JP7176536B2 - 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 - Google Patents

接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 Download PDF

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JP7176536B2
JP7176536B2 JP2019568439A JP2019568439A JP7176536B2 JP 7176536 B2 JP7176536 B2 JP 7176536B2 JP 2019568439 A JP2019568439 A JP 2019568439A JP 2019568439 A JP2019568439 A JP 2019568439A JP 7176536 B2 JP7176536 B2 JP 7176536B2
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adhesive
film
epoxy resin
mass
adhesive composition
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JPWO2019150446A1 (ja
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慎太郎 橋本
祐樹 中村
智陽 山崎
健太 菊地
大輔 舛野
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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  • Engineering & Computer Science (AREA)
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  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
JP2019568439A 2018-01-30 2018-01-30 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 Active JP7176536B2 (ja)

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SG11202107968VA (en) * 2019-01-28 2021-08-30 Showa Denko Materials Co Ltd Adhesive composition, film-like adhesive, adhesive sheet and method for producing semiconductor device
WO2024070897A1 (ja) * 2022-09-29 2024-04-04 積水ポリマテック株式会社 組成物、皮膜、回路シート及びセンサシート

Citations (6)

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JP2007302881A (ja) 2006-04-11 2007-11-22 Hitachi Chem Co Ltd 接着剤組成物及び接着シート
JP2012214526A (ja) 2011-03-28 2012-11-08 Hitachi Chemical Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2013060524A (ja) 2011-09-13 2013-04-04 Hitachi Chemical Co Ltd フィルム状接着剤、接着シート、半導体装置及びその製造方法
JP2014175459A (ja) 2013-03-08 2014-09-22 Hitachi Chemical Co Ltd 半導体装置及び半導体装置の製造方法
JP2015122425A (ja) 2013-12-24 2015-07-02 日東電工株式会社 半導体装置の製造方法、半導体装置、包埋用接着フィルム、及びダイシング・ダイボンドフィルム
JP2016216562A (ja) 2015-05-18 2016-12-22 日東電工株式会社 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置

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