JP7176623B2 - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物 Download PDF

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Publication number
JP7176623B2
JP7176623B2 JP2021515830A JP2021515830A JP7176623B2 JP 7176623 B2 JP7176623 B2 JP 7176623B2 JP 2021515830 A JP2021515830 A JP 2021515830A JP 2021515830 A JP2021515830 A JP 2021515830A JP 7176623 B2 JP7176623 B2 JP 7176623B2
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Japan
Prior art keywords
group
resin composition
maleimide
curable resin
compound
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JP2021515830A
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English (en)
Japanese (ja)
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JPWO2020217675A1 (ja
Inventor
智弘 下野
竜也 岡本
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DIC Corp
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DIC Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Pyrrole Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021515830A 2019-04-26 2020-02-20 硬化性樹脂組成物 Active JP7176623B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019086499 2019-04-26
JP2019086499 2019-04-26
PCT/JP2020/006776 WO2020217675A1 (ja) 2019-04-26 2020-02-20 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2020217675A1 JPWO2020217675A1 (ja) 2021-12-02
JP7176623B2 true JP7176623B2 (ja) 2022-11-22

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ID=72942343

Family Applications (1)

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JP2021515830A Active JP7176623B2 (ja) 2019-04-26 2020-02-20 硬化性樹脂組成物

Country Status (4)

Country Link
JP (1) JP7176623B2 (ko)
KR (1) KR102572049B1 (ko)
CN (1) CN113748149B (ko)
WO (1) WO2020217675A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115151582A (zh) * 2020-02-25 2022-10-04 三菱瓦斯化学株式会社 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂片和印刷电路板
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
WO2022092679A1 (ko) 2020-10-30 2022-05-05 주식회사 엘지에너지솔루션 전극 조립체 및 이를 포함하는 전지셀
TW202233705A (zh) * 2020-11-12 2022-09-01 日商味之素股份有限公司 樹脂組成物
JPWO2022145377A1 (ko) * 2020-12-28 2022-07-07
KR20240019380A (ko) * 2021-08-25 2024-02-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판
CN114230794B (zh) * 2021-12-31 2023-11-10 苏州生益科技有限公司 改性双马来酰亚胺预聚物及树脂组合物、应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004182850A (ja) 2002-12-03 2004-07-02 Mitsubishi Gas Chem Co Inc 特性バランスに優れるプリプレグ及び積層板
JP2012140010A (ja) 2006-10-24 2012-07-26 Hitachi Chemical Co Ltd 導体張積層板、印刷配線板及び多層配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853035B2 (ja) * 1975-10-09 1983-11-26 東洋ゴム工業株式会社 アンゼンタイヤ
JPH0539346A (ja) * 1991-03-28 1993-02-19 Sumitomo Chem Co Ltd ポリマレイミド化合物
JP3033327B2 (ja) * 1992-03-06 2000-04-17 住友化学工業株式会社 熱硬化性樹脂組成物およびそれを用いた銅張り積層板
US5399715A (en) * 1991-12-27 1995-03-21 Sumitomo Chemical Company, Limited Polyamino oligomers and polymaleimide compounds
CN103124474B (zh) * 2006-04-25 2017-11-28 日立化成株式会社 带粘接层的导体箔、贴有导体的层叠板、印制线路板及多层线路板
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
BR112013020348A2 (pt) * 2011-03-07 2016-10-18 Georgia Tech Res Inst membrana de separação de etano/etileno e processo para separar etano e etileno entre si
JP6575151B2 (ja) * 2015-06-05 2019-09-18 日立化成株式会社 熱硬化性樹脂組成物、並びにそれを用いたプリプレグ、積層板及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004182850A (ja) 2002-12-03 2004-07-02 Mitsubishi Gas Chem Co Inc 特性バランスに優れるプリプレグ及び積層板
JP2012140010A (ja) 2006-10-24 2012-07-26 Hitachi Chemical Co Ltd 導体張積層板、印刷配線板及び多層配線板

Also Published As

Publication number Publication date
CN113748149B (zh) 2024-05-24
KR102572049B1 (ko) 2023-08-30
KR20210137514A (ko) 2021-11-17
TW202106798A (zh) 2021-02-16
CN113748149A (zh) 2021-12-03
WO2020217675A1 (ja) 2020-10-29
JPWO2020217675A1 (ja) 2021-12-02

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