JP2017098212A - Lamp fitting and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp fitting which enables improvement of heat radiation performance of light emitting elements, enables reduction of the number of components and automatic machine mounting of the light emitting elements, and achieves simplification of assembly work, and to provide a manufacturing method of the lamp fitting.SOLUTION: A lamp fitting includes: a resin body 3 in which a conductive lead frame 7 is integrally molded; and LED chips 5 mounted on a surface of the lead frame 7. Pad parts 71 of the lead frame 7 are exposed in recessed parts 37 provided on a surface of the body 3, and the LED chips 5 are respectively mounted on the pad parts 71 in the recessed parts 37. At least part of the body 3 is bent to form a lamp fitting housing 2.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a lamp that uses a light emitting element such as an LED (light emitting diode) or LD (laser diode) as a light source, and in particular, has improved the heat dissipation of the light emitting element, while reducing the number of parts and facilitating assembly work. It relates to lighting equipment.

  A lamp that uses this type of light-emitting element as a light source has a configuration in which one or more light-emitting elements are mounted on a circuit board formed of a printed wiring board or the like to form a light source unit, and the light source unit is housed in a lamp housing. Often taken. For example, in a vehicular lamp for an automobile, in order to protect the light source unit from the external environment, the light source unit is housed in a lamp housing whose inside is almost airtight.

  In such a lamp, when the light source unit emits light, the internal temperature of the lamp housing is increased by heat generated from the light emitting element that is the light source, thereby increasing the temperature of the light emitting element, and light emission is caused by so-called thermal runaway. The thermal reliability of the element may be reduced. Therefore, it is necessary to radiate the heat of the light emitting element to the outside of the lamp housing.

  For example, Patent Document 1 discloses a configuration in which a heat dissipating member is integrated with a back side inner surface of a lamp housing that faces the back surface of a circuit board, and an opening for exposing the heat dissipating member to the outside is formed on the back side inner surface. Has been. According to this configuration, heat generated in the light emitting element can be transferred from the circuit board to the heat radiating member and radiated to the outside through the opening. Patent Document 2 discloses a technique in which a conductive member that also serves as a heat radiating member is integrated in an embedded state in a resin lamp housing.

JP 2014-146440 A JP 2011-192905 A

  In the technique of Patent Document 1, a heat radiating member separate from the lamp housing is integrated with the lamp housing by bonding or the like. Therefore, a heat radiating member is required separately from the circuit board, which increases the number of parts and the number of man-hours for assembling the lamp.

  The technique of Patent Document 2 is advantageous in reducing the number of components because the conductive member integrated into the lamp housing also serves as the heat radiating member, so that an independent circuit board and conductive member are not required. However, in Patent Document 2, since the conductive member is integrated with the lamp housing formed in a box shape, the operation of mounting the light emitting element on the conductive member becomes complicated. That is, since the substrate surface on which the light emitting element is mounted is not a flat surface, it is difficult to apply the automatic mounting technology of the light emitting element by the so-called reflow method, the manual mounting is unavoidable, and the assembly work of the lamp is complicated. Become a thing.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a lamp and a method for manufacturing the same that enhance the heat dissipation of the light emitting element, while reducing the number of components and enabling the automatic mounting of the light emitting element. is there.

  The lamp of the present invention is a lamp including a resin body integrally formed with a conductive lead frame and a light emitting element mounted on the lead frame, and the lamp is provided in a recess provided on the surface of the body. The pad portion provided on the lead frame is exposed, and the light emitting element is mounted on the pad portion in the recess.

  In the lamp of the present invention, the edge of the recess is formed in a taper surface in the thickness direction, and the outer edge of the light emitting element is in contact with the taper surface. The body is formed as a lamp housing bent at least partially. Furthermore, the connector comprises a connector case formed by bending at least a part of the body, and a connector terminal portion in which a part of the lead frame is bent in the connector case. In this case, the body is configured such that a window portion is opened at a portion adjacent to the connector case, and at least a part of the lead frame is exposed to the window portion.

  Furthermore, in the present invention, the body preferably includes one or more heat radiation fins protruding from the back surface. Also, at least a part of the lead frame is bent, and the radiating fin is exposed as a radiating fin in which the bent portion is embedded in the body or the bent portion is exposed from the inside of the body to the outside. It may be configured as a radiating fin. Furthermore, it is preferable to provide the sealing part which covers a pad part and a light emitting element in a recessed part.

  The lamp manufacturing method of the present invention includes a step of processing a conductive lead frame into a pattern shape having at least a pad portion and a connector terminal portion, a step of integrally forming the lead frame with a resin material, and forming a body, A step of mounting a light emitting element on a pad portion exposed in a recess provided in the housing, and a step of bending a part of the body to form a lamp housing. This manufacturing method preferably includes a step of bending the connector terminal portion exposed to the body and a step of forming a connector case on a part of the body.

  According to the lamp of the present invention, the lead frame is formed integrally with the body, and the pad portion of the lead frame is exposed in the concave portion provided in the body, so that the light emitting element is mounted on the body and the front surface is mounted on the body. A lamp can be formed by attaching a lens. Therefore, the lamp can be configured with a minimum number of parts. Further, by bending the body and the lead frame, a lamp housing and a connector can be configured, and manufacturing is facilitated. Furthermore, the heat radiation effect of the light emitting element can be further enhanced by providing the body with heat radiation fins or providing the lead frame with a bent portion. Moreover, by providing the sealing portion in the concave portion, the light emitting element and the pad portion can be protected from the external environment, and their reliability can be improved.

  According to the manufacturing method of the present invention, it is possible to mount the light emitting element on the body integrally formed with the lead frame by an automatic machine, and it is possible to form the lamp housing and the connector by bending the body and the lead frame. . Thereby, the assembly process number of a lamp can be reduced and it can manufacture easily.

(A) is the external appearance perspective view which fractured | ruptured the part which looked at HMSL of Embodiment 1 from the front direction, (b) is the external appearance perspective view seen from the rear surface direction. (A) is a front view of a body, (b) is the BB sectional drawing. The perspective view of a lead frame. (A) is an aa line expanded sectional view of Drawing 2 (a), and (b) is an bb line expanded sectional view similarly. The schematic perspective view explaining the 1 of a manufacturing process. The schematic perspective view explaining the 2 of a manufacturing process. The schematic perspective view explaining the 3 of a manufacturing process. The schematic perspective view which changed a part of manufacturing process. (A) is the external appearance perspective view which looked at HMSL of Embodiment 2 from the rear surface direction, (b) is the CC sectional enlarged sectional view. (A) is a perspective view of a lead frame, (b) is a perspective view of the back surface of the insert-molded body. (A) is a perspective view of an LED pad part, (b) is the DD line expanded sectional view.

(Embodiment 1)
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of Embodiment 1 in which the present invention is applied to an HMSL (High Mount Stop Lamp) as one of automotive lamps, and FIG. The perspective view, (b) is an external perspective view seen from the rear surface direction.

  In the HMSL 1, as shown in FIG. 1A, a lamp housing 2 is constituted by a horizontally long container-like body 3 having an open front surface and a front lens 4 attached to the front opening of the body 3. ing. A plurality of light sources 5 are arranged and supported in the horizontal direction in the lamp housing 2, here in the body 3. The HMSL 1 is a lamp that is mounted on a rear side of a vehicle body (not shown) with the front lens 4 facing the rear of the vehicle and is turned on when the vehicle is braked.

  The body 3 is formed in a rectangular container shape having a rectangular bottom surface portion 31 and four side surface portions 32 to 35 surrounding the bottom surface portion 31. As a light source, a light emitting element, here, four rectangular LED chips 5 are mounted. These four LED chips 5 are arranged in a horizontal row at a predetermined interval in the longitudinal direction of the body 3, and each is individually mounted on the inner bottom surface 31 a of the body 3.

  As shown in FIG. 1B, the connector 6 is integrally formed on the outer bottom surface 31 b of the bottom surface portion 31 of the body 3. The connector 6 is detachable from a power connector 8 connected to an in-vehicle power source of an automobile, and is supplied with power for emitting light from the LED chip 5. In addition, a plurality of windows 36a and 36b whose details will be described later are opened in the outer bottom surface 31b.

  FIG. 2A is a view of the HMSL 1 viewed from the front, and FIG. 2B is a cross-sectional view taken along the line BB. The body 3 is formed into a plate shape by molding a heat-resistant resin such as a PPS resin, and is formed into a rectangular container shape by the subsequent processing. A lead frame 7 made of a copper material is integrally embedded in the body 3 by, for example, insert molding. The lead frame 7 is embedded in the region of the bottom surface portion 31 of the body 3 and is not embedded in the regions of the four side surface portions 32 to 35.

  The lead frame 7 is formed by patterning and bending a conductive metal plate such as copper, and FIG. 3 shows a state before bending. The lead frame 7 includes four pairs of LED pad portions 71 for mounting the four LED chips 5, a pair of connector terminal portions 72 for constituting the terminals of the connector 6, and the LED pads. The wiring part 73 which electrically connects the part 71 and the connector terminal part 72 mutually is provided. Further, here, four heat dissipating portions 74 having a rectangular plate shape with a required area are also provided. The lead frame 7 includes a component pad portion for mounting an electronic component for constituting a light emitting circuit for causing the LED chip 5 to emit light as necessary. In this embodiment, the component pad portion is included. Not an example.

  FIG. 4A is an enlarged sectional view taken along line aa in FIG. On the inner bottom surface 31 a of the bottom surface portion 31 of the body 3, rectangular concave portions 37 are respectively formed at locations corresponding to the four pairs of LED pad portions 71 of the lead frame 7, and these four concave portions 37 are formed. The pair of LED pad portions 71 are exposed on the inner bottom surface of the LED. The concave portions 37 are formed in vertical and horizontal dimensions corresponding to the outer shape of the LED chip 5 to be mounted, and the four edge portions of the concave portions 37 are formed as tapered surfaces 37a inclined outward in the plate thickness direction.

  In the LED chip 5, the light emitting surface portion 51 is directed to the front opening of the body 3, and a pair of positive and negative electrodes 52 provided on the back surface opposite to the light emitting surface is connected to the LED pad portion 71 by reflow soldering 9. It is mounted by soldering. In this mounted state, the four outer edge portions on the back surface side of the LED chip 5 are in contact with the four tapered surfaces 37 a of the concave portion 37.

  FIG. 4B is an enlarged cross-sectional view taken along the line bb of FIG. A rectangular cylindrical connector case 61 composed of a part 38 of a part of the body 3 is formed integrally with the body 3 on a part of the outer bottom surface 31b of the body 3 as described later. In the connector case 61, the pair of connector terminal portions 72 of the lead frame 7 are arranged in a state bent in the vertical direction. The connector case 61 and the connector terminal portion 72 constitute the connector 6. The power supply connector 8 can be inserted into the connector case 61, and when the power supply connector 8 is inserted, the pair of connector terminal portions 72 are electrically connected to the power supply connector 8.

  Further, as shown in FIGS. 1 (b) and 2 (b), rectangular windows are provided on both sides of the outer bottom surface 31b of the body 3 with the connector case 61 sandwiched therebetween and on both sides outside the connector case 61, respectively. The portions 36b and 36a are opened, and a part of the heat radiating portion 74 of the lead frame 7 is exposed in the windows 36a and 36b. In addition, since these window parts 36a and 36b are obstruct | occluded by a part of the said heat radiating part 74 or the bottom face part 31, the inner bottom face 31a of the said body 3 is connected to the outer bottom face 31b side through the said window parts 36a and 36b. There is no.

  The front lens 4 is formed of a translucent resin into a rectangular plate shape, and is attached to the front opening of the body 3. Here, the front lens 4 is welded or bonded to the opening edge of the body 3 at the periphery. In place of welding or bonding, for example, although not shown, tongue-like engagement pieces are integrally formed at both ends in the longitudinal direction of the front lens 4, and the engagement pieces are formed in the longitudinal direction of the body 3. It is good also as a structure which attaches the front lens 4 to the body 3 by engaging with the engagement hole protrudingly formed in the both sides | surfaces of the direction.

  In addition, a lens step that refracts the light emitted from the LED chip 5 and emits the light toward the front of the HMSL with a required light distribution may be formed on the inner surface of the front lens 4. For example, as the lens step, it is possible to adopt a configuration in which the inner surface of the front lens 4 is partitioned into a plurality of grids in the vertical and horizontal directions, and a minute spherical lens is integrally formed in each partition.

  The HMSL 1 having the above configuration is supplied with required power, for example, current, from the power connector 8 fitted to the connector 6. This current is passed from the connector terminal portion 72 of the lead frame 7 to the wiring portion 73 and further energized to the four LED pad portions 71. The four LED chips 5 are energized through the LED pad portion 71 on which they are mounted, and emit light. Light emitted from each LED chip 5 by light emission is transmitted through the front lens 4, refracted by the lens step of the front lens 4, and irradiated to the front of the HMSL 1 with a required light distribution. Note that surface treatment may be performed so that the inner surface of the body 3 becomes a light reflecting surface, and reflected light of light emitted from the LED chip 5 may be emitted from the front lens 4.

  When each LED chip 5 emits light, each LED chip 5 generates heat. The generated heat is transferred to the LED pad portion 71 of the lead frame 7 and further transferred to the wiring portion 73 and the heat radiating portion 74. Then, the heat is directly radiated to the outside from the heat radiating portion 74 exposed in the window portion 36 opened in the outer bottom surface 31 b of the body 3. Further, heat is transferred from the wiring portion 73 and the heat radiating portion 74 to the bottom surface portion 31 of the body 3 and is radiated from the outer bottom surface. Thereby, the temperature rise of the LED chip 5 and the thermal runaway associated therewith are prevented, and the thermal reliability is improved.

  Further, the HMSL 1 is composed of four LED chips 5 as a light source, a body 3, and a front lens 4, so that the number of parts is small and the assembling work can be simplified. In particular, since the lead frame 7 for supplying power to the LED chip 5 is integrally embedded in the body 3, the work of assembling the lead frame 7 on which the LED chip 5 is mounted on the body 3 becomes unnecessary.

  5 to 7 are schematic perspective views for explaining a manufacturing method of the HMSL. First, as shown in FIG. 3, a flat copper plate is patterned, and four pairs of LED pad portions 71, a pair of connector terminal portions 72, and these LED pad portions 71 and connector terminal portions 72 are mutually connected. A lead frame 7 having a wiring part 73 to be electrically connected and a rectangular heat radiation part 74 that also serves as a part of the wiring part 73 is formed. The lead frame 7 is not bent in this state.

  Here, in the actual lead frame 7, dummy connection portions are formed as necessary in order to keep the electrically separated portions of the portions 71 to 74 mechanically connected to each other. However, illustration of this dummy connection part is abbreviate | omitted here. Then, as shown by a chain line in FIG. 3, a resin body 3 in which the lead frame 7 is insert-molded is formed.

  The formed body 3 is developed with a bottom surface 31 and four side surfaces 31 to 35 as shown in a front perspective view of FIG. 5A and a rear perspective view of FIG. 5B, respectively. It is formed into a flat plate shape. In addition, at the place where the four side surface portions 32 to 35 are connected to the bottom surface portion 31 of the body 3, a recess having a reduced thickness is formed along the boundary between the two. It is formed as a so-called integral hinge 30a that can bend the boundary between the portion 31 and the side portions 32 to 35 in the thickness direction. The lead frame 7 is embedded only in the bottom surface portion 31 of the body 3 and does not protrude beyond the integral hinge 30a to the side surface portions 32 to 35.

  A concave portion 37 is formed on the inner bottom surface 31 a of the bottom surface portion 31 of the molded body 3, and the LED pad portion 71 of the lead frame 7 is exposed on the inner bottom surface of the concave portion 37. On the other hand, the outer bottom surface 31 b of the body 3 is provided with an opening 39 at a portion where the connector terminal portion 72 of the lead frame 7 is formed, and the connector terminal portion 72 is exposed in the opening 39. Further, a rectangular window portion 36a is opened on the outer bottom surface 31b in a region corresponding to a part of the heat radiation portion 74 of the lead frame 7, and a part of the heat radiation portion 74 is exposed in the window portion 36a. .

  On the outer bottom surface 31b of the body 3, a pair of generally U-shaped slits 38a are formed on both sides of the opening 39, here on both sides in the longitudinal direction of the body 3, so as to face each other. These slits 38a are formed in a region corresponding to the other part of the heat radiation portion 74 of the lead frame 7, and each piece portion 38 surrounded by each slit 38a has a substantially U-shaped integrator. A hinge 30b is formed to face the slit 38a.

  Then, as shown in FIG. 6, the body 3 is set in an automatic reflow mounting machine (not shown), and the LED chip 5 is mounted. The body 3 is set in an automatic reflow mounting machine with the inner bottom surface 31a facing upward, and the LED chip 5 picked up by the tool T of the mounting machine is set in a recess 37 formed in the inner bottom surface 31a. The LED chip 5 is placed on the LED pad portion 71 exposed in the recess 37, and each LED chip 5 is surface-mounted on the LED pad portion 71 by executing reflow in that state.

  At this time, as shown in FIG. 4A, since the edge of the concave portion 37 is formed as a tapered surface 37a, when the LED chip 5 is placed on the LED pad portion 71, the LED chip 5 The outer edge portion, particularly the lower edge portion is brought into contact with the tapered surface 37a, and the LED chip 5 can be positioned with respect to the concave portion 37, that is, the LED chip 5 can be positioned with respect to the LED pad portion 71.

  Next, as shown in FIG. 7A, the body 3 on which the LED chip 5 has been mounted is set in an automatic bending / welding machine (not shown). First, the integral hinge provided on the body 3 is set. Bend along 30a. In the integral hinge 30a surrounding the bottom surface 31, the four side surfaces 32 to 35 are bent at right angles to the thickness direction in the direction of the inner bottom surface 31a, so that the bottom surface 31 and the four side surfaces 32 to 35 are rectangular containers. It is made into a shape. And the side part 32-35 heats the side part which mutually contacts, and it forms as a rectangular container-shaped body by the bottom face part 31 and the four side parts 32-35.

  At the same time, as shown in FIG. 7B, the connector terminal portion 72 of the lead frame 7 exposed in the opening 39 of the outer bottom surface 31b of the bottom surface portion 31 is bent at a right angle with respect to the outer bottom surface 31b. Further, the piece 38 surrounded by the slit 38a of the outer bottom surface 31b is bent using the integral hinge 30b formed in the piece 38. That is, first, the pair of pieces 38 are bent at right angles to the outer surface direction in the integral hinge 30b. Since this piece 38 exists in the region of the heat radiating portion 74 of the lead frame 7, it is possible to bend only the piece 38. Next, both ends of the bent piece 38 are further bent at a right angle. By this bending and bending process, the window portion 36b is opened at the portion where the piece portion 38 is bent and the heat radiating portion 74 of the lead frame 7 is also exposed to the window portion 36b.

  A connector case having a rectangular cylindrical shape surrounding the connector terminal portion 72 as shown in FIG. 1 (b) by welding the side portions where the pair of bent piece portions 38 contact each other. 61 is formed. That is, the connector 6 is formed by the connector terminal portion 72 and the connector case 61.

  When the lead frame 7 is provided with the above-described dummy connecting portion (not shown), the lead frame 7 is partially formed on the inner bottom surface 31a of the body 3 at any timing in the above manufacturing process. Alternatively, the dummy connecting portion may be cut out by drilling a hole having a depth exceeding 1 mm, or by performing notch processing, and the respective portions of the lead frame 7 may be insulated from each other.

  Thereafter, as shown in FIG. 1, the front lens 4 is attached to the opening of the body 3 formed in a rectangular container shape. Here, as described above, it is performed by adhesion or welding. The front lens 4 is integrated with the body 3 to complete the HMSL1. When the engaging piece is formed on the front lens 4, it can be attached only by fitting the front lens 4 to the body 3.

  As described above, in this manufacturing method, the processing step of the lead frame 7, the step of insert-molding the processed lead frame 7 into a resin to form the body 3, and the lead frame 7 integrated with the body 3 Then, the manufacturing of the HMSL is completed by the step of mounting the LED chip 5 by reflowing, the step of bending and bonding the body 3 and the lead frame 7 and the step of attaching the front lens 4. Therefore, the HMSL can be manufactured with a small number of parts and a small number of manufacturing steps.

  Here, as shown in FIG. 8A, when the lead frame 7 is formed, the connector terminal portion 72 is bent at a right angle toward the back surface side, that is, the outer bottom surface 31b side of the bottom surface portion 31, and in this state. The body 3 may be insert-molded. In insert molding of the body 3, as shown in FIG. 8B, a connector case 61 of the connector 6 having a rectangular frame shape is integrally formed on a part 38 on the back surface of the body 3. In this way, since the connector 6 can be formed simultaneously with the insert molding of the body 3, the subsequent bending process of the connector case 61 becomes unnecessary. Further, the strength of the connector case 61 is also increased. Even if the connector 6 is formed in advance on the back side of the body 3 as described above, the LED chip 5 shown in FIG. 6 can be automatically mounted.

(Embodiment 2)
FIG. 9A is a perspective view of the HMSL1 of the second embodiment viewed from the rear. In the second embodiment, the lead frame 7 and the body 3 are insert-molded as in the embodiment shown in FIG. In this insert molding, since the degree of freedom of the shape of the body 3 is increased, in order to improve the heat dissipation in the body 3 by utilizing this, a plurality of standing fin-like heat radiation fins 9 protrude integrally on the back surface of the body 3. Is formed. In addition, the window parts 36a and 36b of Embodiment 1 are not provided. The height dimension from which these heat dissipating fins 9 are projected and the width dimension along the vertical direction of the HMSL1 are formed as large as possible within a range in which the outer dimension of the HMSL1 is not increased unnecessarily.

  The heat radiating fins 9 are disposed at positions corresponding to the LED pad portions 71 provided on the lead frame 7 or at positions corresponding to the heat radiating portions 74. Here, the heat radiating fins 9 are disposed at positions corresponding to the latter heat radiating portions 74. Has been. 9B is an enlarged cross-sectional view taken along the line C-C in FIG. 9A, and a part 74a of the heat radiating portion 74 of the lead frame 7 is bent at a substantially right angle toward the back surface. The radiating fin 9 is covered with a part of the body 3 so that the bent portion 74a becomes a core portion.

  As shown in a perspective view of the lead frame 7 in FIG. 10A, the heat radiating portion 74 is provided with a U-shaped slit 74b, and a part 74a of the heat radiating portion 74 surrounded by the slit 74b is formed on the back side (bottom surface). The portion 74 a is bent with respect to the planar direction of the lead frame 7 by being bent at a right angle toward the outer bottom surface 31 b side of the portion 31. Then, the lead frame 7 is insert-molded into the body 3 so that the bent portion 74a is embedded as a core portion integrally in the radiating fin 9 as shown in the perspective view of FIG. It has been arranged in the state.

  In the configuration of the body 3, the heat generated in the LED chip 5 is transferred from the LED pad portion 71 to the heat radiating portion 74 as in the first embodiment. Then, heat is transferred from the heat radiating portion 74 to the body 3 and radiated from the back surface of the body 3 to the outside. At this time, in the heat radiating portion 74, the portion 74a protrudes toward the back surface of the body 3, and heat is radiated from the heat radiating fins 9 whose both surfaces are covered with resin. The heat dissipating fins 9 increase the heat dissipating area on the back side of the body 3, and the heat transferred to the heat dissipating part 74 can be dissipated with high efficiency.

  When there is a margin in the size of the lead frame 7, a portion of a region different from the heat radiating portion 74 is bent and bent, and the bent portion is covered with the body 3 to constitute a part of the heat radiating fin 9. Also good. For example, a portion close to the LED pad portion 71 may be bent, and the bent portion may be covered with a resin to form the radiation fin 9. By forming such a heat radiating fin 9 in a portion as close as possible to the LED pad portion 71, the heat radiating effect can be further enhanced.

  In addition, the radiating fins 9 of the second embodiment are not necessarily configured as radiating fins having a part of the lead frame 7 as a core part. For example, even if a part of the back surface of the body 3 is formed as a standing wall protruding to the back surface side, and the standing wall is configured as a heat radiation fin, the area of the back surface of the body 3, that is, the heat radiation area can be increased to enhance the heat radiation effect. Can do.

  Furthermore, as described above, the portion 74a where a part of the heat radiating portion 74 is bent and the portion where the other portion of the lead frame 7 is bent may not necessarily be covered with the resin of the body 3. The structure protruded in the state exposed from may be sufficient. When the appearance and external environment resistance of the HMSL1 are not a problem, it is possible to further enhance the heat dissipation effect by configuring the heat dissipation fins that expose these portions 74a and the like.

  In the second embodiment, similarly to the first embodiment, when the lead frame 7 is formed, the connector terminal portion 72 is bent at a right angle toward the back surface side, and insert molding is performed on the body 3 in this state. Good. In this insert molding, if the connector case 61 of the connector 6 having a rectangular frame shape is integrally formed on a part 38 on the back surface of the body 3, the connector 6 can be formed simultaneously with the insert molding of the body 3. Is not required, and the strength of the connector case 61 is increased.

  In any of the first and second embodiments described above, the present invention may employ a configuration in which the LED chip 5 is sealed with a translucent material. FIGS. 11A and 11B are an enlarged perspective view of a part of the LED pad portion 71 and an enlarged sectional view taken along the line DD. The LED pad portion 71 of the lead frame 7 is exposed, and a translucent resin 53 is disposed in the concave portion 37 of the body 3 on which the LED chip 5 is mounted. The LED pad portion 71 is sealed.

  Here, the translucent member 53 is cured by dripping a translucent molten resin into the concave portion 37 by potting or the like. The surface is formed into a spherical shape by the surface tension of the resin. Or you may adhere | attach the translucent members, such as resin and glass previously formed in the predetermined shape. By sealing with the translucent member 53, the LED chip 5 and the LED pad portion 71 are not exposed to the external environment, and their reliability can be improved. Further, as described above, by forming the surface of the translucent member 53 into a spherical surface or a predetermined curved surface shape, the light emitted from the LED chip 5 can be refracted and controlled to a desired light distribution. Become.

  In the embodiment, the HMSL composed of four LED chips is exemplified as the light source. However, it is needless to say that the HMSL can be configured with a different number of light sources. The light source is not limited to the LED chip, and may be an LD or other light emitting element as long as it can be mounted by an automatic machine.

  In the embodiment, in order to facilitate the formation of the lamp housing by bending the molded body, the lead frame is embedded only in the bottom surface portion, but it is possible to bend the body in which the lead frame is embedded. If so, the lead frame may be embedded from the bottom surface to the side surface.

  In the embodiment, the example in which the present invention is applied to the HMSL has been described. However, the present invention can be similarly applied as long as the lamp is configured to mount the light emitting element on the body. This is particularly effective when the present invention is applied to a lamp having a configuration in which a light emitting element can be mounted by an automatic machine such as reflow when mounting the light emitting element on a lead frame integrally formed on the body.

1 Lamp (HMSL)
2 Lamp housing 3 Body 4 Front lens 5 LED chip (light emitting element)
6 Connector 7 Lead frame 8 Power connector 9 Radiation fin 31 Bottom surface portion 31a Inner bottom surface 31b Outer bottom surface 32-35 Side surface portions 36a, 36b Window portion 37 Recessed portion 37a Tapered surface 38 Single portion 53 Translucent member 61 Connector case 71 LED pad portion 72 connector terminal part 73 wiring part 74 heat dissipation part 74a bent part (core part)

Claims (10)

  A lamp having a resin body integrally formed with a conductive lead frame and a light emitting element mounted on the lead frame, the lamp being provided in a recess provided on the surface of the body. The lamp is characterized in that the pad portion formed is exposed, and the light emitting element is mounted on the pad portion in the recess.   The lamp according to claim 1, wherein an edge of the recess is formed on a tapered surface in a thickness direction, and an outer edge of the light emitting element is in contact with the tapered surface.   The lamp according to claim 1, wherein the body is formed as a lamp housing bent at least partially.   4. The connector according to claim 1, further comprising: a connector case formed by bending at least a part of the body; and a connector terminal portion in which a part of the lead frame is bent in the connector case. A lamp according to any one of the above.   The lamp according to any one of claims 1 to 4, wherein the body has a window portion opened at a portion adjacent to the connector case, and a part of the lead frame is exposed to the window portion.   The lamp according to any one of claims 1 to 4, wherein the body includes one or more radiating fins protruding from a back surface.   The lead frame is at least partially bent, and the heat dissipating fin is a heat dissipating fin in which the bent portion is embedded in the body, or the bent portion extends from the inside of the body to the outside. The lamp of Claim 6 comprised as a radiation fin exposed.   The lamp according to any one of claims 1 to 7, wherein the concave portion includes a sealing portion that covers the pad portion and the light emitting element.   A step of processing a conductive lead frame into a pattern shape having at least a pad portion and a connector terminal portion, a step of integrally forming the lead frame with a resin material to form a body, and a recess provided in the body A method of manufacturing a lamp, comprising: mounting a light emitting element on the exposed pad portion; and bending the part of the body to form a lamp housing. The manufacturing method of the lamp of Claim 9 including the process of bending the said connector terminal part exposed from the said body, and the process of forming a connector case in a part of said body.

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