JP7332470B2 - 有機el表示素子用封止剤 - Google Patents
有機el表示素子用封止剤 Download PDFInfo
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- JP7332470B2 JP7332470B2 JP2019521493A JP2019521493A JP7332470B2 JP 7332470 B2 JP7332470 B2 JP 7332470B2 JP 2019521493 A JP2019521493 A JP 2019521493A JP 2019521493 A JP2019521493 A JP 2019521493A JP 7332470 B2 JP7332470 B2 JP 7332470B2
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- meth
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- 239000003381 stabilizer Substances 0.000 claims description 13
- 239000000523 sample Substances 0.000 claims description 6
- -1 alkyl polyol Chemical class 0.000 description 122
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- 238000010538 cationic polymerization reaction Methods 0.000 description 13
- 229910010272 inorganic material Inorganic materials 0.000 description 13
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical group [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
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- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
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- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
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- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 2
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- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
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- 150000008065 acid anhydrides Chemical class 0.000 description 2
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- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
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- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
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WO2014119717A1 (ja) | 2013-02-04 | 2014-08-07 | 積水化学工業株式会社 | 硬化性樹脂組成物、樹脂保護膜、有機光デバイス、及び、バリアフィルム |
JP2015524494A (ja) | 2012-07-19 | 2015-08-24 | ロリク アーゲーRolic Ag | 水捕捉層用放射線硬化性組成物、及びその製造方法 |
JP2015185272A (ja) | 2014-03-20 | 2015-10-22 | 積水化学工業株式会社 | 有機光デバイスの製造方法及び硬化性樹脂組成物 |
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JP3817081B2 (ja) | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | 有機el素子の製造方法 |
WO2001012745A1 (fr) * | 1999-08-12 | 2001-02-22 | Mitsui Chemicals, Inc. | Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant |
JP2001307873A (ja) | 2000-04-21 | 2001-11-02 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス表示素子およびその製造方法 |
US8808457B2 (en) | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
JP2008153211A (ja) | 2006-11-22 | 2008-07-03 | Fujifilm Corp | バリア性フィルム基板およびその製造方法 |
KR20120055720A (ko) * | 2009-09-04 | 2012-05-31 | 가부시끼가이샤 쓰리본드 | 유기 el 소자 밀봉 부재 |
KR20220098297A (ko) * | 2014-05-20 | 2022-07-11 | 세키스이가가쿠 고교가부시키가이샤 | 유기 일렉트로루미네선스 표시 소자용 밀봉제 |
JP6527390B2 (ja) * | 2014-06-03 | 2019-06-05 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
US9909022B2 (en) * | 2014-07-25 | 2018-03-06 | Kateeva, Inc. | Organic thin film ink compositions and methods |
CN106459374B (zh) * | 2015-02-13 | 2020-10-13 | 积水化学工业株式会社 | 有机电致发光显示元件用密封剂 |
TWI695059B (zh) * | 2015-04-17 | 2020-06-01 | 日商積水化學工業股份有限公司 | 電子裝置用密封劑及電子裝置之製造方法 |
KR102340967B1 (ko) * | 2016-09-16 | 2021-12-17 | 세키스이가가쿠 고교가부시키가이샤 | 유기 일렉트로 루미네선스 표시 소자용 봉지제 |
WO2018195066A2 (en) * | 2017-04-21 | 2018-10-25 | Kateeva, Inc. | Compositions and techniques for forming organic thin films |
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