JP7352735B2 - マイクロチャンネルヒートシンクの製造方法 - Google Patents
マイクロチャンネルヒートシンクの製造方法 Download PDFInfo
- Publication number
- JP7352735B2 JP7352735B2 JP2022527757A JP2022527757A JP7352735B2 JP 7352735 B2 JP7352735 B2 JP 7352735B2 JP 2022527757 A JP2022527757 A JP 2022527757A JP 2022527757 A JP2022527757 A JP 2022527757A JP 7352735 B2 JP7352735 B2 JP 7352735B2
- Authority
- JP
- Japan
- Prior art keywords
- cover plate
- plate
- heat sink
- microchannel
- lower cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000000463 material Substances 0.000 claims description 103
- 238000000034 method Methods 0.000 claims description 51
- 238000003825 pressing Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000003486 chemical etching Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 88
- 230000008569 process Effects 0.000 description 23
- 238000002788 crimping Methods 0.000 description 14
- 238000003466 welding Methods 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000006056 electrooxidation reaction Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 229910000816 inconels 718 Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
- F28F2275/061—Fastening; Joining by welding by diffusion bonding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/04—Means for preventing wrong assembling of parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Micromachines (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Semiconductor Lasers (AREA)
Description
マイクロチャンネルヒートシンクを構成する各層板材に予め設定された液体出入り流路及びマイクロチャンネル構造を加工する工程と、
上蓋板と下蓋板を取り、前記上蓋板と前記下蓋板に、それぞれ製造されるマイクロチャンネルヒートシンクの最上層板材と最下層板材のマイクロチャンネル構造に応じて対応するパターンを加工する工程と、
前記上蓋板、前記各層板材及び前記下蓋板を順にアライメントスタッキングする工程と、
アライメントスタッキングされた前記上蓋板、前記各層板材及び前記下蓋板を還元性雰囲気に置いて加熱して保温するとともに、前記上蓋板及び/又は前記下蓋板に加圧する工程と、
所定の時間加圧した後、保温及び加圧を停止し、前記上蓋板及び前記下蓋板を除去する工程と、を含むマイクロチャンネルヒートシンクの製造方法を提供する。
以下、五層の折り返し式構造のマイクロチャンネルヒートシンクの製造を例として、本発明のマイクロチャンネルヒートシンク及びその製造方法をさらに詳細に説明する。理解されるように、本発明のマイクロチャンネルヒートシンクの製造方法は、下記の五層の折り返し式構造のマイクロチャンネルヒートシンクの製造方法に限定されない。
101 第1層板材
102 第2層板材
103 第3層板材
104 第4層板材
105 第5層板材
106 第1位置決め孔
107 液体出入り流路
108 第1マイクロチャンネル構造
200 上蓋板
201 第2位置決め孔
202 第2マイクロチャンネル構造
300 下蓋板
301 第3位置決め孔
302 第3マイクロチャンネル構造
400 マイクロチャンネルヒートシンクの完成品
Claims (11)
- マイクロチャンネルヒートシンクを構成する各層板材に予め設定された液体出入り流路及びマイクロチャンネル構造を加工する工程と、
上蓋板と下蓋板を取り、前記上蓋板と前記下蓋板に、それぞれ製造されるマイクロチャンネルヒートシンクの最上層板材と最下層板材のマイクロチャンネル構造に応じて対応するパターンを加工する工程と、
前記上蓋板、前記各層板材及び前記下蓋板を順にアライメントスタッキングする工程と、
アライメントスタッキングされた前記上蓋板、前記各層板材及び前記下蓋板を還元性雰囲気に置いて加熱して保温するとともに、前記上蓋板及び/又は前記下蓋板に加圧する工程と、
所定の時間加圧した後、保温及び加圧を停止し、前記上蓋板及び前記下蓋板を除去する工程と、を含む、
ことを特徴とするマイクロチャンネルヒートシンクの製造方法。 - 前記上蓋板、前記各層板材及び前記下蓋板の対応する位置に位置決め孔をそれぞれ加工する工程を更に含み、アライメントスタッキング時に、前記上蓋板、前記各層板材及び前記下蓋板を前記位置決め孔により整列させる、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記位置決め孔は、各前記板材の縁角に近い部位に分布し、かつ、各板材において予め設定された液体出入り流路及びマイクロチャンネル構造以外の領域に位置している、
ことを特徴とする請求項2に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記各層板材における前記液体出入り流路及びマイクロチャンネル構造は、化学エッチング、レーザ切断、プラズマ切断、火炎切断、砥石切断、水ナイフ切断、ワイヤ切断、数値制御工作機械加工及びプレスのいずれかの手段で加工して得られる、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記上蓋板と前記下蓋板の材料は、金属又は合金である、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記上蓋板と前記下蓋板の厚さは、受圧時の対応する蓋板の凹みの深さ以上である、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記上蓋板と前記上蓋板に近い板材との間、及び/又は前記下蓋板と前記下蓋板に近い板材との間に分離しやすい分離層を設ける工程をさらに含む、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記分離しやすい分離層は黒鉛紙又は黒鉛液である、
ことを特徴とする請求項7に記載のマイクロチャンネルヒートシンクの製造方法。 - 加圧時に、前記上蓋板と前記下蓋板の積層された各層板材とは反対側に上押圧ブロックと下押圧ブロックをそれぞれ配置し、前記上押圧ブロックと前記下押圧ブロックによりそれぞれ蓋板を押圧することで積層された各層板材を加圧し、或いは、前記上蓋板と前記下蓋板を直接押圧することで前記積層された各層板材を加圧する、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記加圧の圧力は、1~20MPaである、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。 - 前記加熱の方法は、30℃/min~8000℃/minの速度で300℃~950℃まで昇温し、前記保温の保温時間は120s~3600sである、
ことを特徴とする請求項1に記載のマイクロチャンネルヒートシンクの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110708719.0A CN113587692B (zh) | 2021-06-25 | 2021-06-25 | 微通道热沉及其制造方法 |
CN202110708719.0 | 2021-06-25 | ||
PCT/CN2021/124091 WO2022267268A1 (zh) | 2021-06-25 | 2021-10-15 | 微通道热沉及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023535239A JP2023535239A (ja) | 2023-08-17 |
JP7352735B2 true JP7352735B2 (ja) | 2023-09-28 |
Family
ID=82839547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022527757A Active JP7352735B2 (ja) | 2021-06-25 | 2021-10-15 | マイクロチャンネルヒートシンクの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230226590A1 (ja) |
EP (1) | EP4135134A4 (ja) |
JP (1) | JP7352735B2 (ja) |
KR (1) | KR102624495B1 (ja) |
IL (1) | IL293947A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006253702A (ja) | 2006-04-03 | 2006-09-21 | Fanuc Ltd | 冷却装置、その製造方法および半導体レーザ装置 |
JP2007127398A (ja) | 2005-10-05 | 2007-05-24 | Seiko Epson Corp | 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器 |
JP2008300596A (ja) | 2007-05-31 | 2008-12-11 | Sony Corp | ヒートシンクおよび半導体レーザ装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1532628A (en) * | 1974-11-15 | 1978-11-15 | Ass Eng Ltd | Metal bonding method |
JP2003279283A (ja) * | 2002-03-25 | 2003-10-02 | Mitsubishi Heavy Ind Ltd | 熱交換器及びその製造方法 |
JP4449894B2 (ja) * | 2005-12-16 | 2010-04-14 | セイコーエプソン株式会社 | 熱交換器、光源装置、プロジェクタおよび電子機器 |
KR101200929B1 (ko) * | 2010-05-06 | 2012-11-13 | 한국과학기술연구원 | 마이크로-매크로 채널 반응기의 제조방법 |
KR101944288B1 (ko) * | 2010-10-18 | 2019-04-17 | 벨로시스, 인코포레이티드 | 라미네이트형 누설 저항 화학적 프로세서, 이의 제조 방법 및 작동 방법 |
JP2012160688A (ja) * | 2011-01-31 | 2012-08-23 | Sekai Saisoku Shisaku Center:Kk | ヒートシンク及びその製造方法 |
US9383143B2 (en) * | 2013-09-26 | 2016-07-05 | Micro Cooling Concepts, Inc. | Metallic thin-film bonding and alloy generation |
JP6375818B2 (ja) * | 2014-09-19 | 2018-08-22 | 三菱マテリアル株式会社 | 放熱板付パワーモジュール用基板の製造装置及び製造方法 |
CN105244756A (zh) * | 2015-11-24 | 2016-01-13 | 山东华光光电子有限公司 | 一种微通道半导体激光器的烧结夹具及其烧结方法 |
CN107160019A (zh) * | 2017-02-23 | 2017-09-15 | 广东工业大学 | 一种半导体激光器微通道热沉叠片的焊接装置及方法 |
CN110729259B (zh) * | 2019-09-23 | 2021-11-23 | 清华大学 | 微通道热沉及其制造方法 |
JP7365634B2 (ja) * | 2019-10-17 | 2023-10-20 | パナソニックIpマネジメント株式会社 | 熱交換器 |
-
2021
- 2021-10-15 JP JP2022527757A patent/JP7352735B2/ja active Active
- 2021-10-15 KR KR1020227020269A patent/KR102624495B1/ko active IP Right Grant
- 2021-10-15 US US17/788,917 patent/US20230226590A1/en active Pending
- 2021-10-15 EP EP21890364.9A patent/EP4135134A4/en active Pending
-
2022
- 2022-06-14 IL IL293947A patent/IL293947A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007127398A (ja) | 2005-10-05 | 2007-05-24 | Seiko Epson Corp | 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器 |
JP2006253702A (ja) | 2006-04-03 | 2006-09-21 | Fanuc Ltd | 冷却装置、その製造方法および半導体レーザ装置 |
JP2008300596A (ja) | 2007-05-31 | 2008-12-11 | Sony Corp | ヒートシンクおよび半導体レーザ装置 |
Also Published As
Publication number | Publication date |
---|---|
IL293947A (en) | 2022-08-01 |
JP2023535239A (ja) | 2023-08-17 |
KR102624495B1 (ko) | 2024-01-11 |
EP4135134A4 (en) | 2023-11-29 |
EP4135134A1 (en) | 2023-02-15 |
KR20230001004A (ko) | 2023-01-03 |
US20230226590A1 (en) | 2023-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7277283B2 (en) | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold | |
WO2022267268A1 (zh) | 微通道热沉及其制造方法 | |
CN102574361B (zh) | 层合材料及其制造方法 | |
US7786602B2 (en) | Patterned die attach and packaging method using the same | |
JP4465364B2 (ja) | プレートスタック、特にはプレートスタックから成る冷却器または冷却器要素の製造方法 | |
CN106575639A (zh) | 功率模块用基板的制造方法 | |
CN112118711A (zh) | 均热板及其制作方法及电子设备 | |
CN110911316B (zh) | 一种复合型冷却水盘及其制作方法和用途 | |
JP7352735B2 (ja) | マイクロチャンネルヒートシンクの製造方法 | |
JPH06268115A (ja) | 半導体装置用放熱基板の製造方法 | |
CN112340694B (zh) | 一种用于氮化镓功放芯片的玻璃微流道散热器制备方法 | |
KR20170134620A (ko) | 판형 열 교환기의 제조 방법 | |
JP2011230954A (ja) | セラミック部材とフィン付き放熱部材との接合体の製造方法 | |
CN110756979B (zh) | 液冷散热冷板的夹紧工装及方法 | |
WO2016116273A1 (en) | A heat exchanger comprising micro channels and manufacturing thereof | |
CN115608990A (zh) | 一种超高导热微通道用金刚石铜复合材料的焊接方法 | |
WO2017217236A1 (ja) | 回路基板付きヒートシンク及びその製造方法 | |
TWI676778B (zh) | 具有至少一冷卻鰭片之散熱板、用於製造具有至少一冷卻鰭片之散熱板的方法、電子模組 | |
JPH0361539B2 (ja) | ||
WO2021086893A2 (en) | Ultrasonic additively manufactured coldplates on heat spreaders | |
JP2020153548A (ja) | 積層体及び積層体の製造方法 | |
JP2001050682A (ja) | パネル型熱交換器およびその製造方法 | |
JP2018056275A (ja) | 回路基板付きヒートシンク及びその製造方法 | |
JPS61104645A (ja) | 冷却器及びその製造方法 | |
CN219677254U (zh) | 双层热轧材料芯片散热盖及封装芯片 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220510 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220510 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230822 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230915 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7352735 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |