JP7388896B2 - Substrate processing equipment - Google Patents

Description

The technology disclosed in this specification relates to a substrate processing apparatus.

When manufacturing a device, substrate processing is performed in which various processing liquids are supplied to a substrate, such as a semiconductor substrate or a glass substrate, used in the device.

On the other hand, substrate processing apparatuses that perform the above-described substrate processing require maintenance at predetermined timings. When performing maintenance work, the operation of the substrate processing apparatus is stopped to ensure the safety of workers who access the substrate processing apparatus to perform maintenance work (see, for example, Patent Document 1).

Japanese Patent Application Publication No. 2002-64300

By the way, especially when the substrate processing apparatus is restarted after maintenance work is completed, the substrate processing apparatus may not operate normally. This happens when a worker who performs maintenance work accidentally comes into contact with equipment in the substrate processing equipment and the equipment is damaged, or when a worker performs maintenance work on a part of the substrate processing equipment. This may be caused by the operator changing the settings but forgetting to undo the changes.

If such a cause prevents the restart of the substrate processing apparatus, the operating rate of the substrate processing apparatus will decrease each time maintenance work is performed.

The technology disclosed in this specification was developed in view of the problems described above, and even when an operator accesses the substrate processing equipment for maintenance work, etc., the technology disclosed in the specification of the present application is This is a technology to suppress the decline in equipment operating rate.

A first aspect of the technology disclosed in the present specification includes a processing unit for processing a substrate, at least one camera that captures an image of a worker accessing the processing unit, and video data captured by the camera. and a switching unit that switches an imaging range of the camera between a substrate processing mode in which the processing unit processes the substrate and a maintenance mode in which maintenance work regarding the processing unit is performed, the switching unit The imaging range of the camera in the maintenance mode is switched to a range that includes the worker accessing the processing section, and the imaging range of the camera in the substrate processing mode is changed to a range that includes the operator who accesses the processing section. The processing unit is a coating mechanism that discharges a coating liquid from a slit nozzle to form a coating film, and the camera is configured to operate the slit nozzle of the coating mechanism in the maintenance mode. The worker performing maintenance is imaged in an imaging range centered on the slit nozzle .

A second aspect of the technology disclosed herein is related to the first aspect, and the processing unit includes a processing device for processing the substrate, and inputs information for controlling the processing device. and an operation section for

A third aspect of the technology disclosed herein is related to the first or second aspect, and includes a plurality of the cameras, and the switching unit is configured to switch between two or more of the cameras in the maintenance mode. The imaging range of the camera is switched to a range that includes the worker accessing the processing unit.

According to the first to third aspects of the technology disclosed in the present specification, it is possible to store video data of a worker accessing the processing unit, which is captured using a camera. Even when an operator accesses the substrate processing apparatus at any time, it is possible to suppress a decrease in the operating rate of the substrate processing apparatus by discovering an event that may cause a malfunction at an early stage.

In addition, objects, features, aspects, and advantages related to the technology disclosed herein will become more apparent from the detailed description and accompanying drawings set forth below.

FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a functional block diagram conceptually showing an example of the configuration of a control unit. 1 is a diagram schematically showing an example of the configuration of a part of a substrate processing apparatus. FIG. 3 is a diagram showing the operation of the substrate processing apparatus, particularly the camera, according to the embodiment. FIG. 3 is a diagram showing the operation of the substrate processing apparatus, particularly the camera, according to the embodiment.

Embodiments will be described below with reference to the accompanying drawings. In the following embodiments, detailed features and the like are shown for technical explanation, but these are merely examples, and not all of them are necessarily essential features for the embodiments to be implemented.

Note that the drawings are shown schematically, and for convenience of explanation, structures are omitted or simplified as appropriate in the drawings. Further, the mutual relationship between the sizes and positions of the structures shown in different drawings is not necessarily described accurately and may be changed as appropriate. Further, even in drawings such as plan views that are not cross-sectional views, hatching may be added to facilitate understanding of the content of the embodiments.

In addition, in the following description, similar components are shown with the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

In addition, in the description below, when a component is described as "comprising," "includes," or "has," unless otherwise specified, it is an exclusive term that excludes the presence of other components. It's not an expression.

In addition, in the description below, even if ordinal numbers such as "first" or "second" are used, these terms may not be used to facilitate understanding of the content of the embodiments. They are used for convenience and are not limited to the order that can occur based on these ordinal numbers.

In addition, in the description below, expressions indicating relative or absolute positional relationships, such as "in one direction", "along one direction", "parallel", "orthogonal", "centered", Unless otherwise specified, terms such as "concentric" or "coaxial" include cases in which the positional relationship is strictly indicated, and cases in which the angle or distance is displaced within a range that allows tolerance or the same degree of function to be obtained. .

In addition, in the descriptions below, specific positions or directions such as "top", "bottom", "left", "right", "side", "bottom", "front" or "back" are meant. However, these terms are used for convenience to make it easier to understand the content of the embodiments, and the positions and directions when actually implemented are different from each other. It is unrelated.

<Embodiment>
The substrate processing apparatus according to this embodiment will be described below.

<About the configuration of the substrate processing equipment>
FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing apparatus 1 according to the present embodiment.

In the example of FIG. 1, the substrate processing apparatus 1 is a coater and developer apparatus, and mainly includes a cleaning apparatus 12, a dehydrating bake apparatus 13, a resist coating apparatus 14, a pre-bake apparatus 15, an exposure apparatus 16, a developing apparatus 17, and a post-bake apparatus 18. , an indexer unit 11 for loading and unloading substrates to and from the above-mentioned device group, a camera 10A, a camera 10B, a camera 10C, a camera 10D, and a camera 10E (hereinafter, these cannot be distinguished). ), an operation panel 20, a unit operation panel 20A, a unit operation panel 20B, a unit operation panel 20C, a unit operation panel 20D, and a unit operation panel 20E. It includes a unit operation panel 20F, a unit operation panel 20G, and a unit operation panel 20H (hereinafter, these may be simply referred to as "unit operation panel" without distinction).

A cleaning device 12, a dehydration bake device 13, a resist coating device 14, a prebake device 15, and the like are arranged in this order on the line from the indexer section 11 to the exposure device 16. On the return line from the exposure device 16 to the indexer section 11, a developing device 17, a post-bake device 18, and the like are arranged in this order.

A plurality of cassettes storing a plurality of substrates are placed in the indexer section 11. The substrate is, for example, a rectangular glass substrate or a semiconductor substrate used for a liquid crystal display device, an organic EL display device, a touch sensor, a micro LED, or the like. In the indexer section 11, an indexer robot serving as a substrate transport means is arranged. The indexer robot takes out the substrate from the cassette and transports (puts) the substrate into the cleaning device 12 .

In the cleaning device 12, a cleaning process is performed on the substrate. The substrate that has been subjected to the cleaning process is transported to the dehydration baking device 13. In the dehydration baking device 13, dehydration processing (dehydration baking processing) is performed by heating. The substrate subjected to the dehydration baking process is transported to the resist coating device 14.

In the resist coating device 14, a resist coating process is performed. The substrate that has been subjected to the resist coating process is transported to the pre-bake device 15. In the pre-bake device 15, heat treatment is performed. The substrate subjected to the heat treatment is transported to the exposure device 16. In the exposure device 16, exposure processing is performed.

The substrate that has been subjected to these treatments is transported to the developing device 17, where it is subjected to a developing process. The substrate that has been subjected to the development process is transported to the post-bake device 18, where it is heated.

Thereafter, the substrate is housed in the original cassette, which is placed on the indexer section 11 by the indexer robot. Through these series of treatments, a resist pattern is formed on the surface of the substrate.

Each camera provided in the substrate processing apparatus can be remotely controlled and is connected to the control unit 60 by wire or wirelessly. Each camera is equipped with, for example, a CCD, which is one type of solid-state imaging device, and an optical system such as an electronic shutter and a lens, and is capable of capturing moving images.

The imaging range of each camera can be changed under the control of the control unit 60. For example, in the case of the camera 10A, the indexer unit 11, cleaning device 12, dehydration baking device 13, unit operation panel 20A, operation panel 20, unit The imaging range can be changed within a range that includes the operation panel 20B, the unit operation panel 20C, the unit operation panel 20D, and the like.

The operation panel 20 is an operation unit such as a touch panel for performing touch operations or button operations. On the operation panel 20, each robot (for example, a transfer robot such as an indexer robot) and each processing device in the substrate processing apparatus 1 are displayed as control targets. Operations input on the operation panel 20 can be linked with a control section 60, which will be described later.

The unit operation panel is an operation section for performing touch panel or button operations. On the unit operation panel, the corresponding processing device is displayed as a control target. Specifically, on the unit operation panel 20A, the corresponding indexer section 11 is displayed as the control target, on the unit operation panel 20B, the corresponding cleaning device 12 is displayed as the control target, and on the unit operation panel 20C, the corresponding indexer section 11 is displayed as the control target. If there is, the corresponding dehydration bake device 13 is displayed as the control target, if it is the unit operation panel 20D, the corresponding resist coating device 14 is displayed as the control target, and if it is the unit operation panel 20E, the corresponding prebake device 15 is displayed. is displayed as a control target, and if it is the unit operation panel 20F, the corresponding exposure device 16 is displayed as the control target, and if it is the unit operation panel 20G, the corresponding developing device 17 is displayed as the control target, and the unit operation panel If it is 20H, the corresponding post-bake device 18 is displayed as a control target.

Note that the substrate processing apparatus 1 has a substrate inspection section that inspects the condition of the substrate to be subjected to a series of processing (whether there are any cracks or chips on the substrate), for example, between the indexer section 11 and the cleaning device 12. , between the dehydrating bake device 13 and the resist coating device 14, between the exposure device 16 and the developing device 17, or between the post-bake device 18 and the indexer section 11.

As the above-mentioned substrate inspection section, for example, a device that irradiates light onto a substrate to be processed and measures the received level of the reflected light is assumed. Then, the board inspection unit can detect that a crack or a chip has occurred in the board when the light reception level of the measured light is low.

Further, the substrate processing apparatus 1 includes a control section 60 that controls processing in each processing apparatus and transport of the substrate. FIG. 2 is a functional block diagram conceptually showing an example of the configuration of the control unit 60. As shown in FIG.

The control unit 60 is, for example, a control circuit, and as shown in FIG. It consists of common computers interconnected with each other.

The ROM 62 stores basic programs and the like, and the RAM 63 is used as a work area when the CPU 61 performs predetermined processing. The storage unit 64 is configured by a nonvolatile storage device such as a flash memory or a hard disk device.

Further, in the control section 60, an input section 66, a display section 67, and a communication section 68 are also connected to the bus line 65. The input unit 66 is configured with various switches or a touch panel, and receives various input setting instructions such as processing recipes from the operator. The display section 67 is composed of a liquid crystal display device, a lamp, etc., and displays various information under the control of the CPU 61. The communication unit 68 has a data communication function via a LAN (Local Area Network) or the like.

Further, each robot (for example, a transport robot such as an indexer robot) and each processing device are connected to the control unit 60 as control objects. That is, the control unit 60 can function as a transport control unit that controls transport of the substrate. The control unit 60 also functions as a signal transmitting means for transmitting a control signal to the indexer unit 11 for starting or stopping the loading of substrates from the indexer unit 11 to the cleaning device 12. can function.

The control content of the control unit 60 can be reflected and displayed on the operation panel 20 and each unit operation panel.

In the storage unit 64 of the control unit 60, a plurality of modes for transport control of each device constituting the substrate processing apparatus 1 and a plurality of modes for the imaging range of each camera are set in advance. Furthermore, the storage unit 64 of the control unit 60 stores image (video) data captured by each camera. When the CPU 61 of the control unit 60 executes the processing program P, one mode out of the plurality of modes related to the above-mentioned transport control or one mode out of the plurality of modes related to the imaging range of the camera is selected. The mode controls the substrate transport operation or the imaging operation using the camera.

Further, the processing program P may be stored in a recording medium. By using this recording medium, the processing program P can be installed in the control unit 60 (computer). Further, some or all of the functions executed by the control unit 60 do not necessarily need to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

FIG. 3 is a diagram schematically showing an example of a partial configuration of the substrate processing apparatus 1 of FIG. 1. As shown in FIG. In the example of FIG. 3, a resist coating device 14 is shown. Each drive section in the resist coating device 14 shown in FIG. 3 is driven under the control of a control section 60, an example of which is shown in FIG.

The resist coating device 14 is a slit coater that applies a coating liquid to the upper surface Wf of the substrate W that is transported in a horizontal position from the left hand side to the right hand side in FIG.

In the resist coating device 14, an input conveyor 100, an input transfer section 2, a floating stage section 3, an output transfer section 4, and an output conveyor 110 are arranged close to each other in this order along the conveyance direction (+X direction) of the substrate W. As will be described in detail below, these form a transport path for the substrate W that extends in a substantially horizontal direction.

That is, the substrate W to be processed is carried into the input conveyor 100 from the left hand side in FIG. The input conveyor 100 includes a roller conveyor 101 and a drive mechanism 102 that rotationally drives the roller conveyor 101. As the roller conveyor 101 rotates, the substrate W is conveyed in a horizontal position downstream, that is, in the (+X) direction.

The input transfer section 2 includes a roller conveyor 21 and a drive mechanism 22 that has a function of rotating the conveyor and a function of raising and lowering the conveyor. As the roller conveyor 21 rotates, the substrate W is further transported in the (+X) direction. Moreover, the vertical position of the substrate W is changed by the roller conveyor 21 moving up and down. The input transfer section 2 transfers the substrate W from the input conveyor 100 to the floating stage section 3 .

The floating stage section 3 includes a flat stage divided into three parts along the transport direction of the substrate W. That is, the floating stage section 3 includes an entrance floating stage 31, a coating stage 32, and an exit floating stage 33, and the upper surfaces of these stages form part of the same plane.

On the upper surface of each of the inlet flotation stage 31 and the outlet flotation stage 33, a large number of ejection holes are provided in a matrix form to eject compressed air supplied under the control of the control mechanism 35, and the air is provided from the ejected airflow. The substrate W floats due to the buoyant force, and is supported in a horizontal position with the lower surface of the substrate W separated from the upper surface of the stage. The distance between the lower surface of the substrate W and the upper surface of the stage can be, for example, 10 μm or more and 500 μm or less.

On the other hand, on the upper surface of the coating stage 32, ejection holes for ejecting compressed air and suction holes for sucking air between the lower surface of the substrate W and the upper surface of the stage are arranged alternately. The distance between the lower surface of the substrate W and the upper surface of the coating stage 32 is precisely controlled by the control mechanism 35 controlling the amount of compressed air ejected from the ejection holes and the amount of suction from the suction holes. As a result, the vertical position of the upper surface Wf of the substrate W passing above the coating stage 32 is controlled to a specified value.

The substrate W carried into the floating stage section 3 via the input transfer section 2 is given a driving force in the (+X) direction by the rotation of the roller conveyor 21, and is transported onto the entrance floating stage 31.

The entrance floating stage 31, the coating stage 32, and the exit floating stage 33 support the substrate W in a floating state, but do not have the function of moving the substrate W in the horizontal direction. The substrate W is transported in the floating stage section 3 by the substrate transporting section 5 disposed below the entrance floating stage 31, the coating stage 32, and the exit floating stage 33.

The substrate transfer unit 5 applies negative pressure to a chuck 51 that supports the substrate W from below by partially abutting against the peripheral edge of the lower surface of the substrate W, and a suction pad provided at a support portion at the upper end of the chuck 51 to transfer the substrate. It is provided with a control mechanism 52 having a function of attracting and holding W and a function of causing the chuck 51 to reciprocate in the X direction. When the chuck 51 holds the substrate W, the lower surface of the substrate W is located at a higher position than the upper surface of each stage of the floating stage section 3. Therefore, while the peripheral edge of the substrate W is suctioned and held by the chuck 51, the buoyant force applied from the floating stage section 3 maintains the horizontal posture as a whole.

The chuck 51 holds the substrate W carried from the input transfer section 2 to the floating stage section 3, and by moving the chuck 51 in the (+X) direction in this state, the substrate W is coated from above the entrance floating stage 31. It is transported above the exit flotation stage 33 via above the stage 32 .

The transported substrate W is delivered to the output transfer section 4 arranged on the (+X) side of the exit floating stage 33.

The output transfer section 4 includes a roller conveyor 41 and a drive mechanism 42 having a function of rotationally driving the roller conveyor and a function of raising and lowering the roller conveyor. As the roller conveyor 41 rotates, a propulsive force in the (+X) direction is applied to the substrate W, and the substrate W is further transported along the transport direction. Furthermore, the vertical position of the substrate W is changed by the roller conveyor 41 moving up and down.

The output transfer section 4 transfers the substrate W to the output conveyor 110 from above the exit floating stage 33 .

The output conveyor 110 includes a roller conveyor 111 and a drive mechanism 112 that rotationally drives the roller conveyor 111. As the roller conveyor 111 rotates, the substrate W is further conveyed in the (+X) direction and is finally delivered to the outside of the resist coating device 14. It is paid out to.

Note that the input conveyor 100 and the output conveyor 110 may be provided as part of the configuration of the resist coating device 14, but may be separate from the resist coating device 14. Further, for example, a substrate dispensing mechanism of a separate unit provided upstream of the resist coating device 14 may be used as the input conveyor 100. Further, a separate substrate receiving mechanism provided downstream of the resist coating device 14 may be used as the output conveyor 110.

Two sets of application mechanisms for applying a coating liquid to the upper surface Wf of the substrate W are arranged on the transport path of the substrate W transported in this manner. Specifically, a coating mechanism 6 is provided above the entrance floating stage 31, and a coating mechanism 7 is provided above the exit floating stage 33.

The coating mechanism 6 includes a slit nozzle 161 and a maintenance unit 165 for performing maintenance on the slit nozzle 161. Further, the application mechanism 7 includes a slit nozzle 71 and a maintenance unit 75 for performing maintenance on the slit nozzle 71.

A coating liquid is supplied to the slit nozzle 161 and the slit nozzle 71 from a coating liquid supply section (not shown), and the coating liquid is discharged from a discharge port opening downward at the bottom of the nozzle. The coating liquids supplied to the slit nozzle 161 and the slit nozzle 71 may be the same or different.

The slit nozzle 161 can be moved and positioned in the X direction and the Z direction by a positioning mechanism 163. Similarly, the slit nozzle 71 can be moved and positioned in the X direction and the Z direction by a positioning mechanism 73. The positioning mechanism 163 and the positioning mechanism 73 selectively position the slit nozzle 161 and the slit nozzle 71 at a coating position above the coating stage 32 (the position indicated by the broken line).

The coating liquid is discharged from the nozzle positioned at the coating position, and the coating liquid is applied to the substrate W being conveyed between the coating stage 32 and the coating stage 32 . In this way, the coating liquid is applied to the substrate W.

The maintenance unit 165 includes a vat 651 that stores cleaning liquid for cleaning the slit nozzle 161, a preliminary discharge roller 652, a nozzle cleaner 653, and a control mechanism 654 that controls the operations of the preliminary discharge roller 652 and the nozzle cleaner 653. We are prepared.

The maintenance unit 75 also includes a vat 751 that stores cleaning liquid for cleaning the slit nozzle 71, a preliminary discharge roller 752, a nozzle cleaner 753, and a control mechanism 754 that controls the operations of the preliminary discharge roller 752 and the nozzle cleaner 753. It is equipped with

At a position where the slit nozzle 161 is above the preliminary discharge roller 652 and the discharge port faces the upper surface of the preliminary discharge roller 652 (first preliminary discharge position), the discharge port of the slit nozzle 161 is located above the preliminary discharge roller 652. The coating liquid is discharged onto the upper surface.

Prior to being positioned at the coating position, the slit nozzle 161 is positioned at a first preliminary ejection position, and performs a preliminary ejection process by ejecting a predetermined amount of coating liquid from its ejection opening. By performing preliminary discharge processing on the slit nozzle 161 before moving to the coating position in this manner, the discharge of the coating liquid at the coating position can be stabilized from the initial stage. When the control mechanism 654 rotates the preliminary discharge roller 652, the discharged coating liquid is mixed with the cleaning liquid stored in the vat 651 and collected.

In addition, when the slit nozzle 161 is located above the nozzle cleaner 653 (first cleaning position), the nozzle cleaner 653 moves in the Y direction while discharging cleaning liquid, thereby removing the discharge opening of the slit nozzle 161 and its surroundings. The coating liquid adhering to the surface will be washed away.

Further, the positioning mechanism 163 can position the slit nozzle 161 at a position below the first cleaning position where the lower end of the nozzle is accommodated in the butt 651 (first standby position). When the coating process using the slit nozzle 161 is not executed, the slit nozzle 161 is positioned at this first standby position. Although not shown, a standby pod may be disposed for the slit nozzle 161 positioned at the first standby position to prevent the coating liquid from drying at the discharge port.

The same applies to the slit nozzle 71. Specifically, the slit nozzle 71 is positioned at a second preliminary ejection position facing the upper surface of the preliminary ejection roller 752, and the slit nozzle 71 executes the preliminary ejection process. Further, when the slit nozzle 71 is in the second cleaning position above the nozzle cleaner 753, the slit nozzle 71 is cleaned by the nozzle cleaner 753. When the coating process using the slit nozzle 71 is not executed, the slit nozzle 71 is positioned at the second standby position.

In FIG. 3, the slit nozzle 161 in the first preliminary discharge position is represented by a solid line, and the slit nozzle 161 in the first cleaning position is represented by a dotted line. Further, the slit nozzle 71 in the second preliminary ejection position is represented by a solid line, and the slit nozzle 71 in the second standby position is represented by a dotted line. Although not shown, the first standby position corresponding to the slit nozzle 161 and the second cleaning position corresponding to the slit nozzle 71 can be similarly defined.

In this way, the coating mechanism 6 is arranged upstream of the coating position, and the positioning mechanism 163 moves the slit nozzle 161 to the coating position above the coating stage 32 as necessary, so that the slit nozzle 161 can coat the substrate. Application to W is realized. The maintenance unit 165 is also arranged upstream of the coating position. Among the stop positions of the slit nozzle 161 in the maintenance unit 165, the first preliminary discharge position is set to the position closest to the coating position on the downstream side, and the first cleaning position and the first standby position are set to the first preliminary discharge position. It is set upstream from the position.

On the other hand, the coating mechanism 7 is arranged downstream of the coating position, and the positioning mechanism 73 moves the slit nozzle 71 to the coating position above the coating stage 32 as necessary, so that the slit nozzle 71 can transfer the substrate W to the coating position. coating is realized. The maintenance unit 75 is also arranged downstream of the application position. Among the stop positions of the slit nozzle 71 in the maintenance unit 75, the second preliminary discharge position is set to the most upstream position and closest to the coating position, and the second cleaning position and the second standby position are set to the second preliminary discharge position. It is set downstream from the position.

That is, the coating mechanism 6 and the coating mechanism 7 can be configured to be symmetrical with respect to the YZ plane with the coating position in between. Note that the shapes of the respective parts of the application mechanism 6 and the application mechanism 7 do not need to have perfect symmetry, and the configurations of the respective parts may be changed as necessary.

The maintenance unit 165 is located upstream of the application position, and when the slit nozzle 71 is positioned at the application position, the maintenance unit 165 and the slit nozzle 161 positioned at the first preliminary ejection position are connected to the slit nozzle 71. be installed in a position that will not interfere with the Since the first cleaning position and the first standby position are further away from the application position than the first preliminary discharge position, the slit nozzle 161 located at these positions will not interfere with the slit nozzle 71 located at the application position. do not have.

Similarly, the maintenance unit 75 is located downstream of the application position, and when the slit nozzle 161 is positioned at the application position, the maintenance unit 75 and the slit nozzle 71 positioned at the preliminary ejection position are connected to the slit nozzle 161. be installed in a position that will not interfere with the Since the second cleaning position and the second standby position are also further away from the application position than the second preliminary ejection position, the slit nozzle 71 located at these positions will not interfere with the slit nozzle 161 located at the application position. Avoided.

In addition, although the coating apparatus of the floating conveyance type which floats the substrate W on the stage and moves it with respect to a slit nozzle was described above, the substrate W is attracted to the stage and supported in a horizontal position, The coating device may be of a type in which the slit nozzle is moved relative to the slit nozzle.

<About the operation of the substrate processing equipment>
Next, the operation of the substrate processing apparatus according to this embodiment will be described with reference to FIGS. 4 and 5. Here, FIGS. 4 and 5 are diagrams showing the operation of the substrate processing apparatus, particularly the camera, according to the present embodiment.

First, with reference to FIG. 4, the operation of each camera in a mode (substrate processing mode) in which the substrate processing apparatus 1 performs a series of processing on a substrate will be described.

In the above substrate processing mode, each camera captures an image (or video) of an imaging range that includes the substrate being transported, various processing devices that process the substrate, or workers operating the various processing devices. do. Note that the imaging range of each camera may be changed during the process in accordance with each process of substrate processing. The image (or video) data obtained by each camera is stored in the storage unit 64 in the control unit 60 connected by wire or wirelessly.

Note that the imaging range of each camera in the substrate processing mode described above may include the substrate being carried into or out of the processing apparatus corresponding to each camera. If the imaging range of each camera is set in this way, the camera will be able to detect not only defects such as cracks on the substrate within each processing device, but also defects that occur on the substrate when moving between processing devices. can be used to capture images.

Next, with reference to FIG. 5, the operation of each camera in a mode (maintenance mode) in which maintenance work is performed on the substrate processing apparatus 1 will be described.

In the maintenance mode described above, the control unit 60 sets the imaging range of each camera to a predetermined maintenance imaging range. The control unit 60 switches the imaging range of each camera between the substrate processing mode and the maintenance mode as necessary. Here, the maintenance imaging range is an imaging range that includes a processing device that requires maintenance and a worker accessing at least one of a unit operation panel for controlling the processing device. Note that hereinafter, a processing unit that includes at least one of a processing device that requires maintenance and an operation panel (or unit operation panel) for controlling the processing device may be referred to as a processing unit.

When performing maintenance work, when an operator directly accesses a processing device that requires maintenance (in FIG. 5, the resist coating device 14 is marked with diagonal lines), for example, the slit nozzle 71 (see FIG. 3) of the resist coating device 14 is accessed directly. In cases such as visual inspection, adjusting the position of the slit nozzle 71, wiping off coating liquid adhering to the tip of the slit nozzle 71, or replacing the slit nozzle 71, the control unit 60 at least serves as an imaging range for maintenance. , set an imaging range that includes the worker accessing the processing device that requires maintenance.

Specifically, in the case of the camera 10A or the camera 10B, the control unit 60 controls the maintenance of the camera 10A or the camera 10B so that the operator accessing the slit nozzle 71 of the resist coating device 14 is included in the imaging range. An imaging range centered around the slit nozzle 71 of the resist coating device 14 is set as the imaging range. Note that the "center" here may be the central region of the imaging range, and is not intended to be only the exact center of the imaging range.

Further, when performing maintenance work, when an operator indirectly accesses a processing device that requires maintenance, for example, when operating a unit operation panel for controlling a processing device that requires maintenance, the control unit 60 at least An imaging range that includes the worker accessing the unit operation panel is set as the maintenance imaging range.

Specifically, in the case of the camera 10C, the control unit 60 controls the maintenance of the camera 10C so that the operator who accesses the unit operation panel 20D for controlling the resist coating device 14 that requires maintenance is included in the imaging range. An imaging range centered on the unit operation panel 20D is set as the imaging range for the purpose.

By setting the imaging range of each camera in this way, if a worker who performs maintenance work unexpectedly comes into contact with the processing device, or when the operator performs maintenance work, If a worker forgets that the equipment settings have been changed for maintenance, such an event can be detected early by referencing the video data stored by each camera in real time or later. can. Therefore, the cause of the above-mentioned malfunction should be resolved as soon as possible (specifically, readjusting the equipment that came into contact with it, resetting settings that were changed for maintenance, etc.), and restarting the substrate processing equipment. rate can be increased.

Note that if the maintenance imaging range is the same as the imaging range of the camera in the substrate processing mode, the control unit 60 does not need to switch the imaging range of the camera even when switching from the substrate processing mode to the maintenance mode. . That is, the control unit 60 does not need to switch the imaging range of the camera when switching from the substrate processing mode to the maintenance mode or vice versa.

In addition, in FIG. 5, all cameras including the camera 10D and the camera 10E have at least one of the slit nozzle 71 of the resist coating device 14 and the unit operation panel 20D (i.e., the processing section) as the center of the imaging range, Although it is set to image a worker accessing the processing section, in the maintenance mode, at least one camera among the plurality of cameras only needs to set the processing section as the center of its imaging range. However, if multiple cameras are directed toward one processing unit, image (or video) data taken from various directions can be acquired, which can improve the accuracy of finding the cause of a problem.

Furthermore, if there are multiple processing devices that require maintenance, the imaging ranges of the multiple cameras may be distributed around each processing section.

<About the effects produced by the embodiments described above>
Next, examples of effects produced by the embodiment described above will be shown. In addition, in the following description, the effects will be described based on the specific configurations shown in the embodiments described above, but examples will not be included in the present specification to the extent that similar effects are produced. may be replaced with other specific configurations shown.

According to the embodiment described above, the substrate processing apparatus includes a processing section, at least one camera, and a storage section 64. Here, the processing section corresponds to, for example, at least one of the resist coating device 14, which is a processing device that processes a substrate, or the unit operation panel 20D corresponding to the resist coating device 14. Further, the camera corresponds to, for example, camera 10A, camera 10B, camera 10C, camera 10D, or camera 10E. The camera images the worker accessing the processing section. The storage unit 64 stores video data captured by the camera.

According to such a configuration, it is possible to store video data of a worker accessing the processing unit, which is captured using a camera, so that when the worker accesses the substrate processing equipment for maintenance work, it is possible to store video data of the worker accessing the processing unit. Even if such a problem occurs, by discovering an event that may cause a problem at an early stage, it is possible to suppress a decrease in the operating rate of the substrate processing apparatus. Further, even if a problem occurs when restarting the substrate processing apparatus after maintenance, the cause of the problem can be identified quickly and in detail by referring to the stored video data.

In addition, in the case where other configurations illustrated in the present specification are appropriately added to the above configuration, that is, when other configurations in the present specification that are not mentioned as the above configurations are appropriately added. Even if there is, the same effect can be produced.

Further, according to the embodiment described above, the processing unit includes a processing device for processing the substrate (for example, the resist coating device 14) and an operation for inputting information for controlling the processing device. (for example, unit operation panel 20D). According to such a configuration, it is possible to image a worker who accesses the processing device itself that requires maintenance or a worker who accesses the operation section operated during maintenance work, so that, for example, if the worker suddenly Even if a worker comes into contact with the processing equipment, or forgets to operate the operation panel to undo a setting change for maintenance work, these events can be detected with a camera. can be stored in the video data. Therefore, by discovering an event that may cause a malfunction at an early stage, it is possible to suppress a decrease in the operating rate of the substrate processing apparatus. Further, even if a problem occurs when restarting the substrate processing apparatus after maintenance, the cause of the problem can be identified quickly and in detail by referring to the stored video data.

Further, according to the embodiment described above, the substrate processing apparatus includes a switching section. Here, the switching section corresponds to, for example, the control section 60. The control unit 60 switches the imaging range of the camera between a substrate processing mode in which a substrate is processed by a processing device included in the processing unit, and a maintenance mode in which maintenance work is performed on the processing device included in the processing unit. Then, the control unit 60 switches the imaging range of the camera in the maintenance mode to a preset range that includes the worker accessing the processing unit. According to this configuration, in the substrate processing mode, the camera is used to monitor defects such as cracks in the substrate during substrate processing, while in the maintenance mode, the camera is used to identify defects that occur in the substrate processing equipment due to maintenance work. A camera can be used to do this.

Furthermore, according to the embodiment described above, the imaging range of the camera in the substrate processing mode is the imaging range that includes the substrate being carried into or out of the processing section. According to such a configuration, cracks in the substrate can be monitored when the substrate is carried in or out between a plurality of processing apparatuses in the substrate processing apparatus. Therefore, it is possible to specify in detail at which stage in a series of substrate processing the substrate defect has occurred. Note that the determination of board cracking may be made by an operator by visually observing an image in the board inspection section, or may be determined by image analysis performed in the board inspection section.

Further, according to the embodiment described above, the substrate processing apparatus includes a plurality of cameras. Then, the control unit 60 switches the imaging range of two or more cameras (for example, camera 10B and camera 10C) among the plurality of cameras in the maintenance mode to a preset range that includes the worker accessing the processing unit. . According to this configuration, by using multiple cameras to capture images of the processing unit and the worker, video data of the processing unit and the worker from various directions can be stored, so the cause of the problem can be identified quickly. Can be specified in detail.

Further, according to the embodiment described above, the processing section includes the coating mechanism 6 (or coating mechanism 7) that discharges the coating liquid from the slit nozzle 71 (or the slit nozzle 161) to form a coating film. It is. Then, the camera images a worker who maintains the slit nozzle 71 (or slit nozzle 161) in the coating mechanism 6 (or coating mechanism 7) in the maintenance mode. According to such a configuration, if a worker accidentally comes into contact with the slit nozzle during maintenance work on the slit nozzle, the event can be recorded as video data by the camera. , the cause of the problem can be identified early and in detail.

<About modifications of the embodiment described above>
In the embodiments described above, dimensions, shapes, relative arrangement relationships, implementation conditions, etc. of each component may also be described, but these are only examples in all aspects, and It shall not be limited to what is described in this specification.

Accordingly, countless variations and equivalents, not illustrated, are envisioned within the scope of the technology disclosed herein. For example, this includes cases in which at least one component is modified, added, or omitted.

Furthermore, each of the components described in the embodiments described above is assumed to be software or firmware, and hardware corresponding thereto, and in both concepts, each component is referred to as a "part". It is also called a "processing circuit".

1 Substrate processing device 2 Input transfer unit 3 Floating stage unit 4 Output transfer unit 5 Substrate transfer unit 6, 7 Coating mechanism 10A, 10B, 10C, 10D, 10E Camera 11 Indexer unit 12 Cleaning device 13 Dehydration baking device 14 Resist coating Device 15 Pre-bake device 16 Exposure device 17 Developing device 18 Post-bake device 20 Operation panel 20A, 20B, 20C, 20D, 20E, 20F, 20G, 20H Unit operation panel 21, 41, 101, 111 Roller conveyor 22, 42, 102, 112 Drive mechanism 31 Entrance floating stage 32 Coating stage 33 Exit floating stage 35, 52, 654, 754 Control mechanism 40 Baking device 51 Chuck 60 Control unit 61 CPU
62 ROM
63 RAM
64 Storage section 65 Bus line 66 Input section 67 Display section 68 Communication section 71,161 Slit nozzle 73,163 Positioning mechanism 75,165 Maintenance unit 100 Input conveyor 110 Output conveyor 651,751 Bat 652,752 Preliminary discharge roller 653,753 Nozzle cleaner

Claims (3)

a processing section for processing the substrate;
at least one camera that images a worker accessing the processing unit;
a storage unit that stores video data captured by the camera ;
a switching unit that switches an imaging range of the camera between a substrate processing mode in which the processing unit processes the substrate and a maintenance mode in which maintenance work regarding the processing unit is performed;
The switching unit switches an imaging range of the camera in the maintenance mode to a range that includes the worker accessing the processing unit,
The imaging range of the camera in the substrate processing mode is an imaging range that includes the substrate being carried into or out of the processing unit,
The processing section is a coating mechanism that discharges a coating liquid from a slit nozzle to form a coating film,
The camera images the operator who maintains the slit nozzle in the application mechanism in the maintenance mode in an imaging range centered on the slit nozzle.
Substrate processing equipment. The substrate processing apparatus according to claim 1,
The processing section includes a processing device for processing the substrate, and an operation section for inputting information for controlling the processing device.
Substrate processing equipment. The substrate processing apparatus according to claim 1 or 2 ,
comprising a plurality of the cameras;
The switching unit switches an imaging range of two or more of the cameras in the maintenance mode to a range that includes the worker accessing the processing unit.
Substrate processing equipment.

Images