JP7252933B2 - Vapor deposition apparatus, film forming apparatus, film forming method, and electronic device manufacturing method - Google Patents

Description

The present invention relates to a vapor deposition apparatus, a film forming apparatus, a film forming method, and an electronic device manufacturing method.

2. Description of the Related Art In manufacturing an organic EL display or the like, a vapor deposition substance such as an organic material or a metal material is vapor-deposited on a substrate using a mask. For the purpose of controlling the film thickness of the vapor deposition material deposited on the substrate, there has been proposed a vapor deposition apparatus provided with a monitoring device for monitoring the discharge state of the vapor deposition material from the vapor deposition source (Patent Documents 1 and 2).

JP 2019-137877 A JP 2019-99870 A

The monitoring device is affected by the heat of the vapor deposition source, and the monitoring accuracy may deteriorate. For example, in a monitoring device equipped with a crystal oscillator, the emission state is monitored by utilizing the fact that the frequency changes depending on the amount of deposition material adhering to the crystal oscillator. A crystal oscillator changes its vibration characteristics due to its temperature change, and the correlation between the change in the frequency and the emission state fluctuates. Therefore, when the temperature of the crystal oscillator rises due to the heat of the vapor deposition source, the monitoring accuracy decreases.

The present invention provides a technology capable of cooling a deposition source monitoring device.

According to the invention,
a deposition source that releases a deposition material onto a substrate;
monitoring means for monitoring the release state of the vapor deposition material from the vapor deposition source;
A vapor deposition apparatus comprising
a base member on which the monitoring means is mounted;
a wall member provided on the pedestal member so as to be interposed between the monitoring means and the deposition source, and having a window portion that exposes the monitoring means to the deposition source;
Each of the pedestal member and the wall member has a flow path through which a cooling medium flows,
A vapor deposition apparatus characterized by the following is provided.

ADVANTAGE OF THE INVENTION According to this invention, the technique which can cool the monitoring apparatus of a vapor deposition source can be provided.

1 is a schematic diagram of a film forming apparatus according to one embodiment of the present invention; FIG. (A) and (B) are operation|movement explanatory drawing of the film-forming apparatus of FIG. The schematic of a vapor deposition apparatus. Sectional drawing of a drive unit. (A) is an explanatory diagram of a flow path, and (B) is a diagram showing a deformation mode of a flexible tube. 1 is a perspective view of a monitoring device and its peripheral structure; FIG. The perspective view which looked at the structure of the periphery of FIG. 6 from the other side. 1A is an overall view of an organic EL display device, and FIG. 1B is a view showing a cross-sectional structure of one pixel; FIG.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

<Overview of deposition equipment>
FIG. 1 is a schematic diagram of a film forming apparatus 1 according to one embodiment of the present invention. In each figure, arrows X and Y indicate horizontal directions perpendicular to each other, and arrow Z indicates a vertical direction. The film forming apparatus 1 includes a transport apparatus 2 and a plurality of vapor deposition apparatuses 3A and 3B (hereinafter referred to as vapor deposition apparatuses 3 when both are collectively referred to or not distinguished). A plurality of vapor deposition apparatuses 3A and 3B are arranged side by side in the X direction, and the transport apparatus 2 is arranged above these vapor deposition apparatuses 3A and 3B.

The transfer device 2 comprises a transfer chamber 20 internally forming a transfer chamber 20c which is maintained under vacuum during use. A carry-in port 20a is provided at one end of the transfer chamber 20 in the X direction, and a carry-out port 20b is provided at the other end. It is carried out to the outside from the exit 20b. A plurality of transport rollers 21 arranged in the X direction are provided in the transport chamber 20c. The rows of the conveying rollers 21 are arranged in two rows spaced apart in the Y direction. Each conveying roller 21 rotates around a rotation axis in the Y direction. An object to be conveyed is placed on two rows of conveying rollers 21 at both ends in the Y direction, and is conveyed horizontally in the X direction by the rotation of the conveying rollers 21 . In this embodiment, a roller mechanism is used as a transport mechanism for the object to be processed, but other types of transport mechanisms such as magnetic levitation transport may be used.

The vapor deposition apparatus 3 comprises a source chamber 5 forming an interior space 3a which is maintained under vacuum during use. The source chamber 5 has a box shape with an opening 3b formed at the top, and the transfer chamber 20c communicates with the internal space 3a through the opening 3b. The vapor deposition device 3 includes a vapor deposition source 6 that emits a vapor deposition material upward. The vapor deposition source 6 of this embodiment is a so-called line source, and extends in a direction (Y direction orthogonal to the transport direction in this embodiment) that intersects the transport direction (X direction) of the object to be processed by the transport device 2. It is The vapor deposition source 6 includes a crucible containing the raw material of the vapor deposition substance, a heater for heating the crucible, and the like, and heats the raw material and discharges the vapor of the raw material to the transfer chamber 20c.

The vapor deposition device 3 includes a shutter 7 and a rotating unit 8 that rotates the shutter 7 . The rotating unit 8 rotates the shutter 7 on a moving track including a position between the vapor deposition source 6 and the object to be processed transported in the transport chamber 20c. The movement trajectory is the path along which the shutter 7 moves, and is typically a circular trajectory. Sometimes it becomes In the case of this embodiment, the shutter 7 extends along the extension direction of the vapor deposition source 6 (the Y direction in this embodiment), and the rotation unit 8 rotates along the extension direction of the vapor deposition source 6. The shutter 7 is rotated around the center of movement (in this embodiment, the center of rotation in the Y direction). In the case of this embodiment, two sets of shutters 7 and rotating units 8 are provided for one vapor deposition source 6 . The two sets of shutters 7 and rotating units 8 are spaced apart in a direction intersecting the extension direction of the vapor deposition source 6 (in this embodiment, the X direction perpendicular to the extension direction). By opening and closing the discharge port of the vapor deposition source 6 with respect to the transfer chamber 20c with the two shutters 7, it is possible to regulate the discharge of the vapor deposition material to the transfer chamber 20c and the incident angle.

The vapor deposition device 3 is also provided with a monitoring device 9 for monitoring the discharge state of the vapor deposition material from the vapor deposition source 6 . An anti-adhesion plate 4 is provided above the vapor deposition source 6 and around the shutter 7 to prevent the vapor deposition material from adhering to the surroundings. The anti-adhesion plate 4 has a square tube shape with an open top and bottom, and is arranged from the internal space 3a to the transfer chamber 20c.

2A and 2B are explanatory diagrams showing an example of the operation of the film forming apparatus 1. FIG. The film forming apparatus 1 is an in-line type capable of executing a film forming method in which a vapor deposition apparatus 3 vapor-deposits a vapor deposition material onto a process object (a vapor deposition process) while transporting the object to be processed by a transport apparatus 2 (transport process). It is a film forming apparatus. The film forming apparatus 1 is a method for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), and optical members. It is applicable to manufacturing equipment that performs. 2A and 2B illustrate a substrate 10 as an object to be processed. The substrate 10 is transported together with the mask 11, and the deposition material is deposited on the substrate 10 through the mask 11 positioned below the substrate 10, thereby forming a thin film of the deposition material in a predetermined pattern on the substrate 100. The substrate 10 is, for example, a plate material made of a material such as glass, resin, or metal, and the deposition material is a material such as an organic material or an inorganic material (metal, metal oxide, etc.).

In this embodiment, a plurality of vapor deposition apparatuses 3A and 3B are arranged in the transport direction of the substrate 10 . When different types of deposition materials are emitted from the deposition apparatuses 3A and 3B, different deposition materials can be deposited on the substrate 10 successively. In addition, the number of vapor deposition apparatuses 3 is not limited to two, and may be one or three or more.

FIG. 2A schematically shows a state in which the shutter 7 of the vapor deposition device 3A is open and the vapor deposition material 12 is discharged onto the substrate 10 positioned above the vapor deposition device 3A. In FIG. 2A, the shutter 7 of the vapor deposition apparatus 3B is closed, and the shutter 7 is positioned between the vapor deposition source 6 and the substrate 10 being transported in the transport chamber 20c (however, in FIG. 2(A), the substrate 10 does not exist above the vapor deposition device 3B). The vapor deposition material is restricted from reaching the transfer chamber 20c from the vapor deposition source 6 of the vapor deposition apparatus 3B.

FIG. 2B schematically shows a state in which the substrate 10 deposited with the vapor deposition material by the vapor deposition device 3A reaches above the vapor deposition device 3B. The shutter 7 of the vapor deposition device 3B is open, and the vapor deposition material 12 is discharged onto the substrate 10 positioned above the vapor deposition device 3B. In FIG. 2B, the shutter 7 of the vapor deposition apparatus 3A is closed, and the shutter 7 is positioned between the vapor deposition source 6 and the substrate 10 being transported in the transport chamber 20c (however, in FIG. 2(B), the substrate 10 does not exist above the vapor deposition apparatus 3A). The vapor deposition material is restricted from reaching the transfer chamber 20c from the vapor deposition source 6 of the vapor deposition apparatus 3A.

As described above, in this embodiment, the vapor deposition material can be continuously vapor-deposited on the substrate 10 by the plurality of vapor deposition apparatuses 3A and 3B. In the examples of FIGS. 2(A) and 2(B), as the operation of the shutter 7, the opening and closing of the shutter 7 release and block the vapor deposition material from the vapor deposition source 6 to the transfer chamber 20c. However, the operation of the shutters 7 is not limited to this, and by setting the opening degree of the two shutters 7 to an intermediate opening degree, or by positioning one of the two shutters 7 in the open position and the other in the closed position, it is possible to It is also possible to regulate the emission range and control the amount of deposition material deposited on the substrate 10 per unit time and the angle of incidence of the deposition material on the substrate 10 .

<Shutter and rotating unit>
The structures of the shutter 7 and the rotating unit 8 will be described with reference to FIGS. 3 to 5B in addition to FIGS. 1 to 2B. Refer mainly to FIG. FIG. 3 is a schematic diagram showing the internal structure of the vapor deposition apparatus 3, and corresponds to a cross-sectional view taken along the line AA of FIG. 2(A). The rotating unit 8 includes a pair of drive units DU1 and DU2 (hereinafter collectively referred to as drive unit DU, or when not distinguished) and a support member 30 supported by the drive units DU1 and DU2. In addition, the shutter 7 is rotated around the rotation center line AL in the direction in which the vapor deposition source 6 extends (the Y direction in this embodiment). By rotating the shutter 7, the opening and closing operation of the vapor deposition source 6 can be performed in a narrow space surrounded by the anti-adhesion plate 4 as compared with the configuration in which the shutter 7 is moved in parallel.

The support member 30 is a member for supporting the shutter 7, and includes a mounting portion 31 extending along the extending direction of the vapor deposition source 6 (the Y direction in this embodiment) and each end of the mounting portion 31 in the extending direction. and a pair of arm portions 32 fixed to the portion. The mounting portion 31 is configured by a plate-like member having a roof-shaped cross section, and is mounted on a pair of arm portions 32 spaced apart in the longitudinal direction thereof. The shutter 7 is replaceably attached to the attachment portion 31 by a fixing structure (not shown) such as a bolt fastening structure. When the vapor deposition device 3 is used, the shutter 7 may be deteriorated due to adhesion of vapor deposition material or the influence of heat, and may have a shorter life than the rotating unit 8 . Since the shutter 7 is replaceable, the rotation unit 8 can be used for a longer period of time than when the rotation unit 8 and the shutter 7 are inseparable.

As shown in FIG. 5A and the like, the shutter 7 is mounted inside the mounting portion 31 in the radial direction R of the rotation center line AL. Since the shutter 7 is interposed between the mounting portion 31 and the vapor deposition source 6, it is possible to reduce the adhesion of the vapor deposition material to the mounting portion 31 and the effects of heat, thereby extending the life of the mounting portion 31. FIG. Further, in the case of the present embodiment, the cross-sectional shape of the shutter 7 in the plane perpendicular to the rotation center line AL (XZ plane cross-sectional shape) is the same as that of the rotation center line AL, as shown in FIG. It has an arcuate cross-sectional shape that is convex outward in the radial direction R. In other words, the shutter 7 has a shell shape with a curved surface that is convex in the direction away from the vapor deposition source 6 . Compared to the configuration in which the shutter 7 has a flat plate shape, the shutter 7 of the present embodiment does not interfere with the attachment-preventing plate 4 in a narrow space surrounded by the attachment-preventing plate 4, and the rotation range (movement locus length) thereof can be adjusted. can be taken large. In the case of this embodiment, the cross-sectional shape of the shutter 7 has an arc shape concentric with the rotation center line AL. may be arc-shaped.

Each arm portion 32 is configured by a plate-shaped member extending in a direction intersecting the rotation axis direction (Y direction) and extending in a direction along the XZ plane, that is, in a radial direction R of the rotation center line AL. It is The mounting portion 31 is connected to one end of the arm portion 32, and the rotating shaft 33 of the drive unit DU is connected to the other end. The length of the arm part 32 is set so that the moving track of the shutter 7 includes the position between the vapor deposition source 6 and the object to be processed transported in the transport chamber 20c.

The shutter 7 is exposed to heat from the vapor deposition source 6 . In particular, when the vapor deposition material is a metal material, the temperature of the vapor deposition source 6 is high and the temperature of the shutter 7 tends to be high. When the temperature of the shutter 7 becomes high, the vapor deposition material adhering to the shutter 7 may be released from the shutter 7 . Cooling of the shutter 7 is therefore desired. In the case of this embodiment, the support member 30 is cooled by circulating the cooling medium through the support member 30, thereby indirectly cooling the shutter 7. FIG. The cooling medium is, for example, cooling water. The flow path of the cooling medium will be described with reference to FIGS. 3 and 5A. Although FIG. 5A shows the arm portion 32 connected to the drive unit DU1, the same applies to the arm portion 32 connected to the drive unit DU2.

A flow path 31 a is formed inside the attachment portion 31 of the support member 30 . In the case of a large-sized shutter 7, its length in the longitudinal direction (the Y direction in this embodiment) is long, and as a result, the length in the longitudinal direction (the Y direction in this embodiment) of the mounting portion 31 is also long, reaching several meters. may reach. The flow path of the cooling medium may be a flow path that penetrates the mounting portion 31 in the longitudinal direction, but this may cause a large temperature difference in the longitudinal direction of the mounting portion 31 . In this embodiment, two independent flow paths 31a are formed in the attachment portion 31 . Each flow path 31a extends from one end in the longitudinal direction of the mounting portion 31 to an intermediate portion in the longitudinal direction of the mounting portion 31 (near the central portion CL in this embodiment), and is folded back at the folded portion 31b to reach one end. It has a back U shape. By dividing the attachment portion 31 in the longitudinal direction to form the flow path 31a, the attachment portion 31 can be cooled more uniformly in the longitudinal direction.

As shown in FIG. 5A, the arm portion 32 is internally formed with channels 32a and 32b communicating with the channel 31a. One of the flow paths 32a and 32b is a flow path for supplying the cooling medium, and the other flow path is a flow path for discharging the cooling medium.

The configuration of the drive unit DU will be described mainly with reference to FIGS. 3 and 4. FIG. FIG. 4 is a sectional view around the drive unit DU1, and mainly shows the structure of the drive unit DU1. The drive unit DU2 has the same structure as the drive unit DU1.

The drive unit DU includes a rotary shaft 33 , bearings 34 , drive source 36 and bearings 37 . The rotation shaft 33 is on the rotation center line AL and forms the rotation center of the shutter 7 . The rotation shafts 33 of the drive units DU1 and DU2 are arranged coaxially (on the common rotation center line AL). The drive units DU<b>1 and DU<b>2 are arranged on the side of the deposition source 6 in the direction in which the deposition source 6 extends (the Y direction in this embodiment). In other words, the deposition source 6 is located between the drive units DU1 and DU2 in the Y direction. Therefore, the rotation shafts 33 of the drive units DU1 and DU2 are spaced apart in the extending direction of the deposition source 6 (the Y direction in this embodiment) and coaxially with respect to the deposition source 6 on the side of the extending direction. are placed.

The rotating shaft 33 is a hollow rotating shaft having an internal space 33a (passing through the rotating shaft 33 in this embodiment) extending in its axial direction (Y direction in this embodiment). Both ends are open. The rotating shaft 33 of this embodiment is configured by connecting a plurality of members, and includes a shaft member 331 supported by the bearing 34 and a shaft member 332 passing through the drive source 36 . A bearing 34 is supported on the wall of the source chamber 5 via a stem 35 . The bearing 34 includes a hollow case 34 a and ball bearings 34 b supported on both ends of the case 34 a in the axial direction of the rotating shaft 33 . The shaft member 331 is fitted to the inner ring of the ball bearing 34b.

The drive source 36 applies rotational force to the rotating shaft 33 . In this embodiment, the drive source 36 is a hollow motor, and the shaft member 332 is provided integrally with its rotor. The drive source 36 is arranged outside the source chamber 5 , and its flange portion 36 a is fixed to the wall portion of the source chamber 5 . Although a hollow motor is used as the driving source 36 in this embodiment, the present invention is not limited to this. For example, the drive source may be a normal motor separated from the rotating shaft 33, and the driving force of the motor may be transmitted to the rotating shaft 33 by a transmission mechanism such as a gear device or a belt transmission mechanism.

The bearing 37 is a bearing that supports the end of the rotating shaft 33 . The bearing 37 communicates with the internal space 33a of the rotary shaft 33 and is supported by the hollow main body 37a having an internal space 37c extending in the axial direction of the rotary shaft 33 and the main body 37a so as to be rotatable about the rotation center line AL. disk 37b. The end of the rotating shaft 33 is connected to the disk 37b. The bearing 37 is supported by a flange portion 36 a of the drive source 36 via a plurality of connecting members 38 .

The arm portion 32 of the support member 30 is connected to the rotating shaft 33 so as to close the opening at the end of the rotating shaft 33 . By synchronously driving the drive sources 36 of the drive units DU1 and DU2, the support member 30 rotates around the rotation center line AL and the shutter 7 rotates. By providing the drive units DU on both sides of the support member 30 in the longitudinal direction, the support member 30 can be operated more stably than in a configuration in which the support member 30 is rotated in a cantilever state by one drive unit DU.

A configuration for circulating the cooling medium in the support member 30 will be described with reference to FIG. The film forming apparatus 1 includes a circulation device 50 that circulates a cooling medium. The circulation device 50 includes, for example, a tank containing a cooling medium, a pump for pumping the cooling medium, a heat exchanger for cooling the cooling medium, and the like. The circulation device 50 and the flow paths 32 a and 32 b of the arm portion 32 are connected via a pipe 40 . The pipe 40 includes a metal pipe 42a, a flexible tube 41a, and a connection portion 43a connecting these as pipes on the cooling medium supply side. Further, the pipe 40 includes a metal pipe 42b, a flexible tube 41b, and a connection portion 43b connecting these as pipes on the cooling medium discharge side (return side). The metal pipes 42a, 42b and the connecting portions 43a, 43b are located outside the drive unit DU, and the connecting portions 43a, 43b are fixed to stays (not shown).

Flexible tubes 41a and 41b are, for example, nylon tubes or polyurethane tubes. Connecting portions 39a and 39b between the flexible tubes 41a and 41b and the flow paths 32a and 32b are provided in the arm portion 32 within the internal space 33a. The flexible tube 41a is connected to the connecting portion 39a, and the flexible tube 41b is connected to the connecting portion 39b. The flexible tubes 41a and 41b extend from the connection portions 39a and 39b in the axial direction of the rotating shaft 33, and in the case of the present embodiment, extend outside the opening of the end of the rotating shaft 33 on the bearing 37 side. It is extended and further extended to the outside of the bearing 37 and connected to the connecting portions 43a and 43b.

The range in which the rotating shaft 33 rotates is set within a range of 360 degrees or less. In the case of this embodiment, when the shutter 7 rotates, the rotating shaft 33 rotates about 60 degrees. Among the pipes 40, the flexible tubes 41a and 41b passing through the inside of the rotating shaft 33 are immobile at the ends on the side of the connecting portions 43a and 43b, while the ends on the side of the arm portion 32 are displaced. However, since the flexible tubes 41a and 41b are flexible, they are elastically deformed to absorb the misalignment between the ends. FIG. 5B is an explanatory diagram thereof. As shown in the figure, the flexible tubes 41a and 41b are twisted when the end of the arm section side 32 is displaced by the rotation of the rotating shaft 33, but they are not broken due to the flexibility. , the rotating shaft 33 returns to its original position, thereby restoring the initial state. In the present embodiment, the piping inside the rotating shaft 33 is configured by the flexible tubes 41a and 41b in this manner, and displacement between the ends of the tubes due to the rotation of the rotating shaft 33 can be absorbed by the deformation of the tubes. can. A rotary joint is known as a structure for passing a cooling medium through a rotating part, but it is expensive. However, in this embodiment, a flexible tube is used to provide a flow path structure for a cooling medium at a relatively low cost. . In addition, unlike rotary joints, there is no sliding member that seals each other, and the twisting of the flexible tubes 41a and 41b is used. can be prevented more reliably.

When the displacement between the ends of the tubes due to the rotation of the rotating shaft 33 is absorbed by the deformation of the flexible tubes 41a and 41b as in this embodiment, the longer the flexible tubes 41a and 41b, the greater the displacement. It can correspond to the amount of rotation. The bearing 34 of this embodiment has ball bearings 34b spaced apart in the Y direction and has a relatively long overall length. This structure of the bearing 34 not only enhances the rotational stability of the rotating shaft 33, but is also advantageous in terms of lengthening the flexible tubes 41a and 41b by lengthening the rotating shaft 33. FIG. Further, the connecting portions 43a and 43b may be positioned inside the rotary shaft 33, but by positioning them outside as in the present embodiment, the workability of the piping work is improved and the flexibility is increased. It is also advantageous in that the sex tubes 41a and 41b can be elongated. In addition, the fact that the flexible tubes 41a and 41b pass through the bearing 37 and extend to the outside is also advantageous in terms of lengthening them.

<Monitoring device>
The monitoring device 9 will be described with reference to FIGS. 3 and 4. FIG. The monitoring device 9 is mounted on a pedestal member 13 , and the pedestal member 13 is supported by a column 15 erected on the bottom of the source chamber 5 . In the case of this embodiment, two monitoring devices 9 are mounted on one pedestal member 13 . The monitoring device 9 is exchangeably fixed to the base member 13 via the mounting member 9c.

A wall member 14 is provided at the end of the pedestal member 13 on the deposition source 6 side, and the monitoring device 9 is positioned behind the wall member 14 . The pedestal member 13, the wall member 14, and the monitoring device 9 are arranged on the side of the deposition source 6 in the direction in which the deposition source 6 extends (the Y direction in this embodiment). 6 are arranged on both sides. Such an arrangement allows the monitoring device 9 to monitor the discharge state without affecting the discharge of the vapor deposition material from the vapor deposition source 6 to the substrate 10 .

The monitoring device 9 is also spaced apart from the rotary shaft 33 laterally in the radial direction R with respect to the rotary shaft 33 , particularly lateral to the bearing 34 . Empty space around the rotating shaft 33 can be effectively utilized as a space for arranging the monitoring device 9 .

The monitoring device 9 of this embodiment includes a crystal oscillator 9c as a film thickness sensor inside a case 9a. The vapor deposition material discharged from the vapor deposition source 6 is introduced into the crystal oscillator 9c through the introduction portion 9b formed in the case 9a and adheres thereto. The frequency of the crystal oscillator 9c fluctuates depending on the deposition amount of the deposition material. By monitoring the frequency of the crystal oscillator 9c, the film thickness of the deposition material deposited on the substrate 10 can be monitored.

The configurations of the base member 13 and the wall member 14 will be further described with reference to FIGS. 6 and 7. FIG. FIG. 6 is a perspective view of the monitor 9 and its peripheral base member 13 and wall member 14, and FIG. 7 is a perspective view of the base member 13 and wall member 14 viewed from the opposite side.

The pedestal member 13 is a plate-like member and is supported by a support 15 in a horizontal posture. The wall member 14 is a plate-like member and is supported by the base member 13 in a vertical posture. The base member 13 and the wall member 14 are L-shaped as a whole. The wall member 14 is provided on the pedestal member 13 so as to be interposed between the monitoring device 9 and the deposition source 6 , and has a window portion 14 a through which the monitoring device 9 is exposed to the deposition source 6 . Two windows 14a are formed corresponding to the two monitoring devices 9, and in the case of this embodiment, they are notch-shaped windows with an open upper side. The introduction portion 9b of the monitoring device 9 is exposed to the vapor deposition source 6 through the window portion 14a.

The vibration characteristics of the crystal oscillator 9c change due to changes in its temperature, and the correlation between the change in frequency and the discharge state of the vapor deposition material from the vapor deposition source 6 fluctuates. Therefore, when the temperature of the crystal oscillator 9c rises due to the heat of the vapor deposition source 6, the monitoring accuracy decreases. The wall member 14 serves as a cooling plate interposed between the monitoring device 9 and the deposition source 6 to reduce heat radiation from the deposition source 6 to the monitoring device 9 in addition to suppressing scattering of the deposition material to the surroundings. It also has functions.

In this embodiment, the monitoring device 9 is indirectly cooled by circulating the cooling medium through the base member 13 and the wall member 14 . The cooling performance of the monitoring device 9 can be improved.

The base member 13 has connecting portions 13b and 13c to which the pipes 44 and 45 are connected. The connecting portions 13b and 13c are formed at one end and the other end of the base member 13 in the X direction. The pipes 44 and 45 are connected to, for example, the circulation device 50. The pipe 44 is the pipe on the supply side of the cooling medium, and the pipe 45 is the pipe on the discharge side (return side) of the cooling medium. A flow path 13d through which a cooling medium flows is formed inside the base member 13, and the cooling medium flows through the flow path 13d from the connection portion 13b toward the connection portion 13c. The base member 13 is thereby cooled.

Further, the wall member 14 also has a cooling medium flow path 14b formed therein. The flow path 14b is a flow path branched from the flow path 13d of the base member 13, and these flow paths 13d and 14b communicate at a communication point 14c. The communication point 14c is located at the connecting portion between the wall member 14 and the base member 13. As shown in FIG. Since the flow path 13d and the flow path 14b are in communication with each other, the common pipes 44 and 45 allow the cooling medium to flow through the base member 13 and the wall member .

<Electronic device>
Next, an example of an electronic device will be described. The configuration of an organic EL display device will be exemplified below as an example of the electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 8A is an overall view of an organic EL display device 500, and FIG. 8B is a view showing a cross-sectional structure of one pixel.

As shown in FIG. 8A, in a display region 51 of an organic EL display device 500, a plurality of pixels 52 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

The term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51. FIG. In the case of a color organic EL display device, a pixel 52 is configured by combining a plurality of sub-pixels of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often composed of a combination of three types of sub-pixels, a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. Sub-pixels constituting the pixel 52 may be a combination of four types of sub-pixels, for example, a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

FIG. 8B is a schematic partial cross-sectional view taken along the line AB of FIG. 8A. The pixel 52 includes, on a substrate 53, a first electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second layer. It has a plurality of sub-pixels composed of organic EL elements each having an electrode (cathode) 58 . Among these layers, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively.

Also, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 8B, the hole transport layer 55 is formed as a common layer over a plurality of sub-pixel regions, and the red layer 56R, the green layer 56G, and the blue layer 56B are separated for each sub-pixel region. The electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

In addition, an insulating layer 59 is provided between the first electrodes 54 in order to prevent short-circuiting between the adjacent first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

Although the hole-transporting layer 55 and the electron-transporting layer 57 are shown as one layer in FIG. 8B, they may be formed of multiple layers having a hole-blocking layer and an electron-blocking layer depending on the structure of the organic EL display element. may be In addition, an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is formed between the first electrode 54 and the hole transport layer 55 . A hole injection layer having a Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57 as well.

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed of a single light-emitting layer, or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer being a red light emitting layer, and the lower layer being a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light-emitting layer and the upper layer may be formed of an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby improving the color purity of the light-emitting element.

Although an example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G and the blue layer 56B. Also, the number of layers to be laminated may be two or more. Furthermore, layers of different materials may be laminated such as the light emitting layer and the electron blocking layer, or layers of the same material may be laminated such as laminating two or more light emitting layers.

In the manufacture of such an electronic device, the film forming apparatus 1 described above can be applied. and C. depositing the at least one layer.

<Other embodiments>
Although two shutters 7 are provided for one vapor deposition source 6 in the above embodiment, one shutter 7 may be provided for one vapor deposition source 6 . Also, although two drive units DU1 and DU2 are provided for one support member 30, one drive unit DU may be provided for one support member 30. FIG.

The deposition source 6 may be a spot source other than a line source. In the above embodiment, the rotation center line AL of the shutter 7 is in the horizontal direction (Y direction), but it may be in the vertical direction (Z direction). In this case, the shutter 7 may be a plate-shaped shutter that is supported in a horizontal position, and the support member 30 may be configured such that the mounting portion 31 without the arm portion 32 is connected to the rotating shaft 33 . This configuration is advantageous when the deposition source 6 is a spot source.

The cooling medium may not be circulated, and the discharged cooling medium may be discarded without being supplied to the support member 30 or the like again.

The flow path 31a of the mounting portion 31 may penetrate from one longitudinal end to the other end of the mounting portion 31 without being folded in the middle. In this case, the flow path in the arm portion 32 becomes one, and the cooling medium can be circulated in one direction in the order of the drive unit DU1→arm portion 32→mounting portion 31→arm portion 32→drive unit DU2. . Only the flexible tube 41a on the supply side is arranged in the rotary shaft 33 of the drive unit DU1, and only the flexible tube 41b on the discharge side is arranged in the rotary shaft 33 of the drive unit DU2.

The cooling structure of the pedestal member 13 and the wall member 14 is not limited to the vapor deposition apparatus 3 of the above embodiment, and can be applied to various vapor deposition apparatuses.

The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to make public the scope of the invention.

DESCRIPTION OF SYMBOLS 1 film-forming apparatus, 2 conveying apparatus, 3 vapor deposition apparatus, 9 monitoring apparatus

Claims (8)

a deposition source that releases a deposition material onto a substrate;
monitoring means for monitoring the release state of the vapor deposition material from the vapor deposition source;
A vapor deposition apparatus comprising
a base member on which the monitoring means is mounted;
a wall member provided on the pedestal member so as to be interposed between the monitoring means and the deposition source, and having a window portion that exposes the monitoring means to the deposition source;
Each of the pedestal member and the wall member has a flow path through which a cooling medium flows,
A vapor deposition apparatus characterized by: The vapor deposition apparatus according to claim 1 ,
The flow path of the base member and the flow path of the wall member are in communication at a connecting portion between the base member and the wall member.
A vapor deposition apparatus characterized by: The vapor deposition apparatus according to claim 1 or claim 2 ,
The monitoring means comprises a crystal oscillator arranged so that the vapor deposition material emitted from the vapor deposition source adheres to it,
A vapor deposition apparatus characterized by: a transport device for transporting the substrate;
a vapor deposition device for vapor-depositing a vapor deposition material on the substrate;
An in-line film deposition apparatus that performs vapor deposition while transporting the substrate,
The vapor deposition device is
a vapor deposition source extending in a direction intersecting the transport direction of the substrate and emitting a vapor deposition material onto the substrate;
monitoring means for monitoring the release state of the vapor deposition material from the vapor deposition source;
a base member on which the monitoring means is mounted;
a wall member provided on the pedestal member so as to be interposed between the monitoring means and the deposition source, and having a window portion that exposes the monitoring means to the deposition source;
Each of the pedestal member and the wall member has a flow path through which a cooling medium flows,
A film forming apparatus characterized by: The film forming apparatus according to claim 4 ,
The pedestal member and the monitoring means are arranged on the side of the deposition source in the direction in which the deposition source extends,
A film forming apparatus characterized by: The film forming apparatus according to claim 4 or 5 ,
The vapor deposition device is
a shutter;
rotating means for rotating the shutter on a movement track including a position between the deposition source and the substrate;
a rotating shaft forming a rotation center of the shutter along the extending direction of the deposition source;
a support member connected to the rotating shaft and supporting the shutter;
including
The rotating shaft is arranged on the side of the deposition source in the extending direction of the deposition source,
The pedestal member and the monitoring means are arranged radially laterally of the rotating shaft with respect to the rotating shaft,
A film forming apparatus characterized by: A film forming method using the film forming apparatus according to any one of claims 4 to 6 ,
a transporting step of transporting the substrate by the transporting device;
and a vapor deposition step of vapor-depositing the substrate being conveyed by the vapor deposition apparatus. A method for manufacturing an electronic device using the film forming apparatus according to any one of claims 4 to 6 ,
a transporting step of transporting the substrate by the transporting device;
and a vapor deposition step of vapor-depositing the transported substrate with the vapor deposition apparatus.

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