JP7285621B2 - 真空計 - Google Patents
真空計 Download PDFInfo
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- JP7285621B2 JP7285621B2 JP2017229399A JP2017229399A JP7285621B2 JP 7285621 B2 JP7285621 B2 JP 7285621B2 JP 2017229399 A JP2017229399 A JP 2017229399A JP 2017229399 A JP2017229399 A JP 2017229399A JP 7285621 B2 JP7285621 B2 JP 7285621B2
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- heater
- module
- sensing mechanism
- vacuum gauge
- temperature
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L21/00—Vacuum gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L21/00—Vacuum gauges
- G01L21/16—Vacuum gauges by measuring variation of frictional resistance of gases
- G01L21/22—Vacuum gauges by measuring variation of frictional resistance of gases using resonance effects of a vibrating body; Vacuum gauges of the Klumb type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L21/00—Vacuum gauges
- G01L21/30—Vacuum gauges by making use of ionisation effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
- G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
- G01L9/125—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor with temperature compensating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L21/00—Vacuum gauges
- G01L21/10—Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured
- G01L21/12—Vacuum gauges by measuring variations in the heat conductivity of the medium, the pressure of which is to be measured measuring changes in electric resistance of measuring members, e.g. of filaments; Vacuum gauges of the Pirani type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Measuring Fluid Pressure (AREA)
- Glass Compositions (AREA)
- Paper (AREA)
- Cable Accessories (AREA)
Description
前記センシング機構の出力信号が入力され、圧力値を算出する圧力算出回路、及び、前記ヒータの温度を制御するヒータ制御回路を具備する本体モジュールと、を備え、
前記ヒータ制御回路が、前記ヒータの温度が入力された設定温度となるように前記ヒータの電流又は電圧を制御するものであればよい。
1 ・・・センサモジュール
11 ・・・導入空間
12 ・・・ダイアフラム
13 ・・・検出電極
14 ・・・出力電極
15 ・・・収容体
16 ・・・ヒータ
17 ・・・インシュレータ
2 ・・・本体モジュール
21 ・・・校正データ記憶部
22 ・・・圧力算出部
23 ・・・補正係数記憶部
24 ・・・補正部
PB ・・・圧力算出回路
CB ・・・ヒータ制御回路
3 ・・・断熱モジュール
31 ・・・断熱材
32 ・・・中心導線
33 ・・・絶縁体
34 ・・・外導体
35 ・・・コネクタソケット
36 ・・・コンタクトバネ
MC ・・・メインコネクタ
Claims (8)
- 測定空間内の雰囲気と接触するダイアフラムと、前記ダイアフラムに対向させて設けられた検出電極と具備し、当該測定空間内の圧力に応じた出力信号を出力するセンシング機構、温度センサ、及び、前記センシング機構を温調するヒータを具備するセンサモジュールと、
前記センシング機構の出力信号が入力され、圧力値を算出する圧力算出回路、及び、前記温度センサの測定温度と外部入力によって受け付けられた設定温度との偏差が小さくなるように前記ヒータを温度制御するヒータ制御回路を具備し、前記センサモジュールから離間させて設けられた本体モジュールと、を備え、
前記ヒータの設定温度が可変であって、所定の温度範囲から選択して設定されるものであり、
前記圧力算出回路が、
前記センシング機構の出力信号に基づいて圧力値を算出する圧力算出部と、
前記ヒータの複数の設定温度と、当該複数の設定温度のそれぞれに対応する複数の補正係数とを記憶する補正係数記憶部と、
前記ヒータに対して設定された前記設定温度を参照するとともに、当該設定温度に対応する補正係数を前記補正係数記憶部から読み出し、当該読み出した前記補正係数に基づいて、前記圧力算出部が算出する圧力値を補正する補正部と、を備えることを特徴とする真空計。 - 前記本体モジュールに対して前記センサモジュールが、着脱可能である請求項1記載の真空計。
- 前記圧力算出回路が、
前記センシング機構に対応する校正データを記憶する校正データ記憶部をさらに備え、
前記校正データ記憶部が、外部入力により校正データを更新可能に構成されており、
前記圧力算出部が、前記センシング機構の出力信号と、前記校正データに基づいて圧力値を算出するように構成されている請求項1又は2記載の真空計。 - 前記センサモジュールと前記本体モジュールとの間を所定距離離間させ、前記センサモジュールで発生する熱が前記本体モジュールへと伝熱するのを妨げる断熱モジュールをさらに備えた請求項1乃至3いずれかに記載の真空計。
- 前記センサモジュールが、前記センシング機構と前記ヒータが一体となって前記本体モジュールに対して着脱可能に構成されている請求項1乃至4いずれかに記載の真空計。
- 前記断熱モジュールには、
前記センシング機構と前記圧力算出回路との間を接続するメインコネクタと、
前記ヒータと前記ヒータ制御回路との間を接続するサブコネクタと、が設けられており、
前記サブコネクタが、前記ヒータと前記ヒータ制御回路との間を接続する可撓性を有するコードである請求項4に記載の真空計。 - 前記メインコネクタが、
前記センシング機構の出力信号が伝送される中心導線と、
前記中心導線の側周面を覆い、電気的に絶縁する筒状の絶縁体と、
前記絶縁体の外側周面を覆う外導体と、を備え、
前記断熱モジュールには、外導体のさらに外側を覆う筒状の導体製のコネクタソケットが設けられている請求項6記載の真空計。 - 前記補正部が、前記ヒータ制御回路から前記ヒータの設定温度を受け取るように構成された請求項1乃至7いずれかに記載の真空計。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017229399A JP7285621B2 (ja) | 2017-11-29 | 2017-11-29 | 真空計 |
CN201811425237.9A CN109974929A (zh) | 2017-11-29 | 2018-11-27 | 真空计 |
KR1020180148812A KR20190063424A (ko) | 2017-11-29 | 2018-11-27 | 진공계 |
US16/201,954 US20190162618A1 (en) | 2017-11-29 | 2018-11-27 | Vacuum monitor |
TW107142448A TWI791692B (zh) | 2017-11-29 | 2018-11-28 | 真空計 |
JP2023028389A JP7436722B2 (ja) | 2017-11-29 | 2023-02-27 | 真空計 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017229399A JP7285621B2 (ja) | 2017-11-29 | 2017-11-29 | 真空計 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2023028389A Division JP7436722B2 (ja) | 2017-11-29 | 2023-02-27 | 真空計 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019100766A JP2019100766A (ja) | 2019-06-24 |
JP7285621B2 true JP7285621B2 (ja) | 2023-06-02 |
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ID=66632224
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2017229399A Active JP7285621B2 (ja) | 2017-11-29 | 2017-11-29 | 真空計 |
JP2023028389A Active JP7436722B2 (ja) | 2017-11-29 | 2023-02-27 | 真空計 |
Family Applications After (1)
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JP2023028389A Active JP7436722B2 (ja) | 2017-11-29 | 2023-02-27 | 真空計 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190162618A1 (ja) |
JP (2) | JP7285621B2 (ja) |
KR (1) | KR20190063424A (ja) |
CN (1) | CN109974929A (ja) |
TW (1) | TWI791692B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023054358A (ja) * | 2017-11-29 | 2023-04-13 | 株式会社堀場エステック | 真空計 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107976279A (zh) * | 2017-12-15 | 2018-05-01 | 北京创昱科技有限公司 | 一种真空测量装置 |
CN113891650B (zh) | 2019-05-29 | 2023-07-07 | 株式会社久保田 | 拖拉机 |
CN110501948B (zh) * | 2019-08-23 | 2022-05-17 | 大陆汽车车身电子系统(芜湖)有限公司 | 一种用于电子装置的采集电阻式传感器的数据的方法 |
CN111174966A (zh) * | 2020-01-06 | 2020-05-19 | 中国科学院微电子研究所 | 散热结构及电容压力传感器 |
CN111207882A (zh) * | 2020-01-17 | 2020-05-29 | 中国科学院微电子研究所 | 压力传感器 |
CN111207883A (zh) * | 2020-01-17 | 2020-05-29 | 中国科学院微电子研究所 | 压力传感器 |
JP7418248B2 (ja) * | 2020-03-05 | 2024-01-19 | 株式会社堀場エステック | 真空計 |
JP1685892S (ja) * | 2020-10-01 | 2021-05-24 | ||
JP2022173674A (ja) | 2021-05-10 | 2022-11-22 | アズビル株式会社 | 隔膜真空計 |
US12018993B2 (en) * | 2022-03-10 | 2024-06-25 | Illinois Tool Works Inc. | Absolute pressure transducers having improved operating temperature ranges |
CN115435963B (zh) * | 2022-08-15 | 2024-07-16 | 北京北方鸿瑞科技有限公司 | 力学电真空计、检测方法及其应用 |
CN115790963A (zh) * | 2022-12-25 | 2023-03-14 | 兰州空间技术物理研究所 | 一种mems电容薄膜真空计微电容检测装置及标定方法 |
CN117316831B (zh) * | 2023-11-28 | 2024-02-02 | 南昌中微半导体设备有限公司 | 压力控制器、半导体处理设备及气压控制方法 |
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US5808206A (en) * | 1996-01-16 | 1998-09-15 | Mks Instruments, Inc. | Heated pressure transducer assembly |
US5625152A (en) * | 1996-01-16 | 1997-04-29 | Mks Instruments, Inc. | Heated pressure transducer assembly |
WO1997027526A2 (de) * | 1996-01-23 | 1997-07-31 | Kaba Schliesssysteme Ag | Spieljeton mit integriertem elektronischen datenträger |
JP3607420B2 (ja) * | 1996-06-20 | 2005-01-05 | 株式会社日立製作所 | ドライタイプ圧力検出装置 |
JP4437578B2 (ja) | 1999-11-24 | 2010-03-24 | キヤノンアネルバ株式会社 | 簡易交換型真空センサ |
US6612176B2 (en) * | 2000-12-28 | 2003-09-02 | Mks Instruments, Inc. | Pressure transducer assembly with thermal shield |
JP4712220B2 (ja) * | 2001-05-02 | 2011-06-29 | 大亜真空株式会社 | 圧力測定装置 |
DE10215213C1 (de) * | 2002-04-06 | 2003-09-11 | Va Q Tec Ag | Vorrichtung und Verfahren zur Messung des Gasdruckes in evakuierten Dämmplatten |
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JP4563312B2 (ja) * | 2005-12-05 | 2010-10-13 | 株式会社堀場エステック | 静電容量式圧力センサ装置 |
DE102006045471A1 (de) * | 2006-09-26 | 2008-04-03 | Va-Q-Tec Ag | Verfahren zur Bestimmung des Gasdruckes in evakuierten Körpern |
JP5366422B2 (ja) * | 2008-03-28 | 2013-12-11 | アズビル株式会社 | 圧力センサ |
US8504313B2 (en) * | 2010-03-22 | 2013-08-06 | Dennis Cardinale | Electronic vacuum gauge and systems and methods of calibration and operation of same |
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JP7285621B2 (ja) * | 2017-11-29 | 2023-06-02 | 株式会社堀場エステック | 真空計 |
-
2017
- 2017-11-29 JP JP2017229399A patent/JP7285621B2/ja active Active
-
2018
- 2018-11-27 KR KR1020180148812A patent/KR20190063424A/ko not_active Application Discontinuation
- 2018-11-27 US US16/201,954 patent/US20190162618A1/en not_active Abandoned
- 2018-11-27 CN CN201811425237.9A patent/CN109974929A/zh active Pending
- 2018-11-28 TW TW107142448A patent/TWI791692B/zh active
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2023
- 2023-02-27 JP JP2023028389A patent/JP7436722B2/ja active Active
Non-Patent Citations (3)
Title |
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特開2002-328045号公報 |
特開2007-155500号公報 |
特開2009-243887号公報 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023054358A (ja) * | 2017-11-29 | 2023-04-13 | 株式会社堀場エステック | 真空計 |
Also Published As
Publication number | Publication date |
---|---|
JP2019100766A (ja) | 2019-06-24 |
TW201930842A (zh) | 2019-08-01 |
KR20190063424A (ko) | 2019-06-07 |
CN109974929A (zh) | 2019-07-05 |
JP7436722B2 (ja) | 2024-02-22 |
JP2023054358A (ja) | 2023-04-13 |
US20190162618A1 (en) | 2019-05-30 |
TWI791692B (zh) | 2023-02-11 |
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