JP7382553B2 - レーザ加工装置及びそれを用いたレーザ加工方法 - Google Patents

レーザ加工装置及びそれを用いたレーザ加工方法 Download PDF

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Publication number
JP7382553B2
JP7382553B2 JP2021522717A JP2021522717A JP7382553B2 JP 7382553 B2 JP7382553 B2 JP 7382553B2 JP 2021522717 A JP2021522717 A JP 2021522717A JP 2021522717 A JP2021522717 A JP 2021522717A JP 7382553 B2 JP7382553 B2 JP 7382553B2
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Prior art keywords
laser beam
laser
optical
laser processing
workpiece
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Japanese (ja)
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JPWO2020241137A1 (https=
Inventor
静波 王
正敏 西尾
憲三 柴田
学 西原
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
JP2021522717A 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法 Active JP7382553B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019100183 2019-05-29
JP2019100183 2019-05-29
PCT/JP2020/017620 WO2020241137A1 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

Publications (2)

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JPWO2020241137A1 JPWO2020241137A1 (https=) 2020-12-03
JP7382553B2 true JP7382553B2 (ja) 2023-11-17

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JP2021522717A Active JP7382553B2 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

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US (1) US20220072655A1 (https=)
EP (1) EP3978182B1 (https=)
JP (1) JP7382553B2 (https=)
WO (1) WO2020241137A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382552B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
CN119317506B (zh) * 2022-08-02 2025-11-18 三菱电机株式会社 数值孔径可变装置、激光器装置及激光加工机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777138B2 (ja) 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JP2002273586A (ja) 2001-03-16 2002-09-25 National Institute For Materials Science レーザ溶接方法
JP2003001464A (ja) 2001-06-22 2003-01-08 Nippei Toyama Corp レーザ加工装置及びレーザ加工方法
US20180159299A1 (en) 2016-12-02 2018-06-07 Wang-Long Zhou Laser systems utilizing fiber bundles for power delivery and beam switching

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857385U (ja) * 1981-10-16 1983-04-18 株式会社東芝 レ−ザ照射装置
JPS58159514A (ja) * 1982-03-18 1983-09-21 Toshiba Corp レ−ザビ−ム空間分布形成方法
JPS5942502A (ja) * 1982-08-31 1984-03-09 Matsushita Electric Ind Co Ltd 赤外光導光路
JPS6384786A (ja) * 1986-09-26 1988-04-15 Toshiba Corp レ−ザマ−キング装置
US4927226A (en) * 1989-03-27 1990-05-22 General Electric Company Multiplexer for high power CW lasers
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
US6515257B1 (en) * 2001-03-26 2003-02-04 Anvik Corporation High-speed maskless via generation system
US7460755B2 (en) * 2003-01-17 2008-12-02 Hrl Laboratories, Llc Method and apparatus for combining laser light
JP4822737B2 (ja) * 2005-04-22 2011-11-24 ミヤチテクノス株式会社 レーザ溶接方法及びレーザ溶接装置
US8803029B2 (en) * 2006-08-03 2014-08-12 Chrysler Group Llc Dual beam laser welding head
DE102010003750A1 (de) 2010-04-08 2011-10-13 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Anordnung zum Verändern der Strahlprofilcharakteristik eines Laserstrahls mittels einer Mehrfachclad-Faser
DE102011003686A1 (de) * 2011-02-07 2012-08-09 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsvorrichtung
WO2017159439A1 (ja) * 2016-03-17 2017-09-21 パナソニックＩｐマネジメント株式会社 ファイバ結合装置
US11179802B2 (en) * 2016-07-14 2021-11-23 Mitsubishi Electric Corporation Laser machining head and laser machining apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777138B2 (ja) 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JP2002273586A (ja) 2001-03-16 2002-09-25 National Institute For Materials Science レーザ溶接方法
JP2003001464A (ja) 2001-06-22 2003-01-08 Nippei Toyama Corp レーザ加工装置及びレーザ加工方法
US20180159299A1 (en) 2016-12-02 2018-06-07 Wang-Long Zhou Laser systems utilizing fiber bundles for power delivery and beam switching

Also Published As

Publication number Publication date
US20220072655A1 (en) 2022-03-10
EP3978182B1 (en) 2025-03-19
EP3978182A1 (en) 2022-04-06
WO2020241137A1 (ja) 2020-12-03
JPWO2020241137A1 (https=) 2020-12-03
EP3978182A4 (en) 2022-08-24

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