS. 1 and 2, the vapor chamber 1 according to the present embodiment includes a chamber body 5 having a sealed space 3 in which a working fluid 2 is sealed, and a thermal conductor that conducts heat of the chamber body 5 to a substrate 101. Section 6. Among these, the chamber body 5 is composed of a lower sheet body 10X that constitutes at least a part of a lower metal sheet 10, which will be described later, and an upper sheet body 20X, which constitutes at least a part of an upper metal sheet that will be described later. There is. In this embodiment, the lower sheet body 10X constitutes the entire lower metal sheet 10, and the upper sheet body 20X constitutes the entire upper metal sheet 20.

The lower sheet body 10X (corresponding to the lower metal sheet 10 in this embodiment) of the chamber body 5 has a mounting surface 10c (described later) to which the device 102 is attached. This mounting surface 10c is provided closer to the substrate 101 than the sealed space 3 (lower side in FIG. 1). The upper surface 102a of the device 102 (the surface opposite to the surface 102b mounted on the substrate 101) is attached to the mounting surface 10c via a heat conductive sheet 103. The chamber body 5 receives heat from the device 102 via this mounting surface 10c.

The thermally conductive portion 6 is provided around this mounting surface 10c. The thermally conductive portion 6 forms a device housing portion 7 that accommodates the device 102 attached to the mounting surface 10c.

The heat conduction section 6 according to this embodiment will be explained in more detail.

In this embodiment, the heat conduction section 6 is formed separately from the chamber body 5, and is joined to the lower sheet body 10X of the chamber body 5. Further, the heat conductive portion 6 extends from the surface of the lower sheet main body 10X on the substrate 101 side (that is, the lower surface 10b) toward the substrate 101 side. The thermally conductive portion 6 has a thickness (the vertical dimension in FIG. 1) that allows it to come into contact with the substrate 101 when the vapor chamber 1 is attached on the device 102. That is, the thickness of the heat conductive portion 6 is approximately equal to the total thickness of the device 102 and the thickness of the heat conductive sheet 103. As a result, when the vapor chamber 1 is mounted on the substrate 101, the lower end of the heat conduction section 6 (that is, the heat conduction surface 6a described later) is in contact with the heat receiving section 101a (described later) of the substrate 101, and the chamber body 5 of heat can be released to the heat receiving part 101a.

Further, as shown in FIGS. 1 and 2, the heat conduction section 6 is formed in a frame shape around the mounting surface 10c of the lower sheet main body 10X, that is, around the device accommodating section 7 in plan view (described later). ing. Here, the heat conduction section 6 is continuously formed around the entire circumference of the device housing section 7, and is formed in a rectangular frame shape so as to surround the device housing section 7. This ensures a cross-sectional area perpendicular to the main movement direction of heat (the vertical direction in FIG. 1) in the heat conduction section 6. Although FIG. 2 shows an example in which the heat conduction part 6 is arranged at a position overlapping alignment holes 15 and 24, which will be described later, in a plan view, the position of the heat conduction part 6 in a plan view is as follows. The present invention is not limited to this, as long as the device accommodating portion 7 can be formed. Further, the planar shape of the heat conduction section 6 is not limited to a rectangular frame shape, but may be formed in any frame shape as long as the device housing section 7 can be formed therein. Further, the heat conductive portions 6 may be formed in a cylindrical shape, a prismatic shape, or the like in a plan view, and a plurality of them may be provided around the device 102. In this case, gaps may be formed between adjacent heat conductive parts 6 so that the heat conductive parts 6 as a whole are formed intermittently.

The material forming the thermally conductive part 6 is not particularly limited and can be any material as long as it has good thermal conductivity; for example, metal materials such as stainless steel, nickel, copper, and copper alloys are used. It is preferable that In this way, the heat conduction part 6 may be formed of a different material from the chamber body 5, or may be formed of the same material as the chamber body 5, as long as thermal conductivity can be ensured. .

The heat conduction section 6 has a heat conduction surface 6 a that conducts heat of the chamber body 5 to the substrate 101 . The thermally conductive surface 6a is provided on the surface of the thermally conductive portion 6 on the substrate 101 side (the lower surface shown in FIG. 1). The thermally conductive surface 6a is bonded to the substrate 101 by adhesive, silver paste, brazing, soldering, diffusion bonding, laser welding, or the like. However, the present invention is not limited to this, and the heat conductive surface 6a may be mechanically coupled to the substrate 101 by a coupling member (not shown) such as caulking. Note that the substrate 101 may have a heat receiving part 101a formed of a material with good thermal conductivity (for example, a metal material, etc.), and the heat conducting surface 6a may be joined or coupled to the heat receiving part 101a. suitable. In this case, heat from the thermally conductive portion 6 can be efficiently released to the substrate 101.

Further, the heat conductive portion 6 is joined to the lower surface 10b of the lower sheet body 10X of the chamber body 5. For example, the heat conductive portion 6 may be joined to the lower surface 10b by adhesive, silver paste, brazing, soldering, diffusion bonding, laser welding, or the like.

Note that by forming the heat conduction part 6 continuously around the entire circumference of the device housing part 7 and electrically connecting it to a ground electrode to provide a ground potential, the heat conduction part 6 can be used as a magnetic shield. It is also possible to add the following functions.

Next, the chamber body 5 of the vapor chamber 1 according to this embodiment will be explained using FIGS. 2 to 5.

As shown in FIGS. 2 to 5, the chamber body 5 of the vapor chamber 1 includes the lower sheet body 10X and the upper sheet body 20X provided on the lower sheet body 10X, as described above. There is. In this embodiment, the lower sheet main body 10X constitutes the entire lower metal sheet 10, and the upper sheet main body 20X constitutes the entire upper metal sheet 20. That is, the chamber body 5 according to the present embodiment includes a lower metal sheet 10 and an upper metal sheet 20 provided on the lower metal sheet 10. Therefore, in the following description, the lower metal sheet 10 is used in place of the lower sheet main body 10X, and the upper metal sheet 20 is used in place of the upper sheet main body 20X. Note that the lower metal sheet 10 and the upper metal sheet 20 each correspond to a vapor chamber metal sheet.

The device 102 accommodated in the device accommodating portion 7 is attached to the attachment surface 10c (the lower surface of the evaporator 11 described later) of the lower surface 10b of the lower metal sheet 10. The mounting surface 10c is a part of the lower surface 10b of the lower metal sheet 10, and in this embodiment is formed at the center of the vapor chamber 1 when viewed from above.

A sealed space 3 in which a working fluid 2 is sealed is formed between the lower metal sheet 10 and the upper metal sheet 20. Examples of the working fluid 2 include pure water, ethanol, methanol, acetone, and the like.

The lower metal sheet 10 and the upper metal sheet 20 are joined by diffusion bonding, which will be described later. In the form shown in FIG. 2, an example is shown in which the lower metal sheet 10 and the upper metal sheet 20 are both formed into a rectangular shape in plan view, but the invention is not limited to this. Here, the plane view refers to the surface of the vapor chamber 1 that receives heat from the device 102 (the lower surface 10b of the lower metal sheet 10, especially the mounting surface 10c), and the surface that releases the received heat (the upper surface 20b of the upper metal sheet 20). ), and corresponds to, for example, a state in which the vapor chamber 1 is seen from above (see FIG. 2) or a state seen from below.

Note that when the vapor chamber 1 is installed in a mobile terminal, the vertical relationship between the lower metal sheet 10 and the upper metal sheet 20 may be disrupted depending on the posture of the mobile terminal. However, in this embodiment, the metal sheet on the liquid phase side that receives heat from the device 102 is referred to as the lower metal sheet 10, and the metal sheet on the gas phase side that releases the received heat is referred to as the upper metal sheet 20. The description will be made assuming that the lower metal sheet 10 is placed on the lower side and the upper metal sheet 20 is placed on the upper side.

As shown in FIGS. 2 to 5, the lower metal sheet 10 is provided with an evaporation section 11 where the working fluid 2 evaporates to generate steam, and an upper surface 10a (the surface on the side of the upper metal sheet 20), and has a flat surface. The lower flow path recess 12 is formed into a rectangular shape when viewed. Among these, the lower flow path recess 12 constitutes a part of the sealed space 3 described above, and mainly evaporates the working fluid 2 (see FIGS. 3 to 5) condensed from the vapor generated in the evaporator 11. 11. This evaporation section 11 is a section where the working fluid 2 in the sealed space 3 evaporates by receiving heat from the device 102 attached to the mounting surface 10c of the lower metal sheet 10. Therefore, the term evaporator 11 is not limited to a portion that overlaps the device 102, but is used as a concept that includes a portion where the working fluid 2 can be evaporated even if it does not overlap the device 102. Although the evaporator 11 can be provided at any location on the lower metal sheet 10, FIG. 2 shows an example in which the evaporator 11 is provided at the center of the lower metal sheet 10. In this case, the attitude of the mobile terminal in which the vapor chamber 1 is installed can be suppressed from affecting the stabilization of the operation of the vapor chamber 1.

In the present embodiment, as shown in FIGS. 2, 3, and 5, in the lower flow path recess 12 of the lower metal sheet 10, from the bottom surface 12a (described later) to the upper (bottom surface) A plurality of lower channel protrusions 13 are provided that protrude in a direction perpendicular to 12a. In this embodiment, an example is shown in which the lower channel protrusion 13 is formed as a cylindrical boss, and includes an upper surface 13a and side surfaces. Further, the lower channel protrusions 13 are arranged at equal intervals along the longitudinal direction of the vapor chamber 1 (the left-right direction in FIG. 2). Further, the lower channel protrusion 13 is also arranged along the transverse direction of the vapor chamber 1 (the lateral direction perpendicular to the longitudinal direction, the vertical direction in FIG. 2). A bottom surface 12a of the lower channel recess 12 is formed around the lower channel protrusion 13 arranged in this manner. In this way, the vapor of the working fluid 2 is configured to flow around the lower channel protrusion 13, and the flow of the vapor is prevented from being obstructed. Further, the lower flow passage protrusion 13 is arranged so as to overlap the corresponding upper flow passage protrusion 22 (described later) of the upper metal sheet 20 in plan view, and is designed to improve the mechanical strength of the vapor chamber 1. ing.

As shown in FIGS. 3 to 5, a wick W is provided in the lower channel recess 12. As shown in FIGS. Here, the wick is a member that is formed of, for example, a metal mesh made of copper wire pressed into an irregular shape, or a porous sintered body, and exhibits a capillary action. This wick W is configured to be able to provide a driving force toward the evaporation section 11 to the working fluid 2 within the lower channel recess 12 by exerting a capillary action. In this way, the working fluid 2 in the lower channel recess 12 condensed from steam is smoothly transported toward the evaporation section 11. Note that, as shown in FIGS. 3 to 5, the wick W may be provided over the entire area of the bottom surface 12a of the lower channel recess 12. The wick W provided in the evaporator 11 of the bottom surface 12a can increase the heat exchange area between the liquid working fluid 2 and the heat received from the device 102, and can contribute to improving thermal efficiency. On the other hand, the wick W provided around the evaporation section 11 on the bottom surface 12a can contribute to effectively transporting the liquid working fluid 2 to the evaporation section 11. The wick W is attached so as to be fitted into the region between the lower flow passage protrusions 13 in the lower flow passage recess 12, and is prevented from moving depending on the attitude of the vapor chamber 1. ing. Further, the height of the wick W can be set arbitrarily as long as it can increase the heat exchange area in the evaporator 11 and ensure the flow rate of the working fluid 2 toward the evaporator 11 by capillary action.

As shown in FIGS. 2 to 5, a lower peripheral wall 14 is provided at the peripheral edge of the lower metal sheet 10. As shown in FIGS. The lower peripheral wall 14 is formed to surround the sealed space 3 , particularly the lower channel recess 12 , and defines the sealed space 3 . Further, as shown in FIG. 2, lower alignment holes 15 for positioning the lower metal sheet 10 and the upper metal sheet 20 are provided at each of the four corners of the lower peripheral wall 14 in a plan view.

In this embodiment, the upper metal sheet 20 has the same structure as the lower metal sheet 10. That is, the vapor chamber 1 according to the present embodiment is configured such that when the lower metal sheet 10 is turned upside down, it becomes the upper metal sheet 20, and two metal sheets having the same structure as the lower metal sheet 10 are fabricated. Then, one side is turned upside down and joined to each other. Below, the structure of the upper metal sheet 20 will be explained in more detail.

As shown in FIGS. 2 to 5, the upper metal sheet 20 has an upper channel recess 21 provided on the lower surface 20a (the surface on the side of the lower metal sheet 10). This upper channel recess 21 constitutes a part of the sealed space 3 and is mainly configured to diffuse and cool the vapor generated in the evaporator 11. More specifically, the vapor in the upper channel recess 21 is diffused in a direction away from the evaporator 11, and most of the vapor is transported to the peripheral portion where the temperature is relatively low. Further, as shown in FIGS. 3 and 4, a housing member H that constitutes a part of a housing of a mobile terminal or the like is arranged on the upper surface 20b of the upper metal sheet 20. As a result, the steam in the upper channel recess 21 is cooled by the outside air via the upper metal sheet 20 and the housing member H.

In this embodiment, as shown in FIG. A plurality of upper channel protrusions 22 are provided that protrude downward (in a direction perpendicular to the ceiling surface 21a) from the bottom surface of the channel recess 21. In this embodiment, an example is shown in which the upper channel protrusion 22 is formed as a cylindrical boss, and includes a lower surface 22a and a side surface. Moreover, each upper channel protrusion part 22 extends along the longitudinal direction of the vapor chamber 1, and is spaced apart and arrange|positioned at equal intervals. Further, the upper channel protrusion 22 is also arranged along the transverse direction of the vapor chamber 1. A ceiling surface 21a of the upper channel recess 21 (a surface corresponding to the bottom surface 12a of the lower channel recess 12) is formed around the upper channel protrusion 22 arranged in this manner. In this way, the vapor of the working fluid 2 is configured to flow around the upper channel protrusion 22, and the flow of the vapor is prevented from being obstructed. Further, the upper channel protrusion 22 is arranged so as to overlap the corresponding lower channel protrusion 13 of the lower metal sheet 10 in a plan view, thereby improving the mechanical strength of the vapor chamber 1. .

As shown in FIGS. 2 to 5, an upper peripheral wall 23 is provided at the peripheral edge of the upper metal sheet 20. As shown in FIGS. The upper peripheral wall 23 is formed to surround the sealed space 3 , particularly the upper channel recess 21 , and defines the sealed space 3 . Further, as shown in FIG. 2, upper alignment holes 24 for positioning the lower metal sheet 10 and the upper metal sheet 20 are provided at each of the four corners of the upper peripheral wall 23 in plan view. That is, each upper alignment hole 24 is arranged so as to overlap each of the lower alignment holes 15 described above during temporary fixing, which will be described later, and is configured to enable positioning of the lower metal sheet 10 and the upper metal sheet 20. .

Such lower metal sheet 10 and upper metal sheet 20 are permanently joined to each other, preferably by diffusion bonding. More specifically, as shown in FIGS. 3 to 5, the upper surface 14a of the lower peripheral wall 14 of the lower metal sheet 10 and the lower surface 23a of the upper peripheral wall 23 of the upper metal sheet 20 are in contact with each other. The side peripheral wall 14 and the upper peripheral wall 23 are joined to each other. As a result, a sealed space 3 in which the working fluid 2 is sealed is formed between the lower metal sheet 10 and the upper metal sheet 20. Further, the upper surface 13a of the lower channel protruding portion 13 of the lower metal sheet 10 and the lower surface 22a of the upper channel protruding portion 22 of the upper metal sheet 20 are in contact with each other, and correspond to each lower channel protruding portion 13. The upper channel protrusions 22 are joined to each other. This improves the mechanical strength of the vapor chamber 1. In particular, since the lower flow path protrusions 13 and the upper flow path protrusions 22 according to the present embodiment are arranged at equal intervals, the mechanical strength at each position of the vapor chamber 1 can be equalized. Note that the lower metal sheet 10 and the upper metal sheet 20 may be joined by other methods such as brazing, instead of diffusion bonding, as long as they can be permanently joined.

Further, as shown in FIGS. 2 and 4, the vapor chamber 1 further includes an injection part 4 for injecting the working fluid 2 into the sealed space 3 at one end of the pair of longitudinal ends. There is. The injection section 4 has a lower injection projection 16 that projects from the end surface of the lower metal sheet 10 and an upper injection projection 25 that projects from the end surface of the upper metal sheet 20. A lower injection channel recess 17 is formed on the upper surface of the lower injection protrusion 16, and an upper injection channel recess 26 is formed on the lower surface of the upper injection protrusion 25. The lower injection channel recess 17 communicates with the lower channel recess 12 , and the upper injection channel recess 26 communicates with the upper channel recess 21 . The lower injection channel recess 17 and the upper injection channel recess 26 form an injection channel for the working fluid 2 when the lower metal sheet 10 and the upper metal sheet 20 are joined. The working fluid 2 is injected into the sealed space 3 through the injection channel. In addition, in this embodiment, an example is shown in which the injection part 4 is provided at one end of a pair of longitudinal ends of the vapor chamber 1, but the invention is not limited to this. do not have.

By the way, the materials used for the lower metal sheet 10 and the upper metal sheet 20 are not particularly limited as long as they have good thermal conductivity, but for example, the lower metal sheet 10 and the upper metal sheet 20 are made of copper. Alternatively, it is preferably made of a copper alloy. Thereby, the thermal conductivity of the lower metal sheet 10 and the upper metal sheet 20 can be increased. Therefore, the heat transport efficiency of the vapor chamber 1 can be improved. Further, the thickness T0 of the chamber body 5 of the vapor chamber 1 is 0.1 mm to 1.0 mm. In order to improve handling, the thickness T1 of the lower metal sheet 10 and the thickness T2 of the upper metal sheet 20 are preferably half the thickness of the vapor chamber 1, and T1 and T2 are preferably equal.

Next, the operation of this embodiment having such a configuration will be explained. Here, first, a method for manufacturing the vapor chamber 1 will be explained using FIGS. 6 to 12, but the explanation of the half-etching process of the upper metal sheet 20 will be simplified. Note that FIGS. 6 to 12 show cross sections similar to the cross section of FIG. 5.

First, as a main body manufacturing process, the chamber main body 5 of the vapor chamber 1 is manufactured.

In the main body manufacturing process, first, as a preparation process, as shown in FIG. 6, a flat metal material sheet M is prepared.

Subsequently, as a half-etching step, as shown in FIG. 7, the metal material sheet M is half-etched to form a lower metal sheet 10 having a lower channel recess 12 that forms a part of the sealed space 3. Ru. In this case, first, a resist film (not shown) is formed on the upper surface Ma of the metal material sheet M by photolithography in a pattern corresponding to the plurality of lower channel protrusions 13 and the lower peripheral wall 14. Subsequently, in a half-etching step, the upper surface Ma of the metal material sheet M is half-etched. As a result, a portion of the upper surface Ma of the metal material sheet M corresponding to the opening (not shown) in the resist film is half-etched, and the lower channel recess 12 and the lower channel protrusion as shown in FIG. 13 and a lower peripheral wall 14 are formed. At this time, the lower injection channel recess 17 shown in FIG. 2 is also formed at the same time, and the metal material sheet M is etched from the upper surface Ma and the lower surface so as to have the outer contour shape as shown in FIG. An external contour shape is obtained. After the half-etching process, the resist film is removed. Note that half etching means etching for forming a recess that does not penetrate the material. Therefore, the depth of the recess formed by half etching is not limited to half the thickness of the lower metal sheet 10. As the etching solution, for example, an iron chloride-based etching solution such as a ferric chloride aqueous solution, or a copper chloride-based etching solution such as a copper chloride aqueous solution can be used.

On the other hand, in the same manner as the lower metal sheet 10, a metal material sheet (not shown) for the upper metal sheet 20 is half-etched from the lower surface to form the upper channel recess 21, the upper channel protrusion 22, and the upper peripheral wall. 23 is formed. In this way, the upper metal sheet 20 described above is obtained.

Next, as a wick attachment step, as shown in FIG. 8, the wick W is inserted and fitted between the lower channel protrusions 13 of the lower channel recess 12.

Next, as a temporary fixing step, as shown in FIG. 9, the lower metal sheet 10 having the lower channel recess 12 and the upper metal sheet 20 having the upper channel recess 21 are temporarily fixed. In this case, first, by using the lower alignment hole 15 (see FIG. 2) of the lower metal sheet 10 and the upper alignment hole 24 (see FIG. 2) of the upper metal sheet 20, The seat 20 is positioned. Subsequently, the lower metal sheet 10 and the upper metal sheet 20 are fixed. The fixing method is not particularly limited, but for example, the lower metal sheet 10 and the upper metal sheet 20 may be fixed by resistance welding to the lower metal sheet 10 and the upper metal sheet 20. You can. In this case, as shown in FIG. 9, it is preferable to perform spot resistance welding using an electrode rod 40. Laser welding may be used instead of resistance welding. In this way, the lower metal sheet 10 and the upper metal sheet 20 are fixed in a positioned state.

After the temporary fixing process, as shown in FIG. 10, the lower metal sheet 10 and the upper metal sheet 20 are permanently joined by diffusion bonding as a diffusion bonding process. Diffusion bonding refers to bonding a lower metal sheet 10 and an upper metal sheet 20 to be bonded, applying pressure in a direction that brings the metal sheets 10 and 20 into close contact with each other in a reduced pressure atmosphere, and heating them to reduce atoms generated on the bonding surface. This is a bonding method that utilizes the diffusion of Diffusion bonding heats the materials of the lower metal sheet 10 and the upper metal sheet 20 to a temperature close to but below the melting point, thereby avoiding melting and deformation of each metal sheet 10, 20. More specifically, the upper surface 14a of the lower peripheral wall 14 of the lower metal sheet 10 and the lower surface 23a of the upper peripheral wall 23 of the upper metal sheet 20 serve as bonding surfaces and are diffusion bonded. As a result, a sealed space 3 is formed between the lower metal sheet 10 and the upper metal sheet 20 by the lower peripheral wall 14 and the upper peripheral wall 23 . Further, the lower injection channel recess 17 (see FIG. 2) and the upper injection channel recess 26 (see FIG. 2) form an injection channel for the working fluid 2 that communicates with the sealed space 3. Further, the upper surface 13a of the lower flow passage protrusion 13 of the lower metal sheet 10 and the lower surface 22a of the upper flow passage protrusion 22 of the upper metal sheet 20 serve as a bonding surface and are diffusion bonded to each other. Mechanical strength is improved.

In this way, the chamber body 5 according to this embodiment is manufactured.

After the main body fabrication process, as shown in FIG. 11, the hydraulic fluid 2 is injected into the sealed space 3 from the injection part 4 (see FIG. 2). At this time, first, the sealed space 3 is evacuated to reduce the pressure, and then the hydraulic fluid 2 is injected into the sealed space 3. During injection, the working fluid 2 passes through the injection channel formed by the lower injection channel recess 17 and the upper injection channel recess 26 .

After injection of the working fluid 2, the injection channel described above is sealed. For example, it is preferable to irradiate the injection part 4 with a laser to partially melt the injection part 4 and seal the injection channel. As a result, communication between the sealed space 3 and the outside air is cut off, and the hydraulic fluid 2 is sealed in the sealed space 3. In this way, the hydraulic fluid 2 in the sealed space 3 is prevented from leaking to the outside.

After the enclosing process, as shown in FIG. 12, the heat conductive part 6 is attached to the lower surface 10b of the lower metal sheet 10 of the chamber body 5 as a heat conductive part attachment process. In this case, for example, the lower metal sheet 10 and the heat conductive part 6 are joined by adhesive, brazing, soldering, diffusion bonding, laser welding, or the like. Since the vapor chamber 1 may be heated in the above-mentioned encapsulation process, the heat conductive part attaching process is particularly difficult when joining the heat conductive part 6 to the lower metal sheet 10 with adhesive or soldering. It is preferable to carry out the process after the encapsulation process in order to avoid applying heat to the agent and solder. Note that the heat conduction section 6 is formed separately from the chamber body 5 in advance. The heat conductive part 6 can be formed into a rectangular frame shape by etching or the like, but any method can be used to form it. For example, the heat conductive portion 6 may be formed on the lower surface 10b of the lower metal sheet 10 by plating.

In the manner described above, the vapor chamber 1 according to this embodiment is obtained.

The vapor chamber 1 obtained as described above is mounted on the substrate 101 on which the device 102 is mounted, as shown in FIG. 13 in a mounting step.

In this case, first, the thermally conductive sheet 103 is placed on the device 102 mounted on the substrate 101. Further, for example, an adhesive is applied to at least one of the heat conduction surface 6a of the heat conduction section 6 of the vapor chamber 1 and the heat receiving section 101a of the substrate 101.

Subsequently, the vapor chamber 1 is mounted on the substrate 101 on which the device 102 is mounted. As a result, as shown in FIG. 1, the device 102 is housed in the device accommodating portion 7 of the vapor chamber 1 and is attached to the mounting surface 10c of the lower metal sheet 10 of the chamber body 5 via the thermally conductive sheet 103. It is attached. Further, the heat conductive surface 6a of the heat conductive part 6 is bonded to the heat receiving part 101a of the substrate 101 with an adhesive. In this way, vapor chamber mounting substrate 100 according to this embodiment is obtained.

The vapor chamber mounting board obtained as described above is installed in a housing of a mobile terminal or the like.

Next, a method of operating the vapor chamber 1, that is, a method of cooling the device 102 will be explained.

When the lower metal sheet 10 is arranged vertically downward and the upper metal sheet 20 is arranged vertically upward, most of the hydraulic fluid 2 sealed in the sealed space 3 is influenced by gravity and flows downward. It stays in the lower channel recess 12 of the metal sheet 10.

When the device 102 generates heat in this state, the working fluid 2 present in the evaporation section 11 of the lower channel recess 12 receives heat from the device 102. The received heat is absorbed as latent heat, the working fluid 2 evaporates (vaporizes), and vapor of the working fluid 2 is generated. Most of the generated vapor rises within the sealed space 3 and diffuses into the upper channel recess 21. A portion of the generated vapor also diffuses within the lower channel recess 12 of the lower metal sheet 10. The steam in the upper flow path recess 21 and the lower flow path recess 12 leaves the evaporation section 11, and most of the steam is transported to the peripheral portion where the temperature is relatively low (see solid line arrows in FIG. 4). The diffused vapor radiates heat to the lower metal sheet 10 and upper metal sheet 20 of the chamber body 5 and is cooled. A portion of the heat received by the lower metal sheet 10 and the upper metal sheet 20 from the steam is transferred to the outside air via the housing member H (see FIGS. 3 and 4).

A part of the heat received by the lower metal sheet 10 and the upper metal sheet 20 of the chamber body 5 from the vapor of the working fluid 2 is also conducted to the substrate 101 on which the device 102 is mounted via the heat conduction part 6. Heat from each metal sheet 10, 20 can be released to the substrate 101. In this way, the heat of the chamber body 5 is radiated not only through the housing member H but also through the heat conduction part 6 and the substrate 101, so that the heat radiation path of the chamber body 5 can be increased. This allows each metal sheet 10, 20 to be efficiently cooled, thereby efficiently cooling the vapor of the working fluid 2 in the lower channel recess 12 and upper channel recess 21 of the sealed space 3. can do. Therefore, the rate of condensation of the vapor in the sealed space 3 can be increased, and the phase change of the working fluid 2 can be promoted.

The steam radiates heat to the lower metal sheet 10 and the upper metal sheet 20, thereby losing the latent heat absorbed in the evaporator 11 and condensing. The hydraulic fluid 2 that has become liquefied in the upper flow path recess 21 descends within the upper flow path recess 21 and reaches the lower flow path recess 12 . Since the working fluid 2 continues to evaporate in the evaporation section 11, the working fluid 2 in the lower channel concave section 12 other than the evaporation section 11 is transported toward the evaporation section 11 (as indicated by the broken line arrow in FIG. 4). reference). At this time, the lower channel recess 12 is provided with a wick W capable of exerting capillary action. Therefore, due to the capillary action of the wick W, the working fluid 2 obtains a driving force toward the evaporation section 11 and is smoothly transported toward the evaporation section 11.

The working fluid 2 that has reached the evaporator 11 receives heat from the device 102 again and evaporates. In this way, the working fluid 2 circulates within the vapor chamber 1 while repeating phase changes, that is, evaporation and condensation, thereby transferring and discharging the heat of the device 102. As a result, device 102 is cooled.

As described above, according to the present embodiment, the heat of the chamber body 5 is conducted to the substrate 101 by the heat conduction section 6. Thereby, the heat of the chamber body 5 can be released to the substrate 101, and the working fluid 2 in the sealed space 3 can be efficiently condensed. Therefore, the phase change of the working fluid 2 can be promoted, and the heat transport efficiency of the vapor chamber 1 can be improved.

Further, according to this embodiment, the heat conduction section 6 is formed separately from the chamber body 5. In this case, an etching process for forming the device housing portion 7 can be made unnecessary. This makes it possible to reduce the amount of material used in the metal material sheet M (see FIG. 6) before etching that is prepared to form the vapor chamber 1.

Further, according to the present embodiment, the heat conductive portion 6 is formed in a frame shape around the mounting surface 10c of the lower metal sheet 10. This makes it possible to ensure the area of the cross section perpendicular to the main movement direction of heat in the heat conduction part 6, while avoiding interference of the heat conduction part 6 with the device 102. Therefore, the heat conduction section 6 allows the heat of the lower metal sheet 10 and the upper metal sheet 20 of the chamber body 5 to be efficiently released to the heat receiving section 101a of the substrate 101.

In the present embodiment described above, the sealed space 3 is configured such that the vapor generated in the evaporator 11 mainly diffuses within the upper channel recess 21, and the liquid working fluid 2 condensed from the vapor diffuses. , an example in which the liquid is transported to the evaporation section 11 by the wick W provided in the lower channel recess 12 has been described. However, the configuration of the sealed space 3 is not limited to this. For example, the sealed space 3 is configured such that the wick W is not provided in the lower flow path recess 12 and the vapor generated in the evaporator 11 mainly diffuses within the lower flow path recess 12 and the upper flow path recess 21. The liquid working fluid 2 condensed from vapor may be transported to the evaporation section 11 by a liquid flow path recess 30 that is different from the lower flow path recess 12 and the upper flow path recess 21. An example of the configuration of the chamber body 5 of the vapor chamber 1 in this case will be explained using FIGS. 14 to 16.

In the form shown in FIG. 14, the lower channel protrusion 13 of the lower metal sheet 10 extends in an elongated shape along the longitudinal direction of the vapor chamber 1 (the left-right direction in FIG. 14). The lower channel protrusions 13 are arranged parallel to each other and spaced apart at equal intervals. In this way, the vapor of the working fluid 2 flows around each of the lower channel protrusions 13 and is transported to the periphery of the lower channel recess 12 (see solid line arrows in FIG. 14). This structure prevents the flow of steam from being obstructed.

As shown in FIG. 15, the upper channel protrusion 22 of the upper metal sheet 20 extends in an elongated shape along the longitudinal direction of the vapor chamber 1 (the left-right direction in FIG. 15). The upper channel protrusions 22 are arranged parallel to each other and spaced apart at equal intervals. In this way, the structure is such that the vapor of the working fluid 2 flows around each upper channel protrusion 22 and is transported to the periphery of the upper channel recess 21 (see the solid arrow shown in FIG. 15). This prevents the flow of steam from being obstructed. The upper channel protrusion 22 is arranged so as to overlap the corresponding lower channel protrusion 13 of the lower metal sheet 10 in plan view, and is intended to improve the mechanical strength of the vapor chamber 1.

The above-mentioned liquid flow path recess 30 is provided on at least one of the upper surface 13a of the lower flow path projection 13 and the lower surface 22a of the upper flow path projection 22. Here, as shown in FIGS. 14 and 16, an example will be described in which a liquid flow path recess 30 is provided on the upper surface 13a of the lower flow path protrusion 13.

As shown in FIG. 14, the liquid flow path concave portion 30 is shown as an example extending in an elongated shape along the longitudinal direction (left and right direction in FIG. 14) of the lower flow path protrusion 13. The channel protrusion 13 extends from one end to the other end in the longitudinal direction. As shown in FIG. 16, the width of the liquid flow path recess 30 is smaller than the width of the lower flow path protrusion 13, and smaller than the interval between adjacent lower flow path protrusions 13. In this way, the liquid flow path recess 30 transports the liquid working fluid 2 condensed at the periphery of the lower flow path recess 12 and the upper flow path recess 21 to the evaporation section 11 by capillary action. (See the broken line arrow shown in FIG. 14). A plurality of liquid flow path recesses 30 are formed on the upper surface 13a of one lower flow path protrusion 13, and each liquid flow path recess 30 is arranged parallel to each other and spaced apart at equal intervals. .

Note that, from one end to the other end of the lower flow path protrusion 13, each liquid flow path recess 30 communicates with the lower flow path recess 12 through a plurality of communication recesses (not shown). As a result, in the evaporator 11, when the liquid working fluid 2 in the liquid flow path recess 30 evaporates, it is diffused into the lower flow path recess 12 and the upper flow path recess 21, which have a large flow cross-sectional area, and is separated from the vapor. The condensed liquid working fluid 2 enters into the liquid flow path recess 30 from the lower flow path recess 12 and the upper flow path recess 21 .

(Second embodiment)
Next, a vapor chamber, a vapor chamber mounting board, and a vapor chamber metal sheet in a second embodiment of the present invention will be described using FIG. 17.

The second embodiment shown in FIG. 17 is mainly different from the first embodiment shown in FIGS. 1 to 16 in that the heat conduction part is formed integrally with the chamber body. It is almost the same as the shape. Note that in FIG. 17, the same parts as in the first embodiment shown in FIGS. 1 to 16 are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 17, in this embodiment, the heat conduction section 6 is formed integrally with the lower sheet body 10X of the chamber body 5. That is, in the present embodiment, the lower sheet main body 10X constitutes a part of the lower metal sheet 10, and the lower metal sheet 10 is constituted by the lower sheet main body 10X and the heat conductive portion 6. has been done. This lower metal sheet 10 corresponds to the vapor chamber metal sheet according to this embodiment. Note that the lower sheet main body 10X corresponds to a portion mainly constituted by the evaporator section 11, the lower channel recess 12, the lower channel protrusion 13, and the lower peripheral wall 14.

Also in this embodiment, the heat conduction part 6 is formed in a rectangular frame shape around the mounting surface 10c of the lower sheet main body 10X, that is, around the device housing part 7, and the heat conductive part 6 is formed in a rectangular frame shape around the lower sheet main body 10X of the chamber main body 5. It extends from the lower surface 10b toward the substrate 101 side.

That is, the lower metal sheet 10 according to the present embodiment is obtained by preparing a metal material sheet (not shown) having a thickness that allows the formation of the lower sheet main body 10X of the chamber main body 5 and the thermally conductive portion 6. It is obtained by forming a recess on the lower surface of a metal material sheet. This recess corresponds to the device housing section 7 described above. In this way, the heat conduction section 6 formed in the shape of a rectangular frame around the device accommodating section 7 is integrated with the lower sheet main body 10X of the chamber main body 5. Note that, although it is preferable to form the recessed portion by half etching, the method is not limited thereto. When forming the device housing part 7 by half etching, for example, a second half etching process for forming the device housing part 7 is performed between the diffusion bonding process shown in FIG. 10 and the encapsulation process shown in FIG. It is preferable to carry out the following. In this case, in the diffusion bonding step, since the lower surface 10b of the lower metal sheet 10 remains, the lower metal sheet 10 can be evenly pressurized and diffusion bonding can be suitably performed. However, the invention is not limited to this, and from the viewpoint of avoiding complication of the process, the device housing part 7 is formed at the same time as the lower channel recess 12 and the like in the half-etching process shown in FIG. Good too.

By the way, in the vapor chamber 1 shown in FIG. 17, a second lower flow passage recess 18 that constitutes the sealed space 3 is provided in the lower sheet main body 10X. This second lower flow passage recess 18 is formed extending from the lower sheet main body 10X to the heat conduction section 6. Further, the upper sheet body 20X is provided with a second upper passage recess 27 that constitutes the sealed space 3. In this manner, by utilizing the area of the heat conduction portion 6, it is possible to form the second lower flow passage recess 18 and the second upper flow passage recess 27 having a relatively large flow passage cross-sectional area. In this case, the vapor of the working fluid 2 can be more easily diffused, and the efficiency of vapor transport can be improved. In addition, in the flow path constituted by the second lower flow path recess 18 and the second upper flow path recess 27, there is provided a channel for transporting the condensed and liquid working fluid 2 to the evaporation section 11. , a wick W shown in FIG. 3 or the like may be provided.

As described above, according to the present embodiment, the heat of the chamber body 5 is conducted to the substrate 101 by the heat conduction section 6. Thereby, the heat of the chamber body 5 can be released to the substrate 101, and the working fluid 2 in the sealed space 3 can be efficiently condensed. Therefore, the phase change of the working fluid 2 can be promoted, and the heat transport efficiency of the vapor chamber 1 can be improved.

Further, according to the present embodiment, the heat conduction portion 6 is formed integrally with the lower sheet body 10X of the chamber body 5. This can prevent thermal resistance from occurring between the lower sheet body 10X and the heat conduction section 6, and the heat of the chamber body 5 can be efficiently dissipated to the heat receiving section 101a of the substrate 101. Moreover, it is possible to prevent the number of parts for forming the vapor chamber 1 including the heat conduction part 6 from increasing, and to eliminate the need for the heat conduction part joining step shown in FIG. 12 described above.

Further, according to the present embodiment, the heat conduction section 6 is formed in a frame shape around the mounting surface 10c of the lower sheet main body 10X. By this, while avoiding the heat conduction part 6 from interfering with the device 102, the heat conduction part 6 has a cross-sectional area perpendicular to the main movement direction of heat (the vertical direction in FIG. 1) in the heat conduction part 6. can be ensured. Therefore, the heat conduction section 6 can efficiently release the heat of the chamber body 5 to the heat receiving section 101a of the substrate 101. In particular, according to the present embodiment, the heat conductive portion 6 is formed together with the device housing portion 7 by half-etching the lower surface of the lower sheet body 10X. Thereby, the planar area of the heat conduction section 6 can be easily increased.

In addition, in this embodiment mentioned above, the example in which the 2nd upper side channel recessed part 27 was provided in the upper side sheet|seat main body 20X was demonstrated. However, the present invention is not limited to this, and the second upper channel recess 27 may not be provided. Even in this case, the second lower flow passage recess 18 can ensure a flow passage cross-sectional area for diffusing the vapor of the working fluid 2, making it easier to diffuse the vapor of the working fluid 2. I can do it. In particular, when the second upper passage recess 27 is not provided, the upper passage recess 21 may be configured to mainly transport the liquid working fluid 2 to the evaporation section 11. In this case, the cross-sectional shape of the upper flow path recess 21 can be made smaller, for example, like the liquid flow path recess 30 shown in FIG. 16. That is, when the upper metal sheet 20 is configured so that the upper flow passage recess 21 formed as a part of the sealed space 3 mainly passes the liquid working fluid 2, the depth of the upper flow passage recess 21 is Can be made smaller. In this case, the thickness of the upper metal sheet 20 can be reduced, which can contribute to making the chamber body 5 of the vapor chamber 1 thinner.

(Third embodiment)
Next, a vapor chamber, a vapor chamber mounting board, and a vapor chamber metal sheet in a third embodiment of the present invention will be described using FIG. 18.

The third embodiment shown in FIG. 18 differs mainly in that the heat conduction part is formed integrally with the chamber body, and a bent part is interposed between the heat conduction part and the chamber body. , the other configurations are substantially the same as the first embodiment shown in FIGS. 1 to 16. In FIG. 18, the same parts as in the first embodiment shown in FIGS. 1 to 16 are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 18, in this embodiment, the heat conduction section 6 provided around the device housing section 7 is formed integrally with the chamber body 5 including the lower sheet body 10X and the upper sheet body 20X. ing. The heat conduction part 6 is provided outside the chamber body 5 in a plan view, and the bent part 50 is interposed between the heat conduction part 6 and the chamber body 5. Due to this bent portion 50, the heat conductive portion 6 is arranged closer to the substrate 101 than the chamber main body 5. The heat conduction portion 6 and the bending portion 50 are preferably formed continuously around the entire circumference of the chamber body 5, but may be formed intermittently in the circumferential direction.

The heat conduction section 6 according to this embodiment will be explained in more detail.

In this embodiment, the lower sheet main body 10X of the chamber main body 5 constitutes a part of the lower metal sheet 10, and the lower metal sheet 10 is connected to the lower sheet main body 10X and the lower heat conductive portion. 51 (described later) and a lower bent portion 53 (described later). Among these, the lower sheet main body 10X corresponds to a portion mainly constituted by the evaporator section 11, the lower channel recess 12, the lower channel protrusion 13, and the lower peripheral wall 14. Similarly, the upper sheet main body 20X constitutes a part of the upper metal sheet 20, and the upper metal sheet 20 is composed of the upper sheet main body 20X, an upper heat conductive part 52 (described later), and an upper bent part 54 (described later). It is composed of. Among these, the upper sheet main body 20X corresponds to a portion mainly constituted by the upper flow passage recess 21, the upper flow passage protrusion 22, and the upper peripheral wall 23.

The heat conduction part 6 includes a lower heat conduction part 51 connected to the lower peripheral wall 14 of the lower sheet main body 10X of the lower metal sheet 10, and an upper peripheral wall 23 of the upper sheet main body 20X of the upper metal sheet 20. It has a connected upper heat conductive part 52. Among these, a lower bent part 53 is interposed between the lower heat conductive part 51 and the lower peripheral wall 14, and an upper bent part 54 is interposed between the upper heat conductive part 52 and the upper peripheral wall 23. ing. The lower bent portion 53 and the upper bent portion 54 constitute the bent portion 50 described above. The lower heat conductive part 51 and the lower bent part 53 are continuously formed integrally with the lower peripheral wall 14 , and the upper heat conductive part 52 and the upper bent part 54 are formed integrally with the lower peripheral wall 23 . It is formed continuously and integrally. The lower heat conductive portion 51 and the upper heat conductive portion 52 are diffusion bonded, and the lower bent portion 53 and the upper bent portion 54 are diffusion bonded.

By providing the above-mentioned bent portion 50, the heat conductive surface 6a of the heat conductive portion 6 is displaced closer to the substrate 101 than the lower surface 10b of the lower metal sheet 10. The heat conducting surface 6a is in contact with the heat receiving portion 101a of the substrate 101, and is capable of conducting heat from the chamber body 5 to the substrate 101.

When manufacturing the vapor chamber 1 according to the present embodiment, in order to form the lower sheet main body 10X, the lower bent part 53, and the lower heat conductive part 51, the material has a size that allows formation of these parts. A metal material sheet (not shown) is used. Further, in order to form the upper sheet main body 20X, the upper bent portion 54, and the upper heat conductive portion 52, a metal material sheet (not shown) having a size that allows formation of these portions is used.

After the step of enclosing the hydraulic fluid 2 shown in FIG. 11, a bending step is performed. More specifically, the lower metal sheet 10 and the upper metal sheet 20 are bent on the side of the lower peripheral wall 14 and the upper peripheral wall 23 of the bent part 50 so that the lower bent part 53 is on the inside. . Moreover, on the side of the lower heat conductive part 51 and the upper heat conductive part 52 of the bent part 50, the lower metal sheet 10 and the upper metal sheet 20 are bent so that the upper bent part 54 is on the inside. In this way, the bent part 50 shown in FIG. 18 is formed, the heat conductive part 6 is displaced closer to the substrate 101 than the chamber main body 5, and a heat conductive surface 6a in contact with the heat receiving part 101a of the substrate 101 is obtained. .

After that, in the same manner as the mounting process shown in FIG. 13, the vapor chamber 1 is mounted on the substrate 101 on which the device 102 is mounted, and the vapor chamber mounting board 100 shown in FIG. 18 can be obtained.

As described above, according to the present embodiment, the heat of the chamber body 5 is conducted to the substrate 101 by the heat conduction section 6. Thereby, the heat of the chamber body 5 can be released to the substrate 101, and the working fluid 2 in the sealed space 3 can be efficiently condensed. Therefore, the phase change of the working fluid 2 can be promoted, and the heat transport efficiency of the vapor chamber 1 can be improved.

Further, according to the present embodiment, the heat conduction section 6 is formed integrally with the chamber body 5. This can prevent thermal resistance from occurring between the chamber body 5 and the heat conduction section 6, and the heat of the chamber body 5 can be efficiently dissipated to the heat receiving section 101a of the substrate 101. Moreover, it is possible to prevent the number of parts for forming the vapor chamber 1 including the heat conduction part 6 from increasing, and to eliminate the need for the heat conduction part joining step shown in FIG. 12 described above.

Furthermore, according to the present embodiment, a bent portion 50 is interposed between the heat conductive portion 6 and the chamber body 5. This allows the heat conduction surface 6a of the heat conduction part 6 to come into contact with the heat receiving part 101a of the substrate 101 while avoiding interference of the heat conduction part 6 with the device 102. Therefore, the heat of the chamber body 5 can be efficiently released to the heat receiving portion 101a of the substrate 101.

The present invention is not limited to the above-described embodiments and modifications as they are, but can be implemented by modifying the constituent elements within the scope of the invention at the implementation stage. Moreover, various inventions can be formed by appropriately combining the plurality of components disclosed in the above embodiments and modified examples. Some components may be deleted from all the components shown in the embodiments and modifications. Furthermore, components of different embodiments and modifications may be combined as appropriate.

For example, in the present embodiment described above, the lower flow passage protrusion 13 is provided as a boss in the lower flow passage recess 12 of the lower sheet main body 10X (or the lower metal sheet 10), and the upper sheet An example has been described in which the upper channel protrusion 22 is provided as a boss in the upper channel recess 21 of the main body 20X (or the upper metal sheet 20). However, the shapes and configurations of the lower flow path protrusion 13 and the upper flow path protrusion 22 are not limited to these and may be arbitrary.

1 Vapor chamber 2 Working fluid 3 Sealed space 5 Chamber body 6 Heat conduction section 10 Lower metal sheet 10X Lower sheet body 10c Mounting surface 20 Upper metal sheet 50 Bend section 100 Vapor chamber mounting board 101 Substrate 102 Device 102a Upper surface 102b Surface

Claims (7)

A vapor chamber that cools a cooled device mounted on a board,
a chamber body having a sealed space filled with a working fluid and receiving heat from the cooled device;
a heat conduction section that conducts heat from the chamber body to the substrate;
a first surface provided from the chamber main body to the thermally conductive portion;
a second surface provided across from the chamber body to the heat conduction section and disposed on the opposite side to the first surface ;
The thermally conductive part is provided outside the chamber main body in a plan view,
A bent part is interposed between the heat conductive part and the chamber body,
In plan view, the bent portion is located outside the sealed space ,
The bent portion includes a first bent portion that is bent so that the first surface is on the inside, and a second bent portion that is bent so that the second surface is on the inside. a second bent portion disposed outwardly of the vapor chamber. A portion of the first surface in the thermally conductive portion is parallel to a portion of the first surface in the chamber body,
The vapor chamber according to claim 1, wherein a portion of the second surface in the heat conduction section is parallel to a portion of the second surface in the chamber body. A vapor chamber that cools a cooled device mounted on a board,
a chamber body having a sealed space filled with a working fluid and receiving heat from the cooled device;
a heat conduction section that conducts heat from the chamber body to the substrate;
a first surface provided from the chamber main body to the thermally conductive portion;
a second surface provided across from the chamber body to the heat conduction section and disposed on the opposite side to the first surface;
The thermally conductive part is provided outside the chamber main body in a plan view,
A bent part is interposed between the heat conductive part and the chamber body,
In plan view, the bent portion is located outside the sealed space,
A portion of the first surface in the thermally conductive portion is parallel to a portion of the first surface in the chamber body,
A vapor chamber in which a portion of the second surface in the heat conduction section is parallel to a portion of the second surface in the chamber body. The vapor chamber according to any one of claims 1 to 3 , wherein the thermally conductive part is formed integrally with the chamber main body. the chamber body includes a peripheral wall defining the sealed space;
the bent portion is interposed between the peripheral wall and the heat conductive portion;
The vapor chamber according to any one of claims 1 to 4 . The chamber body has a first metal sheet body and a second metal sheet body provided on the first metal sheet body,
The first metal sheet main body is provided with a channel recess that constitutes a part of the sealed space,
In plan view, the bent portion is located outside the channel recess;
A vapor chamber according to any one of claims 1 to 5 . The vapor chamber according to any one of claims 1 to 6 ,
the substrate;
A vapor chamber mounting board, comprising: the cooled device mounted on the board.

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