JP7309553B2 - LIGHT SOURCE UNIT, LIGHT SOURCE UNIT MANUFACTURING METHOD AND VEHICLE LAMP - Google Patents

Description

The present invention relates to a light source unit, a method for manufacturing a light source unit, and a vehicle lamp.

In general, a vehicle lamp has a light source unit fitted in an opening of a lamp chamber consisting of an outer lens and a housing. The light source unit has a heat sink made of a metal material and a socket body formed by integrally molding a resin member by an insert (injection) molding method.

FIG. 8 is a perspective view showing a radiator plate (heat sink) of a conventional light source unit (see Patent Document 1).

In FIG. 8, the heat sink 10 is formed of aluminum or the like having high thermal conductivity, and includes a substantially rectangular heat sink 11 on the XY plane for mounting the light emitting element mounting board, and a Z-shaped heat sink perpendicular to both ends of the heat sink 11 . substantially rectangular heat dissipating portions 12 and 13 continuous in the direction, substantially rectangular heat dissipating portions 14 and 15 on the XY plane continuing to the ends of the heat dissipating portions 12 and 13 opposite to the heat dissipating portion 11, and the heat dissipating portion 14 , 15 and substantially rectangular heat radiating portions 16 and 17 continuing in the Z direction at right angles to the outer ends of the heat radiating portions 16 and 17 .

9 and 10 are diagrams for explaining a method of manufacturing a socket body of a light source unit using the heat sink 10 of FIG. FIG. 10 shows the injection molding molten resin filling process, and (A) and (B) are both ZX sectional views. In particular, (B) of FIG. 10 shows the pressing pin detachment process.

First, in the injection mold setting process shown in FIG. 9, 101 is a fixed mold, 102 is a movable mold, 103 and 104 are slider molds, and 105 and 106 are pressing pins. Incidentally, the slider type is appropriately provided according to the convex shape of the socket body. The heat radiating portion 11 of the heat radiating plate 10 is sandwiched between the fixed mold 101 and the movable mold 102 from above and below (front and back) (see FIG. 9B), so the position of the heat radiating plate 10 in the Z direction is determined. On the other hand, the heat radiating portions 16 and 17 of the heat radiating plate 10 are pressed by the pressing pins 105 and 106 (see FIG. 9A), so that the XY direction position of the heat radiating plate 10 is determined.

Next, in the injection molding molten resin filling process shown in FIG. 10, when the molten resin R is filled from a nozzle (not shown), as shown in FIG. The heat radiating plate 10 is covered with the molten resin R except for the contact portions with the heat radiating portions 16 and 17 of the heat radiating plate 10 and the contact portions between the pressing pins 105 and 106 . When the pressing pins 105 and 106 are moved in the direction of separating from the heat radiating portions 16 and 17 of the heat radiating plate 10 in the pressing pin removing process immediately before the filling is completed, the heat radiating portions 16 and 17 are displaced as shown in FIG. 10B. is also covered with the molten resin R. Therefore, since the heat sink 10 is completely covered with the socket body 18 in which the molten resin R is solidified, high waterproofness and airtightness can be realized. At this time, radiation fins 18-1, 18-2 and 18-3 are formed on the socket body 18. As shown in FIG.

Japanese Patent Application Laid-Open No. 2018-63902

However, in the conventional light source unit 1 shown in FIG. 9 and FIG. Since it is fixed by the mold 102 and the pressing pins 105 and 106, stress is concentrated on the heat radiating portions 14 and 15, which are intermediate portions of the heat radiating plate 10, due to the mold load when the movable mold 102 and the pressing pins 105 and 106 are clamped. There is a problem that the heat radiating portions 14 and 15 are deformed when the heat is applied, and the heat radiating plate 10 is also deformed.

If the heat sink 10 is deformed, the flow of the resin and the thickness of the resin change, which causes molding defects (shrinkage, voids, etc.). In addition, when the deformed heat sink 10 is exposed outside the socket body, it causes deterioration of waterproofness and airtightness.

A light source unit according to the present invention includes a light emitting element mounting substrate and a socket body in which a heat sink to which the light emitting element mounting substrate is attached and a resin member are integrated by injection molding. A first heat radiating portion to which a device mounting board is attached, second and third heat radiating portions continuous to both ends of the first heat radiating portion in a direction orthogonal to the first heat radiating portion, and second and third heat radiating portions. and fourth and fifth heat radiating portions extending in parallel with the first heat radiating portion continuously to the second and third heat radiating portions on the opposite end of the first heat radiating portion. A hole for an insertion pin or a U-shaped groove for an insertion pin used for injection molding is provided in the heat radiating portion 5.

Further, in the method for manufacturing a light source unit according to the present invention, in the method for manufacturing a light source unit described above, the first heat radiating portion of the heat radiating plate is sandwiched between the front and back sides of the first mold and the second mold, and the insertion pin is used to radiate heat. A mold setting step for inserting into the insertion pin holes or insertion pin U-shaped grooves of the fourth and fifth heat radiating portions of the plate, and after the mold setting step, between the first and second molds A molten resin filling step for filling the molten resin, and for removing the insertion pins from the insertion pin holes or the insertion pin U-shaped grooves of the fourth and fifth heat radiating portions of the heat radiating plate during the molten resin filling step. and an insertion pin removing step.

Further, a vehicle lamp according to the present invention comprises a lamp chamber composed of an outer lens and a housing, and the above-described light source unit fitted in an opening of the lamp chamber.

According to the present invention, there is no deformation of the heat sink due to injection molding.

1 is a diagram showing a vehicle lamp to which an embodiment of a light source unit according to the present invention is applied; FIG. FIG. 2 is an exploded perspective view of the light source unit of FIG. 1; 2 is a ZX plane cross-sectional view of the light source unit of FIG. 1; FIG. FIG. 3 is a front view of the socket body of FIG. 2; 5A and 5B are diagrams for explaining an injection molding die setting step in the method of manufacturing the socket body of FIG. 4, where (A) is a ZX plane cross-sectional view and (B) is a YZ plane cross-sectional view; 5A and 5B are diagrams for explaining the injection molding molten resin filling step of the method for manufacturing the socket body of FIG. 4, both of which are cross-sectional views of the ZX plane; FIG. 3 is a perspective view showing a modification of the heat sink of FIG. 2; and FIG. 11 is a perspective view showing a conventional heat sink. 9A is a cross-sectional view of the ZX plane, and FIG. 9B is a cross-sectional view of the YZ plane; FIG. is. 10A and 10B are diagrams for explaining an injection molding molten resin filling step in the method of manufacturing the socket body of the light source unit using the radiator plate of FIG. 8, both of which are cross-sectional views of the ZX plane;

FIG. 1 is a diagram showing a vehicle lamp to which an embodiment of a light source unit according to the present invention is applied.

1, the light source unit 1 is fitted into the opening of the lamp chamber 2 formed by the outer lens 21 and the housing 22 .

2 is an exploded perspective view of the light source unit 1 of FIG. 1, and FIG. 3 is a ZX plane sectional view of the light source unit 1 of FIG.

2 and 3, a radiator plate (heat sink) 10' made of aluminum or the like having high thermal conductivity is formed integrally with a socket body 18' made of a heat-dissipating resin member. The heat sink 10' is shown separated from the socket body 18' to illustrate each element of the heat sink 10'. As shown in FIG. 3, leg portions 18'-1 and 18'-2 are formed on the socket body 18'.

Similar to the heat sink 10 of FIG. Approximately rectangular heat radiation portions 12 and 13 that are orthogonal and continue in the Z direction, and substantially rectangular heat radiation portions 14′ and 15 on the XY plane that are continuous to the ends of the heat radiation portions 12 and 13 on the opposite side of the heat radiation portion 11. ', but the radiators 16 and 17 in FIG. 8 do not exist. Therefore, the leg portions 18'-1 and 18'-2 of the socket body 18' do not include heat sinks. Further, the heat radiating portions 14' and 15' are different from the heat radiating portions 14 and 15 in FIG. 8 in that insertion pin holes 14'a and 15'a used for injection molding are provided. The diameters of the insertion pin holes 14'a and 15'a are larger than the diameters of insertion pins 105' and 106' which will be described later.

FIG. 4 shows a front view of the socket body 18' of FIG. 5 and 6 are diagrams for explaining the manufacturing method of the socket body 18' of FIG. (B) is a cross-sectional view in the YZ plane of FIG. 4, FIG. 6 shows the injection molding molten resin filling step, and (A) and (B) are both cross-sectional views in the ZX plane of FIG. In particular, FIG. 6B shows the insertion pin withdrawal process.

First, in the injection mold setting process shown in FIG. 5, 101 is a fixed mold, 102 is a movable mold, 103 and 104 are slider molds, and 105' and 106' are insertion pins. Also in this case, the slider type is appropriately provided according to the convex shape of the socket body 18'. The heat radiating portion 11 of the heat radiating plate 10' is sandwiched between the fixed die 101 and the movable die 102 from above and below (front and back), so that the position of the heat radiating plate 10' in the Z direction is determined. (See FIG. 5B) On the other hand, insertion pins 105' and 106' are inserted into the insertion pin holes 14'a and 15'a of the heat radiating portions 14' and 15' of the heat radiating plate 10'. The XY position of the heat sink 10' is determined (see FIG. 5A).

Next, in the injection molding molten resin filling step shown in FIG. 6, when molten resin R is filled from a nozzle (not shown), as shown in FIG. The heat sink 10' is covered with the molten resin R except for the contact portion with 102 and the portions of the insertion pins 105' and 106'. During this filling, for example, in the insertion pin removing step immediately before the completion of filling, the direction in which the insertion pins 105' and 106' are removed from the insertion pin holes 14'a and 15'a of the heat radiating portions 14' and 15' of the heat sink 10' 6B, the insertion pin holes 14'a and 15'a of the heat radiating portions 14' and 15' are also covered with the molten resin R, as shown in FIG. 6B. Therefore, since the heat sink 10' is completely covered with the socket body 18' in which the molten resin R is solidified, high waterproofness and airtightness can be realized.

In the light source unit 1' shown in FIGS. 5 and 6A, the front and back of the heat radiation portion 11 on the heat sink plate 10' and the heat radiation portions 14' and 15' are movable mold 101, fixed mold 102 and insertion pin 105. ', 106'. In this case, the diameters of the insertion pins 105', 106' are smaller than the diameters of the insertion pin holes 14'a, 15'a of the heat sinks 14', 15'. The pins 105', 106' do not exert any force on the heat sinks 14', 15'. Therefore, even if a mold load is applied during mold clamping, stress is not concentrated on the heat radiating portions 14' and 15', which are the root portions of the heat radiating plate 10'. As a result, the heat radiating portions 14' and 15' do not deform, so the heat radiating plate 10' does not deform.

Since the heat sink 10' does not deform, it is possible to ensure an appropriate molding state, and there is no occurrence of molding defects (shrinkage, voids, etc.) and deterioration of waterproofness and airtightness.

5 and 6, the fixed mold 101 on the lower side may be a movable mold, and the movable mold 102 on the upper side may be a fixed mold.

FIG. 7 is a perspective view showing a modification of the heat sink 10' of FIG.

In FIG. 7, instead of the insertion pin holes 14a and 15a of FIG. 2, U-shaped grooves 14'b and 15'b for insertion pins are provided. The insertion pin U-shaped grooves 14'b and 15'b are open outside the heat radiating portions 14' and 15', and the width W of the insertion pin U-shaped grooves 14'b and 15'b is the same as that of the insertion pin. larger than the diameter of 105', 106'. Therefore, the insertion pins 105' and 106' are easily inserted into the insertion pin U-shaped grooves 14'b and 15'b before the molten resin R is filled, and the insertion pin U-shaped grooves 14 are inserted immediately before the molten resin R is filled. 'b, 15'b can be easily detached.

In the above embodiments, the light emitting element is a semiconductor light emitting element such as a light emitting diode (LED) element, a laser diode (LD) element, or the like.

Also, the present invention can be applied to any modifications within the obvious scope of the above embodiments.

INDUSTRIAL APPLICABILITY The present invention can be applied to vehicle lamps other than vehicle headlamps, such as turn lamps, position lamps, fog lamps, daytime running lamps (DRL), tail lamps, stop lamps, high mount stop lamps, and the like.

1: light source unit 2: lamp chamber 21: outer lens 22: housing 10, 10': heat sinks 11, 12, 13, 14, 15, 14', 15', 16, 17: heat sinks 14'a, 15'a : Insertion pin holes 14'b, 15'b: Insertion pin U-shaped grooves 18, 18': Socket bodies 18-1, 18-2, 18-3: Radiation fins 18'-1, 18'-2: Leg portion 19: Heat conducting member 20: Light emitting element mounting board 101: Fixed mold 102: Movable mold 103, 104: Slider mold 105, 106: Pressing pin 105', 106': Insertion pin

Claims (6)

a light-emitting element mounting substrate;
A light source unit comprising: a socket body in which a heat sink to which the light emitting element mounting board is attached and a resin member are integrated by injection molding,
The heat sink is
a first heat dissipation part to which the light emitting element mounting substrate is attached;
second and third heat radiating portions continuous in a direction perpendicular to the first heat radiating portion at both ends of the first heat radiating portion;
Fourth and fourth heat dissipating portions extending parallel to the first heat dissipating portion continuously from the second and third heat dissipating portions at ends of the second and third heat dissipating portions opposite to the first heat dissipating portion. 5 and a heat radiating part,
A light source unit in which holes for insertion pins or U-shaped grooves for insertion pins used in the injection molding are provided in the fourth and fifth heat radiating portions. 2. The light source unit according to claim 1, wherein the socket body has legs that do not enclose the heat sink. In the method for manufacturing the light source unit according to claim 1 or 2,
The first heat dissipating portion of the heat dissipating plate is sandwiched between the front and back sides by a first mold and a second mold, and insertion pins are inserted into the insertion pin holes of the fourth and fifth heat dissipating portions of the heat dissipating plate or the a mold setting step for inserting into the U-shaped groove for the insertion pin;
After the mold setting step, a molten resin filling step for filling molten resin between the first and second molds;
an insertion pin removing step for removing the insertion pin from the insertion pin hole or the insertion pin U-shaped groove of the fourth and fifth heat radiating portions of the heat radiating plate during the molten resin filling step; A manufacturing method of a light source unit provided. 4. The method of manufacturing a light source unit according to claim 3 , wherein the diameter of the insertion pin hole is larger than the diameter of the insertion pin. 4. The method of manufacturing a light source unit according to claim 3 , wherein the width of the U-shaped groove for the insertion pin is larger than the diameter of the insertion pin. a lamp chamber comprising an outer lens and a housing;
A vehicle lamp, comprising: the light source unit according to claim 1 or 2, which is fitted in the opening of the lamp chamber.

Images