JP7253255B2 - 低温で大気圧プラズマ強化化学蒸着を実施する装置 - Google Patents
低温で大気圧プラズマ強化化学蒸着を実施する装置 Download PDFInfo
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Description
低温でのアナターゼ薄膜のPMMA光ファイバ上への大気圧プラズマ強化化学蒸着
金ナノ粒子を含むアナターゼTiO2薄膜も、図14で示している設定を使用して蒸着された。この設定は、放電後領域に2個の同時注入システムが存在していることを除いて、図1に示している設定に基づいている。一方が、たとえば、TiO2前駆物質(たとえばTEOT、チタン(IV)エトキシド)の霧である第1の化学前駆物質を供給するのに対して、他方は、Au前駆物質(たとえば、HAuCl4.3H2O)の霧である第2の化学前駆物質を供給する。マイクロ波電力は、200Wで設定され、Arプラズマ気体流は、10slmで設定される。
Claims (15)
- 結晶金属酸化物誘導体を基質(112;212)上に蒸着するプラズマ放電後蒸着装置(100;200)であって、
a)基質入口(102;202)を備えている気体源(116;216)と、
b)基質出口(104;204)を備えている放電後蒸着室(110;210)であって、
前記基質入口(102;202)と前記基質出口(104;204)とは、長手方向の中心軸線を定めている放電後蒸着室(110;210)と、
c)前記長手方向の中心軸線上で前記気体源(116;216)と前記蒸着室(110;210)との間に配置されており、プラズマ放電を閉じ込めるように構成されている誘電性チューブ(108;208)と、
を有し、
前記誘電性チューブ(108;208)は、前記誘電性チューブ(108;208)の内側の表面上に配置されている放電区域(136)と、前記長手方向の中心軸線上で中心に配置されている中心区域(138)とを有しており、
前記中心区域(138)は、前記誘電性チューブ(108;208)の内側の表面から1mmと2.5mmとの間の距離に位置しており、
前記誘電性チューブ(108;208)は、プラズマ放電を発生するように構成されている表面波ランチャ(106;206)に囲まれており、
前記プラズマ放電によって前記基質(112;212)を活性化する、プラズマ放電後蒸着装置(100;200)。 - 前記表面波ランチャ(106;206)は、前記中心区域(138)内で150℃以下または150℃、好ましくは100℃未満の温度を提供するように構成されていることを特徴とする、請求項1に記載のプラズマ放電後蒸着装置(100;200)。
- 前記誘電性チューブ(108;208)は、水晶、パイレックス(登録商標)、アルミナ、シリカ、または任意の誘電性材料、優先的には水晶の放電チューブであることを特徴とする、請求項1または2に記載のプラズマ放電後蒸着装置(100;200)。
- 前記表面波ランチャ(106;206)は、300MHzと300GHzとの間の周波数、優先的には2.45GHzの周波数のマイクロ波表面波ランチャであることを特徴とする、請求項1に記載のプラズマ放電後蒸着装置(100;200)。
- 前記放電後蒸着室(110;210)は、前記表面波ランチャ(106;206)から0.5cmと20cmとの間の距離に、優先的には6cmの距離に位置していることを特徴とする、請求項1から4のいずれか1項に記載のプラズマ放電後蒸着装置(100;200)。
- 前記気体源(116;216)は、気体を前記表面波ランチャ(106;206)内に注入するように構成されており、前記気体は、優先的には、アルゴン、ヘリウム、クリプトン、キセノン、窒素、水素、酸素、及び/またはそれらの任意の組み合わせであることを特徴とする、請求項1から5のいずれか1項に記載のプラズマ放電後蒸着装置(100;200)。
- 該装置(100;200)は、装置(100;200)の放電後領域に配置されており、化学前駆物質を基質(112;122)のプラズマ活性化表面上に送達するように構成されており、前記化学前駆物質は、優先的には、結晶金属酸化物誘導体前駆物質、より優先的には、ドーピング用に予備成形されている金属ナノ粒子と混合されている及び/または化学前駆物質と混合されている結晶金属酸化物誘導体前駆物質である、化学前駆物質源(118;218)をさらに有することを特徴とする、請求項1から6のいずれか1項に記載のプラズマ放電後蒸着装置(100;200)。
- 前記化学前駆物質源(118;218)は、化学前駆物質を霧及び/またはエアロゾルの形態で送達するように構成されている微粒化構成(120;220)に接続されており、前記微粒化構成(120;220)は、優先的には超音波システムであることを特徴とする、請求項7に記載のプラズマ放電後蒸着装置(100;200)。
- 前記気体源(116;216)は、金属ナノ粒子前駆物質を前記気体内に送達するように構成されている金属ナノ粒子前駆物質送達システム(248)をさらに有し、前記金属ナノ粒子前駆物質は、より優先的には、銀、パラジウム、プラチナ、または金のナノ粒子前駆物質であることを特徴とする、請求項1から8のいずれか1項に記載のプラズマ放電後蒸着装置(100;200)。
- 該装置は、装置の放電後領域に配置されており、第1の化学前駆物質と第2の化学前駆物質とを基質のプラズマ活性化表面上に送達するように構成されている2個の化学前駆物質源を有し、前記化学前駆物質は、優先的にはチタン(IV)エトキシド及び金三塩酸塩であることを特徴とする、請求項1から9のいずれか1項に記載のプラズマ放電後蒸着装置。
- a)プラズマ活性化基質を生成するように、基質(112;212)をプラズマ放電後蒸着装置内で活性化し、
b)前記プラズマ放電後蒸着装置(100; 200)の放電後領域に配置され、化学前駆物質を基質(112;122)のプラズマ活性化表面上に送達するように構成された化学前駆物質源(118;218)によって、前記プラズマ放電後蒸着装置の放電後領域において前記プラズマ活性化基質に官能基を持たせる、
ステップを有し、
前記化学前駆物質は、結晶金属酸化物誘導体であり、
前記プラズマ放電後蒸着装置は、請求項1から10のいずれか1項に記載のプラズマ放電後蒸着装置(100;200)であることを特徴とする、プラズマ増強化学蒸着方法。 - プラズマ増強化学蒸着は、大気圧及び/または150℃以下または150℃の、好ましくは100℃未満の温度で実施されることを特徴とする、請求項11に記載のプラズマ増強化学蒸着方法。
- 前記基質(112;212)は、熱敏感基質であることを特徴とする、請求項11または12に記載のプラズマ増強化学蒸着方法。
- 前記基質(112;212)は、1次元基質または2次元基質であることを特徴とする、請求項11から13のいずれか1項に記載のプラズマ増強化学蒸着方法。
- 前記結晶金属酸化物誘導体は、優先的には、TiO2、ZnO、WO3、またはドーピングされている結晶金属酸化物誘導体であって、優先的には、ホウ素でドーピングされているTiO2、または金属ナノ粒子の結晶金属酸化物誘導体との混合物であることを特徴とする、請求項11から14のいずれか1項に記載のプラズマ増強化学蒸着方法。
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LU93221A LU93221B1 (en) | 2016-09-15 | 2016-09-15 | Device for performing atmospheric pressure plasma enhanced chemical vapour deposition at low temperature |
LU93221 | 2016-09-15 | ||
PCT/EP2017/073165 WO2018050758A1 (en) | 2016-09-15 | 2017-09-14 | Device for performing atmospheric pressure plasma enhanced chemical vapour deposition at low temperature |
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TWI754245B (zh) * | 2020-03-17 | 2022-02-01 | 國立陽明交通大學 | 電漿系統及混合電漿與水霧的方法 |
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JP2008028231A (ja) | 2006-07-24 | 2008-02-07 | Furukawa Electric Co Ltd:The | 半導体膜形成装置、半導体膜形成方法、及び半導体膜付き線条体 |
JP2008504442A (ja) | 2004-06-28 | 2008-02-14 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィック(セーエヌエールエス) | 電気流体力学、特に後放電噴霧によって、薄膜蒸着する方法及び装置 |
JP2008073986A (ja) | 2006-09-22 | 2008-04-03 | Dainippon Printing Co Ltd | ガスバリア性積層フィルム |
JP2011162877A (ja) | 2010-02-08 | 2011-08-25 | Sungkyunkwan Univ Foundation For Corporate Collaboration | グラフィンロールトロールコーティング装置及びこれを用いたグラフィンロールトロールコーティング方法 |
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US20070212486A1 (en) * | 2005-05-20 | 2007-09-13 | Dinega Dmitry P | Plasma Enhanced Chemical Vapor Deposition of Metal Oxide |
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JP2008504442A (ja) | 2004-06-28 | 2008-02-14 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィック(セーエヌエールエス) | 電気流体力学、特に後放電噴霧によって、薄膜蒸着する方法及び装置 |
JP2008028231A (ja) | 2006-07-24 | 2008-02-07 | Furukawa Electric Co Ltd:The | 半導体膜形成装置、半導体膜形成方法、及び半導体膜付き線条体 |
JP2008073986A (ja) | 2006-09-22 | 2008-04-03 | Dainippon Printing Co Ltd | ガスバリア性積層フィルム |
JP2011162877A (ja) | 2010-02-08 | 2011-08-25 | Sungkyunkwan Univ Foundation For Corporate Collaboration | グラフィンロールトロールコーティング装置及びこれを用いたグラフィンロールトロールコーティング方法 |
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EP3513423A1 (en) | 2019-07-24 |
LU93221B1 (en) | 2018-04-11 |
US20190259583A1 (en) | 2019-08-22 |
WO2018050758A1 (en) | 2018-03-22 |
PL3513423T3 (pl) | 2021-07-19 |
EP3513423B1 (en) | 2020-11-18 |
JP2019533078A (ja) | 2019-11-14 |
ES2854982T3 (es) | 2021-09-23 |
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