JP7237972B2 - Jig and semiconductor device manufacturing method - Google Patents

Description

The present invention relates to a jig and a method of manufacturing a semiconductor device.

2. Description of the Related Art Conventionally, when a semiconductor element as a component is joined to an insulating substrate as a plate-like member with a bonding material such as solder, a jig is used for positioning the semiconductor element. For example, Japanese Unexamined Patent Application Publication No. 2002-361410 discloses a plate-like first jig having an opening formed therein, and a plate-like jig disposed inside the opening so as to be movable in the opening along the surface of the first jig. , solder and a second jig for positioning the component is disclosed. Further, Japanese Patent Application Laid-Open No. 2009-59832 discloses a jig used for soldering a component to a curved plate-like member, wherein the jig contacts the curved portion of the downwardly convex curved plate-like member. A jig is disclosed that has a convex portion that

JP-A-2002-361410 JP 2009-59832 A

In the above-mentioned document, when a plate-like member such as an insulating substrate to which a component such as a semiconductor element is to be bonded is curved, a gap larger than expected occurs between the jig and the plate-like member. No particular reference is made to the problem that the position of the positioned component is shifted due to

SUMMARY OF THE INVENTION It is an object of the present invention to provide a jig and a method for manufacturing a semiconductor device that can suppress positional displacement of a component with respect to a plate-like member, even if the plate-like member to which the component such as a semiconductor element is to be bonded is curved. to provide.

A jig according to the present disclosure is a jig used for positioning a semiconductor element, and includes a base portion and a positioning portion. The base portion has a first surface and a second surface opposite to the first surface. A first through hole is formed in the base portion to reach the second surface from the first surface. The positioning portion is arranged inside the first through hole, and a second through hole into which the semiconductor element is inserted is formed. The positioning portion is movable inside the first through hole, and is configured such that an end portion of the positioning portion on the second surface side protrudes outward from the second surface.

A method of manufacturing a semiconductor device according to the present disclosure includes a step of preparing a plate member and a semiconductor element. The manufacturing method of the semiconductor device includes the steps of placing the jig on the plate member and placing the bonding material and the semiconductor element inside the second through hole in the positioning portion of the jig. The method for manufacturing the semiconductor device described above includes a step of fixing the semiconductor element to the plate member with a bonding material.

According to the above, even if the plate-like member is curved, it is possible to suppress positional displacement of the component with respect to the plate-like member.

1 is a schematic perspective view of a jig according to Embodiment 1; FIG. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1; 5 is a flow chart for explaining a method of manufacturing a semiconductor device according to Embodiment 1; FIG. 4 is a schematic cross-sectional view for explaining the method of manufacturing the semiconductor device according to the first embodiment; 4 is a schematic diagram of a semiconductor device manufactured using the method of manufacturing a semiconductor device shown in FIG. 3; FIG. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the semiconductor device as a comparative example. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the semiconductor device as a comparative example. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the semiconductor device as a comparative example. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the semiconductor device as a comparative example. FIG. 5 is an enlarged schematic diagram for explaining a first modification of the jig according to Embodiment 1; FIG. 9 is a schematic partial cross-sectional view for explaining a second modification of the jig according to Embodiment 1; FIG. 7 is a schematic cross-sectional view of a jig according to Embodiment 2; FIG. 13 is a schematic diagram for explaining the size of the jig shown in FIG. 12; FIG. 11 is a schematic partial cross-sectional view for explaining a first modification of the jig according to Embodiment 2; FIG. 11 is a schematic partial cross-sectional view for explaining a second modification of the jig according to Embodiment 2; FIG. 11 is a schematic partial cross-sectional view of a jig according to Embodiment 3; FIG. 17 is a schematic partial cross-sectional view for explaining a configuration example of the jig shown in FIG. 16; FIG. 18 is a schematic partial plan view of the jig shown in FIG. 17; FIG. 11 is a schematic perspective view of a jig according to Embodiment 4; FIG. 12 is a schematic diagram for explaining a first modification of the jig according to Embodiment 4; FIG. 13 is a schematic diagram for explaining a second modification of the jig according to the fourth embodiment; FIG. 11 is a schematic plan view showing a base portion of a jig according to Embodiment 5; FIG. 11 is a schematic plan view showing a positioning portion of a jig according to Embodiment 5; FIG. 11 is a schematic partial cross-sectional view of a jig according to Embodiment 5; FIG. 11 is a schematic partial cross-sectional view for explaining a first modified example of the jig according to Embodiment 5; FIG. 11 is a schematic plan view for explaining a second modification of the jig according to Embodiment 5; FIG. 11 is a schematic cross-sectional view of a jig according to Embodiment 6; 28 is a schematic cross-sectional view for explaining a configuration example of the jig shown in FIG. 27; FIG.

Embodiments of the present invention will be described below. In addition, the same reference numerals are given to the same configurations, and the description thereof will not be repeated.

Embodiment 1.
<Jig configuration>
FIG. 1 is a schematic perspective view of a jig according to Embodiment 1. FIG. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. A jig 1 shown in FIGS. 1 and 2 is a jig 1 used for positioning semiconductor elements 21 and 22 and includes a base portion 4 and a positioning portion 3 . The base portion 4 has a first surface 4c and a second surface 4d opposite to the first surface 4c. The base portion 4 is formed with a first through hole 4a reaching from the first surface 4c to the second surface 4d. A plurality of first through holes 4a are formed in the base portion 4 of the jig 1 shown in FIGS. In the jig 1 shown in FIG. 1, the base portion 4 is formed with six first through holes 4a. The number of the first through holes 4a may be one, or any number of two or more. The plurality of first through holes 4a may be arranged in a matrix as shown in FIG. 1, but may be arranged arbitrarily. The planar shape of the first through hole 4a may be a square shape as shown in FIG. 1, or may be a circular shape or a polygonal shape such as a triangular shape.

The positioning portion 3 is arranged inside the first through hole 4a. The positioning portion 3 is formed with a second through hole 3a into which a semiconductor element as a component to be positioned is inserted. The positioning portion 3 is movable in the thickness direction of the base portion 4 inside the first through hole 4a. The positioning portion 3 is configured to be movable in the first through hole 4a so that the end of the positioning portion 3 on the side of the second surface 4d protrudes outside the second surface 4d.

The planar outer shape of the positioning portion 3 is similar to the shape of the first through hole 4a in plan view. However, the planar shape of the positioning portion 3 can be any shape as long as the position of the positioning portion 3 in the first through hole 4a can be determined. Although the shape of the second through hole 3a of the positioning portion 3 is square, the planar shape of the second through hole 3a may be any shape as long as the position of the semiconductor element to be positioned can be determined. can.

<Method for manufacturing a semiconductor device>
FIG. 3 is a flow chart for explaining the method of manufacturing the semiconductor device according to the first embodiment. FIG. 4 is a schematic cross-sectional view for explaining the method of manufacturing the semiconductor device according to the first embodiment. FIG. 5 is a schematic diagram of a semiconductor device manufactured using the semiconductor device manufacturing method shown in FIG. A method for manufacturing a semiconductor device will be described with reference to FIGS.

As shown in FIG. 3, in the method of manufacturing a semiconductor device, first, a preparation step (S10) is performed. In this step (S10), the parts and jig 1 that constitute the semiconductor device are prepared. Parts constituting the semiconductor device include, for example, the insulating substrate 10, which is an example of the plate member shown in FIG. 4, solder, and semiconductor elements.

Next, a positioning step (S20) is performed. In this step (S20), the insulating substrate 10 is arranged in the recess 5a of the lower jig 5 in which the recess 5a is formed. The insulating substrate 10 includes an insulating layer 11 made of ceramics, a rear conductor pattern 13 for heat radiation, and a front conductor pattern 12 forming a circuit. The back conductor pattern 13 is formed on the back surface of the insulating layer 11 . A surface conductor pattern 12 is formed on the surface of the insulating layer 11 . Any material can be used as the material forming the back-surface conductor pattern 13 and the front-surface conductor pattern 12, and for example, copper may be used as the material. The thickness of the back conductor pattern 13 can be set to 0.7 mm, for example. The thickness of the surface conductor pattern 12 can be set to 0.8 mm, for example.

A jig 1 as an upper jig is arranged on an insulating substrate 10 . The jig 1 is arranged so as to close the concave portion 5a of the lower jig 5 . The positioning portion 3 of the jig 1 is arranged so as to overlap a position on the surface conductor pattern 12 of the insulating substrate 10 where the semiconductor element is to be fixed. At this time, as shown in FIG. 4, the positioning portion 3 moves in the thickness direction of the base portion 4 in the first through hole 4a of the base portion 4 of the jig 1, and the lower portion of the positioning portion 3 comes into contact with the insulating substrate 10. there is In this state, the solder and the semiconductor elements 21 and 22 (see FIG. 5) are placed inside the second through holes 3a of the positioning portion 3. As shown in FIG. As the solder, pellet-shaped solder having a size slightly smaller than the planar shape of the second through holes 3a can be used. Here, since the positioning portion 3 is movable inside the first through hole 4a, a gap large enough for the semiconductor elements 21 and 22 to pass through is formed between the positioning portion 3 and the insulating substrate 10. can be prevented. Therefore, the arrangement of the semiconductor elements on the insulating substrate 10 can be accurately determined. The thickness of semiconductor elements 21 and 22 is, for example, 50 μm or more and 250 μm or less, and the thickness of pellet-shaped solder used in the positioning step (S20) is, for example, 40 μm or more and 150 μm or less.

Next, a bonding step (S30) is performed. In this step (S30), the lower jig 5 and the jig 1 heat the insulating substrate 10 on which the solder 23 and the semiconductor elements 21 and 22 are arranged at accurate positions. Any heating method can be used. For example, insulating substrate 10 may be placed in a soldering furnace. The heating melts the solder, and as shown in FIG. 5, the surface conductor pattern 12 of the insulating substrate 10 and the semiconductor elements 21 and 22 are joined. When the insulating substrate 10 is put into the soldering furnace, the insulating substrate 10 is assembled in the lower jig 5 and the jig 1 . The insulating substrate 10 may be conveyed by a conveyor in the soldering furnace. The pressure in the soldering oven may be sub-atmospheric. In this case, the generation of voids in the solder 23 can be suppressed.

Here, even if the insulating substrate 10 has a warp amount of, for example, 100 μm or less at room temperature, the linear expansion coefficients of the constituent materials of the insulating layer 11 and the constituent materials of the back conductor pattern 13 and the front conductor pattern 12 are increased by heating. A large concave warp may occur due to the difference in . For example, the linear expansion coefficient of ceramic forming the insulating layer 11 is about 3 ppm/K, and the linear expansion coefficient of copper forming the back conductor pattern 13 and the front conductor pattern 12 is about 17 ppm/K. In addition, when the length of the longest side of the insulating layer 11 in the insulating substrate 10 is longer than 50 mm, the amount of warpage is significantly increased. Even in such a case, by using the jig 1 according to the present embodiment, it is possible to suppress the generation of a large gap between the jig 1 and the insulating substrate 10 in the bonding step (S30).

Next, a post-processing step (S40) is performed. In this step (S40), lower jig 5 and jig 1 are removed from insulating substrate 10 discharged from, for example, a soldering furnace. After that, the semiconductor elements 21 and 22 and the surface conductor pattern 12 are connected by wires 24 . Thus, the semiconductor device shown in FIG. 5 can be obtained.

Any metal wire can be used as the wire 24, but an aluminum (Al) wire, for example, may be used. The wire 24 may have a diameter of, for example, 400 μm. Any semiconductor element can be used as the semiconductor elements 21 and 22 . As semiconductor elements 21 and 22, IGBTs (Insulated Gate Bipolar Transistors) and FwDi (Free-Wheel Diodes) can be used, for example.

<Effect>
A jig 1 according to the present disclosure is a jig 1 used for positioning semiconductor elements 21 and 22 and includes a base portion 4 and a positioning portion 3 . The base portion 4 has a first surface 4c and a second surface 4d opposite to the first surface 4c. The base portion 4 is formed with a first through hole 4a reaching from the first surface 4c to the second surface 4d. The positioning portion 3 is arranged inside the first through hole 4a, and has a second through hole 3a into which the semiconductor elements 21 and 22 are inserted. The positioning portion 3 is movable inside the first through hole 4a, and is configured such that the end of the positioning portion 3 on the side of the second surface 4d protrudes outside the second surface 4d.

In this way, the insulating substrate 10 as a plate member for fixing the semiconductor elements 21 and 22 is warped as shown in FIG. Even if a gap larger than expected is formed, the end portion of the positioning portion 3 on the side of the second surface 4d is positioned adjacent to the surface of the insulating substrate 10 by moving the positioning portion 3 inside the first through hole 4a. placed. That is, the position of the positioning portion 3 of the jig 1 changes following the warped shape of the insulating substrate 10 . Therefore, when the semiconductor elements 21 and 22 and the solder 23 are arranged inside the second through hole 3 a of the positioning portion 3 , the semiconductor elements 21 and 22 pass through the gap between the jig 1 and the insulating substrate 10 in the second through hole. It is possible to prevent movement outside the hole 3a. Therefore, it is possible to prevent the semiconductor elements 21 and 22 as components from being misaligned with respect to the insulating substrate 10, and to suppress the occurrence of defects in the semiconductor device.

The method of manufacturing a semiconductor device according to the present disclosure includes a preparation step (S10), which is a step of preparing insulating substrate 10 as a plate-like member and semiconductor elements 21 and 22 . In the method of manufacturing the semiconductor device, the jig 1 is arranged on the insulating substrate 10 as a plate member, and solder 23 as a bonding material and a semiconductor element are placed inside the second through hole 3 a in the positioning portion 3 of the jig 1 . A positioning step (S20), which is a step of arranging 21 and 22, is provided. The manufacturing method of the semiconductor device includes a bonding step (S30) of fixing the semiconductor elements 21 and 22 to the insulating substrate 10 as a plate-like member with solder 23 as a bonding material.

In this way, since the positioning step (S20) is performed using the jig 1 according to the present embodiment, even if the insulating substrate 10 is warped, the semiconductor elements 21 and 22 can be placed on the insulating substrate 10 and placed on the insulating substrate 10. position can be accurately determined. Therefore, it is possible to suppress the occurrence of defects such as deviation of the bonding positions of the semiconductor elements 21 and 22 with respect to the insulating substrate 10 from the designed positions.

Further, if the jig 1 described above is used, the positioning portion 3 and the surface conductor pattern 12 of the insulating substrate 10 are in contact with each other when the insulating substrate 10 is heated in the bonding step (S30). However, since heat can be transferred to the insulating substrate 10 even when the temperature is low, the heating rate of the insulating substrate 10 can be increased, so that the heating time in the bonding step (S30) can be shortened.

Effects of the jig 1 and the semiconductor device manufacturing method according to the present embodiment described above will be described in more detail while comparing with a semiconductor device manufacturing method using a jig as a comparative example. 6 to 9 are schematic cross-sectional views for explaining a method of manufacturing a semiconductor device as a comparative example. 6 to 9 correspond to the positioning step (S20) and bonding step (S30) in FIG.

As shown in FIG. 6, the insulating substrate 10 is placed in the recess of the lower jig 105 . As shown in FIG. 7, a jig 101 is arranged on the insulating substrate 10 . The jig 101 has through holes 101a formed in regions where the semiconductor elements 21 and 22 are to be arranged. Then, as shown in FIG. 8, the solder 23 and the semiconductor elements 21 and 22 are arranged inside the through hole 101a. In this manner, the jig 101 determines the positions of the solder 23 and the semiconductor elements 21 and 22 on the insulating substrate 10 . The thickness of jig 101 is, for example, 3 mm. Also, the thickness of the semiconductor elements 21 and 22 is 100 μm, and the thickness of the solder 23 is 60 μm.

Here, when insulating substrate 10 is warped in the bonding step (S30) as shown in FIG. , 22 are formed. In this state, the jig 101 cannot position the semiconductor elements 21 and 22 .

As a result, as shown in FIG. 9, the solder 23 and the semiconductor elements 21 and 22 move laterally from the gap. Possible causes of the movement include vibration of the conveyor for moving the insulating substrate 10 and local melting of the solder due to the in-plane temperature distribution of the solder 23 . As a result, the semiconductor elements 21 and 22 are fixed on the insulating substrate 10 while being displaced from each other. In other words, the semiconductor elements 21 and 22 are not connected to the correct positions on the insulating substrate 10, and the subsequent wire bonding cannot be performed normally, or the malfunction of the circuit occurs, causing defects in the semiconductor device. .

On the other hand, if the jig 1 according to the present embodiment is used as described above, even if the insulating substrate 10 is warped as shown in FIG. Generation of large gaps is suppressed. As a result, it is possible to prevent the semiconductor elements 21 and 22 from moving to the outside of the second through hole 3a through the gap.

<Structure and action effect of modified example of jig>
FIG. 10 is an enlarged schematic diagram for explaining a first modification of the jig according to Embodiment 1. FIG. The jig shown in FIG. 10 basically has the same configuration as the jig 1 shown in FIGS. It is different from the jig 1 shown. That is, in the jig shown in FIG. 10, the concave portion 4b is partially formed in the planar shape of the first through hole 4a. Further, the positioning portion 3 is formed with a convex portion 3b that fits into the concave portion 4b. In this way, when the positioning portion 3 is inserted into the first through hole 4a, by fitting the convex portion 3b into the concave portion 4b, it is possible to prevent the positioning portion 3 from being misoriented with respect to the first through hole 4a. As a result, for example, when the planar shape of the second through hole 3a in the positioning portion 3 is not square, that is, when the planar shape of the semiconductor elements 21 and 22 to be positioned is rectangular or the like, the semiconductor elements 21 and 22 are Both orientation and placement can be determined accurately. The convex portion 3b of the positioning portion 3 may be formed over the entire thickness direction of the base portion 4, or may be formed only partially in the thickness direction.

FIG. 11 is a schematic partial cross-sectional view for explaining a second modification of the jig according to Embodiment 1. FIG. The jig shown in FIG. 11 basically has the same configuration as the jig 1 shown in FIGS. 1 and 2, but the cross-sectional shape of the positioning portion 3 is different from that of the jig 1 shown in FIGS. That is, in the jig shown in FIG. 11, the outer peripheral side wall 3c of the positioning portion 3 is inclined. The width between the outer peripheral side walls 3c of the positioning portion 3 decreases toward the second surface 4d of the base portion 4. As shown in FIG. With such a configuration, the work of inserting the positioning portion 3 into the first through hole 4a of the base portion 4 from the first surface 4c side can be easily performed.

Embodiment 2.
<Jig configuration>
FIG. 12 is a schematic cross-sectional view of a jig according to Embodiment 2. FIG. 13 is a schematic diagram for explaining the size of the jig shown in FIG. 12. FIG. The jig 1 shown in FIGS. 12 and 13 basically has the same configuration as the jig 1 shown in FIGS. The shape is different from the jig 1 shown in FIGS. That is, in the jig 1 described above, the base portion 4 includes the first projecting portion 41 projecting from the inner wall of the first through hole 4a. The first protrusion 41 protrudes toward the inside of the first through hole 4a. The positioning portion 3 includes a second projecting portion 31 projecting outward from the outer peripheral side wall. The second projecting portion 31 is located closer to the first surface 4c side of the base portion 4 than the first projecting portion 41 is. The positioning portion 3 includes a second projecting portion 31 and a wall portion 32 extending downward from the inner peripheral side of the second projecting portion. The second projecting portion 31 and the wall portion 32 have an inverted L-shaped cross section.

When viewed from the first surface 4c side of the base portion 4, the first projecting portion 41 and the second projecting portion 31 are arranged so as to overlap each other. In addition, although the 1st protrusion part 41 may be formed in the perimeter of the internal peripheral surface of the 1st through-hole 4a, it may be formed only in a part of the said internal peripheral surface. Further, the second protruding portion 31 may be formed on the entire circumference of the outer peripheral side wall of the positioning portion 3, or may be formed only on a part of the circumference of the outer peripheral side wall. A first protruding portion 41 is formed at the lowest portion of the first through-hole 4a that continues to the second surface 4d. The width W2 of the first through hole 4a in the region where the first projecting portion 41 is formed is smaller than the width W1 of the positioning portion 3 in the region where the second projecting portion 31 is formed.

<Effect>
In the jig 1 described above, the base portion 4 includes a first projecting portion 41 . The first protrusion 41 protrudes toward the inside of the first through hole 4a. The positioning portion 3 includes a second projecting portion 31 . The second projecting portion 31 projects toward the base portion 4 and is located closer to the first surface 4 c than the first projecting portion 41 . When viewed from the first surface 4c side of the base portion 4, the first projecting portion 41 and the second projecting portion 31 are arranged so as to overlap each other.

In this case, when the positioning portion 3 moves toward the second surface 4d of the base portion 4, the second projection portion 31 of the positioning portion 3 comes into contact with the first projection portion 41 of the base portion 4, whereby the positioning portion 3 moves toward the second surface 4d. It is possible to prevent the base portion 4 from falling out from the inside of the first through hole 4a. Therefore, when the jig 1 is moved by a robot arm or the like, it is possible to prevent the positioning portion 3 from falling off from the base portion 4 and becoming separated. Therefore, the work efficiency in the semiconductor device manufacturing method using the jig 1 is improved.

In addition, the height L1 of the first projecting portion 41 can be set to 1 mm, for example. Moreover, the thickness L2 of the base portion 4 can be set to 3 mm, for example. The thickness L3 of the second projecting portion 31 in the positioning portion 3 can be set to 1 mm, for example. The length L4 of the wall portion 32 can be 1.8 mm, for example. The thickness L5 of the positioning portion 3 is 2.8 mm in this case. With such dimensions, the semiconductor elements 21 and 22 can be positioned with respect to the insulating substrate 10 using the jig 1 when the amount of warpage of the insulating substrate 10 is from about 0.05 mm to about 0.8 mm. be able to.

In addition, by determining the dimensions of the jig 1 so that the value obtained by subtracting the thickness L1 of the first projecting portion 41 from the length L4 of the wall portion 32 is equal to or greater than the warp amount h of the insulating substrate 10, the insulating substrate A jig 1 corresponding to 10 warpage amounts h can be prepared.

<Structure and action effect of modified example of jig>
FIG. 14 is a schematic partial cross-sectional view for explaining a first modification of the jig according to Embodiment 2. FIG. 14 basically has the same configuration as the jig 1 shown in FIGS. 12 and 13, but the relationship between the thickness L2 of the base portion 4 and the thickness L5 of the positioning portion 3 is is different from the jig 1 shown in FIG. That is, in the jig shown in FIG. 14, the thickness L2 of the base portion 4 is larger than the thickness L5 of the positioning portion 3 in the thickness direction from the first surface 4c to the second surface 4d. For example, the thickness L2 can be 4.2 mm and the thickness L5 can be 3 mm. By doing so, it is possible to prevent the positioning portion 3 from protruding from the upper side of the base portion 4 when the jig is carried or placed on the insulating substrate 10 . Therefore, it is possible to reduce the possibility that the positioning portion 3 will protrude from the base portion 4 and the jig will come apart.

FIG. 15 is a schematic partial cross-sectional view for explaining a second modification of the jig according to the second embodiment. The jig shown in FIG. 15 basically has the same configuration as the jig 1 shown in FIGS. It differs from the jig 1 shown in FIGS. 12 and 13 in that the surface roughness of at least one of the end faces 3d of 31 is made relatively large. Specifically, in the jig shown in FIG. 15, the surface roughness of at least one of the inner peripheral side surface of the first through hole 4a of the base portion 4 and the end surface 3d of the second projecting portion 31 of the positioning portion 3 is It is made larger than the surface roughness of either the first surface 4 c or the second surface 4 d of the base portion 4 . The surface roughness (Ra) of at least one of the inner peripheral side surface of the first through hole 4a of the base portion 4 and the end surface 3d of the second projecting portion 31 of the positioning portion 3 may be set to 1.0 μm or more and 10 μm or less.

In this way, when the positioning portion 3 moves inside the first through hole 4a, the friction coefficient at the contact portion between the end surface 3d of the second projecting portion 31 and the inner peripheral side surface of the first through hole 4a is increased. can. Therefore, it is possible to increase the resistance when the positioning portion 3 moves upward in the first through hole 4a, so that the possibility of the positioning portion 3 jumping out from the upper portion of the first through hole 4a can be reduced.

Embodiment 3.
<Jig configuration>
16 is a schematic partial cross-sectional view of a jig according to Embodiment 3. FIG. FIG. 17 is a schematic partial cross-sectional view for explaining a configuration example of the jig shown in FIG. FIG. 18 is a partial schematic plan view of the jig shown in FIG. 17. FIG. The jigs shown in FIGS. 16 to 18 basically have the same configuration as the jig 1 shown in FIGS. It is different from the jig 1 shown. That is, in the jig shown in FIGS. 16 to 18, in the cross section of the base portion 4 along the extending direction of the first through hole 4a, the width of the first through hole 4a gradually increases toward the first surface 4c side. It's getting smaller. From another point of view, the inner wall of the first through hole 4a is inclined with respect to the first surface 4c. The inner walls facing each other in the cross section of the first through hole 4a may have the same inclination angle with respect to the first surface 4c, or may have different inclination angles.

As a method for realizing the jig shown in FIG. 16, for example, as shown in FIGS. Specifically, the base portion 4 is composed of a body portion 42 and a tapered portion 43 . The main body portion 42 is formed with a through hole whose inner wall extends perpendicularly to the first surface 4c (see FIG. 16) in a region where the first through hole 4a is to be formed. A first protrusion 41 is formed at the bottom of the through hole. The positioning part 3 is arranged inside the through hole. After that, the tapered portion 43 is inserted inside the through hole. The outer peripheral surface of the tapered portion 43 is fixed in contact with the inner wall of the through hole. The inner wall of the tapered portion 43 constitutes the inclined inner wall of the first through hole 4a. Any method can be adopted for fixing the tapered portion 43 to the body portion 42 . For example, the tapered portion 43 may be fixed to the main body portion 42 by forming a through hole penetrating from the tapered portion 43 to the main body portion 42 and arranging a fixing member such as a press-fitting pin in the through hole.

As shown in FIG. 18, the tapered portion 43 is formed so as to contact the entire circumference of the through hole of the body portion 42, but the tapered portion 43 is formed only partially on the inner peripheral surface of the through hole of the body portion 42. can be placed in

<Effect>
In the jig 1, the inner wall of the first through-hole 4a is formed such that the width of the first through-hole 4a gradually decreases toward the first surface 4c in the cross section along the extending direction of the first through-hole 4a. is inclined with respect to the first surface 4c.

In this case, the width W3 of the first through-hole 4a on the first surface 4c is relatively smaller than the width of the first through-hole 4a at the central portion in the extending direction of the first through-hole 4a. It is difficult for the positioning portion 3 to protrude from the first surface 4c side. Therefore, it is possible to prevent the positioning portion 3 from protruding from the upper portion of the first through hole 4 a of the base portion 4 and being separated from the base portion 4 . The width W3 of the first through hole 4a on the first surface 4c is preferably smaller than the width W1 of the positioning portion 3 on the first surface 4c side, which is the maximum width.

Embodiment 4.
<Jig configuration>
19 is a schematic perspective view of a jig according to Embodiment 4. FIG. The jig 1 shown in FIG. 19 has basically the same configuration as the jig 1 shown in FIGS. and is different from the jig 1 shown in FIG. That is, in the jig shown in FIG. 19, the planar shape of the first through hole 4a is rectangular. Further, in the jig shown in FIG. 19, the outer peripheral shape of the positioning portion 3 in plan view is rectangular, and a plurality of through holes 3aa to 3ac are formed as the second through holes 3a in one positioning portion 3. . The number of through holes 3aa to 3ac may be three as shown in FIG. 19, but may be any number of two or more. The intervals between the plurality of through holes 3aa to 3ac may be equal, but may be different. The plurality of through holes 3aa to 3ac are arranged so as to line up in one direction in the positioning portion 3, but may be arranged in a staggered manner.

<Effect>
In the above jig, a plurality of through holes 3aa to 3ac are formed as second through holes 3a in one positioning portion 3. As shown in FIG. In this case, even in a configuration in which a plurality of semiconductor elements 21 and 22 are arranged close to each other on the insulating substrate 10, the semiconductor elements 21 and 22 can be positioned using the jig.

<Structure and action effect of modified example of jig>
FIG. 20 is a schematic diagram for explaining a first modification of the jig according to Embodiment 4. FIG. FIG. 20 shows only the positioning portion 3 of the jig. The jig having the positioning portion 3 shown in FIG. 20 basically has the same configuration as the jig shown in FIG. 19, but the configuration of the positioning portion 3 is different from the jig shown in FIG. That is, the positioning portion 3 shown in FIG. 20 is composed of three positioning portions 30a to 30c. Each of the positioning portions 30a to 30c is a component having a U-shaped planar shape. The positioning portion 3 is configured by arranging the positioning portions 30a to 30c in a row. The positioning portion 3 is arranged inside the first through hole 4a in the base portion 4 of FIG. The individual positioning portions 30a to 30c are configured to be independently movable in the thickness direction of the base portion 4 within the first through hole 4a.

In this way, when the amount of warpage of the insulating substrate 10 is large, or when the distance from the jig differs for each position where a plurality of semiconductor elements are mounted, the warpage of the insulating substrate 10 for each of the plurality of semiconductor elements can be minimized. By independently moving the positioning portions 30a to 30c according to the amount, it is possible to suppress the occurrence of misalignment of a plurality of semiconductor elements. Although the three positioning portions 30a to 30c are arranged in a row in FIG. 20, the positioning portion 3 may be configured using any number of positioning portions, such as two or four or more.

FIG. 21 is a schematic diagram for explaining a second modification of the jig according to the fourth embodiment. FIG. 21 shows only the positioning portion 3 of the jig as in FIG. The jig having the positioning portion 3 shown in FIG. 21 basically has the same configuration as the jig having the positioning portion 3 shown in FIG. It is different from jigs with That is, in the positioning portion 3 shown in FIG. 21, the recesses 35 are formed in the contact portions with the end portions 36 of the adjacent positioning portions 30a to 30c. By fitting the end portion 36 into the concave portion 35, the relative positions of the plurality of positioning portions 30a to 30c within the first surface 4c of the base portion 4 can be defined. That is, the positioning accuracy of the positioning portions 30a to 30c within the first surface 4c of the base portion 4 can be improved.

Embodiment 5.
<Jig configuration>
22 is a schematic plan view showing a base portion of a jig according to Embodiment 5. FIG. 23 is a schematic plan view showing a positioning portion of a jig according to Embodiment 5. FIG. 24 is a schematic partial cross-sectional view of a jig according to Embodiment 5. FIG. The jigs shown in FIGS. 22 to 24 basically have the same configuration as the jig 1 shown in FIG. is different from the jig 1 shown in FIG. That is, in the jig 1 shown in FIGS. 22 to 24, the base portion 4 includes first projecting portions 41a and 41b projecting from the inner wall of the first through hole 4a. The first protrusions 41a and 41b protrude toward each other from opposing positions on the inner surface of the first through hole 4a. The first protrusions 41a and 41b are located on the long sides of the planar shape of the first through hole 4a. The positioning portion 3 includes second protrusions 31a and 31b that protrude outward from the outer peripheral side wall. The second projecting portions 31a and 31b are positioned closer to the first surface 4c of the base portion 4 than the first projecting portions 41a and 41b. The positioning portion 3 includes second protrusions 31a and 31b and wall portions extending downward from the inner peripheral sides of the second protrusions 31a and 31b. The second projecting portions 31a and 31b and the wall portion have an inverted L-shaped cross section as shown in FIG.

When viewed from the first surface 4c side of the base portion 4, the first projecting portion 41a and the second projecting portion 31a are arranged so as to overlap each other. Also, the first projecting portion 41b and the second projecting portion 31b are arranged so as to overlap each other. First projecting portions 41a and 41b are formed at the lowermost portion of the first through-hole 4a that continues to the second surface 4d.

The planar shape of the positioning portion 3 may be a rectangular shape similar to the planar shape of the first through hole 4a. It may have a shape different from the planar shape of the through hole 4a.

As shown in FIG. 22, the width W4 of the first protrusion 41a is larger than the width W5 of the first protrusion 41b. For example, width W4 can be 2.3 mm and width W5 can be 1.3 mm. Also, the width W6 of the second projecting portion 31a is larger than the width W7 of the second projecting portion 31b. Moreover, as shown in FIG. 24, the width W6 of the second projecting portion 31a is preferably larger than the width W4 of the first projecting portion 41a. The difference between width W6 and width W4 can be, for example, 0.3 mm or more and 0.6 mm or less. In addition, it is preferable that such a magnitude relationship between the widths is also established between the width W5 of the first projecting portion 41b shown in FIG. 22 and the width W7 of the second projecting portion 31b shown in FIG. In addition, it is preferable that such a width magnitude relationship also be established between the first projecting portion 41 and the second projecting portion 31 in other embodiments.

<Effect>
In the jig 1, the positioning portion 3 is formed with two second projecting portions 31a and 31b. Also in the base portion 4, two first projecting portions 41a and 41b are formed in the first through hole 4a. A width W4, which is the amount of protrusion of the first protrusion 41a from the inner wall of the first through hole 4a, is larger than the width W5 of the other first protrusions 41b. Also, the width W6, which is the amount of protrusion of the second protrusion 31a in the positioning portion 3, is larger than the width W7 of the other second protrusions 31b.

In this case, the orientation of the positioning portion 3 when the positioning portion 3 is inserted into the first through hole 4a can be defined. That is, unless the orientation of the positioning portion 3 is adjusted so that the first protrusion 41a having a relatively large width W4 and the second protrusion 31a having a relatively large width W6 overlap each other, the positioning portion 3 cannot be inserted into the first through hole 4a. Therefore, even if the positioning portion 3 has slipped out of the first through hole 4a, the positioning portion 3 can be inserted into the first through hole 4a with the direction of the positioning portion 3 accurately maintained.

Moreover, in the jig 1, the widths W6 and W7 of the second protrusions 31a and 31b are larger than the widths W4 and W5 of the first protrusions 41a and 41b. In this case, it is possible to reduce the possibility that the positioning portion 3 is clogged inside the first through hole 4a. The difference between the widths W6 and W7 and the widths W4 and W5 can be, for example, 0.3 mm or more and 0.6 mm or less. If the difference is less than 0.3 mm, there is a possibility that the positioning portion 3 will be clogged inside the first through hole 4a. Also, if the difference exceeds 0.6 mm, there is a possibility that the second protrusions 31a and 31b will not come into contact with the first protrusions 41a and 41b.

<Structure and action effect of modified example of jig>
FIG. 25 is a schematic partial cross-sectional view for explaining a first modification of the jig according to Embodiment 5. FIG. FIG. 25 shows only the first projecting portion 41a formed on the base portion 4 of the jig. The jig provided with the base portion 4 shown in FIG. 25 basically has the same configuration as the jig shown in FIGS. 22 to 24 is different from the jig shown in FIGS. Although not shown, the other first projecting portion 41b (see FIG. 22) is similarly formed with a chamfered portion 41c.

With such a configuration, when the positioning portion 3 is inclined with respect to the extending direction of the first through-hole 4a, the positioning portion 3 is caught by the first projecting portions 41a and 41b and the first through-hole 4a and 4b is caught. It is possible to suppress the occurrence of a situation in which the positioning portion 3 is fixed inside the hole 4a. The width of the chamfered portion 41c is preferably ⅓ or less of the height L1 (see FIG. 13) of the first projecting portion 41a. For example, when the height L1 is 1 mm, the width of the chamfered portion 41c can be 0.1 mm or more and 0.3 mm or less.

FIG. 26 is a schematic plan view for explaining a second modification of the jig according to Embodiment 5. FIG. FIG. 26 shows only the positioning portion 3 of the jig. The jig provided with the positioning portion 3 shown in FIG. 26 basically has the same configuration as the jig shown in FIGS. 4 differs from the jig shown in FIGS. 22-24.

Two through holes 3aa and 3ab are formed as the second through holes 3a in the positioning portion 3 shown in FIG. The planar shape of the through hole 3aa and the planar shape of the through hole 3ab are different. That is, when a plurality of through-holes are formed as the second through-holes 3a, the plurality of through-holes may include through-holes having different planar shapes.

The positioning portion 3 shown in FIG. 26 includes a position detection mark portion 38 formed on the surface of the base portion 4 on the first surface 4c side. The position detection mark portion 38 is used to detect the presence or absence of positional deviation of the positioning portion 3 and the amount of positional deviation. The position detection mark portion 38 includes a first mark portion 38a and a second mark portion 38b that are spaced apart from each other. Any configuration can be adopted as the configuration of the position detection mark portion 38 as long as it can be optically recognized. For example, the position detection mark portion 38 may be any one of through holes, concave portions, and convex portions formed in the base portion 4 . Further, the number of position detection mark portions 38 may be two as shown in FIG. 26, but may be three or more. Also, the number of position detection mark portions 38 may be one. In this case, positional deviation of the positioning portion 3 can be detected by detecting both the position of the position detection mark portion 38 and the position of the second through hole 3a.

In the positioning portion 3, the first mark portion 38a and the second mark portion 38b may be arranged so as to sandwich the plurality of through holes 3aa and 3ab. The first mark portion 38 a and the second mark portion 38 b may be arranged diagonally on the surface of the positioning portion 3 . Also, the first mark portion 38a and the second mark portion 38b may be arranged on the same side as viewed from one of the plurality of through holes 3aa and 3ab.

In the base portion 4 on which the positioning portion 3 is arranged, the planar shape of the first through hole 4a when viewed from the first surface 4c side of the base portion 4 is a quadrangular shape, which is an example of a polygonal shape. The planar shape of the positioning portion 3 seen from the first surface 4c side is substantially a quadrangular polygonal shape along the planar shape of the first through hole 4a. A chamfered portion 37 is formed at a corner portion of the planar shape of the positioning portion 3 . The chamfered portion 37 may have a flat surface or a curved surface.

In the positioning portion 3, the planar shape of the second through hole 3a is substantially a quadrilateral shape, which is an example of a polygonal shape. A notch portion 39 protruding outward is formed at a corner portion of the planar shape of the second through hole 3a. The planar shape of the notch portion 39 is semicircular. The planar shape of the notch portion 39 may be any shape other than the semicircular shape.

In the positioning portion 3 shown in FIG. 26, the ratio of the length of the long side on which the second protrusions 31a and 31b are formed to the length of the short side on which the second protrusions 31a and 31b are not formed is It is smaller than the ratio in the positioning portion 3 shown in 23 . The ratio in the positioning portion 3 can be arbitrarily set according to the number and arrangement of the second through holes 3a.

In the jig provided with the positioning portion 3 shown in FIG. 26, since the position detection mark portion 38 is formed, the position of the positioning portion 3 can be accurately determined by detecting the position detection mark portion 38 by image recognition. can be measured to Therefore, when the positioning portion 3 is displaced in the first through hole 4a due to the gap (clearance) between the positioning portion 3 and the first through hole 4a of the base portion 4, the setting position of the positioning portion 3 may be shifted. can be accurately detected. Therefore, if a jig having the positioning portion 3 shown in FIG. 26 is used, the solder 23 and the semiconductor elements 21 and 22 can be accurately positioned inside the second through hole 3a by performing control such as correcting the detected deviation amount. can be mounted on Also, the jig can be used to accurately position the solder 23 and the semiconductor elements 21 and 22 on the surface of the insulating substrate 10 (see FIG. 10).

In addition, since the position detection mark portion 38 includes the first mark portion 38a and the second mark portion 38b, which are a plurality of mark portions, the positional deviation of the positioning portion 3 in the rotational direction can be detected by detecting the plurality of mark portions. can also be detected accurately. Therefore, the accurate position of the positioning unit 3 can be detected by detecting both the amount of positional deviation due to movement of the positioning unit 3 and the amount of deviation due to rotation.

In addition, since the chamfered portions 37 are formed at the corners of the planar shape of the positioning portion 3, the corners of the positioning portion 3 are more likely to penetrate the base portion 4 than when the chamfered portions 37 are not formed. The possibility of contact with the side wall of the hole 4a can be reduced. Therefore, wear of the base portion 4 and the positioning portion 3 due to the contact can be suppressed. As a result, it is possible to extend the life of the jig.

In addition, since the notch 39 is formed at the corner of the second through hole 3a, the corners of the semiconductor elements 21 and 22 arranged inside the second through hole 3a are not on the inner wall of the second through hole 3a. It can reduce the possibility of contact. Moreover, since the second through hole 3a having such a cutout portion 39 can be formed by processing using a relatively inexpensive end mill, the manufacturing cost of the jig can be reduced.

Embodiment 6.
<Jig configuration>
27 is a schematic cross-sectional view of a jig according to Embodiment 6. FIG. 28 is a schematic cross-sectional view for explaining a configuration example of the jig shown in FIG. 27. FIG. The jig shown in FIGS. 27 and 28 basically has the same configuration as the jig 1 shown in FIGS. different. That is, in the jig shown in FIGS. 27 and 28, an upper protruding portion 45 protruding from the inner peripheral surface of the first through hole 4a is formed on the first surface 4c side of the first through hole 4a. As a specific configuration for forming the upper projecting portion 45, for example, a configuration as shown in FIG. 28 can be adopted. That is, in jig 1 , base portion 4 includes first portion 47 , second portion 49 , and fixing pin 48 . The first portion 47 is stacked on the second portion 49 in the thickness direction. The first portion 47 is formed with a first surface side portion 4aa that continues to the first surface 4c at the first through hole 4a. The first portion 47 is connected to the second portion 49 . A portion 4ab other than the first surface side portion 4aa of the first through hole 4a is formed in the second portion 49. As shown in FIG. A fixing pin 48 is arranged to extend from the inside of the fixing through hole 47 a formed in the first portion 47 to the inside of the fixing opening 49 a formed in the second portion 49 . The fixing through hole 47a is formed at a position overlapping the fixing opening 49a.

<Effect>
In the above-described jig 1, in a cross section along the extending direction of the first through hole 4a, the width W1 of the first through hole 4a on the first surface 4c is the same as the width W1 at the central portion in the extending direction of the first through hole 4a. It is smaller than the width W7 of one through hole 4a.

In this case, the width W3 of the first through-hole 4a on the first surface 4c is relatively smaller than the width W7 of the first through-hole 4a at the central portion in the extending direction of the first through-hole 4a. It is difficult for the positioning portion 3 to protrude from the first surface 4c side. Therefore, even if the handling of the jig becomes complicated, the occurrence of the problem that the positioning portion 3 protrudes from the upper portion of the first through hole 4a of the base portion 4 and is separated from the base portion 4 can be suppressed. The width W3 of the first through hole 4a on the first surface 4c is preferably smaller than the width W1 of the positioning portion 3 on the first surface 4c side, which is the maximum width.

In the jig 1 described above, the base portion 4 includes a first portion 47 and a second portion 49 . The first portion 47 is formed with a first surface side portion 4aa that continues to the first surface 4c of the first through hole 4a. The first portion 47 is connected to the second portion 49 . A portion 4ab other than the first surface side portion 4aa of the first through hole 4a is formed in the second portion 49. As shown in FIG.

In this case, by combining the first portion 47 and the second portion 49, the width W3 of the first through hole 4a on the first surface 4c is equal to that of the first through hole 4a at the central portion in the extending direction of the first through hole 4a. It is possible to realize a base portion 4 which is relatively smaller than the width W7 of .

In the jig 1, the first portion 47 is formed with a fixing through hole 47a. A fixing opening 49a is formed in the second portion 49 at a position overlapping with the fixing through hole 47a when viewed from the first surface 4c side. The base portion 4 includes a fixing pin 48 that extends from the inside of the fixing through hole 47 a to the inside of the fixing opening 49 a and fixes the first portion 47 to the second portion 49 . In this case, the base portion 4 can be easily formed by fixing the first portion 47 and the second portion 49 with the fixing pin 48 .

In the insulating substrate 10, the amount of warp increases due to heating during soldering, and the amount of warp decreases during subsequent cooling. Therefore, it is preferable to determine the dimensions of the jig 1 in consideration of the maximum amount of warp of the insulating substrate 10 . Further, it is preferable that the material of the jig 1 is carbon, which is excellent in conductivity and whose temperature rises quickly when heated. Further, carbon is desirable as a constituent material of the jig 1 because it does not get wet with solder and is excellent in workability. A material different from the material of the positioning portion 3 may be used for the base portion 4 of the jig 1 that does not come into direct contact with the semiconductor elements 21 and 22 and the solder 23 . For example, the material of the base portion 4 may be copper, which is wettable with solder.

It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. As long as there is no contradiction, at least two of the embodiments disclosed this time may be combined. The scope of the present invention is indicated by the scope of the claims rather than the above description, and is intended to include all changes within the scope and meaning equivalent to the scope of the claims.

Reference Signs List 1, 5, 101, 105 jig 3 positioning portion 3a second through hole 3aa, 3ab, 101a through hole 3b convex portion 3c outer peripheral side wall 3d end surface 4 base portion 4a first through hole 4aa second 1 surface side portion 4ab portion 4b, 5a, 35 concave portion 4c first surface 4d second surface 10 insulating substrate 11 insulating layer 12 surface conductor pattern 13 back surface conductor pattern 21, 22 semiconductor element 23 Solder 24 Wire 30a, 30c Positioning portion 31, 31a, 31b Second projection 32 Wall 36 End 37 Chamfer 38 Mark for position detection 38a First mark 38b Second mark portion 39 notch portion 41, 41a, 41b first projection portion 41c chamfered portion 42 body portion 43 tapered portion 45 upper projection portion 47 first portion 47a fixing through hole 48 fixing pin , 49 second part, 49a fixing opening.

Claims (12)

A jig used for positioning a semiconductor element arranged on an upper surface of a plate-shaped member,
a base portion having a first surface and a second surface opposite to the first surface, the base portion having a first through hole extending from the first surface to the second surface; moreover,
a positioning portion disposed inside the first through-hole and formed with a second through-hole into which the semiconductor element is inserted;
The positioning portion is movable inside the first through hole, and the end portion of the positioning portion on the second surface side protrudes outward from the second surface by an amount equal to or larger than the amount of warp of the plate member. configured to
the base portion includes a first projecting portion projecting toward the inside of the first through hole,
The positioning portion includes a second protrusion that protrudes toward the base portion and is positioned closer to the first surface than the first protrusion,
When viewed from the first surface side of the base portion, the first projecting portion and the second projecting portion are arranged so as to overlap,
the positioning portion has a wall portion extending toward the first surface connected to the first surface side of the second projecting portion;
the side surface of the second through-hole includes the side surface of the second protrusion and the side surface of the wall;
The thickness of the positioning portion is the sum of the thicknesses of the second projecting portion and the wall portion,
the thickness of the first projecting portion is smaller than the thickness of the wall portion and smaller than the thickness of the base portion;
In a cross section along the extending direction of the first through-hole, the inner wall of the first through-hole is formed on the first surface such that the width of the first through-hole gradually decreases toward the first surface. A fixture that is tilted with respect to A jig used for positioning a semiconductor element arranged on an upper surface of a plate-shaped member,
a base portion having a first surface and a second surface opposite to the first surface, the base portion having a first through hole extending from the first surface to the second surface; moreover,
a positioning portion disposed inside the first through-hole and formed with a second through-hole into which the semiconductor element is inserted;
The positioning portion is movable inside the first through hole, and the end portion of the positioning portion on the second surface side protrudes outward from the second surface by an amount equal to or larger than the amount of warp of the plate member. configured to
the base portion includes a first projecting portion projecting toward the inside of the first through hole,
The positioning portion includes a second protrusion that protrudes toward the base portion and is positioned closer to the first surface than the first protrusion,
When viewed from the first surface side of the base portion, the first projecting portion and the second projecting portion are arranged so as to overlap,
the positioning portion has a wall portion extending toward the first surface connected to the first surface side of the second projecting portion;
the side surface of the second through-hole includes the side surface of the second protrusion and the side surface of the wall;
The thickness of the positioning portion is the sum of the thicknesses of the second projecting portion and the wall portion,
the thickness of the first projecting portion is smaller than the thickness of the wall portion and smaller than the thickness of the base portion;
In a cross section along the extending direction of the first through hole, the width of the first through hole on the first surface is the width of the first through hole at the central portion in the extending direction of the first through hole. A smaller jig. A jig used for positioning a semiconductor element arranged on an upper surface of a plate-shaped member,
a base portion having a first surface and a second surface opposite to the first surface, the base portion having a first through hole extending from the first surface to the second surface; moreover,
a positioning portion disposed inside the first through-hole and formed with a second through-hole into which the semiconductor element is inserted;
The positioning part is movable inside the first through hole, and the end of the positioning part on the second surface side protrudes outward from the second surface,
The jig, wherein the positioning portion includes a position detection mark portion formed on the first surface side surface. 4. The jig according to claim 3 , wherein the thickness of said base portion is greater than the thickness of said positioning portion in the thickness direction from said first surface to said second surface. In a cross section along the extending direction of the first through-hole, the inner wall of the first through-hole is formed on the first surface such that the width of the first through-hole gradually decreases toward the first surface. 5. A jig according to claim 3 or claim 4 , which is slanted with respect to . In a cross section along the extending direction of the first through hole, the width of the first through hole on the first surface is the width of the first through hole at the central portion in the extending direction of the first through hole. 5. A jig according to claim 3 or claim 4 , which is smaller. The base portion
a first portion having a first surface side portion continuous with the first surface of the first through hole;
7. The jig according to claim 6 , further comprising a second portion to which said first portion is connected and in which a portion other than said first surface side portion of said first through hole is formed. A fixing through-hole is formed in the first portion,
A fixing opening is formed in the second portion at a position overlapping with the fixing through hole when viewed from the first surface side,
8. The jig according to claim 7 , wherein the base portion includes a fixing pin that extends from the inside of the fixing through-hole to the inside of the fixing opening and fixes the first portion to the second portion. . 4. The jig according to claim 3 , wherein said mark portion for position detection includes a first mark portion and a second mark portion spaced apart from each other. A planar shape of the first through hole viewed from the first surface side is a polygonal shape,
A planar shape of the positioning portion viewed from the first surface side is a polygonal shape along the planar shape of the first through hole,
The jig according to any one of claims 1 to 9 , wherein a chamfered portion is formed at a corner portion of the planar shape of the positioning portion. The planar shape of the second through hole is a polygonal shape,
11. The jig according to any one of claims 1 to 10 , wherein a notch portion projecting outward is formed at a corner portion of the planar shape of the second through hole. preparing the plate member and the semiconductor element;
The jig according to any one of claims 1 to 11 is arranged on the plate member, and a bonding material and the semiconductor element are placed inside the second through hole in the positioning portion of the jig. arranging;
and fixing the semiconductor element to the plate member with the bonding material.

Images