JP7345548B2 - イメージセンサー用基板 - Google Patents
イメージセンサー用基板 Download PDFInfo
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- JP7345548B2 JP7345548B2 JP2021527093A JP2021527093A JP7345548B2 JP 7345548 B2 JP7345548 B2 JP 7345548B2 JP 2021527093 A JP2021527093 A JP 2021527093A JP 2021527093 A JP2021527093 A JP 2021527093A JP 7345548 B2 JP7345548 B2 JP 7345548B2
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- 239000000758 substrate Substances 0.000 title claims description 159
- 239000010949 copper Substances 0.000 claims description 71
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 229910002056 binary alloy Inorganic materials 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 13
- 229910052790 beryllium Inorganic materials 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 10
- 239000010941 cobalt Substances 0.000 claims description 10
- 229910002058 ternary alloy Inorganic materials 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 293
- 238000010586 diagram Methods 0.000 description 49
- 239000010931 gold Substances 0.000 description 18
- 239000007769 metal material Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 238000006073 displacement reaction Methods 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 238000004088 simulation Methods 0.000 description 12
- 239000000654 additive Substances 0.000 description 10
- 230000000996 additive effect Effects 0.000 description 10
- 238000007667 floating Methods 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010276 construction Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Optics & Photonics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Adjustment Of Camera Lenses (AREA)
Description
Claims (15)
- 第1オープン領域を含む絶縁層と、
前記絶縁層上に配置される伝導性パターン部と、
前記絶縁層の下に配置されるスプリングプレートと、を含み、
前記絶縁層は、
第1絶縁部と、
前記第1オープン領域を挟んで前記第1絶縁部から離隔される第2絶縁部と、
前記第1オープン領域に配置され、前記第1絶縁部および第2絶縁部の間を連結する第3絶縁部とを含み、
前記伝導性パターン部は、
前記第1絶縁部上に配置された第1リードパターン部と、
前記第2絶縁部上に配置された第2リードパターン部と、
前記絶縁層の前記第3絶縁部の上に配置されて、前記第1リードパターン部と前記第2リードパターン部との間を連結し、折曲部分を含む延長パターン部とを含み、
前記延長パターン部は、前記第1オープン領域の上で互いに離隔する複数の延長パターンを含み、
前記第3絶縁部は、前記複数の延長パターンにそれぞれ対応し、前記第1オープン領域の上に互いに離隔する複数の延長絶縁部を含み、
前記スプリングプレートは、第2オープン領域を挟んで相互に離隔される第1および第2プレート部と、前記第2オープン領域に配置される弾性部材を含み、
前記第1絶縁部は、前記第1プレート部上に配置され、
前記第2絶縁部は、前記第2プレート部上に配置され、
前記弾性部材は、前記第1および第2プレート部の間を連結し、
前記スプリングプレートは、前記絶縁層の下に配置され、前記第1オープン領域と光軸方向に重なった第2オープン領域を含み、
前記弾性部材は、前記第1プレート部の角領域に隣接した前記第2オープン領域のコーナー領域に配置され、互いに異なる水平方向に折り曲げられた折曲部を含み、
前記第3絶縁部は、前記弾性部材と光軸方向に重なる第1部分と、前記第1部分と連結され、前記弾性部材及び前記延長パターン部と光軸方向に重ならない第2部分とを含む弾性絶縁部を含む、イメージセンサー用基板。 - 前記第2オープン領域は、前記第1プレート部の異なる角領域に隣接した複数のコーナー領域を含み、
前記弾性部材は、前記複数のコーナー領域にそれぞれ配置された複数の折曲部を含み、
前記延長パターンは、第1延長パターンおよび前記第1延長パターンと隣接した第2延長パターンを含み、
前記複数の延長絶縁部は、前記第1延長パターンと光軸方向に重なる第1延長絶縁部および前記第2延長パターンと光軸方向に重なる第2延長絶縁部を含み、
前記第1延長絶縁部は、前記第2延長パターンと光軸方向に重ならず、
前記第2延長絶縁部は、前記第1延長パターンと光軸方向に重ならない、請求項1に記載のイメージセンサー用基板。 - 前記延長パターン部の長さは、前記第1リードパターン部と前記第2リードパターン部との間の直線距離よりも大きい、請求項1乃至2のいずれか1項に記載のイメージセンサー用基板。
- 前記延長パターン部は、前記第1リードパターン部と前記第2リードパターン部との間の直線距離の1.5倍から4倍の間の長さを有する、請求項1乃至3のいずれか1項に記載のイメージセンサー用基板。
- 前記第1及び第2延長絶縁部のそれぞれは、前記第1及び第2延長パターンのそれぞれ線幅よりも大きい線幅を有する、請求項2に記載のイメージセンサー用基板。
- 前記第1リードパターン部と、前記第2リードパターン部は、金属層と、前記金属層上に配置されるメッキ層とを含む、請求項1乃至5のいずれか1項に記載のイメージセンサー用基板。
- 前記スプリングプレートは、前記伝導性パターン部と電気的に連結されず、
前記弾性部材は、前記第1オープン領域で前記延長パターン部と光軸方向に重ならない領域を有する、請求項1乃至6のいずれか1項に記載のイメージセンサー用基板。 - 前記延長パターン部は、銅(Cu)-ニッケル(Ni)、銅(Cu)-スズ(Sn)、銅(Cu)-ベリリウム(Be)、銅(Cu)-コバルト(Co)のうちいずれかの2元系合金または銅(Cu)-ニッケル(Ni)-スズ(Sn)、銅(Cu)-ベリリウム(Be)-コバルト(Co)のいずれかの3元系合金で形成される、請求項1乃至7のいずれか1項に記載のイメージセンサー用基板。
- 前記第1プレート部は、少なくとも一つのスリットを含む、請求項1に記載のイメージセンサー用基板。
- 前記延長パターン部は、複数の折曲されるスプリング形状を有し、
前記複数の延長絶縁部は、前記延長パターン部に対応する形状を有する、請求項1に記載のイメージセンサー用基板。 - 前記延長パターン部は、前記第1オープン領域の角領域と光軸方向に重畳されない、請求項1乃至10のいずれか1項に記載のイメージセンサー用基板。
- 前記弾性部材は、前記第2オープン領域の角領域に配置され、
前記延長パターン部は、前記第1オープン領域および前記第2オープン領域の角領域と光軸方向に重畳されない、請求項1に記載のイメージセンサー用基板。 - 前記延長パターン部の線幅は、前記第1および第2リードパターン部それぞれの線幅よりも小さい、
請求項1乃至12のいずれか1項に記載のイメージセンサー用基板。 - ハウジングと、
前記ハウジング内に配置されるレンズバレルと、
前記レンズバレル内に配置されるレンズアセンブリと、
前記ハウジング内に配置される請求項1乃至13のいずれか1項に含まれたイメージセンサー用基板と、
前記イメージセンサー用基板の前記第1リードパターン部上に配置されるイメージセンサー、および
前記イメージセンサー用基板の前記第2リードパターン部と連結されるパッド部を含むフレキシブル回路基板を含む、カメラモジュール。 - 前記イメージセンサー用基板の前記絶縁層に配置され、前記イメージセンサーを移動させる駆動部を含む、請求項14に記載のカメラモジュール。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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KR10-2018-0143392 | 2018-11-20 | ||
KR1020180143392A KR102554187B1 (ko) | 2018-11-20 | 2018-11-20 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
KR10-2019-0002156 | 2019-01-08 | ||
KR1020190002156A KR102641106B1 (ko) | 2019-01-08 | 2019-01-08 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
PCT/KR2019/015531 WO2020105956A1 (ko) | 2018-11-20 | 2019-11-14 | 이미지 센서용 기판 |
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KR100646560B1 (ko) | 2005-07-08 | 2006-11-14 | 자화전자(주) | 이미지센서를 이용한 시프트 방식의 손 떨림 보정장치 |
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WO2017156462A1 (en) | 2016-03-11 | 2017-09-14 | Skattward Research Llc | Optical image stabilization with voice coil motor for moving image sensor |
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US20230209163A1 (en) | 2023-06-29 |
CN117410297A (zh) | 2024-01-16 |
JP2022513607A (ja) | 2022-02-09 |
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CN113169196B (zh) | 2024-01-19 |
US11622064B2 (en) | 2023-04-04 |
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