JP7248699B2 - 配線基板および電気装置 - Google Patents
配線基板および電気装置 Download PDFInfo
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- JP7248699B2 JP7248699B2 JP2020548436A JP2020548436A JP7248699B2 JP 7248699 B2 JP7248699 B2 JP 7248699B2 JP 2020548436 A JP2020548436 A JP 2020548436A JP 2020548436 A JP2020548436 A JP 2020548436A JP 7248699 B2 JP7248699 B2 JP 7248699B2
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- 239000000463 material Substances 0.000 claims description 119
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 13
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
AAA・・・・・・・・・・・電気装置
E・・・・・・・・・・・・・基材層
1・・・・・・・・・・・・・枠状基材(第1枠状基材)
1a、11a、17a・・・・中央領域
1b、11b、17b・・・・貫通孔
1c・・・・・・・・・・・・裏面
1d・・・・・・・・・・・・側面
1e・・・・・・・・・・・・おもて面
1f・・・・・・・・・・・・ブリッジ部で仕切られた領域
3・・・・・・・・・・・・・金属部材
3a・・・・・・・・・・・・ステージ部
3at・・・・・・・・・・・ステージ部の端部
3b・・・・・・・・・・・・ブリッジ部
3ba・・・・・・・・・・・第1主面
3bb・・・・・・・・・・・第2主面
3bc・・・・・・・・・・・側方面
3bd・・・・・・・・・・・角部
3bt・・・・・・・・・・・端面
5、15・・・・・・・・・・ビア導体
7・・・・・・・・・・・・・金属製枠部材
11・・・・・・・・・・・・第2枠状基材
13・・・・・・・・・・・・配線部
17・・・・・・・・・・・・第3枠状基材
25・・・・・・・・・・・・電気素子
27・・・・・・・・・・・・蓋体
Claims (7)
- 枠状基材と、銅箔からなる金属部材とを有し、
前記枠状基材は、おもて面と、該おもて面の反対側に位置する裏面とを有する板状を成し、中央領域に貫通孔を有し、
前記金属部材は、第1主面と、該第1主面の反対側に位置する第2主面とを有し、かつ、ステージ部とブリッジ部とを有し、
前記ステージ部は、前記ステージ部の前記第1主面が前記貫通孔から露出するように前記貫通孔に嵌っており、
前記ブリッジ部は、前記ステージ部と幅が同じかまたは狭く、かつ前記ステージ部から外側に向かって延びているとともに、前記枠状基材に埋まっており、
前記金属部材は、前記第2主面が前記枠状基材の前記裏面に面するように配置されており、
前記ブリッジ部は、前記ステージ部とは反対側の末端に位置する端面を有し、該端面が前記枠状基材の側面に露出しており、
前記ステージ部は、前記第1主面が前記枠状基材の前記おもて面との間に空間部を有するように配置されている、配線基板。 - 前記ブリッジ部は前記ステージ部を中心にして複数の方向に延びており、前記枠状基材は前記ブリッジ部で分けられた領域のうち少なくとも1つの領域にビア導体を有する、請求項1に記載の配線基板。
- 前記ブリッジ部は前記ステージ部を中心にして四方に延びており、前記枠状基材は前記ブリッジ部で分けられた4つの領域のそれぞれにビア導体を有する、請求項1または2に記載の配線基板。
- 前記ブリッジ部は、前記第1主面および前記第2主面につながり、前記ブリッジ部の幅方向に位置する側方面を有し、
前記ブリッジ部の前記側方面は、前記第1主面と前記第2主面との間の厚み方向の中央部が前記第1主面および前記第2主面よりも前記ブリッジ部の幅方向に突出している、請求項1乃至3のうちいずれかに記載の配線基板。 - 前記ステージ部の周縁部が前記枠状基材によって覆われている、請求項1乃至4のうちいずれかに記載の配線基板。
- 中央領域に貫通孔を有する板状の枠状部材がさらに積層されている、請求項1乃至5のうちいずれかに記載の配線基板。
- 請求項1乃至6のうちいずれかに記載の配線基板に電気素子が搭載されている、電気装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018182272 | 2018-09-27 | ||
JP2018182272 | 2018-09-27 | ||
PCT/JP2019/035929 WO2020066665A1 (ja) | 2018-09-27 | 2019-09-12 | 配線基板および電気装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020066665A1 JPWO2020066665A1 (ja) | 2021-09-24 |
JP7248699B2 true JP7248699B2 (ja) | 2023-03-29 |
Family
ID=69952859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020548436A Active JP7248699B2 (ja) | 2018-09-27 | 2019-09-12 | 配線基板および電気装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220037250A1 (ja) |
EP (1) | EP3859773A4 (ja) |
JP (1) | JP7248699B2 (ja) |
CN (1) | CN112771658A (ja) |
WO (1) | WO2020066665A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324501A (ja) | 2006-06-05 | 2007-12-13 | Ngk Spark Plug Co Ltd | 配線基板 |
US20130033843A1 (en) | 2011-08-03 | 2013-02-07 | Laird Technologies, Inc. | Board level electromagnetic interference (emi) shields including releasably attached/detachable pickup members |
JP2014157949A (ja) | 2013-02-16 | 2014-08-28 | Kyocera Corp | 配線基板および電子装置 |
WO2016063695A1 (ja) | 2014-10-23 | 2016-04-28 | 住友ベークライト株式会社 | 金属箔張基板、回路基板および発熱体搭載基板 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2784522B2 (ja) | 1990-09-17 | 1998-08-06 | イビデン株式会社 | 電子部品搭載用基板及びその製造法 |
JPH11274696A (ja) * | 1998-03-19 | 1999-10-08 | Miyoshi Electronics Corp | 放熱性に優れたセラミック回路基板 |
US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
KR100634379B1 (ko) * | 2004-07-14 | 2006-10-16 | 삼성전자주식회사 | 반도체 패키지 |
US8410371B2 (en) * | 2009-09-08 | 2013-04-02 | Cree, Inc. | Electronic device submounts with thermally conductive vias and light emitting devices including the same |
JP2011249195A (ja) * | 2010-05-28 | 2011-12-08 | Panasonic Corp | 印刷装置 |
US8970028B2 (en) * | 2011-12-29 | 2015-03-03 | Invensas Corporation | Embedded heat spreader for package with multiple microelectronic elements and face-down connection |
JP6301595B2 (ja) * | 2013-06-14 | 2018-03-28 | 日本特殊陶業株式会社 | 配線基板、多層配線基板の製造方法 |
-
2019
- 2019-09-12 JP JP2020548436A patent/JP7248699B2/ja active Active
- 2019-09-12 US US17/280,326 patent/US20220037250A1/en active Pending
- 2019-09-12 CN CN201980063768.4A patent/CN112771658A/zh active Pending
- 2019-09-12 EP EP19866359.3A patent/EP3859773A4/en active Pending
- 2019-09-12 WO PCT/JP2019/035929 patent/WO2020066665A1/ja unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324501A (ja) | 2006-06-05 | 2007-12-13 | Ngk Spark Plug Co Ltd | 配線基板 |
US20130033843A1 (en) | 2011-08-03 | 2013-02-07 | Laird Technologies, Inc. | Board level electromagnetic interference (emi) shields including releasably attached/detachable pickup members |
JP2014157949A (ja) | 2013-02-16 | 2014-08-28 | Kyocera Corp | 配線基板および電子装置 |
WO2016063695A1 (ja) | 2014-10-23 | 2016-04-28 | 住友ベークライト株式会社 | 金属箔張基板、回路基板および発熱体搭載基板 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2020066665A1 (ja) | 2021-09-24 |
US20220037250A1 (en) | 2022-02-03 |
EP3859773A1 (en) | 2021-08-04 |
WO2020066665A1 (ja) | 2020-04-02 |
CN112771658A (zh) | 2021-05-07 |
EP3859773A4 (en) | 2022-06-22 |
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