JP7338277B2 - Cutting device and cutting method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a cutting apparatus and a cutting method for obtaining a plurality of plate-shaped objects having a predetermined width by cutting a thin metal plate. More specifically, the present invention relates to a cutting device and a cutting method for obtaining a cathode sling ribbon used in an electrorefining process using a seed plate of a non-ferrous metal by cutting the seed plate to a predetermined width.

2. Description of the Related Art In metalworking, there is a cutting method in which a thin metal plate is cut to obtain a plurality of plate-like objects having a predetermined width arranged side by side. An example of the use of such a cutting method is the production of ribbons used as cathode hangers for electrorefining processes using seed plates of non-ferrous metals.

Here, copper smelting methods include a wet method in which copper is leached from a copper concentrate into an acid or the like, and a method in which the copper concentrate is melted to produce an anode (smelting process), and the resulting anode is used for electrolytic refining. There is a dry method for producing electrolytic copper (electrolytic refining process). The dry process is the mainstream of copper smelting, especially for sulfide concentrates, because it enables large-scale production and is low in cost.

The dry method will be explained more specifically. First, in the smelting process, the copper concentrate obtained by flotation is melted in a flash smelting furnace to form matte, the resulting matte is oxidized in a converter to obtain blister copper, and the resulting blister copper is refined in a refining furnace. Purified blister copper having a purity of about 99% is obtained by this method, and the purified blister copper is poured into a casting machine to cast an anode (anode plate) for copper electrolytic refining.

In the subsequent electrorefining step, a plurality of anodes and a plurality of separately prepared cathodes (cathode plates) are alternately arranged at regular intervals in an electrolytic cell in which a copper electrolyte is held, and these anodes and cathodes energize the As a result, copper ions are eluted from the anode into the electrolytic solution, and the copper ions are electrodeposited on the cathode to obtain electrolytic copper having a copper grade of 99.99% or more on the cathode.

In the electrolytic refining of copper, a cathode made of a mother plate such as stainless steel is used, and the electrodeposited electrolytic copper is periodically stripped off to make a product. There is a seed plate method in which the cathode is used as a cathode on which electrolytic copper is electrodeposited, and the cathode is used as a product as it is.

The seed plate is obtained by processing electrolytic copper stripped by a permanent cathode method or the like into a rectangular plate. As shown in FIG. 2, the cathode consisting of a seed plate comprises a seed plate 1, a crossbar (also referred to as a beam) 2, and a hanger 3 joining them together. Such a cathode is obtained by cutting another seed plate to a predetermined size to obtain a ribbon, which is a plate-like object, and in the cathode assembly process, looping this ribbon and hanging it on the crossbar 2, It is obtained by fixing to the upper part of the seed plate 1 to form a hanger 3.

Normally, the process of cutting such a seed plate to obtain a ribbon and the process of assembling a cathode by fixing the ribbon to the seed plate 1 and the crossbar 2 to form a hanger 3 are both automated. there is

To explain this automated work process in detail, first, electrolytic copper electrodeposited to a thickness of about 1 mm on a stainless steel plate called a mother plate is peeled off from the mother plate to obtain a seed plate. This seed plate is cut by a shear, which is a primary cutting machine, and becomes a cut seed plate and cutting scraps. Chips generated by this primary cutting are collected and charged into a converter as a coolant.

As shown in FIG. 3, the cutting seed plate 4 is cut into a predetermined width by a slitter 5, which is a secondary cutting machine, to form a plurality of ribbons 7. At this time, both ends of the cutting seed plate 4 in the width direction are , become chips 8 . The shavings 8 generated by this secondary cutting are also recovered and charged into the converter as a coolant.

As disclosed in Japanese Patent Application Laid-Open No. 2003-145340, a cutting seed plate, a plurality of ribbons, and cutting scraps are transported by a roller conveyor or a belt conveyor, and the ribbons are supplied to the next process such as a leveler. . The ribbons are then automatically accumulated in the ribbon magazine.

Swarf must be removed before the ribbon is fed to the leveler. For this reason, a guiding mechanism such as a guide for adjusting the destination of the ribbons and cutting scraps is provided between the slitter and the leveler. For example, in the cutting apparatus described in Japanese Patent Application Laid-Open No. 2003-145340, a movable end portion is installed in a mechanism that feeds a ribbon from a slitter to a leveler or the like to the next process, and is movable up and down and has rollers rotatably attached. A swarf removal device is provided.

In this device, a non-contact chip detection sensor is installed on the slitter side of the chip removal device, and this sensor detects the arrival position of the chip from the slitter, and raises and lowers the movable end of the chip removal device. As a result, the cutting scraps are forcibly knocked down by the rollers arranged at the movable end portion and discharged from the discharge port.

Japanese Patent Application Laid-Open No. 2003-145340

However, even in a cutting device equipped with such a cutting waste removing device, cutting waste is appropriate depending on the hardness and surface roughness of the seed plate, or depending on the deterioration of cutting due to wear of the cutting blade of the slitter. may not be removed immediately. In this case, the cut waste is supplied to the leveler together with the ribbon and mixed into the ribbon magazine.

In an automated process, these scraps are sent directly to the cathode assembly process, resulting in a cathode with a handle shorter than the standard product. Since such a cathode does not meet product standards, it must be removed as a defective plate.

INDUSTRIAL APPLICABILITY The present invention reliably prevents shavings having a shorter width from being mixed into a plate-shaped object such as a ribbon, thereby making it possible to prevent the generation of defective plates using the shavings. The object is to provide an apparatus and a cutting method.

TECHNICAL FIELD The present invention relates to a cutting apparatus for cutting a thin metal plate such as a seed plate to obtain a plurality of plate-shaped objects such as ribbons having a predetermined width.

Specifically, the cutting device of the present invention comprises:
a slitter for cutting the thin metal plate to obtain a plurality of plate-shaped objects having a predetermined width;
a device for feeding the plurality of plate-shaped objects of a predetermined width to the next process;
a swarf removing device provided in a device for feeding the plate-shaped materials to the next process for removing swarf generated together with the plurality of plate-shaped materials by the slitter; and
a discharge section provided below the cutting waste removing device and through which the cutting waste passes when discharged;
Prepare.

In particular, the cutting device of the present invention is characterized in that the discharge section is provided with a sensor for detecting passage of the cutting waste.

Preferably, the sensor is a non-contact sensor. More preferably, a transmission type photoelectric sensor is used as the non-contact sensor, and the passage of the cutting debris is detected when the transmission type photoelectric sensor is blocked by the passage of the cutting debris. .

Preferably, the cutting device of the present invention includes a device for feeding the thin metal plate into the slitter, and the sensor detects the passage of the cut waste within a predetermined time after the thin metal plate is cut by the slitter. is not detected, a device for feeding the thin metal sheets to the slitter and/or a device for feeding the plate-shaped objects to the next process are stopped.

The time when the thin metal plate is cut by the slitter is when the leading end of the thin metal plate in the traveling direction is fed into the slitter and cutting is started, or when the leading end of the plate-shaped object in the traveling direction It is possible to adopt the time when the part moves from the slitter to a predetermined position.

As the cutting waste removing device, a guide fixed to a device for feeding the plate-like object to the next process and guiding the cutting waste downward can be employed. Preferably, the cutting waste removing device is constituted by a device having a movable end portion which is movable up and down and to which rollers are rotatably attached. In this case, the device more preferably includes a cylinder having the tip portion and a mechanism for driving the cylinder, and more preferably the cylinder is an air cylinder.

Further, the cutting waste removing device detects, on the slitter side, that the plate-like material has passed through the slitter. A second sensor may be provided for detecting movement to the location. Preferably, the second sensor provided in the cutting waste removing device is a non-contact sensor capable of detecting the position of the leading end of the plate-like object in the traveling direction. The time point at which the second sensor detects the position of the leading edge of the plate in the traveling direction can be treated as a reference time when the cutting seed plate is cut by the slitter.

TECHNICAL FIELD The present invention relates to a cutting method for cutting a thin metal plate such as a seed plate to obtain a plurality of plate-like objects such as ribbons having a predetermined width.

Specifically, the cutting method of the present invention comprises:
a step of cutting a thin metal plate using a slitter to obtain a plurality of plate-shaped objects having predetermined widths;
a step of feeding the plurality of plate-shaped objects to a next step; and
a step of removing cutting debris generated together with the plurality of plate-shaped objects by the slitter;
Prepare.

In particular, the cutting method of the present invention comprises:
The method further comprises a step of confirming passage of the cutting waste with a sensor in a discharge portion through which the cutting waste removed in the step of removing the cutting waste passes.

It is preferable that the sensor is a non-contact type sensor, the non-contact type sensor is a transmission type photoelectric sensor, and the transmission type photoelectric sensor is blocked by the passage of the cutting chips, so that the cutting chips are removed. More preferably, passage is detected.

a step of feeding the thin metal plate into the slitter, wherein the thin metal plate is cut when the sensor does not detect passage of the cutting waste within a predetermined time after the thin metal plate is cut by the slitter. It is preferable to include a step of stopping the step of feeding the plate-like material to the slitter and/or the step of feeding the plate-like material to the next step.

According to the present invention, in the step of cutting the seed plate by the slitter, it is possible to reliably detect that the cutting waste generated at the width direction end of the seed plate was not discharged in the step of discharging the cutting waste, and the cutting waste However, since it is possible to reliably prevent it from being mixed in the next process together with the ribbon, it is possible to prevent the generation of defective cathodes that do not meet product specifications.

1 is a conceptual diagram showing the configuration of a cutting device of the present invention; FIG. 1 is a schematic diagram of a cathode used for electrolytic refining of copper by the seed plate method; FIG. FIG. 4 is a conceptual diagram showing a process of obtaining a plurality of ribbons from a seed plate by a slitter;

The present invention relates to a cutting apparatus and a cutting method for cutting a thin metal plate to obtain a plurality of plate-shaped objects of a predetermined width, in which cutting chips are generated at the ends of the thin metal plate in the width direction. Apparatus and cutting method.

Hereinafter, as an example of an embodiment of the present invention, a ribbon 7 constituting a hanger 3 attached to a seed plate 1, which is a thin plate of electrolytic copper, used in an electrolytic refining process by a seed plate method is seeded by a slitter 5. A detailed description will be given based on a cutting apparatus and a cutting method obtained by cutting a plate (cutting seed plate 4). However, the present invention is not limited to this, and is widely applied to a cutting device and a cutting method having a configuration in which cutting chips are generated at the width direction end portions when processing a thin metal plate to a predetermined width by a cutting machine such as a shear or a press. Applies.

As shown in FIG. 1, the cutting apparatus of the present invention comprises a slitter 5 for cutting a cut seed plate 4 obtained by cutting a seed plate 1 with a shear to obtain ribbons 7 having a plurality of predetermined widths. , a plurality of roller conveyors 15, which are devices for feeding the ribbon 7 to the next process, and a slitter 5 arranged in the middle part of the roller conveyor 15 in the direction in which the ribbon 7 advances, for removing the cutting waste 8 generated together with the ribbon 7 by the slitter 5. and an air cylinder 10, which is a cutting waste removing device, and a discharge part 9 provided below the air cylinder 10 and through which the cutting waste 8 is discharged.

A known device can be applied as the slitter 5 applicable to the present invention. As shown in FIG. 3, the cutting seed plate 4 is cut into a plurality of pieces along the traveling direction by a plurality of disk-shaped cutting blades 6 constituting the slitter 5, and has a strip-shaped constant size, that is, the same predetermined width. A plurality of ribbons 7 are processed. At this time, the portion of the cutting seed plate 4 located at the end in the width direction becomes cutting waste 8 having a width smaller than the predetermined width of the ribbon 7 . In FIG. 1, reference numerals 4, 7, and 8 indicate movements of the cutting seed plate 4, the ribbon 7, and the cutting scraps 8 shown in FIG. ing.

A roller conveyor 14 on the receiving side and a roller conveyor 15 on the sending side are arranged in front of and behind the slitter 5 in the advancing direction of the cutting seed plate 4 . In this example, the roller conveyor 14 on the receiving side corresponds to a device that feeds the cut seed plate 4 to the slitter 5, and the roller conveyor 15 on the delivery side corresponds to a device that feeds the ribbon 7 to the next process. The roller conveyor 15 on the delivery side is composed of two roller conveyors that are spaced apart from each other in the direction in which the ribbon 7 advances.

In this example, the air cylinder 10 is arranged at an intermediate portion in the advancing direction of the ribbon 7 of the two roller conveyors that constitute the roller conveyor 15 on the delivery side. However, the roller conveyor on the sending side is composed of two or more roller conveyors installed in series, and the air cylinder 10 is installed at either end of the sending side roller conveyor 15 in the traveling direction of the ribbon 7. It is also possible to That is, an air cylinder is placed between the slitter 5 and the delivery-side roller conveyor 15, or between the delivery-side roller conveyor 15 and a device (leveler 13 in this example) that constitutes the next process such as transportation or leveling. , can also be installed. In the interpretation of the present invention, these cases are also included in the configuration in which the cutting waste removing device is provided in the device that feeds the plate-like object to the next process.

The air cylinder 10 has a piston 11 and a rotatable roller 12 provided at the movable end of the piston 11 .

The shavings 8 are generated from both ends in the width direction of the cutting seed plate 4 and pass through both ends in the width direction of the roller conveyor 15, so the air cylinders 10 are installed at both ends in the width direction of the roller conveyor 15. be done. However, in a mode in which shavings are generated only at one end in the width direction of the thin metal sheet, a swarf removing device such as an air cylinder can be installed only on one side in the width direction of the device that feeds the plate-like object to the next process. good.

The piston 11 can move up and down by operating a valve (not shown) that supplies compressed air to the air cylinder 10 . The piston 11 can rise to a position where the cutting waste 8 can be held down by the rollers 12 even when the cutting waste 8 is discharged from the slitter 5 in an upwardly warped state. When passing under the cylinder 10, it is possible to move downward. With such a configuration, even if large warped chips 8 are generated due to variations in the thickness and properties of the cutting seed plate 4 which is the raw material, it is possible to forcibly discharge the chips 8 downward. there is

In this example, three rollers 12 are attached to the movable end of the piston 11 of each air cylinder 10 so that the cutting chips 8 can be dropped more smoothly.

In this example, the air cylinder 10 is used as the drive mechanism used for the swarf discharge device, but a mechanism such as a hydraulic cylinder that moves the piston by hydraulic pressure, or a motor or the like that converts the rotary motion into reciprocating motion. A mechanism can also be used to provide linear motion of the movable end. By using these drive mechanisms, the cutting waste 8 can be pushed downward by the movable end of the cutting waste discharger and discharged downward. In addition to the rollers 12, it is possible to apply a structure capable of appropriately pressing only the cutting waste 8 downward to the movable end of the piston 11. As shown in FIG. Furthermore, as a simple means for constructing the chip discharging device, a guiding mechanism such as a guide for guiding cutting chips downward can be applied.

In this example, a leveler 13 is installed as a device that constitutes the next step. The leveler 13 is a device that performs a leveling process for removing warpage and distortion of the ribbon 7 . Afterwards there is a roller conveyor 16 for transporting the ribbon 7 to further processes. However, as a device constituting the next process, a roller conveyor may be installed for simply transporting the plate-like material obtained by cutting the ribbon 7, and a leveler may be installed downstream of this roller conveyor for transport. can also The ribbons 7 are eventually accumulated in a predetermined location such as a ribbon magazine (not shown).

In this example, a discharge section 9 through which the cutting chips 8 are discharged is provided below the air cylinder 10 between the two pairs of roller conveyors forming the roller conveyor 15 on the delivery side. The discharging part 9 can be composed of a simple space, or can be composed of the inside of a device such as a chute that regulates the traveling direction of the cutting waste 8 .

In this example, the discharge section 9 is provided with a sensor 17 for detecting passage of the cutting waste 8 . Any type of sensor 17 can be used as long as it can detect an object such as cutting waste 8 passing through the discharge section 9 . For example, photoelectric sensors such as infrared sensors, laser sensors, proximity sensors, and non-contact sensors such as ultrasonic sensors can be used. Among these non-contact sensors, a photoelectric sensor such as an infrared sensor can be preferably used for reasons such as cost and availability. The detection method of the photoelectric sensor is also arbitrary, and any method such as a transmission type with a light emitter and a receiver, a retroreflective type with a light emitter and receiver and a reflector, or a diffuse reflection type with only a light emitter and receiver can be adopted. . Of these, in the transmissive photoelectric sensor or the retroreflective photoelectric sensor, the non-contact sensor is blocked by the passage of the shavings 8, and the amount of light entering the light receiver is reduced. is detected. From the viewpoint of reliable detection of the cutting waste 8, it is preferable to use a transmissive photoelectric sensor that has high operational stability and is not affected by reflected light from a detection object. In addition, as the sensor 17, a contact-type sensor having a contact that contacts the cutting waste 8 and rotates, or the like can be applied.

In this example, a non-contact sensor 18 is also provided as a second sensor on the outer surface of the air cylinder 10 on the slitter side. As for the non-contact sensor, as long as it can detect the passing of the cutting waste 8 separately from the passing of the adjacent ribbon 7, it does not matter what type it is. For example, photoelectric sensors such as infrared sensors, laser sensors, proximity sensors, and non-contact sensors such as ultrasonic sensors can be used.

In a preferred example, it is preferable that not only the passage of the cutting debris 8 but also the distance to the tip of the cutting debris 8 can be measured. In this case, according to the distance from the non-contact sensor 18 to the tip of the cutting waste 8, the piston 11 is reliably raised to a position where the cutting waste 8 can be held down by the rollers 12, and passes under the air cylinder 10. It is possible to reliably discharge the cutting waste 8.

A timer is used to adjust the time until the air cylinder 10 is activated after the non-contact sensor 18 detects the leading edge of the cutting waste 8 in the traveling direction, and the time the piston 11 is held at the lower limit position. can do. Further, the operating speed of the air cylinder 10 can be adjusted using a speed controller (speed controller).

Preferably, the cutting apparatus of the present invention cuts the cutting seed plate 4 when the sensor 17 does not detect the passage of the cutting debris 8 within a predetermined time after the cutting seed plate 4 is subjected to cutting by the slitter 5. It is configured to stop the roller conveyor 14 on the receiving side for sending the ribbon 7 to the slitter 5 and/or the roller conveyor 15 on the sending side for sending the ribbon 7 to the leveler 13 in the next process. Although it is preferred to stop both the roller conveyor 14 and the roller conveyor 15, it is sufficient to stop only the roller conveyor 15 if the feed of the cutting seed plate 4 can be stopped by other means. On the other hand, when the cutting waste 8 is to be collected separately after the roller conveyor 15, it is also possible to configure so that only the roller conveyor 14 is stopped.

As the time when the cutting seed plate 4 is subjected to cutting by the slitter 5, it is possible to adopt the time when the leading end portion of the cutting seed plate 4 in the advancing direction is fed into the slitter 5 and the cutting is started. In this case, the start of cutting of the cutting seed plate 4 is detected by a sensor that detects the rotational speed and torque of the slitter 5 . Alternatively, it is possible to adopt the time when the leading end portion of the ribbon 7 in the traveling direction, which is produced by cutting the cutting seed plate 4 by the slitter 5, moves from the slitter 5 to a predetermined position. In this case, the non-contact sensor 18 can also be used.

Furthermore, since the time required for the cutting seed plate 4 to reach the slitter 5 is constant, instead of when the cutting seed plate 4 is subjected to cutting by the slitter 5, when the cutting seed plate 4 is supplied to the cutting device Time measurement may be started from

Further, when the cutting seed plate 4 is supplied at predetermined intervals, the roller conveyor 14 and/or the roller conveyor 15 are stopped when the sensor 17 does not detect the passage of the cutting waste 8 at predetermined intervals. Can also be configured.

In this example, the time when the non-contact sensor 18 detects the leading edge of the ribbon 7 in the traveling direction is treated as the reference time when the cutting seed plate 4 is cut by the slitter 5 .

By using the cutting apparatus of the present invention exemplified as described above, the step of feeding the cutting seed plate 4 to the slitter 5 by the roller conveyor 14, and using the slitter 5, cutting the cutting seed plate 4 into a plurality of A step of obtaining ribbons 7 having the same predetermined width, a step of feeding a plurality of ribbons 7 to a leveler 13, which is the next step, by a roller conveyor 15, and a slitter 5 removing cutting waste 8 generated together with the plurality of ribbons 7. In the cutting method comprising the step of removing the cutting wastes 8, the passage of the cutting wastes 8 can be reliably confirmed by the sensor 17 in the discharge section 9 through which the cutting wastes 8 removed in the step of removing the cutting wastes 8 pass.

a roller conveyor 14 for feeding the cutting seed plate 4 to the slitter 5 when the sensor 17 does not detect the passage of the cutting waste 8 within a predetermined time after the cutting seed plate 4 is subjected to cutting by the slitter 5; and/or stopping the roller conveyor 15 for feeding the ribbon 7 to the leveler 13. By stopping the roller conveyor 14 on the receiving side that feeds the cutting seed plate 4 to the slitter 5, the cutting scraps 8 that are not properly discharged are prevented from being mixed into the next ribbon 7 and the next cutting scraps 8, This cutting waste 8 can be reliably removed. In addition, by stopping the feed-side roller conveyor 15 for feeding the ribbon 7 to the next process, not only is it possible to prevent the cut waste 8 from being fed to the next process and further to the ribbon magazine, It becomes possible to easily remove the cutting waste 8. With such a configuration, it is possible to reduce the manufacturing cost of electrolytic copper.

The present invention will be further described below based on examples. A ribbon 7 used for the hanger 3 was produced using a cutting device similar to the device conceptually shown in FIG. As the sensor 17 installed in the discharge section 9, a transmissive infrared sensor provided with a light projector and a light receiver was used. An infrared sensor was used as the non-contact sensor 18, which is the second sensor provided on the outer surface of the air cylinder 10 on the slitter side.

The air cylinder 10, the sensor 17, and the non-contact sensor 18 were all installed at both ends of the roller conveyor 15 in the width direction.

If the sensor 17 does not detect the passage of the cutting waste 8 within 5 seconds after the non-contact sensor 18 detects that the tip of the ribbon 7 has passed, the operation of the roller conveyor 15 is immediately stopped. configured to

The test operation period was set to one month, and the number of shavings mixed with the ribbon in the ribbon magazine was counted. The number of ribbons produced during the test run period was 360,000.

In the test run, a seed plate (1050 mm x 1070 mm) was cut to a predetermined size with a shear to obtain a cut seed plate 4 (310 mm x 1070 mm) (3 cut seed plates per seed plate). Chips (60 mm×1070 mm) generated at that time were removed (two chips per seed plate).

The obtained cutting seed plates 4 are sequentially put into a cutting device, and the cutting seed plates 4 are cut by the slitter 5 to obtain ribbons 7 (310 mm × 95 mm) (11 ribbons per cutting seed plate), They were sequentially supplied to the leveler 13 and then accumulated in a ribbon magazine (not shown). Shavings 8 generated at the ends in the width direction during cutting by the slitter 5 were removed by operating the air cylinder 10 .

As a result, no cutting waste 8 was mixed into the ribbon magazine.

On the other hand, when a test operation was conducted for one month using the same cutting apparatus except that the sensor 17 was not installed in the discharge section 9, the number of pieces of cutting waste 8 mixed in the ribbon magazine was 30. there were.

1 seed plate 2 crossbar 3 hanger 4 cutting seed plate 5 slitter 6 cutting blade 7 ribbon 8 cutting waste 9 discharge part 10 air cylinder 11 piston 12 roller 13 leveler 14 roller conveyor 15 roller conveyor 16 roller conveyor 17 sensor 18 non-contact type sensor (second sensor)

Claims (8)

a slitter for cutting a plurality of thin metal plates sequentially supplied to obtain a plurality of plate-shaped objects having predetermined widths;
a device for sequentially feeding the plurality of metal sheets into the slitter;
a device for feeding the plurality of plate-shaped objects of a predetermined width to the next process;
a swarf removing device provided in an apparatus for feeding the plurality of plate-shaped objects to the next process for removing shavings generated together with the plurality of plate-shaped objects by the slitter; and
a discharge section provided below the cutting waste removing device and through which the cutting waste passes when discharged;
with
The discharge unit is equipped with a sensor for detecting passage of the cutting waste,
A device that feeds the plurality of thin metal plates into the slitter when the sensor does not detect passage of the cut waste within a predetermined time after the plurality of thin metal plates are cut by the slitter; and/ Alternatively, it is configured to stop a device that feeds the plurality of plate-shaped objects to the next process,
cutting device. 2. The cutting device according to claim 1 , wherein said sensor comprises a non-contact sensor. 3. The cutting device according to claim 2 , wherein the non-contact sensor is a transmissive photoelectric sensor. The cutting device according to any one of claims 1 to 3 , wherein said cutting waste removing device is configured by a device having a movable end portion which can move up and down and to which rollers are rotatably attached. The cutting device according to any one of claims 1 to 4 , wherein the cutting waste removing device includes a second sensor on the slitter side for detecting that the plate-like object has passed through the slitter. a step of sequentially feeding a plurality of thin metal plates into a slitter;
a step of cutting the plurality of thin metal plates that are sequentially supplied using the slitter to obtain a plurality of plate-shaped objects having predetermined widths;
a step of feeding the plurality of plate-shaped objects to a next step; and
a step of removing cutting debris generated together with the plurality of plate-shaped objects by the slitter;
with
a step of confirming passage of the cutting waste by a sensor in a discharge portion through which the cutting waste removed in the step of removing the cutting waste passes;
A step of feeding the plurality of thin metal plates into the slitter when the sensor does not detect passage of the cut waste within a predetermined time after the plurality of thin metal plates are cut by the slitter; and/ Alternatively, the step of stopping the step of sending the plurality of plate-shaped objects to the next step,
comprising
cutting method. 7. The cutting method according to claim 6 , wherein said sensor comprises a non-contact sensor. 8. The cutting according to claim 7 , wherein the non-contact sensor comprises a transmission type photoelectric sensor, and the passage of the cutting debris is detected by blocking the transmission type photoelectric sensor due to the passage of the cutting debris. Method.

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