JP7271850B2 - 有機金属前駆体化合物 - Google Patents
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45534—Use of auxiliary reactants other than used for contributing to the composition of the main film, e.g. catalysts, activators or scavengers
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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Description
R1、R2、R3、R4、及びR5は、それぞれ独立して、水素、炭素数1~5のアルキル基、炭素数1~5のアルコキシ基及び炭素数6~12のフェニル基の中から選択され、
Mは、周期表上で4族に属する金属元素の中から選択され、
R6、R7及びR8は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択され、
X1は、それぞれ独立して、下記化2aまたは2bで表される有機基の中から選択され、
R9、R10及びR11は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択され得る。
本発明の特徴によれば、前記化1において、Mは、Ti、Zr、Hf及びRfの中から選択され得るが、これに制限されるものではない。
以下においては、図1を参照して、本発明の一実施例に係る有機金属前駆体化合物及びそれを用いた薄膜の製造方法について説明する。
R1、R2、R3、R4、及びR5は、それぞれ独立して、水素、炭素数1~5のアルキル基、炭素数1~5のアルコキシ基及び炭素数6~12のフェニル基の中から選択され得るが、これに制限されるものではない。
Mは、周期表上で4族に属する金属元素の中から選択され得るが、これに制限されるものではなく、多様な金属元素をいずれも含むことができる。
R6、R7及びR8は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択され得るが、これに制限されるものではない。
R9、R10及びR11は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択され得るが、これに制限されるものではない。
R1、R2、R3、R4、R5、R6及びR7は、それぞれ独立して、水素及び炭素数1~5のアルキル基の中から選択され得るが、これに制限されるものではない。
以下においては、図2から図4を参照して、本発明の一実施例に係る特性を説明する。
R1、R2、R3、R4、R5、R6及びR7は、それぞれ独立して、水素及び炭素数1~5のアルキル基の中から選択され得るが、これに制限されるものではない。
Claims (9)
- 下記化1で表される、有機金属前駆体化合物であって、
R1、R2、R3、R4、及びR5は、それぞれ独立して、水素、炭素数1~5のアルキル基、および炭素数1~5のアルコキシ基の中から選択され、
Mは、周期表上で4族に属する金属元素の中から選択され、
R6、R7及びR8は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択され、
X1は、それぞれ独立して、下記化2aまたは2bで表される有機基の中から選択され、
R9、R10及びR11は、それぞれ独立して、水素、炭素数1~5の線状のアルキル基及び炭素数3~5の分枝状アルキル基の中から選択される、有機金属前駆体化合物。 - 前記化1において、Mは、Ti、Zr、Hf及びRfの中から選択される、請求項1に記載の有機金属前駆体化合物。
- 請求項1から3のいずれか一項に記載の有機金属前駆体化合物を反応器に導入するステップを含む、薄膜の製造方法。
- 前記薄膜の製造方法は、
原子層蒸着(Atomic Layer Deposition)または化学気相蒸着(Chemical Vapor Deposition)である、請求項4に記載の薄膜の製造方法。 - 前記薄膜の製造方法は、
酸化剤、窒化剤及び還元剤の少なくとも一つを導入するステップをさらに含む、請求項4に記載の薄膜の製造方法。 - 前記薄膜は、
ビス(ジメチルアミノ)(iso-プロポキシ)(メチルシクロペンタジエニル)ハフニウム酸化物(HfOx)膜である、請求項4に記載の薄膜の製造方法。 - 前記ビス(ジメチルアミノ)(iso-プロポキシ)(メチルシクロペンタジエニル)ハフニウムは、
(シクロペンタジエニル)トリス(ジメチルアミノ)ハフニウムよりGPC(Growth Per Cycle)値が0.2ずつ低い水準である、請求項7に記載の薄膜の製造方法。 - 前記薄膜の製造方法は、
前記有機金属前駆体化合物を基板上に移送するステップをさらに含み、
前記移送は、
蒸気圧を利用して揮発移送方法、直接液体注入方法(Direct Liquid Injection)及び液体移送方法(Liquid Delivery System)の少なくとも一つによって遂行される、請求項4に記載の薄膜の製造方法。
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Citations (5)
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JP2004306014A (ja) | 2003-03-26 | 2004-11-04 | Sumitomo Chem Co Ltd | オレフィン三量化触媒及びオレフィン三量体の製造方法 |
JP2012009823A (ja) | 2010-05-28 | 2012-01-12 | Tokyo Electron Ltd | 成膜方法および成膜装置 |
JP2013047391A (ja) | 2005-12-06 | 2013-03-07 | Tri Chemical Laboratory Inc | ハフニウム系薄膜形成方法およびハフニウム系薄膜形成材料 |
JP2016037654A (ja) | 2014-08-11 | 2016-03-22 | 株式会社トリケミカル研究所 | 膜形成材料および膜形成方法 |
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WO2003029256A1 (en) * | 2001-10-01 | 2003-04-10 | Dow Global Technologies Inc. | Bulky amido group substituted group 4 metal compounds and polymerization process |
JP2006045083A (ja) * | 2004-08-02 | 2006-02-16 | Asahi Denka Kogyo Kk | 薄膜形成用原料、薄膜の製造方法及び金属化合物 |
KR20080101040A (ko) * | 2007-05-15 | 2008-11-21 | 주식회사 유피케미칼 | 금속 박막 또는 세라믹 박막 증착용 유기 금속 전구체화합물 및 이를 이용한 박막 증착 방법 |
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KR102235869B1 (ko) * | 2018-02-07 | 2021-04-05 | 주식회사 유피케미칼 | 4 족 금속 원소-함유 화합물, 이의 제조 방법, 이를 포함하는 막 형성용 전구체 조성물, 및 이를 이용하는 막의 형성 방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2003048912A (ja) | 2001-08-06 | 2003-02-21 | Sumitomo Chem Co Ltd | ビニル化合物重合用触媒成分、ビニル化合物重合用触媒、ビニル化合物重合体の製造方法および遷移金属化合物の用途 |
JP2004306014A (ja) | 2003-03-26 | 2004-11-04 | Sumitomo Chem Co Ltd | オレフィン三量化触媒及びオレフィン三量体の製造方法 |
JP2013047391A (ja) | 2005-12-06 | 2013-03-07 | Tri Chemical Laboratory Inc | ハフニウム系薄膜形成方法およびハフニウム系薄膜形成材料 |
JP2012009823A (ja) | 2010-05-28 | 2012-01-12 | Tokyo Electron Ltd | 成膜方法および成膜装置 |
JP2016037654A (ja) | 2014-08-11 | 2016-03-22 | 株式会社トリケミカル研究所 | 膜形成材料および膜形成方法 |
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US20220194967A1 (en) | 2022-06-23 |
CN114644647A (zh) | 2022-06-21 |
KR20220087046A (ko) | 2022-06-24 |
TWI828023B (zh) | 2024-01-01 |
JP2022096611A (ja) | 2022-06-29 |
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