JP7286754B2 - プロセスキットの中心合わせ測定のための方法及び装置 - Google Patents
プロセスキットの中心合わせ測定のための方法及び装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 113
- 238000005259 measurement Methods 0.000 title description 9
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- 235000012431 wafers Nutrition 0.000 description 93
- 238000012545 processing Methods 0.000 description 25
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 238000004590 computer program Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
- G01B7/087—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means for measuring of objects while moving
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2220/00—Function indicators
- B65H2220/03—Function indicators indicating an entity which is measured, estimated, evaluated, calculated or determined but which does not constitute an entity which is adjusted or changed by the control process per se
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/10—Size; Dimensions
- B65H2511/13—Thickness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/10—Size; Dimensions
- B65H2511/16—Irregularities, e.g. protuberances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2515/00—Physical entities not provided for in groups B65H2511/00 or B65H2513/00
- B65H2515/70—Electrical or magnetic properties, e.g. electric power or current
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Automation & Control Theory (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
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Description
本出願は、2018年9月4日に出願された米国非仮出願第16/121,183号の優先権を主張し、その全内容は、参照により本明細書に組み込まれる。
Claims (13)
- 第1の表面、前記第1の表面の反対側の第2の表面、及び前記第1の表面と前記第2の表面との間の端面を含む、基板、
前記端面に沿って形成された複数の第1のセンサ領域であって、各第1のセンサ領域が自己参照容量センサを有し、各第1のセンサ領域が、前記端面と、前記端面に対向する任意の面との間の間隙距離を測定するように構成されている、複数の第1のセンサ領域、及び
前記基板の前記第1の表面において、前記第1の表面から凹んで形成された複数の第2のセンサ領域であって、前記複数の第2のセンサ領域の各々は、該第2のセンサ領域に対向する任意の面までの距離を特定するセンサのアレイを備え、前記複数の第2のセンサ領域の各々は、前記基板の前記端面まで延在している、複数の第2のセンサ領域
を備える、センサウエハ。 - 前記複数の第1のセンサ領域は、少なくとも3つのセンサ領域を含む、請求項1に記載のセンサウエハ。
- 前記自己参照容量センサは、第1のプローブと第2のプローブとを備え、前記第1のプローブの出力位相が、前記第2のプローブの出力位相から180度オフセットされている、請求項1または2に記載のセンサウエハ。
- 前記複数の第1のセンサ領域の各々に近接する前記基板の前記第2の表面の中に凹部を更に備える、請求項1から3のいずれか一項に記載のセンサウエハ。
- 前記凹部は、前記第1のセンサ領域から少なくとも1.0mm後方に延在する、請求項4に記載のセンサウエハ。
- 前記複数の第1のセンサ領域の各々の下方に電界ガードを更に備える、請求項1から5のいずれか一項に記載のセンサウエハ。
- 前記複数の第1のセンサ領域に通信可能に結合された計算モジュールを更に備える、請求項1から6のいずれか一項に記載のセンサウエハ。
- 前記計算モジュールが、前記複数の第2のセンサ領域にも通信可能に結合されている、請求項7に記載のセンサウエハ。
- 前記複数の第2のセンサ領域は、少なくとも3つのセンサ領域を含む、請求項1から8のいずれか一項に記載のセンサウエハ。
- チャンバ内のプロセスキットの位置を特定する方法であって、
プロセスキットをチャンバの中で支持面の周りに配置すること、
前記支持面によって支持される第1の表面、前記第1の表面の反対側の第2の表面、前記第1の表面を前記第2の表面に接続する端面であって複数の第1のセンサ領域が形成された端面、及び前記第1の表面において前記第1の表面から凹んで形成された複数の第2のセンサ領域を含み、前記複数の第2のセンサ領域の各々は、該第2のセンサ領域に対向する任意の面までの距離を特定するセンサのアレイを備え、前記複数の第2のセンサ領域の各々は、前記端面まで延在している、センサウエハを、前記支持面上に配置すること、
前記複数の第1のセンサ領域の各々と前記プロセスキットの表面との間の間隙距離を特定すること、
前記間隙距離から、前記センサウエハの中心点に対する前記プロセスキットの中心点の第1の中心点オフセットを特定すること、
前記複数の第2のセンサ領域の各々を使用して、前記支持面の縁部の位置を検出すること、並びに
前記支持面の前記縁部の前記位置から、前記支持面の中心点に対する前記センサウエハの前記中心点のオフセットである、第2の中心点オフセットを特定すること
を含む、方法。 - 前記複数の第1のセンサ領域は、自己参照容量センサを備える、請求項10に記載の方法。
- 前記自己参照容量センサは、第1のプローブと第2のプローブとを備え、前記第1のプローブの出力位相が、前記第2のプローブの出力位相から180度オフセットされている、請求項11に記載の方法。
- 前記第2の中心点オフセットに前記第1の中心点オフセットを加算することによって、総オフセットを特定することを更に含む、請求項10から12のいずれか一項に記載の方法。
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US16/121,183 | 2018-09-04 | ||
US16/121,183 US10847393B2 (en) | 2018-09-04 | 2018-09-04 | Method and apparatus for measuring process kit centering |
PCT/US2019/044524 WO2020050926A1 (en) | 2018-09-04 | 2019-07-31 | Method and apparatus for measuring process kit centering |
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KR (2) | KR102639660B1 (ja) |
CN (1) | CN112470262B (ja) |
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JP7231076B2 (ja) * | 2018-03-08 | 2023-03-01 | 株式会社三洋物産 | 遊技機 |
US10847393B2 (en) * | 2018-09-04 | 2020-11-24 | Applied Materials, Inc. | Method and apparatus for measuring process kit centering |
US11404296B2 (en) * | 2018-09-04 | 2022-08-02 | Applied Materials, Inc. | Method and apparatus for measuring placement of a substrate on a heater pedestal |
EP3896385B1 (en) * | 2018-12-11 | 2024-01-17 | Rorze Corporation | Electrostatic capacitance sensor |
JP2020103418A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社三洋物産 | 遊技機 |
JP2021186294A (ja) * | 2020-05-29 | 2021-12-13 | 株式会社三洋物産 | 遊技機 |
JP2023053387A (ja) * | 2022-02-04 | 2023-04-12 | 株式会社三洋物産 | 遊技機 |
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