JP7337140B2 - バッファユニット及び温度変化が伴われる基板支持部材の水平測定用基板型センサーの保管方法 - Google Patents
バッファユニット及び温度変化が伴われる基板支持部材の水平測定用基板型センサーの保管方法 Download PDFInfo
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Description
基板処理装置500aは下部ベッセル524の下部壁及び第1基板支持部540の間に配置される遮断プレート580を含むことができる。遮断プレート580は下部ベッセル524の前記
222 基板保管部
224 スロット
230 据え置き部
235 無線充電モジュール
540 支持部材
546 支持ピン
600 基板型センサー
610 基材
621 第1センサー
622 第2センサー
630 中央モジュール
C センター
Claims (19)
- 基板を一時的貯蔵するバッファユニットであって、
内部に基板が貯蔵される空間を提供するハウジングと、
前記ハウジング内に配置されて前記基板が置かれる1つ以上のスロットと、
前記ハウジングの下部に配置され、上面が勾配がなく平らな平面で提供され、無線充電モジュールが内装される据え置き部と、を含み、
前記据え置き部には基板型センサーが保管され、
前記据え置き部には前記据え置き部の上面勾配を測定するレベルセンサーをさらに含むバッファユニット。 - 前記バッファユニットは、
インデックスモジュールと処理モジュールの搬送装置との間に配置され、
前記処理モジュールは、基板を常温より高温の雰囲気に処理する装置を含む請求項1に記載のバッファユニット。 - 前記基板型センサーは、
前記基板の形状を有する基材と、
前記基材に提供されるレベル測定センサーと、
前記レベル測定センサーから収集されたデータを受信する受信部と、
前記レベル測定センサー及び前記受信部に電力を提供する電源部と、を含み、
前記電源部は、前記無線充電モジュールによって充電される請求項1に記載のバッファユニット。 - 前記基板型センサーは、
温度変化が伴われる雰囲気に提供されて基板を支持する支持部材の水平を測定するための基板型センサーであって、
前記レベル測定センサーは、
前記基材に提供され、3軸以上の加速度センサー又は6軸以上の慣性測定ユニット(IMU)で構成される1つ以上のセンサーを含む請求項3に記載のバッファユニット。 - 前記基板型センサーは、
前記据え置き部に支持された状態で零点調整が成される請求項3に記載のバッファユニット。 - 前記基材は、前記基板の寸法と実質的に同一な物理的寸法を有する請求項3に記載のバッファユニット。
- 前記受信部に受信された前記データを外部に送出する送出部をさらに含む請求項3に記載のバッファユニット。
- 前記センサーは、複数が提供され、1つのセンサーを基準に他の1つのセンサーは、前記基材の中心を基準に180°(deg)対向される位置に提供される請求項4に記載のバッファユニット。
- 前記センサーは、露出される温度に応じて変わる固有の誤差を発生させる請求項4に記載のバッファユニット。
- 基板型センサーを利用する基板を支持する支持部材の水平を測定する方法(水平測定方法)であって、
前記基板型センサーは、
前記基板の形状を有する基材と、
前記基材に提供されるレベル測定センサーと、
前記レベル測定センサーから収集されたデータを受信する受信部と、
前記レベル測定センサー及び前記受信部に電力を提供する電源部と、を含み、
請求項1に記載のバッファユニットの前記据え置き部に前記基板型センサーが据え置いた状態で前記基板型センサーの零点調整をする第1段階と、
前記基板型センサーを前記支持部材に位置させる第2段階と、を含み、
前記基板型センサーから収集されたデータを受信して前記支持部材が水平であるか否かを判断する水平測定方法。 - 前記基板型センサーは、
温度変化が伴われる雰囲気に提供されて基板を支持する支持部材の水平を測定し、
前記レベル測定センサーは、
前記基材に提供され、3軸以上の加速度センサー又は6軸以上の慣性測定ユニット(IMU)で構成される1つ以上のセンサーを含み、
前記第2段階は、
前記基板型センサーを第1角度に前記支持部材に位置させる第2-1段階と、
前記第2-1段階で前記センサーから収集されたデータを第1データに受信する第2-2段階と、
前記基板型センサーを前記第1角度と異なる第2角度に前記支持部材に位置させる第2-3段階と、
前記第2-2段階で前記センサーから収集されたデータを第2データに受信する第2-4段階と、を含み、
前記第1データ及び前記第2データを比較して前記支持部材が水平であるか否かを判断する請求項10に記載の水平測定方法。 - 前記センサーは、前記6軸以上の慣性測定ユニット(IMU)であり、
前記第1データ及び前記第2データは、各々Roll(Level X)とPitch(Level Y)の要素を含み、
前記第1データ及び前記第2データの比較は、
前記第1データの要素と前記第2データの要素の同一性を比較することであり、
前記第1データの要素と前記第2データの要素が同一範疇に含まれれば、水平であると判断し、
前記第1データの要素と前記第2データの要素が同一範疇で外れれば、傾いたことと判断する請求項11に記載の水平測定方法。 - 前記センサーは、前記6軸以上の慣性測定ユニット(IMU)であり、
前記第1データ及び前記第2データは、各々Roll(Level X)とPitch(Level Y)の要素を含み、
前記第1データは、(Level X1、Level Y1)の要素を含み、
前記第2データは、(Level X2、Level Y2)の要素を含み、
前記センサーは、露出される温度に応じて変わる固有の誤差を発生させ、
前記基板型センサーによって測定された前記支持部材による勾配は、プロセッサによって実行可能なプログラムコードを格納する非一時的コンピュータ読出し媒体によって(Level Xa、Level Ya)を含む要素として算出され、
前記第1角度を0°(deg)と定義する時、前記第2角度は、180°(deg)である場合に、
前記Level Xaは、(Level X1-Level X2)/2であり、
前記 Level Yaは、(Level Y1-Level Y2)/2で算出されることができる請求項11に記載の水平測定方法。 - 前記基板型センサーは、
前記センサーは、複数が提供され、1つのセンサーを基準に他の1つのセンサーは、前記基材の中心を基準に180°(deg)対向される位置に提供されることであり、
前記第1データ及び前記第2データは、前記1つのセンサーと前記他の1つのセンサーから各々受信し、
前記1つのセンサーから受信された前記第1データ及び前記第2データを比較して前記支持部材が水平であるか否かを判断し、
前記他の1つのセンサーから受信された前記第1データ及び前記第2データを比較して前記1つのセンサーから導出された判断の有効性を検証する請求項11に記載の水平測定方法。 - 前記支持部材は、超臨界流体を利用して基板を処理する基板処理装置の高圧ベッセルに提供されることであり、
前記支持部材は、前記基板を前記支持部材の平面から所定の間隔離隔させる複数の支持ピンを含み、
前記第1角度及び前記第2角度で前記センサーが前記支持ピンの中でいずれか1つ以上に対応される位置に位置されるようにする請求項11に記載の水平測定方法。 - 前記第1データは、(X1、Y1、Z1)の要素を含み、
前記第2データは、(X2、Y2、Z2)の要素を含み、
前記第1データ及び前記第2データの比較は、
前記第1データの要素と前記第2データの要素の同一性を比較することであり、
前記第1データの要素と前記第2データの要素が同一範疇に含まれれば、水平であると判断し、
前記第1データの要素と前記第2データの要素が同一範疇で外れれば、傾いたことと判断する請求項11に記載の水平測定方法。 - 基板型センサーの保管方法であって、
基板を一時的貯蔵するバッファユニットの下部に上面が勾配がなく平らな平面で提供され、無線充電モジュールが内装される据え置き部を提供し、
前記据え置き部に前記基板型センサーを保管し、
前記据え置き部には前記据え置き部の上面勾配を測定するレベルセンサーをさらに含む基板型センサーの保管方法。 - 前記基板型センサーは、
前記据え置き部に支持された状態で零点調整が成される請求項17に記載の基板型センサーの保管方法。 - 前記基板型センサーは、前記基板型センサーの各構成に電力を提供する電源部を含み、
前記電源部は、前記無線充電モジュールによって充電される請求項17に記載の基板型センサーの保管方法。
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