JPWO2023027123A1 - - Google Patents
Info
- Publication number
- JPWO2023027123A1 JPWO2023027123A1 JP2023514475A JP2023514475A JPWO2023027123A1 JP WO2023027123 A1 JPWO2023027123 A1 JP WO2023027123A1 JP 2023514475 A JP2023514475 A JP 2023514475A JP 2023514475 A JP2023514475 A JP 2023514475A JP WO2023027123 A1 JPWO2023027123 A1 JP WO2023027123A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/82—Coating or impregnation with organic materials
- C04B41/83—Macromolecular compounds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021138222 | 2021-08-26 | ||
| JP2021138222 | 2021-08-26 | ||
| PCT/JP2022/031929 WO2023027123A1 (ja) | 2021-08-26 | 2022-08-24 | 複合シート、及び複合シートの製造方法、並びに、積層基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023027123A1 true JPWO2023027123A1 (https=) | 2023-03-02 |
| JP7263634B1 JP7263634B1 (ja) | 2023-04-24 |
| JPWO2023027123A5 JPWO2023027123A5 (https=) | 2023-08-02 |
Family
ID=85322879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514475A Active JP7263634B1 (ja) | 2021-08-26 | 2022-08-24 | 複合シート、及び複合シートの製造方法、並びに、積層基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7263634B1 (https=) |
| WO (1) | WO2023027123A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6262522B2 (ja) * | 2013-12-26 | 2018-01-17 | デンカ株式会社 | 樹脂含浸窒化ホウ素焼結体およびその用途 |
| EP3428223B1 (en) * | 2016-03-10 | 2021-05-05 | Denka Company Limited | Ceramic resin composite body |
| JP6609073B1 (ja) * | 2019-01-15 | 2019-11-20 | 株式会社日本マイクロニクス | プローブ基板及び電気的接続装置 |
| JP7566727B2 (ja) * | 2019-03-29 | 2024-10-15 | デンカ株式会社 | 複合体、複合体の製造方法、積層体及び積層体の製造方法 |
-
2022
- 2022-08-24 JP JP2023514475A patent/JP7263634B1/ja active Active
- 2022-08-24 WO PCT/JP2022/031929 patent/WO2023027123A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP7263634B1 (ja) | 2023-04-24 |
| WO2023027123A1 (ja) | 2023-03-02 |
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