JP7263634B1 - 複合シート、及び複合シートの製造方法、並びに、積層基板 - Google Patents

複合シート、及び複合シートの製造方法、並びに、積層基板 Download PDF

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Publication number
JP7263634B1
JP7263634B1 JP2023514475A JP2023514475A JP7263634B1 JP 7263634 B1 JP7263634 B1 JP 7263634B1 JP 2023514475 A JP2023514475 A JP 2023514475A JP 2023514475 A JP2023514475 A JP 2023514475A JP 7263634 B1 JP7263634 B1 JP 7263634B1
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Japan
Prior art keywords
composite sheet
thermosetting resin
ceramic plate
less
resin composition
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Active
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JP2023514475A
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English (en)
Japanese (ja)
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JPWO2023027123A5 (https=
JPWO2023027123A1 (https=
Inventor
仁孝 南方
政秀 金子
亮 吉松
真也 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2023027123A1 publication Critical patent/JPWO2023027123A1/ja
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Publication of JPWO2023027123A5 publication Critical patent/JPWO2023027123A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2023514475A 2021-08-26 2022-08-24 複合シート、及び複合シートの製造方法、並びに、積層基板 Active JP7263634B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021138222 2021-08-26
JP2021138222 2021-08-26
PCT/JP2022/031929 WO2023027123A1 (ja) 2021-08-26 2022-08-24 複合シート、及び複合シートの製造方法、並びに、積層基板

Publications (3)

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JPWO2023027123A1 JPWO2023027123A1 (https=) 2023-03-02
JP7263634B1 true JP7263634B1 (ja) 2023-04-24
JPWO2023027123A5 JPWO2023027123A5 (https=) 2023-08-02

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JP2023514475A Active JP7263634B1 (ja) 2021-08-26 2022-08-24 複合シート、及び複合シートの製造方法、並びに、積層基板

Country Status (2)

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JP (1) JP7263634B1 (https=)
WO (1) WO2023027123A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015124122A (ja) * 2013-12-26 2015-07-06 電気化学工業株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
WO2017155110A1 (ja) * 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
WO2020148960A1 (ja) * 2019-01-15 2020-07-23 株式会社日本マイクロニクス プローブ基板及び電気的接続装置
WO2020203586A1 (ja) * 2019-03-29 2020-10-08 デンカ株式会社 複合体、複合体の製造方法、積層体及び積層体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015124122A (ja) * 2013-12-26 2015-07-06 電気化学工業株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
WO2017155110A1 (ja) * 2016-03-10 2017-09-14 デンカ株式会社 セラミックス樹脂複合体
WO2020148960A1 (ja) * 2019-01-15 2020-07-23 株式会社日本マイクロニクス プローブ基板及び電気的接続装置
WO2020203586A1 (ja) * 2019-03-29 2020-10-08 デンカ株式会社 複合体、複合体の製造方法、積層体及び積層体の製造方法

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WO2023027123A1 (ja) 2023-03-02
JPWO2023027123A1 (https=) 2023-03-02

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