JP2022534502A5 - - Google Patents
Info
- Publication number
- JP2022534502A5 JP2022534502A5 JP2021570380A JP2021570380A JP2022534502A5 JP 2022534502 A5 JP2022534502 A5 JP 2022534502A5 JP 2021570380 A JP2021570380 A JP 2021570380A JP 2021570380 A JP2021570380 A JP 2021570380A JP 2022534502 A5 JP2022534502 A5 JP 2022534502A5
- Authority
- JP
- Japan
- Prior art keywords
- structure according
- fluid phase
- phase conductor
- joint
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023191774A JP2024035235A (ja) | 2019-05-28 | 2023-11-09 | 異種材料間の連続した相互接続部 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962853481P | 2019-05-28 | 2019-05-28 | |
| US62/853,481 | 2019-05-28 | ||
| PCT/US2020/034854 WO2020243254A1 (en) | 2019-05-28 | 2020-05-28 | Continuous interconnects between heterogeneous materials |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023191774A Division JP2024035235A (ja) | 2019-05-28 | 2023-11-09 | 異種材料間の連続した相互接続部 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022534502A JP2022534502A (ja) | 2022-08-01 |
| JP2022534502A5 true JP2022534502A5 (https=) | 2023-03-30 |
| JP7384934B2 JP7384934B2 (ja) | 2023-11-21 |
Family
ID=73550791
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021570380A Active JP7384934B2 (ja) | 2019-05-28 | 2020-05-28 | 異種材料間の連続した相互接続部 |
| JP2023191774A Pending JP2024035235A (ja) | 2019-05-28 | 2023-11-09 | 異種材料間の連続した相互接続部 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023191774A Pending JP2024035235A (ja) | 2019-05-28 | 2023-11-09 | 異種材料間の連続した相互接続部 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11682615B2 (https=) |
| EP (1) | EP3977524A4 (https=) |
| JP (2) | JP7384934B2 (https=) |
| KR (2) | KR102810370B1 (https=) |
| CN (2) | CN114175280B (https=) |
| WO (1) | WO2020243254A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102810370B1 (ko) | 2019-05-28 | 2025-05-19 | 리퀴드 와이어 인크. | 변형가능 전자 디바이스 |
| US11937372B2 (en) | 2020-06-24 | 2024-03-19 | Yale University | Biphasic material and stretchable circuit board |
| WO2023034886A1 (en) | 2021-08-31 | 2023-03-09 | Liquid Wire Inc. | Flexible and stretchable structures |
| US12096563B2 (en) | 2020-08-31 | 2024-09-17 | Liquid Wire Inc. | Flexible and stretchable structures |
| JP2024500352A (ja) * | 2020-12-11 | 2024-01-09 | リキッド ワイヤ インコーポレイテッド | 集積導体を有する構造体 |
| WO2022183219A1 (en) * | 2021-02-26 | 2022-09-01 | Liquid Wire Llc | Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein |
| US12588109B2 (en) * | 2021-05-18 | 2026-03-24 | Liquid Wire Inc. | Flexible high-power electronics bus |
| US20250016931A1 (en) | 2021-07-30 | 2025-01-09 | Liquid Wire Inc. | Flexible and stretchable structures |
| JP2024535142A (ja) * | 2021-08-16 | 2024-09-27 | リキッド ワイヤ インコーポレイテッド | 伸縮性および可撓性の金属フィルム構造体 |
| WO2023070090A1 (en) | 2021-10-22 | 2023-04-27 | Liquid Wire Inc. | Flexible three-dimensional electronic component |
| US20240418495A1 (en) | 2021-10-27 | 2024-12-19 | Liquid Wire Inc. | Two-dimensional motion capture strain sensors |
| WO2023171464A1 (ja) * | 2022-03-08 | 2023-09-14 | 株式会社村田製作所 | 伸縮性デバイス |
| JP7836705B2 (ja) * | 2022-04-27 | 2026-03-27 | メクテック株式会社 | フレキシブルプリント配線板及び電気配線 |
| WO2025192170A1 (ja) * | 2024-03-14 | 2025-09-18 | 株式会社村田製作所 | 伸縮性デバイス |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3235212A1 (de) * | 1982-09-23 | 1984-03-29 | Schoeller & Co Elektronik Gmbh, 3552 Wetter | Kontaktierungselement fuer gedruckte schaltungen |
| US4770641A (en) * | 1986-03-31 | 1988-09-13 | Amp Incorporated | Conductive gel interconnection apparatus |
| US7327554B2 (en) * | 2003-03-19 | 2008-02-05 | Ngk Spark Plug Co., Ltd. | Assembly of semiconductor device, interposer and substrate |
| US7141874B2 (en) * | 2003-05-14 | 2006-11-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component packaging structure and method for producing the same |
| US7959058B1 (en) * | 2005-01-13 | 2011-06-14 | The United States Of America As Represented By The Secretary Of The Navy | Hybrid composite welded joint |
| JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
| TWI393511B (zh) * | 2007-05-29 | 2013-04-11 | 松下電器產業股份有限公司 | Dimensional printed wiring board and manufacturing method thereof |
| US9536815B2 (en) | 2009-05-28 | 2017-01-03 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
| TW201127246A (en) * | 2010-01-22 | 2011-08-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
| EP2654556B1 (en) | 2010-12-22 | 2018-10-10 | CardioInsight Technologies, Inc. | Multi-layered sensor apparatus |
| TWI473218B (zh) | 2012-07-26 | 2015-02-11 | 欣興電子股份有限公司 | 穿孔中介板及其製法與封裝基板及其製法 |
| KR102229384B1 (ko) * | 2013-02-15 | 2021-03-18 | 오르멧 서키츠 인코퍼레이티드 | 다층 전자 기판의 z-축 상호 연결 구조물 |
| US9455421B2 (en) | 2013-11-21 | 2016-09-27 | Atom Nanoelectronics, Inc. | Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays |
| WO2016203774A1 (ja) * | 2015-06-19 | 2016-12-22 | 日本電信電話株式会社 | フレキシブルプリント配線板のはんだ接合構造 |
| JP6982959B2 (ja) * | 2016-02-05 | 2021-12-17 | 日本メクトロン株式会社 | 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法 |
| US10672530B2 (en) | 2016-02-29 | 2020-06-02 | Liquid Wire Inc. | Deformable conductors and related sensors, antennas and multiplexed systems |
| EP3424053B1 (en) * | 2016-02-29 | 2021-09-15 | Liquid Wire Inc. | Liquid wire |
| US10357171B2 (en) | 2016-07-08 | 2019-07-23 | General Electric Company | Adjustable ECG sensor and related method |
| KR102810370B1 (ko) | 2019-05-28 | 2025-05-19 | 리퀴드 와이어 인크. | 변형가능 전자 디바이스 |
-
2020
- 2020-05-28 KR KR1020247000986A patent/KR102810370B1/ko active Active
- 2020-05-28 WO PCT/US2020/034854 patent/WO2020243254A1/en not_active Ceased
- 2020-05-28 CN CN202080039373.3A patent/CN114175280B/zh active Active
- 2020-05-28 US US16/885,854 patent/US11682615B2/en active Active
- 2020-05-28 KR KR1020217042896A patent/KR102625030B1/ko active Active
- 2020-05-28 CN CN202510817650.3A patent/CN120659461A/zh active Pending
- 2020-05-28 JP JP2021570380A patent/JP7384934B2/ja active Active
- 2020-05-28 EP EP20813667.1A patent/EP3977524A4/en active Pending
-
2021
- 2021-05-18 US US17/303,030 patent/US11688677B2/en active Active
-
2023
- 2023-05-12 US US18/316,586 patent/US12205878B2/en active Active
- 2023-11-09 JP JP2023191774A patent/JP2024035235A/ja active Pending
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