JP7249218B2 - Grinding equipment - Google Patents

Description

The present invention relates to grinding equipment.

The grinding apparatus grinds the workpiece with a grinding wheel while measuring the thickness of the workpiece held on the holding surface of the chuck table. The grinding device includes an outer height gauge for measuring the height of the holding surface and an inner height gauge for measuring the height of the upper surface of the workpiece held on the holding surface. The difference from the measured value is obtained as the thickness of the workpiece including the protective tape attached to the workpiece, and the thickness is ground until the thickness reaches a predetermined thickness.
In recent years, sapphire and SiC are often ground as workpieces. Sapphire and SiC are hard materials, and if the grinding wheel is strongly pressed and ground, the protective tape attached to the workpiece will be crushed, so the protective tape will become thin and the workpiece will be finished thick. There is a problem. Therefore, instead of fixing the workpiece to the protective tape, as shown in Patent Document 1, the workpiece is fixed to the glass base with wax and then ground. In addition, when the workpiece is transported using the transport unit, the ground surface of the workpiece may be scratched when it is held. To prevent this, the ground surface should not be held. In order to convey the workpiece, as shown in Patent Document 2, a tape may be used to integrate the workpiece and the ring frame to grind the workpiece.

JP 2017-92412 A JP 2019-57618 A

As described above, when grinding a workpiece fixed to a glass base and grinding a workpiece supported by a ring frame, different types of chuck tables are used. The position of the measurement area with which the outer height gauge contacts to measure the height of the holding surface of the chuck table differs in the radial direction of the chuck table.
Therefore, when switching between the grinding of the workpiece fixed on the glass base and the grinding of the workpiece supported by the ring frame, the outer height gauge is adjusted according to the position of the measurement area of each chuck table. The need to adjust the position prevents efficient grinding.
That is, there is a problem of performing the grinding of the workpiece more efficiently when performing the grinding of the workpiece fixed to the glass base and the grinding of the workpiece supported by the ring frame. .

The present invention comprises holding means having a holding surface for holding a workpiece, grinding means for grinding the workpiece held by the holding means with a grinding wheel, and the upper surface of the workpiece ground with the grinding wheel. and a holding surface height measuring means for measuring the height of the upper surface of the workpiece held on the holding surface by bringing the probe into contact with the holding surface, and holding surface height measuring means for measuring the height of the holding surface by bringing the probe into contact with the holding surface. and a difference between the height of the holding surface measured by the holding surface height measuring means and the height of the upper surface of the workpiece measured by the upper surface height measuring means is measured by the workpiece. wherein the holding means comprises a base on which two types of chuck tables, a first chuck table and a second chuck table, are exchangeably mounted; The first chuck table sucks and holds the substrate or the protective tape of the first work set in which the substrate is adhered to the lower surface of the workpiece or the second work set in which the protective tape is adhered to the lower surface of the workpiece. a first holding surface connected to the first holding surface outside the outer periphery of the first holding surface, having the same height as the first holding surface, and having a height measured by the holding surface height measuring means; an annular first measurement surface to be measured, the second chuck table applying tape to a ring frame having an opening for receiving the workpiece and the workpiece positioned in the opening. a second holding surface which is formed to have approximately the same diameter as the workpiece of the third work set integrated by the third work set and which sucks and holds the workpiece through the tape; an annular second measurement surface whose height is measured by the holding surface height measuring means; an annular recess formed between the second holding surface and the second measurement surface; a frame holding part disposed in the recess of the ring frame and holding the ring frame so that the upper surface of the ring frame is lower than the second holding surface, wherein the first measurement surface and the second measurement surface are The holding surface height measuring means includes a first probe in contact with the first measuring surface, a first arm to which the first probe is connected at one end, and the second arm. a second probe in contact with the measurement surface; a second arm having one end connected to the second probe; and the second probe when the first probe is in contact with the first measurement surface. When the second probe is in contact with the second measurement surface so as not to contact the first measurement surface, the first probe is placed on the ring frame held by the frame holder. The other end of the first arm and the other end of the second arm are connected so as not to contact the second measurement surface, and the first arm and the second arm are bifurcated and supported. A grinding device comprising: a support for

When switching between grinding a work set in which the workpiece is fixed to the glass base and grinding a work set in which the workpiece is supported by the ring frame and the workpiece and the frame are integrated with tape. Furthermore, since there is no need to adjust the position of the outer height gauge, the amount of work required for each grinding process can be reduced, and the grinding process can be performed efficiently.

1 is a perspective view showing the entire grinding apparatus to which a first chuck table is attached; FIG. It is a perspective view showing the whole grinding device to which the second chuck table is mounted. FIG. 4 is a side cross-sectional view showing how the first work set or the second work set held on the first chuck table is ground; FIG. 11 is a cross-sectional view of the state of grinding the third work set held on the second chuck table, as seen from the side;

1 Configuration of Grinding Apparatus A grinding apparatus 1 shown in FIG. The configuration of the grinding apparatus 1 will be described below.

As shown in FIG. 1, the grinding device 1 includes a device base 10 extending in the Y-axis direction, and a column 11 erected on the device base 10 in the +Y direction.

As shown in FIG. 1, a holding means 2 for holding a workpiece W is provided on a device base 10 of the grinding device 1 . The holding means 2 includes a first chuck table 2A. The first chuck table 2A includes a suction portion 20, a suction portion 20 whose upper surface is a first holding surface 20A, and a frame 21 that supports the suction portion 20. and

What is held on the first chuck table 2A is either the first work set U1 configured by bonding the substrate S1 to the lower surface Wb of the workpiece W via an adhesive or the like, or the lower surface Wb of the workpiece W. In the first work set U1, the substrate S1, in the second work set U2, the protective tape S2, the first holding They are held by suction on the surface 20A. In either case, the upper surface Wa of the workpiece W is exposed.
The upper surface of the frame 21 is connected to the first holding surface 20A outside the outer periphery of the first holding surface 20A and forms an annular first measurement surface 21A having the same height as the first holding surface 20A. 21 A of 1st measurement surfaces are surfaces whose height is measured, in order to calculate the thickness of the to-be-processed object W. FIG.

The holding means 2 can replace the first chuck table 2A with the second chuck table 2B shown in FIG. The second chuck table 2B includes a suction portion 20 whose upper surface is the second holding surface 20B, and a frame 21 that supports the suction portion 20 .

A workpiece W3 held on the second chuck table 2B has a tape T attached to an annular ring frame F having an opening Fo for accommodating the workpiece W3 and to the workpiece W3 placed in the opening Fo. The tape T is suction-held on the second holding surface 20B in the integrated third work set U3. The upper surface Wa of the workpiece W is exposed while the tape T is held on the second holding surface 20B. The second holding surface 20B is formed to have substantially the same diameter as the workpiece W. As shown in FIG.
The upper surface of the frame 21 is an annular second measurement surface 21B, and the second measurement surface 21B is formed at the same height position as the second holding surface 20B. The second measurement surface 21B is a surface whose height is measured in order to calculate the thickness of the workpiece W. As shown in FIG. A recess 23 is formed between the second holding surface 20B and the second measuring surface 21B of the second chuck table 2B.
Note that the first measurement surface 21A and the second measurement surface 21B are formed at positions with different diameters. That is, the inner diameter of the first measurement surface 21A and the inner diameter of the second measurement surface 21B are different, and the outer diameter of the first measurement surface 21A and the outer diameter of the second measurement surface 21B are also different.

Grinding feed means 4 for supporting the grinding means 3 so as to move up and down is arranged on the side surface of the column 11 in the -Y direction.
The grinding means 3 includes a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 rotatably supporting the spindle 30, a spindle motor 32 rotating the spindle 30 about the rotating shaft 35, and the spindle 30. It has an annular mount 33 connected to the lower end thereof, and a grinding wheel 34 detachably attached to the lower surface of the mount 33 . The grinding wheel 34 includes a wheel base 341 and a plurality of substantially rectangular parallelepiped grinding wheels 340 annularly arranged on the lower surface of the wheel base 341. The lower surface of the grinding wheel 340 grinds the workpiece W. It is a ground surface 340a that

The grinding feed means 4 includes a ball screw 40 having a rotating shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and a rotating shaft 45 connected to the upper end of the ball screw 40. a Z-axis motor 42 for rotating the ball screw 40 by means of a motor 42; an elevating plate 43 having an internal nut screwed onto the ball screw 40 and having a side portion in sliding contact with the guide rail 41; 44.
When the ball screw 40 is driven by the Z-axis motor 42 and rotates about the rotary shaft 45, the elevator plate 43 is guided by the guide rail 41 and moves up and down in the Z-axis direction, and the holder moves up and down. The difference is that the grinding means 3 held by 44 moves in the Z-axis direction.

A thickness measuring means 5 for measuring the thickness of the workpiece W is arranged on the device base 10 . The thickness measuring means 5 includes an upper surface height measuring means 50 for measuring the height of the upper surface Wa of the workpiece W, and a holding surface height measuring means for measuring the height of the first measuring surface 21A or the second measuring surface 21B. 51.
The thickness measuring means 5 also includes a calculating means 52 for calculating the difference between the value measured by the upper surface height measuring means 50 and the value measured by the holding surface height measuring means 51 as the thickness of the workpiece W. .

The holding surface height measuring means 51 includes a first probe 510 brought into contact with the first measurement surface 21A, a first arm 511 connected to one end 511a of the first probe 510, and a second measurement surface 21B. A second probe 512, a second arm 513 to which the second probe 512 is connected to one end 513a, and a second arm 513b to which the other end 511b of the first arm 511 and the other end 513b of the second arm 513 are connected. A supporting portion 514 is provided to bifurcate and support the first arm 511 and the second arm 513 .

As shown in FIGS. 3 and 4, the holding means 2 has a base 22 on which two types of chuck tables, a first chuck table 2A and a second chuck table 2B, are exchangeably mounted. The first chuck table 2A and the second chuck table 2B are fixed on the base 22 by screws 220. As shown in FIG.

As shown in FIG. 4, the concave portion 23 is provided with a frame holding portion 26 that holds the ring frame F with the upper surface Fa of the ring frame F located at a position lower than the second holding surface 20B. The frame holding portion 26 has, for example, a magnet, and holds the ring frame F by magnetic force.

As shown in FIGS. 3 and 4, a suction source 27 is connected below the base 22 via a suction path 28 . For example, as shown in FIG. 3, when the first chuck table 2A is mounted on the base 22, the workpiece W is mounted on the first holding surface 20A of the first chuck table 2A. When the suction source 27 is operated, the suction source 27 exerts a suction force, the generated suction force is transmitted to the first holding surface 20A through the suction path 28, and the workpiece W is sucked to the first holding surface 20A. can hold.
As shown in FIG. 4, even when the second chuck table 2B is mounted on the base 22, the workpiece W is similarly placed on the second holding surface 20B of the second chuck table 2B. By operating the suction source 27 in this state, the workpiece W can be held by suction on the second holding surface 20B.

As shown in FIGS. 3 and 4, below the base 22, rotating means 24 for rotating the first chuck table 2A and the second chuck table 2B around a rotating shaft 25 is arranged.
As shown in FIGS. 3 and 4, the rotating means 24 is connected to a drive shaft 241 having an axis parallel to the Z-axis direction, a motor 242 for rotating the drive shaft 241, and the upper end of the drive shaft 241. a drive pulley 240, a transmission belt 243 wound around the drive pulley 240 to transmit the driving force of the drive pulley 240 to the driven pulley 244, a driven pulley 244 wound around the transmission belt 243 together with the drive pulley 240, and a driven pulley 240; It has a spindle 245 connected to a pulley 244 and a rotary joint 246 connected to the lower end of the spindle 245 .
When the drive shaft 241 is rotated using the motor 242 , the driving pulley 240 rotates, and the rotational force of the driving pulley 240 is transmitted to the driven pulley 244 by the transmission belt 243 to rotate the driven pulley 244 . When the driven pulley 244 rotates, the spindle 245 rotates about the rotating shaft 25, and the base 22 and the first chuck table 2A or the second chuck table 2B mounted on the base 22 rotate about the rotating shaft 25. and rotate.

Since the first measurement surface 21A shown in FIG. 3 has the same height as the first holding surface 20A, by measuring the height of the first measurement surface 21A using the holding surface height measuring means 51, the first The height of the holding surface 20A can be measured.
Similarly, since the second measurement surface 21B shown in FIG. 4 has the same height as the second holding surface 20B, the height of the second measurement surface 21B can be , the height of the second holding surface 20B can be measured.
As shown in FIG. 3, when the first probe 510 is in contact with the first measurement surface 21A, the second probe 512 is not in contact with the first measurement surface 21A, and as shown in FIG. , when the second probe 512 is in contact with the second measurement surface 21B, the first probe 510 is positioned above the ring frame F held by the frame holder 26 and is in contact with the second measurement surface 21B. not.

2 Operation of Grinding Apparatus Operation of the grinding apparatus 1 when grinding the workpiece W using the grinding apparatus 1 will be described.
For example, when grinding the first work set U1 or the second work set U2, the first chuck table 2A is mounted on the base 22 as shown in FIG.
With the first chuck table 2A attached to the base 22, for example, the first work set U1 having the substrate S1 adhered to the lower surface Wb of the workpiece W is placed on the first holding surface 20A. Then, the suction source 27 is operated to transmit the generated suction force to the first holding surface 20A through the suction path 28, thereby suction-holding the first work set U1 on the first holding surface 20A.

As shown in FIGS. 1 and 3, the first chuck table 2A is rotated around the rotating shaft 25 using the rotating means 24 while the first work set U1 is held by suction on the first holding surface 20A. Similarly, the first work set U1 is rotated about the rotating shaft 25 by rotating the first work set U1.
Specifically, by driving the drive shaft 241 using the motor 242 shown in FIG. When the driven pulley 244 rotates, the spindle 245 connected to the driven pulley 244 rotates around the rotating shaft 25 . As a result, the first chuck table 2A and the first work set U1 sucked and held by the first holding surface 20A rotate about the rotary shaft 25. As shown in FIG.

Next, using horizontal movement means (not shown) or the like, the first chuck table 2A is positioned below the grinding wheel 340 as shown in FIG. After that, by controlling the spindle motor 32 to rotate the spindle 30 about the rotation shaft 35 , the grinding wheel 340 connected to the spindle 30 also rotates about the rotation shaft 35 .
Then, in a state in which the grinding wheel 340 is rotating about the rotating shaft 35, the Z-axis motor 42 is controlled to drive the ball screw 40, thereby rotating the ball screw 40 about the rotating shaft 45. , the lift plate 43 descends in the -Z direction while being guided by the guide rail 41 . Along with this, the housing 31 supported by the lifting plate 43 via the holder 44 descends in the -Z direction, and as shown in FIG. It abuts on the upper surface Wa of the workpiece W held by 20a. Thereafter, the grinding wheel 340 is further lowered to push down the grinding surface 340a of the grinding wheel 340 against the upper surface Wa of the workpiece W, whereby the workpiece W can be ground.

At this time, as shown in FIGS. 1 and 3, the upper surface Wa of the workpiece W is brought into contact with the upper surface probe 500 to measure the height of the upper surface Wa of the workpiece W. The height of the first holding surface 20A having the same height as the first measurement surface 21A is measured by contacting the probe 510 to measure the height of the first measurement surface 21A. The difference between the measured height of the upper surface Wa of the workpiece W and the height of the first holding surface 20A is calculated by the calculator 52 as the thickness of the workpiece W. FIG.

When grinding the third work set U3, the second chuck table 2B is mounted on the base 22 as shown in FIG. At this time, for example, if the grinding of the third work set U3 is performed after the grinding of the first work set U1 and the second work set U2, the first chuck table 2A mounted on the base 22 in advance is used. Replace with the second chuck table 2B.

In the grinding process of the third work set U3, first, as shown in FIG. After placing and holding, the suction source 27 is operated. Thereby, the suction force generated by the suction source 27 is transmitted to the second holding surface 20B through the suction path 28, and the workpiece W can be held by suction on the second holding surface 20B via the tape T.
After the workpiece W is held on the second holding surface 20B, grinding is performed by operating the grinding device 1 in the same manner as the above-described grinding of the first work set U and the second work set U2. can be done.

At this time, as shown in FIGS. 2 and 4, the upper surface Wa of the workpiece W is brought into contact with the upper surface probe 500 to measure the height of the upper surface Wa of the workpiece W. By bringing two probes 512 into contact to measure the height of the second measurement surface, the height of the second holding surface 20B having the same height as the second measurement surface 21B is measured. The difference between the measured height of the upper surface Wa of the workpiece W and the height of the second holding surface 20B is calculated by the calculator 52 as the thickness of the workpiece W. FIG.

In the grinding process of the workpiece W using the grinding apparatus 1, the first probe 510 and the second probe 512 of the thickness measuring means 5 are bifurcated and supported by the supporting portion 514. When continuously grinding the workpiece W of a plurality of work sets including different types of work sets such as one work set U1 and a third work set U3, the first chuck table 2A is adjusted according to the type of work set. (2B) must be removed from the base 22 and replaced, and then the positional relationship between the first probe 510 and the first measurement surface 21A and the positional relationship between the second probe 512 and the second measurement surface 21B must be adjusted. do not. That is, it is only necessary to select either the first probe 510 or the second probe 512 according to the type of chuck table. Since the first measurement surface 21A and the second measurement surface 21B are formed at positions with different diameters, for example, the first arm 511 to which the first probe 510 is connected and the second arm 512 to which the second probe 512 is connected By changing the length of 513, the first probe 510 and the second probe 512 can be brought into contact with the first measurement surface 21A and the second measurement surface 21B, respectively.
Therefore, for example, when switching from the grinding of the first work set U1 (or the second work set U2) to the grinding of the third work set U3, the second chuck table 512 is required to adjust the position of the second probe 512. 2B is moved in the Y-axis direction to finely adjust the positional relationship between the second probe 512 and the second measurement surface 21B. Similarly, when switching from grinding the third work set U3 to grinding the first work set U1 (or the second work set U2), the positional relationship between the first probe 510 and the first chuck table 2A is adjusted. no longer needed. As a result, the amount of work required for grinding can be reduced, and the workpiece W can be ground efficiently.

1: Grinding device 10: Device base 11: Column 12: Cover 13: Accordion 2: Holding means 2A: First chuck table 2B: Second chuck table 20: Suction unit 20A: First holding surface 20B: Second holding surface 21: Frame 21A: First measurement surface 21B: Second measurement surface 22: Base 220: Screw 23: Recess 24: Rotating means 240: Drive pulley 241: Drive shaft 242: Motor 243: Transmission belt 244: Driven pulley 245: Spindle 246: Rotary joint 25: Rotating shaft 26: Frame holder 27: Suction source 28: Suction path 3: Grinding means 30: Spindle 31: Housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding wheel 340a: Grinding Surface 341: Wheel base 35: Rotating shaft 4: Grinding feed means 40: Ball screw 41: Guide rail 42: Z-axis motor 43: Elevating plate 44: Holder 45: Rotating shaft 5: Thickness measuring means 50: Upper surface height measuring means 500: Upper surface probe 51: Holding surface height measuring means 510: First probe 511: First arm 511a: One end of first arm 511b: Other end of first arm 512: Second probe 513: Second arm 513a: Second One end of 2 arms 513b: Other end of second arm 514: Support part 52: Calculation means W: Workpiece Wa: Upper surface of workpiece Wb: Lower surface of workpiece S1: Substrate S2: Protective tape T: Tape F: Ring frame Fo: Opening of ring frame Fa: Upper surface of ring frame U1: First work set U2: Second work set U3: Third work set

Claims (1)

A holding means having a holding surface for holding a workpiece, a grinding means for grinding the workpiece held by the holding means with a grinding wheel, and a probe brought into contact with the upper surface of the workpiece ground by the grinding wheel. upper surface height measuring means for measuring the height of the upper surface of the workpiece held on the holding surface; and holding surface height measuring means for measuring the height of the holding surface by bringing a probe into contact with the holding surface. Calculating the difference between the height of the holding surface measured by the holding surface height measuring means and the height of the upper surface of the workpiece measured by the upper surface height measuring means as the thickness of the workpiece A grinding device comprising a calculating means for
The holding means comprises a base on which two types of chuck tables, a first chuck table and a second chuck table, are exchangeably mounted,
The first chuck table is
a first holding surface for sucking and holding the substrate or the protective tape of the first work set in which the substrate is adhered to the lower surface of the workpiece or the second work set in which the protective tape is adhered to the lower surface of the workpiece;
An annular first holding surface connected to the first holding surface outside the outer circumference of the first holding surface, having the same height as the first holding surface, and having a height measured by the holding surface height measuring means. 1 measuring surface;
The second chuck table is
A ring frame having an opening for accommodating the workpiece and the workpiece placed in the opening are formed to have approximately the same diameter as the workpiece of the third work set integrated by adhering a tape. a second holding surface for sucking and holding the workpiece through the tape;
an annular second measurement surface having the same height as the second holding surface and whose height is measured by the holding surface height measuring means;
an annular recess formed between the second holding surface and the second measurement surface;
a frame holding part disposed in the annular recess and holding the ring frame so that the top surface of the ring frame is lower than the second holding surface;
The first measurement surface and the second measurement surface are formed with different diameters,
The holding surface height measuring means is
a first probe in contact with the first measurement surface, a first arm having one end connected to the first probe;
a second probe in contact with the second measurement surface, a second arm having one end connected to the second probe;
so that the second probe is out of contact with the first measurement surface when the first probe is in contact with the first measurement surface,
When the second probe is in contact with the second measurement surface, the first probe is placed on the ring frame held by the frame holding portion and is not in contact with the second measurement surface. A grinding device comprising: a support part that connects the other end of the first arm and the other end of the second arm and bifurcates the first arm and the second arm to support the first arm and the second arm.

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