JP2021010979A - Cutting device and cutting method - Google Patents

Abstract

To provide a cutting device which certainly prevents cut scraps from getting mixed into a ribbon, and can prevent occurrence of defective cathodes.SOLUTION: A cutting device comprises: a slitter 5 which cuts a metal thin plate (cutting seed plate) 4, and obtains plural tabular objects (ribbons) 7 having a prescribed width; a device 15 for delivering the tabular objects 7 to a next process; a cut scrap removal device 10 which is provided on the device 15 for delivering the tabular objects to the next process, and removes cut scraps 8, which are generated together with the tabular objects 7, by the slitter 5; and a discharge part 9 which is provided below the cut scrap removal device 10, and passes when the cut scraps 8 are discharged. In this cutting device, a sensor 17 for detecting passage of the cut scraps 8 is provided on the discharge part 9, and when the sensor 17 does not detect passage of the cut scraps 8 within a prescribed time after a thin metal plate 4 is used for cutting by the slitter 5, a device 14 for delivering the thin metal plate 4 into the slitter 5 and/or the device 15 for delivering the tabular objects 7 to the next process is stopped.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cutting device and a cutting method for obtaining a plurality of plate-shaped objects having a predetermined width by cutting a thin metal plate. More specifically, the present invention relates to a cutting device and a cutting method for obtaining a cathode suspension ribbon used in an electrolytic refining step using a seed plate in a non-ferrous metal by cutting the seed plate to a predetermined width.

In metal processing, there is a cutting method in which a thin metal plate is cut to obtain a plurality of plate-shaped objects having a predetermined width in parallel. An example of using such a cutting method is a step of manufacturing a ribbon used for a suspension for a cathode, which is used in an electrolytic refining step using a seed plate in a non-ferrous metal.

Here, the copper smelting method includes a wet method in which copper is leached from the copper concentrate into an acid or the like, and an anode is produced by melting the copper concentrate (melting step), and electrorefining is performed from the obtained anode. There is a dry method for producing electrolytic copper by means of (electrorefining step). The dry method is the mainstream of copper smelting, especially for sulfide concentrate, because it can be produced on a large scale and the cost is low.

The dry method will be described more specifically. First, in the smelting step, the copper concentrate obtained by floating beneficiation is melted in a self-melting furnace to obtain a mat, the obtained mat is oxidized in a converter to obtain blister copper, and the obtained blister copper is refined in a refining furnace. Purified blister copper having a purity of about 99% is obtained, and the refined blister copper is poured into a casting machine to cast an anode (aden plate) for copper electrolytic purification.

In the subsequent electrolytic refining step, a plurality of anodes and a plurality of separately prepared cathodes (cathode plates) are alternately arranged at regular intervals in an electrolytic cell in which a copper electrolytic solution is held, and these anodes and cathodes are alternately arranged. Energize. As a result, copper ions are eluted from the anode into the electrolytic solution, and the copper ions are electrodeposited on the cathode to obtain electrolytic copper having a copper grade of 99.99% or more on the cathode.

For electrolytic purification of copper, a cathode made of a mother plate such as stainless steel is used, and the electrodeposited electrolytic copper is periodically stripped off to make a product, and the electrolytic copper is made into a thin plate shape called a seed plate. There is a seed plate method in which the cathode is used as a cathode and the cathode on which electrolytic copper is electrodeposited is used as it is.

The seed plate is obtained by processing electrolytic copper stripped off by a permanent cathode method or the like into a rectangular plate shape. As shown in FIG. 2, the cathode made of a seed plate includes a seed plate 1, a crossbar (also referred to as a beam) 2, and a hanging strap 3 for joining the two. For such a cathode, another seed plate is cut to a predetermined size to obtain a ribbon which is a plate-like material, and in the cathode assembly step, the ribbon is looped and hung on the crossbar 2. It is obtained by fixing it to the upper part of the seed plate 1 and using it as a hanging strap 3.

Usually, the process of cutting such a seed plate to obtain a ribbon and the process of assembling a cathode by fixing the ribbon to the seed plate 1 and the crossbar 2 to form a hanging hand 3 are both automated. There is.

To specifically explain this automated work process, first, electrolytic copper electrodeposited on a stainless steel plate called a master plate to a thickness of about 1 mm is peeled off from the master plate to obtain a seed plate. This seed plate is cut by a shear, which is a primary cutting machine, and becomes a cutting seed plate and cutting waste. The cutting chips generated in this primary cutting are collected and charged into the converter as a cooling agent.

As shown in FIG. 3, the cutting seed plate 4 is cut to a predetermined width by a slitter 5 which is a secondary cutting machine to form a plurality of ribbons 7. At this time, both ends of the cutting seed plate 4 in the width direction are formed. , Cutting waste 8. The cutting chips 8 generated in this secondary cutting are also collected and charged into the converter as a cooling agent.

As disclosed in Japanese Patent Application Laid-Open No. 2003-145340, the cutting seed plate, a plurality of ribbons, and cutting scraps are transported by a roller conveyor or a belt conveyor, and the ribbons are supplied to a leveler or the like, which is the next step. .. After that, the ribbons are automatically collected in the ribbon magazine.

Cutting debris needs to be removed before the ribbon is fed to the leveler. For this reason, a guidance mechanism such as a guide for adjusting the destination of the ribbon and cutting chips is provided between the slitter and the leveler. For example, in the cutting device described in Japanese Patent Application Laid-Open No. 2003-145340, a movable end portion is installed in a mechanism for feeding a ribbon from a slitter to a next process such as a leveler, and is movable up and down and has a roller rotatably attached. It is equipped with a cutting debris removing device.

In this device, a non-contact type cutting debris detection sensor is installed on the slitter side of the cutting debris removing device, and this sensor detects the arrival position of the cutting debris from the slitter and raises and lowers the movable end of the cutting debris removing device. By allowing the cutting debris to be forcibly knocked down by the rollers arranged at the movable end portion, the cutting debris is forcibly knocked down and discharged from the discharge port.

Japanese Unexamined Patent Publication No. 2003-145340

However, even in a cutting device provided with such a cutting debris removing device, the cutting debris is appropriate depending on the hardness of the seed plate and the roughness of the surface, or depending on the deterioration of cutting due to the wear of the cutting blade of the slitter. It may not be possible to remove it. In this case, the cutting chips are supplied to the leveler together with the ribbon and mixed in the ribbon magazine.

In the automated process, these cutting chips are sent to the cathode assembly process as they are, so that a cathode having a shorter hanger than the genuine product is formed. Since such a cathode does not meet the product standard, it is necessary to remove it as a defective plate as it is.

The present invention makes it possible to reliably prevent cutting chips having a shorter width from being mixed into a plate-shaped object such as a ribbon, and to prevent the generation of defective plates using cutting chips. It is an object of the present invention to provide an apparatus and a cutting method.

The present invention relates to a cutting device for cutting a thin metal plate such as a seed plate to obtain a plurality of plate-like objects having a predetermined width such as a ribbon.

Specifically, the cutting device of the present invention
A slitter for cutting a thin metal plate to obtain a plurality of plate-like objects having a predetermined width,
An apparatus for feeding the plurality of plate-shaped objects having a predetermined width to the next process,
A device for feeding the plate-shaped material to the next process, a cutting waste removing device for removing cutting waste generated together with the plurality of plate-shaped materials by the slitter, and a cutting waste removing device, and
A discharge unit provided below the cutting waste removing device and passing through when the cutting waste is discharged,
To be equipped.

In particular, the cutting device of the present invention is characterized in that the discharging portion is provided with a sensor for detecting the passage of the cutting debris.

The sensor is preferably composed of a non-contact type sensor. It is more preferable that a transmissive photoelectric sensor is used as the non-contact sensor so that the passage of the cutting chips is detected by blocking the transmissive photoelectric sensor by the passage of the cutting chips. ..

Preferably, the cutting device of the present invention includes a device for feeding the metal thin plate to the slitter, and the sensor passes the cutting waste within a predetermined time from the time when the metal thin plate is subjected to cutting by the slitter. Is not detected, the device for feeding the thin metal plate to the slitter and / or the device for feeding the plate-like material to the next step is configured to be stopped.

When the metal thin plate is subjected to cutting by the slitter, the tip portion of the metal thin plate in the traveling direction is sent to the slitter and cutting is started, or the tip of the plate-shaped object in the traveling direction. It can be adopted when the unit moves from the slitter to a predetermined position.

As the cutting debris removing device, a guide that is fixed to a device that feeds the plate-shaped object to the next process and guides the cutting debris downward can be adopted. Preferably, the cutting debris removing device comprises a device that is movable up and down and has a movable end to which rollers are rotatably attached. In this case, the device more preferably includes a cylinder provided with the tip portion and a mechanism for driving the cylinder, and more preferably the cylinder is an air cylinder.

Further, the cutting debris removing device detects that the plate-shaped object has passed through the slitter on the slitter side, and more specifically, the tip portion of the plate-shaped object in the traveling direction is predetermined from the slitter. A second sensor for detecting the movement to the position can be provided. Preferably, the second sensor provided in the cutting debris removing device is composed of a non-contact type sensor capable of detecting the position of the tip portion in the traveling direction of the plate-shaped object. The time when the position of the tip end portion of the plate-shaped object in the traveling direction is detected by the second sensor can be treated as a reference time when the cutting seed plate is subjected to cutting by the slitter.

The present invention relates to a cutting method for cutting a thin metal plate such as a seed plate to obtain a plurality of plate-like objects having a predetermined width such as a ribbon.

Specifically, the cutting method of the present invention is:
A process of cutting a thin metal plate using a slitter to obtain a plate-like material having a plurality of predetermined widths.
A step of feeding the plurality of plate-like objects to the next step, and
A step of removing cutting chips generated together with the plurality of plate-like objects by the slitter, and
To be equipped.

In particular, the cutting method of the present invention
The discharge portion through which the removed cutting chips pass in the step of removing the cutting chips is provided with a step of confirming the passage of the cutting chips by a sensor.

It is preferable that the sensor is composed of a non-contact type sensor, and the non-contact type sensor is composed of a transmissive photoelectric sensor, and the transmissive photoelectric sensor is blocked by the passage of the cutting debris, whereby the cutting debris is formed. It is more preferable to detect passage.

The metal thin plate is provided with a step of feeding the metal thin plate into the slitter, and when the sensor does not detect the passage of the cutting chips within a predetermined time from the time when the metal thin plate is subjected to cutting by the slitter, the metal thin plate is pressed. It is preferable to include a step of stopping the step of feeding the plate-shaped material to the slitter and / or the step of feeding the plate-shaped material to the next step.

According to the present invention, in the step of cutting the seed plate by the slitter, it is surely detected that the cutting chips generated at the widthwise end of the seed plate are not discharged in the step of discharging the cutting waste, and the cutting waste is detected. However, since it can be reliably prevented from being mixed with the ribbon in the next process, it is possible to prevent the occurrence of defective cathodes that do not meet the product standards.

It is a conceptual diagram which shows the structure of the cutting apparatus of this invention. It is a schematic diagram of a cathode used for electrolytic refining of copper by a seed plate method. It is a conceptual diagram which shows the process of obtaining a plurality of ribbons from a seed plate by a slitter.

The present invention is a cutting device and a cutting method for cutting a metal thin plate to obtain a plurality of plate-like objects having a predetermined width, and at this time, cutting in which cutting chips are generated at the widthwise end of the metal thin plate. Regarding the device and cutting method.

Hereinafter, as an example of an embodiment of the present invention, a ribbon 7 constituting a hanger 3 attached to a seed plate 1 which is a thin plate of electrolytic copper used in an electrolytic refining step by a seed plate method is seeded by a slitter 5. It will be described in detail based on the cutting apparatus and the cutting method obtained by cutting the plate (cutting seed plate 4). However, the present invention is not limited to this, and is broadly applicable to a cutting device and a cutting method having a configuration in which cutting chips are generated at the end in the width direction when a thin metal plate is processed to a predetermined width by a cutting machine such as a shear or a press. Applies.

As shown in FIG. 1, the cutting apparatus of the present invention cuts a cutting seed plate 4 obtained by cutting a seed plate 1 with a shear, and a slitter 5 for cutting a ribbon 7 having a plurality of predetermined widths. To remove the cutting chips 8 generated together with the ribbon 7 by the slitter 5 arranged in the intermediate portion of the roller conveyor 15 in the traveling direction with the plurality of roller conveyors 15 which are devices for feeding the ribbon 7 to the next process. It is provided with an air cylinder 10 which is a cutting waste removing device of the above, and a discharging unit 9 provided below the air cylinder 10 and passing through when the cutting waste 8 is discharged.

A known device can be applied as the slitter 5 applicable to the present invention. As shown in FIG. 3, the cutting seed plate 4 is cut into a plurality of pieces along the traveling direction by the plurality of disc-shaped cutting blades 6 constituting the slitter 5, and has a strip-shaped fixed size, that is, the same predetermined width. It is processed into a plurality of ribbons 7. At this time, the portion of the cutting seed plate 4 located at the end in the width direction becomes the cutting waste 8 having a width smaller than the predetermined width of the ribbon 7. In FIG. 1, reference numerals 4, 7, and 8 indicate the movements of the cutting seed plate 4, the ribbon 7, and the cutting waste 8 shown in FIG. 3, respectively, and the description of each specific shape is omitted. ing.

A roller conveyor 14 on the receiving side and a roller conveyor 15 on the sending side are arranged in front of and behind the cutting seed plate 4 of the slitter 5 in the traveling direction. In this example, the roller conveyor 14 on the receiving side corresponds to a device for feeding the cutting seed plate 4 to the slitter 5, and the roller conveyor 15 on the sending side corresponds to a device for feeding the ribbon 7 to the next process. The roller conveyor 15 on the delivery side is composed of two roller conveyors arranged apart from each other in the front-rear direction in the traveling direction of the ribbon 7.

In this example, the air cylinder 10 is arranged at an intermediate portion in the traveling direction of the ribbons 7 of the two roller conveyors constituting the roller conveyor 15 on the delivery side. However, the delivery side roller conveyor is composed of two or more continuously installed roller conveyors, and the air cylinder 10 is installed at either the front or rear end of the delivery side roller conveyor 15 in the traveling direction of the ribbon 7. It is also possible to do. That is, the air cylinder is placed between the slitter 5 and the roller conveyor 15 on the delivery side, or between the roller conveyor 15 on the delivery side and the device (in this example, the leveler 13) that constitutes the next process such as transfer or leveling. , It is also possible to install. In these cases as well, in the interpretation of the present invention, it is assumed that the cutting waste removing device is provided in the device for feeding the plate-shaped material to the next step.

The air cylinder 10 includes a piston 11 and a rotatable roller 12 provided at a movable end of the piston 11.

Since the cutting waste 8 is generated from both ends in the width direction of the cutting seed plate 4 and passes through both ends in the width direction of the roller conveyor 15, the air cylinder 10 is installed at each end in the width direction of the roller conveyor 15. Will be done. However, in the embodiment in which cutting chips are generated only at one end in the width direction of the thin metal plate, a cutting waste removing device such as an air cylinder should be installed only on one side in the width direction of the device that feeds the plate to the next process. Good.

The piston 11 can be moved up and down by operating a valve (not shown) that supplies compressed air to the air cylinder 10. The piston 11 can be raised to a position where the cutting waste 8 can be held down by the roller 12 even when the cutting waste 8 is discharged from the slitter 5 in a state of being warped upward, and the cutting waste 8 is air. When passing below the cylinder 10, it is possible to move downward. With such a configuration, even if a large warped cutting waste 8 is generated due to variations in the thickness and properties of the cutting seed plate 4 which is a raw material, the cutting waste 8 can be forcibly discharged downward. There is.

In this example, three rollers 12 are attached to the movable ends of the pistons 11 of each air cylinder 10 so that the cutting chips 8 can be dropped more smoothly.

In this example, an air cylinder 10 is used as a drive mechanism used for a cutting waste discharging device, but a mechanism for hydraulically moving a piston such as a hydraulic cylinder, or a motor or the like and its rotational motion are converted into reciprocating motion. A mechanism can also be used to linearly move the movable end. By using these drive mechanisms, the cutting chips 8 can be pressed downward by the movable end of the cutting waste discharging device and discharged downward. Further, in addition to the rollers 12, a structure capable of appropriately pressing only the cutting chips 8 downward can be applied to the movable end of the piston 11. Further, as a simple means for forming the cutting waste discharging device, for example, a guiding mechanism such as a guide for guiding the cutting waste downward can be applied.

In this example, the leveler 13 is installed as an apparatus that constitutes the next process. The leveler 13 is a device that performs a leveling step for removing the warp and distortion of the ribbon 7. After that, a roller conveyor 16 for transporting the ribbon 7 to a further process is provided. However, as a device constituting the next process, a roller conveyor for simply transporting a plate-like object obtained by cutting a ribbon 7 or the like is installed, and a leveler is installed on the downstream side of the roller conveyor for transporting. You can also. The ribbon 7 is finally accumulated in a predetermined place such as a ribbon magazine (not shown).

In this example, between the two pairs of roller conveyors constituting the roller conveyor 15 on the delivery side, a discharge portion 9 through which the cutting waste 8 is discharged is provided below the air cylinder 10. The discharge portion 9 may be formed by a simple space portion, or may be formed inside a device that regulates the traveling direction of cutting chips 8 such as a chute.

In this example, the discharge unit 9 is provided with a sensor 17 for detecting the passage of the cutting chips 8. The type of the sensor 17 is not limited as long as it can detect an object such as cutting chips 8 passing through the discharging unit 9. For example, a photoelectric sensor such as an infrared sensor, a non-contact sensor such as a laser sensor, a proximity sensor, or an ultrasonic sensor can be used. Among these non-contact sensors, a photoelectric sensor such as an infrared sensor can be preferably used for reasons such as cost and availability. The detection method of the photoelectric sensor is also arbitrary, and any method such as a transmission type having a floodlight and a light receiver, a regression reflection type having a light projecting receiver and a reflector, and a diffuse reflection type having only a light projecting receiver can be adopted. .. Of these, in the transmissive photoelectric sensor or the retroreflective photoelectric sensor, the non-contact sensor is blocked by the passage of the cutting scraps 8 and the amount of light entering the receiver is reduced, so that the cutting scraps 8 are used. Passage is detected. From the viewpoint of reliable detection of cutting chips 8, it is preferable to use a transmissive photoelectric sensor having high operational stability and not being affected by reflected light by the detected object. In addition, as the sensor 17, a contact type sensor including a contactor that rotates in contact with the cutting scrap 8 can also be applied.

In this example, a non-contact sensor 18 is also provided as a second sensor on the outer surface of the air cylinder 10 on the slitter side. The type of non-contact sensor is not limited as long as the passage of the cutting chips 8 can be detected separately from the passage of the adjacent ribbon 7. For example, a photoelectric sensor such as an infrared sensor, a non-contact sensor such as a laser sensor, a proximity sensor, or an ultrasonic sensor can be used.

In a preferred example, it is preferable to be able to measure not only the passage of the cutting chips 8 but also the distance to the tip of the cutting chips 8. In this case, depending on the distance from the non-contact sensor 18 to the tip of the cutting waste 8, the piston 11 is surely raised to a position where the cutting waste 8 can be pressed by the roller 12 and passes under the air cylinder 10. It is possible to reliably discharge the cutting waste 8 to be generated.

After detecting the tip of the cutting waste 8 in the traveling direction by the non-contact sensor 18, the time until the air cylinder 10 is operated and the time when the piston 11 is held at the lower limit position are adjusted by using a timer. can do. Further, the operating speed of the air cylinder 10 can be adjusted by using a speed controller (speakon connector).

The cutting device of the present invention preferably cuts the cutting seed plate 4 when the sensor 17 does not detect the passage of the cutting waste 8 within a predetermined time from the time when the cutting seed plate 4 is subjected to cutting by the slitter 5. It is configured to stop the receiving roller conveyor 14 for feeding the slitter 5 and / or the sending roller conveyor 15 for feeding the ribbon 7 to the leveler 13, which is the next step. It is preferable to stop both the roller conveyor 14 and the roller conveyor 15, but if the supply of the cutting seed plate 4 can be stopped by another means, it is sufficient to stop only the roller conveyor 15. On the other hand, when the cutting waste 8 is separately collected by the roller conveyor 15 or later, it may be configured to stop only the roller conveyor 14.

When the cutting seed plate 4 is subjected to cutting by the slitter 5, it can be adopted when the tip end portion of the cutting seed plate 4 in the traveling direction is sent to the slitter 5 and cutting is started. In this case, the start of cutting of the cutting seed plate 4 is detected by the sensor that detects the rotation speed and torque of the slitter 5. Alternatively, it can be adopted when the tip portion of the ribbon 7 in the traveling direction generated by cutting the cutting seed plate 4 by the slitter 5 moves from the slitter 5 to a predetermined position. In this case, the non-contact type sensor 18 can also be used.

Further, since the time for the cutting seed plate 4 to reach the slitter 5 is constant, when the cutting seed plate 4 is supplied to the cutting device instead of when the cutting seed plate 4 is subjected to cutting by the slitter 5. You may start the time measurement from.

Further, when the cutting seed plate 4 is supplied at predetermined intervals, the roller conveyor 14 and / or the roller conveyor 15 is stopped when the sensor 17 does not detect the passage of the cutting waste 8 at predetermined intervals. It can also be configured.

In this example, the time when the non-contact sensor 18 detects the tip of the ribbon 7 in the traveling direction is treated as the reference time when the cutting seed plate 4 is subjected to cutting by the slitter 5.

By using the cutting device of the present invention illustrated as described above, a step of feeding the cutting seed plate 4 to the slitter 5 by the roller conveyor 14 and a plurality of cutting seed plates 4 by cutting the cutting seed plate 4 using the slitter 5. A step of obtaining ribbons 7 having the same predetermined width, a step of feeding a plurality of ribbons 7 to a leveler 13 which is a next step by a roller conveyor 15, and a step of removing cutting chips 8 generated together with the plurality of ribbons 7 by a slitter 5. In the cutting method including the step of removing the cutting waste 8, the sensor 17 can reliably confirm the passage of the cutting waste 8 in the discharging unit 9 through which the cutting waste 8 removed in the step of removing the cutting waste 8 passes.

Roller conveyor 14 for feeding the cutting seed plate 4 to the slitter 5 when the sensor 17 does not detect the passage of the cutting waste 8 within a predetermined time from the time when the cutting seed plate 4 is subjected to cutting by the slitter 5. And / or, a step of stopping the roller conveyor 15 for feeding the ribbon 7 to the leveler 13 can be further provided. By stopping the roller conveyor 14 on the receiving side that feeds the cutting seed plate 4 to the slitter 5, it is possible to prevent the cutting waste 8 that has not been properly discharged from being mixed into the next ribbon 7 and the next cutting waste 8. It is possible to reliably remove the cutting chips 8. Further, by stopping the roller conveyor 15 on the sending side for sending the ribbon 7 to the next process, not only the cutting waste 8 is prevented from being sent to the next process and further to the ribbon magazine, but also the cutting waste 8 is not properly discharged. The cutting waste 8 can be easily removed. With such a configuration, it is possible to reduce the cost of producing electrolytic copper.

Hereinafter, the present invention will be further described based on Examples. The ribbon 7 used for the hanging strap 3 was produced by using a cutting device similar to the device conceptually shown in FIG. As the sensor 17 installed in the discharge unit 9, a transmissive infrared sensor including a floodlight and a light receiver was used. Further, an infrared sensor was used as the non-contact type sensor 18 which is a second sensor provided on the outer surface of the air cylinder 10 on the slitter side.

The air cylinder 10, the sensor 17, and the non-contact sensor 18 were all installed at both ends of the roller conveyor 15 in the width direction.

If the non-contact sensor 18 detects that the tip of the ribbon 7 has passed and the sensor 17 does not detect the passage of the cutting chips 8 within 5 seconds, the operation of the roller conveyor 15 is immediately stopped. It was configured in.

The test operation period was one month, and the number of cutting chips mixed with the ribbon in the ribbon magazine was measured. The number of ribbons produced during the test operation was 360,000.

In the test operation, a seed plate (1050 mm × 1070 mm) was cut to a predetermined size with a shear to obtain a cut seed plate 4 (310 mm × 1070 mm) (three cut seed plates per seed plate). The cutting chips (60 mm × 1070 mm) generated at that time were removed (two cutting chips per seed plate).

The obtained cutting seed plates 4 were sequentially put into a cutting device, and the cutting seed plates 4 were cut by the slitter 5 to obtain ribbons 7 (310 mm × 95 mm) (11 ribbons per cutting seed plate). They were sequentially supplied to the leveler 13 and then accumulated in a ribbon magazine (not shown). The cutting debris 8 generated at the end in the width direction during cutting by the slitter 5 was removed by operating the air cylinder 10.

As a result, the cutting waste 8 was not mixed in the ribbon magazine.

On the other hand, when a test operation was conducted for one month using the same cutting device except that the sensor 17 was not installed in the discharge unit 9, the number of cutting scraps 8 mixed in the ribbon magazine was 30. there were.

1 Seed plate 2 Crossbar 3 Suspension hand 4 Cutting seed plate 5 Slitter 6 Cutting blade 7 Ribbon 8 Cutting waste 9 Discharge part 10 Air cylinder 11 Piston 12 Roller 13 Leveler 14 Roller conveyor 15 Roller conveyor 16 Roller conveyor 17 Sensor 18 Non-contact type Sensor (second sensor)

Claims (10)

A slitter for cutting a thin metal plate to obtain a plate-like material having a plurality of predetermined widths,
An apparatus for feeding the plurality of plate-shaped objects having a predetermined width to the next process,
A device for feeding the plurality of plate-shaped objects to the next process, a cutting waste removing device for removing cutting chips generated together with the plurality of plate-shaped objects by the slitter, and a cutting debris removing device.
A discharge unit provided below the cutting waste removing device and passing through when the cutting waste is discharged,
With
The discharge unit is provided with a sensor for detecting the passage of the cutting chips.
Cutting device. A device for feeding the metal thin plate to the slitter is provided, and when the sensor does not detect the passage of the cutting chips within a predetermined time from the time when the metal thin plate is subjected to cutting by the slitter, the metal thin plate is pressed. The cutting device according to claim 1, wherein the device for feeding the slitter and / or the device for feeding the plate-shaped material to the next step is stopped. The cutting device according to claim 1 or 2, wherein the sensor is composed of a non-contact type sensor. The cutting device according to claim 3, wherein the non-contact sensor is composed of a transmissive photoelectric sensor. The cutting device according to any one of claims 1 to 4, wherein the cutting debris removing device comprises a device having a movable end portion that can be raised and lowered and has a roller rotatably attached. The cutting device according to any one of claims 1 to 5, wherein the cutting debris removing device includes a second sensor on the slitter side for detecting that the plate-like object has passed through the slitter. A process of cutting a thin metal plate using a slitter to obtain a plate-like material having a plurality of predetermined widths.
A step of feeding the plurality of plate-like objects to the next step, and
A step of removing cutting chips generated together with the plurality of plate-like objects by the slitter, and
With
A step of confirming the passage of the cutting chips by a sensor is provided in the discharge portion through which the cutting chips removed in the step of removing the cutting chips pass.
Cutting method. The metal thin plate is provided with a step of feeding the metal thin plate into the slitter, and when the sensor does not detect the passage of the cutting chips within a predetermined time from the time when the metal thin plate is subjected to cutting by the slitter, the metal thin plate is pressed. The cutting method according to claim 7, further comprising a step of feeding the plate to the slitter and / or a step of stopping the step of feeding the plate-shaped material to the next step. The cutting method according to claim 7 or 8, wherein the sensor is composed of a non-contact type sensor. The cutting according to claim 9, wherein the non-contact type sensor is composed of a transmission type photoelectric sensor, and the passage of the cutting chips is detected by blocking the transmission type photoelectric sensor by the passage of the cutting chips. Method.

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