JP7334065B2 - チップの製造方法 - Google Patents

チップの製造方法 Download PDF

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Publication number
JP7334065B2
JP7334065B2 JP2019099800A JP2019099800A JP7334065B2 JP 7334065 B2 JP7334065 B2 JP 7334065B2 JP 2019099800 A JP2019099800 A JP 2019099800A JP 2019099800 A JP2019099800 A JP 2019099800A JP 7334065 B2 JP7334065 B2 JP 7334065B2
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workpiece
wafer
modified layer
multifocal
processing
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JP2020194896A (ja
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圭 田中
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Disco Corp
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Disco Corp
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Priority to JP2019099800A priority Critical patent/JP7334065B2/ja
Priority to TW109117349A priority patent/TWI836080B/zh
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JP2019099800A 2019-05-28 2019-05-28 チップの製造方法 Active JP7334065B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019099800A JP7334065B2 (ja) 2019-05-28 2019-05-28 チップの製造方法
TW109117349A TWI836080B (zh) 2019-05-28 2020-05-25 晶片之製造方法

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JP2019099800A JP7334065B2 (ja) 2019-05-28 2019-05-28 チップの製造方法

Publications (2)

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JP2020194896A JP2020194896A (ja) 2020-12-03
JP7334065B2 true JP7334065B2 (ja) 2023-08-28

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JP2019099800A Active JP7334065B2 (ja) 2019-05-28 2019-05-28 チップの製造方法

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JP (1) JP7334065B2 (zh)
TW (1) TWI836080B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022102475A (ja) * 2020-12-25 2022-07-07 浜松ホトニクス株式会社 レーザ加工方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001076A (ja) 2002-03-12 2004-01-08 Hamamatsu Photonics Kk レーザ加工方法
JP2007095952A (ja) 2005-09-28 2007-04-12 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びレーザーダイシング方法
JP2009152288A (ja) 2007-12-19 2009-07-09 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びダイシング方法
US20110000897A1 (en) 2007-08-03 2011-01-06 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2016107334A (ja) 2014-11-27 2016-06-20 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2017064746A (ja) 2015-09-29 2017-04-06 株式会社東京精密 レーザー加工装置及びレーザー加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019016731A (ja) * 2017-07-10 2019-01-31 株式会社ディスコ ウェーハの加工方法
JP6991656B2 (ja) * 2017-10-24 2022-01-12 株式会社ディスコ チップの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001076A (ja) 2002-03-12 2004-01-08 Hamamatsu Photonics Kk レーザ加工方法
JP2007095952A (ja) 2005-09-28 2007-04-12 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びレーザーダイシング方法
US20110000897A1 (en) 2007-08-03 2011-01-06 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2009152288A (ja) 2007-12-19 2009-07-09 Tokyo Seimitsu Co Ltd レーザーダイシング装置及びダイシング方法
JP2016107334A (ja) 2014-11-27 2016-06-20 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP2017064746A (ja) 2015-09-29 2017-04-06 株式会社東京精密 レーザー加工装置及びレーザー加工方法

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TW202044400A (zh) 2020-12-01
JP2020194896A (ja) 2020-12-03
TWI836080B (zh) 2024-03-21

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