JP7292125B2 - 生産システム - Google Patents
生産システム Download PDFInfo
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- JP7292125B2 JP7292125B2 JP2019115862A JP2019115862A JP7292125B2 JP 7292125 B2 JP7292125 B2 JP 7292125B2 JP 2019115862 A JP2019115862 A JP 2019115862A JP 2019115862 A JP2019115862 A JP 2019115862A JP 7292125 B2 JP7292125 B2 JP 7292125B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Description
管理サーバー10は、通信部11と、記憶部12と、制御ユニット13とを備え、かかる各部により、生産システム1における生産工程の管理に関する各種処理を実行する。
搬送ユニット20は、通信部21と、記憶部22と、制御ユニット23とを備える。
第1装置30-1は、被加工物に第1工程の加工を行う。図2に示すように、第1装置30-1は、通信部31と、記憶部32と、制御ユニット33とを備える。なお、第1装置30-1と、第1装置30-2と、第1装置30-3と、第1装置30-4とは、それぞれ同一の構成を有する。
第2装置40-1は、搬入された被加工物に対して第1工程後の第2工程の加工を行う。図2に示すように、第2装置40-1は、通信部41と、記憶部42と、制御ユニット43とを備える。なお、第2装置40-1と、第2装置40-2と、第2装置40-3と、第2装置40-4とは、それぞれ同一の構成を有する。
2 通信ネットワーク
10 管理サーバー
11 通信部
12 記憶部
12-1 記録部
13 制御ユニット
20 搬送ユニット
21 通信部
22 記憶部
23 制御ユニット
30-1~30-4 第1装置
31 通信部
32 記憶部
33 制御ユニット
40-1~40-4 第2装置
41 通信部
42 記憶部
42-1 検査結果格納部
42-2 判定結果格納部
43 制御ユニット
43-1 検査部
43-2 判定部
43-3 報知部
Claims (2)
- 生産システムであって、
被加工物に同一の第1工程の加工を行う複数の第1装置と、
被加工物に第1工程後の同一の第2工程の加工を行う複数の第2装置と、
該第1工程から該第2工程において、どの該被加工物が複数の第1装置のうちのどの該第1装置で加工されたかを記録する記録部と、
該第1装置、該第2装置及び該記録部を制御する制御ユニットと、を備え、
該第2装置は、それぞれ、
被加工物を検査して不良を発見する検査部と、
複数の第1装置のうちのどの該第1装置で加工した被加工物に不良が多いかを判定する判定部と、
該判定部の判定結果を報知する報知部と、
を備える生産システム。 - 複数の第1装置のうちのいずれかから複数の第2装置のうちのいずれかに被加工物を搬送する搬送ユニットをさらに備え、
該制御ユニットは、該搬送ユニットを制御する請求項1に記載の生産システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019115862A JP7292125B2 (ja) | 2019-06-21 | 2019-06-21 | 生産システム |
KR1020200063383A KR20200145679A (ko) | 2019-06-21 | 2020-05-27 | 생산 시스템 |
CN202010541339.8A CN112117211A (zh) | 2019-06-21 | 2020-06-15 | 生产系统 |
TW109120135A TWI824159B (zh) | 2019-06-21 | 2020-06-16 | 生產系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019115862A JP7292125B2 (ja) | 2019-06-21 | 2019-06-21 | 生産システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021002237A JP2021002237A (ja) | 2021-01-07 |
JP7292125B2 true JP7292125B2 (ja) | 2023-06-16 |
Family
ID=73799272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019115862A Active JP7292125B2 (ja) | 2019-06-21 | 2019-06-21 | 生産システム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7292125B2 (ja) |
KR (1) | KR20200145679A (ja) |
CN (1) | CN112117211A (ja) |
TW (1) | TWI824159B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343952A (ja) | 2005-06-08 | 2006-12-21 | Fujitsu Ltd | 製造管理装置、製造管理方法および製造管理プログラム |
JP2010170178A (ja) | 2009-01-20 | 2010-08-05 | Sharp Corp | 生産管理システム |
US20150346709A1 (en) | 2014-06-03 | 2015-12-03 | Samsung Electronics Co., Ltd. | Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0729958A (ja) * | 1993-07-14 | 1995-01-31 | Hitachi Ltd | 半導体製造装置 |
SG192295A1 (en) * | 2012-01-10 | 2013-08-30 | K One Ind Pte Ltd | Flexible assembly line for tray packaging |
CN203805476U (zh) * | 2014-02-25 | 2014-09-03 | 元亨利包装科技(上海)有限公司 | 一种带有多工位的不停机印刷加工系统 |
JP6456177B2 (ja) | 2015-02-12 | 2019-01-23 | 株式会社ディスコ | ウェーハ処理システム |
JP6625857B2 (ja) | 2015-10-14 | 2019-12-25 | 株式会社ディスコ | ウェーハ加工方法 |
JP6672094B2 (ja) * | 2016-07-01 | 2020-03-25 | 株式会社日立製作所 | プラント制御装置、圧延制御装置、プラント制御方法およびプラント制御プログラム |
US20180229497A1 (en) * | 2017-02-15 | 2018-08-16 | Kateeva, Inc. | Precision position alignment, calibration and measurement in printing and manufacturing systems |
CN108663378A (zh) * | 2017-03-31 | 2018-10-16 | 东莞中创智能制造系统有限公司 | 一种在线产品质量检测方法 |
-
2019
- 2019-06-21 JP JP2019115862A patent/JP7292125B2/ja active Active
-
2020
- 2020-05-27 KR KR1020200063383A patent/KR20200145679A/ko active Search and Examination
- 2020-06-15 CN CN202010541339.8A patent/CN112117211A/zh active Pending
- 2020-06-16 TW TW109120135A patent/TWI824159B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343952A (ja) | 2005-06-08 | 2006-12-21 | Fujitsu Ltd | 製造管理装置、製造管理方法および製造管理プログラム |
JP2010170178A (ja) | 2009-01-20 | 2010-08-05 | Sharp Corp | 生産管理システム |
US20150346709A1 (en) | 2014-06-03 | 2015-12-03 | Samsung Electronics Co., Ltd. | Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor |
Also Published As
Publication number | Publication date |
---|---|
TWI824159B (zh) | 2023-12-01 |
CN112117211A (zh) | 2020-12-22 |
JP2021002237A (ja) | 2021-01-07 |
TW202101357A (zh) | 2021-01-01 |
KR20200145679A (ko) | 2020-12-30 |
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