JP7302115B2 - 六方晶窒化ホウ素粉末、及び樹脂組成物 - Google Patents

六方晶窒化ホウ素粉末、及び樹脂組成物 Download PDF

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Publication number
JP7302115B2
JP7302115B2 JP2023501448A JP2023501448A JP7302115B2 JP 7302115 B2 JP7302115 B2 JP 7302115B2 JP 2023501448 A JP2023501448 A JP 2023501448A JP 2023501448 A JP2023501448 A JP 2023501448A JP 7302115 B2 JP7302115 B2 JP 7302115B2
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Prior art keywords
boron nitride
hexagonal boron
nitride powder
less
powder
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Japanese (ja)
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JPWO2022202618A5 (https=
JPWO2022202618A1 (https=
Inventor
豪 竹田
重臣 緒方
玲偉 田中
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023501448A 2021-03-24 2022-03-17 六方晶窒化ホウ素粉末、及び樹脂組成物 Active JP7302115B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021049932 2021-03-24
JP2021049932 2021-03-24
PCT/JP2022/012331 WO2022202618A1 (ja) 2021-03-24 2022-03-17 六方晶窒化ホウ素粉末、及び樹脂組成物

Publications (3)

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JPWO2022202618A1 JPWO2022202618A1 (https=) 2022-09-29
JPWO2022202618A5 JPWO2022202618A5 (https=) 2023-03-22
JP7302115B2 true JP7302115B2 (ja) 2023-07-03

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JP2023501448A Active JP7302115B2 (ja) 2021-03-24 2022-03-17 六方晶窒化ホウ素粉末、及び樹脂組成物

Country Status (4)

Country Link
JP (1) JP7302115B2 (https=)
KR (1) KR20230135679A (https=)
CN (1) CN116963994B (https=)
WO (1) WO2022202618A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017034003A1 (ja) 2015-08-26 2017-03-02 デンカ株式会社 熱伝導性樹脂組成物
JP2018165241A (ja) 2017-03-28 2018-10-25 デンカ株式会社 六方晶窒化ホウ素粉末、その製造方法、及び化粧料
JP2019521064A (ja) 2016-05-27 2019-07-25 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 窒化ホウ素凝集体を製造するためのプロセス
JP2019182737A (ja) 2018-04-02 2019-10-24 株式会社トクヤマ 六方晶窒化ホウ素粉末およびその製造方法
JP2020164192A (ja) 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末の梱包体、化粧料及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3521173B2 (ja) * 1997-07-11 2004-04-19 電気化学工業株式会社 六方晶窒化ほう素粉末の製造方法
JPWO2014109134A1 (ja) * 2013-01-10 2017-01-19 株式会社カネカ 六方晶窒化ホウ素及びそれを用いた高熱伝導性樹脂成形体
JP6284094B2 (ja) * 2013-08-23 2018-02-28 国立研究開発法人産業技術総合研究所 誘電体用樹脂組成物および高周波誘電体デバイス
JP6483508B2 (ja) * 2014-04-18 2019-03-13 株式会社トクヤマ 六方晶窒化ホウ素粉末及びその製造方法
JP6746443B2 (ja) * 2016-09-13 2020-08-26 株式会社トクヤマ 六方晶窒化ホウ素粉末
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
US20190077661A1 (en) * 2017-09-14 2019-03-14 Rogers Corporation Boron nitride foam, methods of manufacture thereof, and articles containing the boron nitride foam
JP7069485B2 (ja) 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
JP7069314B2 (ja) * 2018-06-29 2022-05-17 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
CN110451465B (zh) * 2019-09-09 2022-08-16 吉林大学 一种海胆状氮化硼纳米球-纳米管分级结构及其制备方法
WO2021100617A1 (ja) * 2019-11-19 2021-05-27 デンカ株式会社 六方晶窒化ホウ素粉末

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017034003A1 (ja) 2015-08-26 2017-03-02 デンカ株式会社 熱伝導性樹脂組成物
JP2019521064A (ja) 2016-05-27 2019-07-25 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 窒化ホウ素凝集体を製造するためのプロセス
JP2018165241A (ja) 2017-03-28 2018-10-25 デンカ株式会社 六方晶窒化ホウ素粉末、その製造方法、及び化粧料
JP2019182737A (ja) 2018-04-02 2019-10-24 株式会社トクヤマ 六方晶窒化ホウ素粉末およびその製造方法
JP2020164192A (ja) 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末の梱包体、化粧料及びその製造方法

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CN116963994A (zh) 2023-10-27
KR20230135679A (ko) 2023-09-25
JPWO2022202618A1 (https=) 2022-09-29
CN116963994B (zh) 2026-02-10
WO2022202618A1 (ja) 2022-09-29

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