JP7384934B2 - 異種材料間の連続した相互接続部 - Google Patents

異種材料間の連続した相互接続部 Download PDF

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Publication number
JP7384934B2
JP7384934B2 JP2021570380A JP2021570380A JP7384934B2 JP 7384934 B2 JP7384934 B2 JP 7384934B2 JP 2021570380 A JP2021570380 A JP 2021570380A JP 2021570380 A JP2021570380 A JP 2021570380A JP 7384934 B2 JP7384934 B2 JP 7384934B2
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Japan
Prior art keywords
substrate
materials
conductive
joint
fluid phase
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Active
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JP2021570380A
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English (en)
Japanese (ja)
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JP2022534502A (ja
JP2022534502A5 (https=
JPWO2020243254A5 (https=
Inventor
チャールズ ジェイ． キンツェル，
マーク ウィリアム ローナイ，
マイケル アドベンチャー ホプキンス，
ジョルジ イー．， ジュニア カルボ，
サイ スリニバス デサバシナ，
トレバー アントニオ リビエラ，
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Liquid Wire Inc
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Liquid Wire Inc
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Filing date
Publication date
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Publication of JP2022534502A publication Critical patent/JP2022534502A/ja
Publication of JP2022534502A5 publication Critical patent/JP2022534502A5/ja
Publication of JPWO2020243254A5 publication Critical patent/JPWO2020243254A5/ja
Priority to JP2023191774A priority Critical patent/JP2024035235A/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/857—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/092—Adapting interconnections, e.g. making engineering charges, repairing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2021570380A 2019-05-28 2020-05-28 異種材料間の連続した相互接続部 Active JP7384934B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023191774A JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962853481P 2019-05-28 2019-05-28
US62/853,481 2019-05-28
PCT/US2020/034854 WO2020243254A1 (en) 2019-05-28 2020-05-28 Continuous interconnects between heterogeneous materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023191774A Division JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Publications (4)

Publication Number Publication Date
JP2022534502A JP2022534502A (ja) 2022-08-01
JP2022534502A5 JP2022534502A5 (https=) 2023-03-30
JPWO2020243254A5 JPWO2020243254A5 (https=) 2023-03-30
JP7384934B2 true JP7384934B2 (ja) 2023-11-21

Family

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JP2021570380A Active JP7384934B2 (ja) 2019-05-28 2020-05-28 異種材料間の連続した相互接続部
JP2023191774A Pending JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

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Country Status (6)

Country Link
US (3) US11682615B2 (https=)
EP (1) EP3977524A4 (https=)
JP (2) JP7384934B2 (https=)
KR (2) KR102810370B1 (https=)
CN (2) CN114175280B (https=)
WO (1) WO2020243254A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3977524A4 (en) 2019-05-28 2023-11-08 Liquid Wire Inc. CONTINUOUS CONNECTIONS BETWEEN HETERGENEOUS MATERIALS
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
WO2023034886A1 (en) 2021-08-31 2023-03-09 Liquid Wire Inc. Flexible and stretchable structures
US12096563B2 (en) * 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
JP2024500352A (ja) * 2020-12-11 2024-01-09 リキッド ワイヤ インコーポレイテッド 集積導体を有する構造体
US20240147631A1 (en) * 2021-02-26 2024-05-02 Liquid Wire, LLC Devices, systems, and methods for making and using highly sustainable circuits
WO2022246402A1 (en) 2021-05-18 2022-11-24 Liquid Wire Inc. Flexible high-power electronics bus
WO2023010106A1 (en) 2021-07-30 2023-02-02 Liquid Wire Inc. Flexible and stretchable structures
WO2023023482A1 (en) 2021-08-16 2023-02-23 Liquid Wire Inc. Stretchable and flexible metal film structures
US20240428981A1 (en) 2021-10-22 2024-12-26 Liquid Wire Inc. Flexible three-dimensional electronic component
WO2023076844A1 (en) 2021-10-27 2023-05-04 Liquid Wire Inc. Two-dimensional motion capture strain sensors
WO2023171464A1 (ja) * 2022-03-08 2023-09-14 株式会社村田製作所 伸縮性デバイス
JP7836705B2 (ja) * 2022-04-27 2026-03-27 メクテック株式会社 フレキシブルプリント配線板及び電気配線
WO2025192170A1 (ja) * 2024-03-14 2025-09-18 株式会社村田製作所 伸縮性デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014505529A (ja) 2010-12-22 2014-03-06 カーディオインサイト テクノロジーズ インコーポレイテッド 多層センサー装置
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer
US20180247727A1 (en) 2016-02-29 2018-08-30 Liquid Wire Inc. Deformable Conductors and Related Sensors, Antennas and Multiplexed Systems

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3235212A1 (de) * 1982-09-23 1984-03-29 Schoeller & Co Elektronik Gmbh, 3552 Wetter Kontaktierungselement fuer gedruckte schaltungen
US4770641A (en) * 1986-03-31 1988-09-13 Amp Incorporated Conductive gel interconnection apparatus
US7327554B2 (en) * 2003-03-19 2008-02-05 Ngk Spark Plug Co., Ltd. Assembly of semiconductor device, interposer and substrate
US7141874B2 (en) * 2003-05-14 2006-11-28 Matsushita Electric Industrial Co., Ltd. Electronic component packaging structure and method for producing the same
US7959058B1 (en) 2005-01-13 2011-06-14 The United States Of America As Represented By The Secretary Of The Navy Hybrid composite welded joint
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
TWI393511B (zh) * 2007-05-29 2013-04-11 松下電器產業股份有限公司 Dimensional printed wiring board and manufacturing method thereof
WO2014011232A1 (en) 2012-07-12 2014-01-16 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
TW201127246A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
KR102229384B1 (ko) * 2013-02-15 2021-03-18 오르멧 서키츠 인코퍼레이티드 다층 전자 기판의 z-축 상호 연결 구조물
US9455421B2 (en) * 2013-11-21 2016-09-27 Atom Nanoelectronics, Inc. Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays
US10165690B2 (en) * 2015-06-19 2018-12-25 Nippon Telegraph And Telephone Corporation Solder joint structure of flexible printed circuit board
JP6982959B2 (ja) * 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP7141042B2 (ja) * 2016-02-29 2022-09-22 リキッド ワイヤ エルエルシー 液体ワイヤ
US10357171B2 (en) 2016-07-08 2019-07-23 General Electric Company Adjustable ECG sensor and related method
EP3977524A4 (en) 2019-05-28 2023-11-08 Liquid Wire Inc. CONTINUOUS CONNECTIONS BETWEEN HETERGENEOUS MATERIALS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014505529A (ja) 2010-12-22 2014-03-06 カーディオインサイト テクノロジーズ インコーポレイテッド 多層センサー装置
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer
US20180247727A1 (en) 2016-02-29 2018-08-30 Liquid Wire Inc. Deformable Conductors and Related Sensors, Antennas and Multiplexed Systems

Also Published As

Publication number Publication date
JP2022534502A (ja) 2022-08-01
US11688677B2 (en) 2023-06-27
WO2020243254A1 (en) 2020-12-03
CN114175280B (zh) 2025-07-08
JP2024035235A (ja) 2024-03-13
EP3977524A1 (en) 2022-04-06
KR102625030B1 (ko) 2024-01-16
US11682615B2 (en) 2023-06-20
KR102810370B1 (ko) 2025-05-19
US20200381349A1 (en) 2020-12-03
KR20220030949A (ko) 2022-03-11
CN114175280A (zh) 2022-03-11
CN120659461A (zh) 2025-09-16
US20240047334A1 (en) 2024-02-08
US20210272891A1 (en) 2021-09-02
EP3977524A4 (en) 2023-11-08
KR20240009535A (ko) 2024-01-22
US12205878B2 (en) 2025-01-21

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