JP7170476B2 - Composition for Forming Heat Dissipating Member, Heat Dissipating Member, and Method for Producing Same - Google Patents

Description

TECHNICAL FIELD The present invention relates to a composition for forming a heat-dissipating member, a heat-dissipating member, a method for producing the heat-dissipating member, and a heat-dissipating member with an adhesive layer.

2. Description of the Related Art Conventionally, in electronic devices such as thermoelectric conversion devices, photoelectric conversion devices, and semiconductor devices such as large-scale integrated circuits, thermally conductive heat dissipating members have been used to dissipate generated heat. For example, as a method for efficiently dissipating heat generated from a semiconductor device to the outside, a sheet-like heat dissipating member (heat dissipating sheet) having excellent thermal conductivity is provided between the semiconductor device and the heat sink. there is

As exemplified in Patent Literature 1, the heat-dissipating sheet as described above is produced by coating a release film with a coating liquid containing a resin, a heat-dissipating filler, and a solvent as essential components, and drying the coating. In addition, if necessary, a release film is further laminated on the coating layer of the coating liquid. Here, in order to increase the thermal conductivity of the heat-dissipating sheet, it is desirable to increase the blending amount of the heat-dissipating filler.

Japanese Patent No. 3312723

However, when the heat-dissipating sheet is produced by the above method, the surface of the heat-dissipating sheet obtained after drying the coating solution is roughened and uneven. In this case, there is a problem that the contact area between the heat-dissipating sheet and the adherend is reduced and the thermal conductivity is lowered.

The present invention has been made in view of such actual circumstances, and provides a composition for forming a heat-dissipating member capable of obtaining a heat-dissipating member exhibiting high thermal conductivity with good reproducibility, and a composition for forming a heat-dissipating member exhibiting high thermal conductivity with good reproducibility. An object of the present invention is to provide a member, a method for manufacturing the same, and a heat dissipation member with an adhesive layer having the heat dissipation member.

In order to achieve the above object, firstly, the present invention contains a curable resin component and a filler made of a metal oxide or metal hydroxide, the resin component contains a polar monomer, and the resin component contains (Invention 1).

The composition for forming a heat dissipating member according to the above invention (Invention 1) has a low viscosity and dispersibility of the filler without using a solvent due to the combination of the filler made of a metal oxide or metal hydroxide and the polar monomer. good coating properties. Thereby, it is possible to obtain a heat dissipating member exhibiting high thermal conductivity with good reproducibility.

In the above invention (invention 1), it is preferable that the filler content is 30% by mass or more and 96% by mass or less (invention 2).

In the above inventions (inventions 1 and 2), the polar monomer is preferably a hydroxyl group-containing monomer (invention 3).

Secondly, the present invention provides a heat dissipating member obtained by curing the composition for forming a heat dissipating member (Inventions 1 to 3) (Invention 4).

It is preferable that the heat dissipating member according to the above invention (invention 4) has a residual rate of 90% by mass or more after being immersed in ethyl acetate at 23° C. for 24 hours (invention 5).

In the above inventions (inventions 4 and 5), the average particle size of the filler is preferably less than the thickness of the heat dissipating member (invention 6).

The heat dissipating member according to the above inventions (inventions 4 to 6) is preferably in the form of a sheet (invention 7).

Thirdly, the present invention comprises a step of coating a first release sheet with a non-solvent curable composition for forming a heat dissipating member, and a second release sheet on the coating layer of the composition for forming a heat dissipating member. and curing the composition for forming a heat radiating member (Invention 8).

In the above invention (invention 8), it is preferable that the composition for forming a heat radiating member is active energy ray-curable, and that the composition for forming a heat radiating member is cured by irradiation with an active energy ray (invention 9).

Fourthly, the present invention provides a heat dissipating member with an adhesive layer (invention 10), which has an adhesive layer on at least one surface of the heat dissipating member (inventions 4 to 7).

According to the composition for forming a heat dissipating member and the method for producing a heat dissipating member according to the present invention, a heat dissipating member having high thermal conductivity can be obtained with good reproducibility. Moreover, the heat radiating member and the heat radiating member with an adhesive layer according to the present invention have high thermal conductivity with good reproducibility.

1 is a cross-sectional view of a heat radiating member (with a release sheet) according to one embodiment of the present invention; FIG. 1 is a cross-sectional view of a heat dissipating member with an adhesive layer according to one embodiment of the present invention; FIG.

Embodiments of the present invention will be described below.
[Composition for Forming Heat Dissipating Member]
A composition for forming a heat dissipating member according to one embodiment of the present invention (hereinafter sometimes referred to as "composition C for forming a heat dissipating member") comprises a curable resin component (A), a metal oxide or a metal hydroxide It contains a filler (B) consisting of The resin component (A) contains a polar monomer, and the proportion of the polar monomer in the resin component (A) is 20% by mass or more.

The composition C for forming a heat radiating member has low viscosity, good filler dispersibility, and coatability without using a solvent due to the combination of a filler made of a metal oxide or a metal hydroxide and a polar monomer. Excellent for As a result, it is possible to obtain a heat dissipating member (especially a sheet-like heat dissipating member) that exhibits high thermal conductivity with good reproducibility.

The composition C for forming a heat radiating member that does not use a solvent is preferable from the viewpoint of environmental problems and working environment measures. However, the present invention does not exclude the use of a solvent added to the composition C for forming a heat dissipating member, as long as the desired effects of the present invention can be obtained.

1. Components (1) Resin component (A)
The resin component (A) in this embodiment is a curable resin component. Types of curability include active energy ray curability, thermosetting, and the like, and among them, active energy ray curability is preferable from the viewpoint of ease of handling.

The resin component (A) in this embodiment contains a polar monomer. The polar monomer is preferably a monomer containing at least one selected from a hydroxyl group, a carboxyl group, an amino group and an amide group as a polar group, particularly a (meth)acryloyl group containing a (meth)acryloyl group together with a polar group. Containing monomers are preferred. In addition, in this specification, (meth)acryloyl means both acryloyl and methacryloyl. The same applies to other similar terms.

Such polar monomers include, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, (meth) ) hydroxyalkyl (meth)acrylates such as 3-hydroxybutyl acrylate and 4-hydroxybutyl (meth)acrylate; saturated carboxylic acid; monoalkyl (meth)acrylates such as monomethylaminoethyl (meth)acrylate, monoethylaminoethyl (meth)acrylate, monomethylaminopropyl (meth)acrylate, and monoethylaminopropyl (meth)acrylate aminoalkyl; and acrylamides such as N-methylolmethacrylamide. These polar monomers may be used alone or in combination of two or more.

Among the above, monomers having a hydroxyl group (hydroxyl group-containing monomers) are preferred. According to the hydroxyl group-containing monomer, in combination with the filler (B) composed of a metal oxide or metal hydroxide, the filler (B) has good dispersibility, and the obtained composition C for forming a heat radiating member has a viscosity of can be effectively reduced. As a result, a heat dissipating member having higher thermal conductivity can be manufactured with better reproducibility.

As the hydroxyl group-containing monomer, a (meth)acryloyl group-containing monomer having a hydroxyl group is preferable, and specifically, the above-mentioned (meth)acrylic acid hydroxyalkyl ester is preferable. Among them, 2-hydroxyethyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate is preferable from the viewpoint of the viscosity-reducing effect or coatability, particularly 2-hydroxyethyl acrylate or 4-hydroxybutyl acrylate. is preferred.

Incidentally, the viscosity of (meth)acryloyl group-containing monomers having a hydroxyl group (especially 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate) is generally 500 mPa s or less, which is considerably low. indicate a value.

In order to obtain high thermal conductivity with good reproducibility, the proportion of the polar monomer in the resin component (A) should be 20% by mass or more, preferably 40% by mass or more, and particularly preferably 60% by mass. % or more, more preferably 80 mass % or more. The upper limit of the ratio of the polar monomer in the resin component (A) is 100% by mass.

The resin component (A) may contain at least one of monomers (other monomers) other than the above polar monomers and oligomers in order to develop other properties such as adhesiveness and flexibility of the obtained heat dissipating member. good.

As the above-mentioned other monomer, it is preferable to use the above-mentioned (meth)acryloyl group-containing monomer having no polar group (hereinafter sometimes referred to as "(meth)acryloyl group-containing monomer M"). This (meth)acryloyl group-containing monomer M may be used alone or in combination of two or more.

As the (meth)acryloyl group-containing monomer M, for example, (meth)acrylic acid alkyl esters having alkyl groups of 1 to 20 carbon atoms are preferred. Alkyl groups may be straight or branched. Examples of (meth)acrylic acid alkyl esters in which the alkyl group has 1 to 20 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, and pentyl (meth)acrylate. Acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, myristyl (meth)acrylate, palmityl (meth)acrylate, stearyl (meth)acrylate Acrylate, lauryl (meth)acrylate and the like. Among these, from the viewpoint of imparting flexibility to the formed heat dissipating member, (meth)acrylic acid alkyl esters having 1 to 10 carbon atoms in the alkyl group are preferable, and in particular, exhibit high adhesive strength to various adherends. From this point of view, alkyl acrylates having alkyl groups of 4 to 8 carbon atoms are preferred. Specifically, butyl acrylate, isooctyl acrylate, or 2-ethylhexyl acrylate is preferred.

Moreover, as the (meth)acryloyl group-containing monomer M, a (meth)acrylate having an alicyclic structure in the molecule (alicyclic structure-containing (meth)acrylate) is also preferably exemplified. The alicyclic structure-containing (meth)acrylate has a bulky alicyclic structure, can provide an appropriate distance between formed polymers, and can impart flexibility to the obtained heat dissipating member.

Examples of alicyclic structure-containing (meth)acrylates include cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, adamantyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl (meth)acrylate, cyclopentenyloxyethyl (meth)acrylate and the like. Among these, dicyclopentanyl acrylate, adamantyl acrylate, or isobornyl acrylate is preferable from the viewpoint of imparting flexibility.

As the (meth)acryloyl group-containing monomer M, when the (meth)acrylic acid alkyl ester having 1 to 20 carbon atoms and the alicyclic structure-containing (meth)acrylate are used in combination, the mass ratio thereof is 90. :1 to 50:50, particularly preferably 90:10 to 60:40, further preferably 80:20 to 70:30.

The oligomer may have the polar group described above, or may not have the polar group described above.

Examples of the oligomer include polyester, epoxy, urethane, polyether, polybutadiene, and silicone oligomers having a radically polymerizable group. Among these, urethane oligomers having a radically polymerizable group (polymerizable urethane oligomers) are preferred from the viewpoint of imparting flexibility and improving cohesive strength.

In order to achieve the above viscosity, the upper limit of the polymerization average molecular weight of the polymerizable urethane oligomer is preferably 100,000 or less, particularly preferably 50,000 or less, and further preferably 20,000 or less. Preferably. On the other hand, the lower limit of the polymerization average molecular weight of the polymerizable urethane oligomer is preferably 1,000 or more, more preferably 3,000 or more, particularly preferably 5,000 or more, and further preferably 8 ,000 or more. In addition, the weight average molecular weight in this specification is the value of standard polystyrene conversion measured by the gel permeation chromatography (GPC) method.

The polymerizable urethane oligomer is preferably polyfunctional, and the polymerizable groups possessed by the polymerizable urethane oligomer are preferably present at terminals, particularly at both terminals. As the type of the polymerizable group, for example, a (meth)acryloyl group, a vinyl group, or the like is preferable, and a (meth)acryloyl group is particularly preferable. That is, the polymerizable urethane oligomer is preferably a urethane acrylate oligomer.

The urethane acrylate oligomer is a polyurethane oligomer obtained by reacting a compound such as polyalkylene polyol, polyether polyol, polyester polyol, hydrogenated isoprene having a terminal hydroxyl group, or hydrogenated butadiene having a terminal hydroxyl group with a polyisocyanate. can be obtained by esterification with (meth)acrylic acid or (meth)acrylic acid derivatives.

Among the urethane acrylate oligomers, polyether urethane acrylate is particularly preferable from the viewpoint of dispersibility of the filler (B).

The above oligomers may be used singly or in combination of two or more. It is also preferable to use the oligomer together with the (meth)acryloyl group-containing monomer M described above.

When the resin component (A) contains a polar monomer and a (meth)acryloyl group-containing monomer M, the proportion of the polar monomer in the resin component (A) is preferably 20% by mass or more, particularly 40% by mass. % or more is preferable. On the other hand, the ratio is preferably 80% by mass or less, particularly preferably 60% by mass or less. The (meth)acryloyl group-containing monomer M in the resin component (A) is preferably 20% by mass or more, particularly preferably 40% by mass or more. On the other hand, the ratio is preferably 80% by mass or less, particularly preferably 60% by mass or less. When each component is in the above ratio, it is possible to effectively improve the adhesiveness and flexibility while keeping the viscosity low.

When the resin component (A) contains a polar monomer, a (meth)acryloyl group-containing monomer M, and an oligomer, the proportion of the polar monomer in the resin component (A) is preferably 20% by mass or more. , particularly preferably 30% by mass or more, more preferably 35% by mass or more. On the other hand, the ratio is preferably 80% by mass or less, particularly preferably 60% by mass or less, and further preferably 50% by mass or less. The proportion of the (meth)acryloyl group-containing monomer M in the resin component (A) is preferably 10% by mass or more, particularly preferably 20% by mass or more, and further preferably 40% by mass or more. is preferred. On the other hand, the ratio is preferably 70% by mass or less, particularly preferably 60% by mass or less, and further preferably 50% by mass or less. Moreover, the proportion of the oligomer in the resin component (A) is preferably 1% by mass or more, particularly preferably 5% by mass or more, and further preferably 10% by mass or more. On the other hand, the ratio is preferably 50% by mass or less, particularly preferably 40% by mass or less, and further preferably 20% by mass or less. When each component is in the above ratio, it is possible to effectively improve the adhesiveness and flexibility while keeping the viscosity low.

The content of the resin component (A) in the composition C for forming a heat dissipating member is preferably 4% by mass or more, particularly preferably 8% by mass or more, and further preferably 12% by mass or more. preferable. As a result, the viscosity of the composition C for forming a heat radiating member can be kept low, and the coatability can be improved, and the obtained heat radiating member has high thermal conductivity with good reproducibility. On the other hand, the content of the resin component (A) is preferably 50% by mass or less, more preferably 40% by mass or less, particularly preferably 30% by mass or less, and further preferably 15% by mass or less. is preferably Thereby, the content of the filler (B) can be ensured, and the heat dissipation property of the obtained heat dissipation member can be made excellent.

(2) Filler (B)
The filler (B) contained in the composition C for forming a heat radiating member is composed of a metal oxide or a metal hydroxide. Such a material has excellent thermal conductivity, that is, excellent heat dissipation, and also has excellent dispersibility in the resin component (A) containing 20% by mass or more of polar monomers.

Note that "consisting of a metal oxide or a metal hydroxide" does not mean "consisting only of a metal oxide or a metal hydroxide". This means that it may contain components other than metal oxides and metal hydroxides.

Examples of metal oxides include aluminum oxide, magnesium oxide, zinc oxide, titanium oxide, and iron oxide. Moreover, aluminum hydroxide, magnesium hydroxide, etc. are mentioned as a metal hydroxide. Among them, aluminum oxide (alumina) is particularly preferable because of its excellent heat dissipation and dispersibility. In addition, since aluminum oxide does not have electrical conductivity, it is preferable from that point of view when it is used for applications that require insulation. In addition, the said filler (B) may be used individually by 1 type, and may be used in combination of 2 or more type.

The shape of the filler (B) includes, for example, granular, needle-like, plate-like, scale-like, and irregular shapes, and the granular shape includes roundness, spherical, polygonal, and the like. The term “rounded shape” as used herein means a shape that is rounded as a whole, and includes shapes such as a spherical shape, an ellipsoidal shape, and an egg shape. Instead, it also includes a shape having a flat surface.

Among the above, it is preferable to use at least round or spherical granular fillers, and it is also preferable to use a combination of granular fillers and amorphous fillers. When a granular filler and an irregular filler are combined, it is preferable to use a combination of a round or spherical filler and an irregular filler, and it is particularly preferable to use a combination of a round filler and an irregular filler. . In these cases, the filling rate of the filler (B) in the obtained heat dissipating member is improved, an efficient heat conduction path is formed in the heat dissipating member, and as a result, the heat dissipating member has better heat dissipation.

The average particle size of the filler (B) is preferably less than the intended thickness of the heat dissipating member. As a result, the thermal conductivity of the obtained heat dissipating member can be increased with good reproducibility.

When the filler (B) is granular, its average particle size is preferably 8 μm or more, more preferably 15 μm or more, particularly preferably 25 μm or more, and further preferably 30 μm or more. preferable. Moreover, the average particle diameter is preferably 100 μm or less, particularly preferably 70 μm or less, and further preferably 40 μm or less. When the average particle size of the granular filler is within the above range, the filling rate of the filler (B) in the obtained heat dissipating member can be increased, and the heat dissipating property can be improved with good reproducibility.

When the shape of the filler (B) is irregular, the average particle diameter thereof is preferably 0.1 μm or more, particularly preferably 0.5 μm or more, and further preferably 1.0 μm or more. preferable. The average particle size is preferably 7 μm or less, particularly preferably 4 μm or less, and more preferably 2 μm or less. When the average particle size of the irregular filler is in the above range, the filling rate of the filler (B) in the obtained heat dissipating member can be increased, and the heat dissipating property can be improved with good reproducibility.

In addition, the average particle size of the filler in this specification refers to the particle size calculated as the arithmetic mean value of the major axis diameters of 20 randomly selected fillers measured with an electron microscope.

The content of the filler (B) in the composition C for forming a heat radiating member is preferably 30% by mass or more, more preferably 50% by mass or more, and particularly preferably 70% by mass or more. Furthermore, it is preferably 85% by mass or more. This makes it possible to increase the filling rate of the filler (B) in the obtained heat dissipating member, resulting in more excellent heat dissipating properties. On the other hand, the content of the filler (B) is preferably 96% by mass or less, particularly preferably 92% by mass or less, further preferably 88% by mass or less. As a result, a heat dissipating member having a higher thermal conductivity can be obtained with good reproducibility.

(3) Photoinitiator (C)
When the resin component (A) is active energy ray-curable and ultraviolet rays are used as the active energy ray for curing, the composition C for forming a heat radiating member further contains a photopolymerization initiator (C). It is preferable to contain. By containing the photopolymerization initiator (C) in this way, the resin component (A) can be efficiently polymerized, and the polymerization curing time and the irradiation dose of the active energy ray can be reduced.

Examples of such a photopolymerization initiator (C) include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy -2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4- (methylthio)phenyl]-2-morpholino-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylamino Benzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertiary-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2 , 4-diethylthioxanthone, benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylaminobenzoate, oligo[2-hydroxy-2-methyl-1[4-(1-methylvinyl)phenyl]propanone], 2,4 ,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide and the like. These may be used alone or in combination of two or more.

The content of the photopolymerization initiator (C) in the heat-dissipating member-forming composition C is preferably 0.1 parts by mass or more, particularly 0.5 parts by mass, with respect to 100 parts by mass of the resin component (A). It is preferably at least 1 part. Moreover, the content of the photopolymerization initiator (C) is preferably 10 parts by mass or less, particularly preferably 5 parts by mass or less.

(4) Various Additives Various additives such as tackifiers, flame retardants, antioxidants, light stabilizers, softeners, rust preventives, etc. may be added to the composition C for forming a heat dissipating member, if desired. can be done.

2. Preparation of Composition for Forming Heat Dissipating Member The composition C for forming a heat dissipating member is prepared by mixing each component as the resin component (A) with a filler (B), and optionally adding a photopolymerization initiator (C) and an additive. can be produced by adding

Here, due to the combination of the resin component (A) and the filler (B), the composition C for forming a heat dissipating member according to the present embodiment has a low viscosity even when the filler (B) is contained in a large amount. Excellent in nature. Therefore, the composition C for forming a heat radiating member can be used as it is as a coating liquid without adding a solvent or the like. That is, it is preferable that the composition C for forming a heat radiating member according to this embodiment does not contain a solvent. This eliminates the need for a drying step for volatilizing the solvent after coating, prevents the surface from becoming rough due to drying, and makes it possible to obtain a heat radiating member having a higher thermal conductivity.

[Heat dissipation member]
The heat dissipating member according to this embodiment is obtained by curing the composition C for forming a heat dissipating member according to the embodiment described above. The shape of the heat dissipating member according to this embodiment is not particularly limited, and may be sheet-like, plate-like, block-like, or the like, but the sheet-like shape that can be manufactured by coating is preferable. A sheet-shaped heat dissipation member will be described below as an example.

As shown in FIG. 1, a first release sheet 11a is laminated on one surface (the upper surface in FIG. 1) of a heat radiating member 1 according to this embodiment as an example, and the other side of the heat radiating member 1 is laminated. 2 (lower side in FIG. 1) is laminated with a second release sheet 11b. Each of the release sheets 11a and 11b is laminated on the heat radiating member 1 so that the release surfaces thereof are in contact with the heat radiating member 1. As shown in FIG. In this specification, the release surface of the release sheet refers to the surface of the release sheet that has releasability, and includes both the surface that has been subjected to a release treatment and the surface that exhibits releasability without being subjected to a release treatment. .

1. Each Member (1) Heat Dissipating Member The heat dissipating member 1 in this embodiment is obtained by curing the composition C for forming a heat dissipating member according to the embodiment described above, and is in the form of a sheet in this embodiment.

The lower limit of the thickness of the heat radiating member 1 (value measured according to JIS K7130) is preferably 1 μm or more, more preferably 10 μm or more, and particularly preferably 20 μm or more. It is preferably 100 μm or more in order to exhibit followability to a rough surface. When the lower limit value of the thickness of the heat radiating member 1 is above, it is easy to exhibit the desired heat radiating property. In addition, the filler (B) having a particle size that is excellent in heat dissipation can be filled in the heat dissipating member 1 without protruding from the surface of the heat dissipating member 1, and the thermal conductivity of the heat dissipating member 1 can be maintained high. can be done.

The upper limit of the thickness of the heat radiating member 1 is preferably 1000 μm or less, more preferably 500 μm or less, particularly preferably 300 μm or less, and 40 μm or less when maximizing heat dissipation. is preferably When the upper limit value of the thickness of the heat dissipating member 1 is the above, it can be manufactured by one coating of the composition C for forming a heat dissipating member, and is suitable for use in devices that require thinness. becomes. In addition, the heat radiating member 1 may be formed as a single layer, or may be formed by laminating a plurality of layers.

The heat radiating member 1 preferably has a residual rate after being immersed in ethyl acetate at 23° C. for 24 hours (residual rate after solvent immersion) of 90% by mass or more, particularly preferably 94% by mass or more. is preferably 96% by mass or more. As a result, the heat dissipating member 1 has a very high cohesive force, and it is possible to effectively prevent a phenomenon in which the filler (B) changes its arrangement due to heat and causes a change in the heat dissipating property. That is, even under repeated heating, the reproducibility of thermal conductivity is more excellent. The upper limit of the residual ratio after immersion in the solvent is not particularly limited, but is preferably 100% by mass or less, and particularly preferably 99% by mass or less. Here, the details of the method for measuring the residual rate of the heat dissipating member after being immersed in the solvent in the present specification are as shown in the test examples described later.

The thermal conductivity of the heat dissipating member 1 at 23° C. and 50% RH (value measured according to ISO 22007-3) is preferably 1.5 W/m K or more, particularly 1.8 W/m K. It is preferably 2.0 W/m·K or more, more preferably 2.0 W/m·K or more. Accordingly, it can be said that the heat dissipation member 1 is excellent in heat dissipation. The heat dissipating member 1 obtained by curing the composition C for forming a heat dissipating member described above can satisfy the above thermal conductivity. Although the upper limit of the thermal conductivity of the heat radiating member 1 at 23° C. and 50% RH is not particularly limited, it is usually preferably 14 W/m·K or less, particularly 7 W/m·K or less. preferable.

Moreover, the difference (width) between the maximum value and the minimum value obtained by measuring the thermal conductivity of any 10 samples of the heat radiating member 1 is preferably 0.7 W/m·K or less, and 0.7 W/m·K or less. It is more preferably 4 W/m·K or less, particularly preferably 0.3 W/m·K or less, further preferably 0.2 W/m·K or less. Therefore, it can be said that the reproducibility of the thermal conductivity is good.

(2) Release Sheets Examples of the release sheets 11a and 11b include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, and polyethylene film. Phthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylate copolymer film, polystyrene film, polycarbonate film , a polyimide film, a fluororesin film, or the like is used. Crosslinked films of these are also used. Furthermore, a laminated film of these may be used.

The release surfaces of the release sheets 11a and 11b (especially the surfaces in contact with the heat radiating member 1) are preferably subjected to a release treatment. Examples of release agents used in the release treatment include alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based release agents.

Although the thickness of the release sheets 11a and 11b is not particularly limited, it is usually about 20 to 150 μm.

2. Manufacture of Heat Dissipating Member In a method for manufacturing a heat dissipating member according to an embodiment of the present invention, a solvent-free curable composition for forming a heat dissipating member is applied to a first release sheet, and a second release sheet is applied to the coating layer. A heat dissipating member is produced by laminating the release sheets of (1) and curing the composition for forming a heat dissipating member. According to this method, since the composition for forming a heat-dissipating member is solvent-free, a drying process for volatilizing the solvent after coating is not required. parts can be obtained.

As the solvent-free curable composition for forming a heat dissipating member, the above-described composition C for forming a heat dissipating member is preferable. As a result, it is possible to obtain a heat dissipating member exhibiting high thermal conductivity with good reproducibility. When the composition C for forming a heat dissipating member is active energy ray-curable, as an example of manufacturing the heat dissipating member 1, the composition C for forming a heat dissipating member is applied to the release surface of one of the release sheets 11a (or 11b). By doing so, a coating layer is formed. Next, the release surface of the other release sheet 11b (or 11a) is overlaid on the coating layer and press-bonded. After that, the coating layer is irradiated with a predetermined amount of active energy rays to cure the composition C for forming a heat radiating member, thereby forming the heat radiating member 1 .

The application layer may be irradiated with active energy rays through one release sheet 11a (or 11b) or through both release sheets 11a and 11b. In order to efficiently and reliably cure the composition C for forming a heat radiating member, it is preferable to irradiate the active energy ray through both the release sheets 11a and 11b.

A desired position between the first release sheet 11a and the second release sheet 11b (for example, when the release sheets 11a and 11b are long, both end edges along the longitudinal direction; the release sheets 11a and 11b In the case of a rectangular shape, spacers having a predetermined thickness may be interposed at the edges of each side. In this state, the laminate of the first release sheet 11a/the coating layer of the composition C for forming a heat radiating member/the second release sheet 11b is press-bonded to obtain the thickness of the coating layer of the composition C for forming a heat radiating member. can be adjusted to the thickness of the spacer, and the heat radiating member 1 having a desired thickness can be easily formed.

As a method for applying the coating liquid of the composition C for forming a heat radiating member, for example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like can be used.

Here, the active energy ray refers to an electromagnetic wave or a charged particle beam that has energy quanta, and specifically includes ultraviolet rays, electron beams, and the like. Among active energy rays, ultraviolet rays are particularly preferable because they are easy to handle.

Irradiation with ultraviolet rays can be performed by a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, or the like, and the irradiation amount of ultraviolet rays is preferably about 50 to 300 mW/cm ² . The amount of light is preferably 50-2000 mJ/cm ² , more preferably 100-1000 mJ/cm ² , and particularly preferably 200-600 mJ/cm ² . On the other hand, electron beam irradiation can be performed by an electron beam accelerator or the like, and the electron beam irradiation dose is preferably about 1 to 1000 krad. When the irradiation amount of the active energy ray is within the above range, the composition C1 for forming a heat-dissipating sheet can be efficiently cured.

The composition C for forming a heat radiating member can be cured by irradiation with an active energy ray and heat treatment, but it is preferable to only irradiate with an active energy ray. This makes it possible to prevent thermal deterioration, thermal shrinkage, etc. of the resin film or the like to which the composition C for forming a heat radiating member is applied. In addition, by not heating, loss of volatile components in the composition C for forming a heat radiating member due to heating can be suppressed.

[Heat dissipation member with adhesive layer]
A heat dissipating member with an adhesive layer according to one embodiment of the present invention has an adhesive layer on at least one surface of the heat dissipating member according to the above-described embodiment. For example, in the case of a sheet-like or plate-like heat dissipating member, one main surface or both main surfaces thereof have an adhesive layer, and in the case of a block-like heat dissipating member, for example, the largest area It has a pressure-sensitive adhesive layer on the surface having Hereinafter, a case in which both main surfaces of a sheet-like heat radiating member have pressure-sensitive adhesive layers will be described as an example.

As shown in FIG. 2 , the pressure-sensitive adhesive layer-attached heat dissipation member 2 according to one embodiment of the present invention includes a heat dissipation member 1 and a first The adhesive layer 21a, the second adhesive layer 21b laminated on the other surface (the lower surface in FIG. 2) of the heat radiating member 1, and the heat radiating member 1 side in the first adhesive layer 21a A release sheet 22a is laminated on the opposite surface, and a release sheet 22b is laminated on the surface of the second adhesive layer 21b opposite to the heat radiating member 1 side. The release sheets 22a and 22b are laminated on the adhesive layers 21a and 21b so that their release surfaces are in contact with the adhesive layers 21a and 21b.

The heat dissipation member 1 is the heat dissipation member 1 according to the embodiment described above. Also, the release sheets 22a and 22b are the same as the release sheets 11a and 11b in the above-described embodiment.

The types of adhesives constituting the first adhesive layer 21a and the second adhesive layer 21b are not particularly limited, and examples include acrylic adhesives, polyester adhesives, polyurethane adhesives, and rubber adhesives. , a silicone-based pressure-sensitive adhesive, or the like. The adhesive may be emulsion type, solvent type or non-solvent type, and may be crosslinked or non-crosslinked. Among them, acrylic pressure-sensitive adhesives are preferred because of their excellent adhesive physical properties.

In addition, the acrylic pressure-sensitive adhesive may be active energy ray-curable or non-active energy ray-curable. A curable acrylic pressure-sensitive adhesive is preferred. As the active energy ray non-curable acrylic pressure-sensitive adhesive, a cross-linking type is particularly preferable, and a thermal cross-linking type is more preferable.

The pressure-sensitive adhesives constituting the first pressure-sensitive adhesive layer 21a and the second pressure-sensitive adhesive layer 21b may be the same or different, and may be appropriately designed according to the type of the adherend. Just do it.

Moreover, the first adhesive layer 21a and the second adhesive layer 21b may contain a filler having excellent thermal conductivity as long as desired adhesive strength is obtained.

The thickness of each of the first adhesive layer 21a and the second adhesive layer 21b is preferably 1 μm or more, particularly preferably 5 μm or more, further preferably 10 μm or more. Thereby, it becomes possible to obtain preferable adhesive strength. The thicknesses of the first adhesive layer 21a and the second adhesive layer 21b are each preferably 100 μm or less, particularly preferably 50 μm or less, and further preferably 20 μm or less. Accordingly, it is possible to prevent the thermal conductivity and heat dissipation of the heat dissipation member 1 from being hindered.

The storage elastic modulus at 23° C. and 1 Hz of the first adhesive layer 21a and the second adhesive layer 21b is preferably 10 MPa or less, particularly preferably 1 MPa or less, and further preferably 0.2 MPa. The following are preferable. This makes it easier for the heat radiating member 2 with the pressure-sensitive adhesive layer to follow the adherend and to be in close contact with the adherend. The storage modulus is preferably 0.01 MPa or more, particularly preferably 0.07 MPa or more, and further preferably 0.12 MPa or more. Thereby, the strength of the first adhesive layer 21a and the second adhesive layer 21b is ensured, and the durability of the heat dissipation member 2 with the adhesive layer is improved.

A manufacturing method as an example of the heat radiating member 2 with the pressure-sensitive adhesive layer will be described.
First, a first adhesive sheet having a first adhesive layer 21a formed on the release surface of the release sheet 22a and a second adhesive sheet having a second adhesive layer 21b formed on the release surface of the release sheet 22b. Prepare an adhesive sheet. These can be manufactured by a conventional method.

Next, the heat dissipating member 1 is prepared with the release sheets 11a and 11b removed, and the first adhesive sheet is attached to one surface of the heat dissipating member 1 via the first adhesive layer 21a. Also, a second adhesive sheet is attached to the other surface of the heat dissipating member 1 via the second adhesive layer 21b. Thereby, said heat radiating member 2 with an adhesive layer can be obtained.

The adhesive strength of the heat dissipation member 2 with an adhesive layer according to the present embodiment to stainless steel (SUS304, #360 polished) is preferably 1 N/25 mm or more, particularly preferably 4 N/25 mm or more, and furthermore It is preferably 8 N/25 mm or more. As a result, adhesion to heat-generating members and heat-dissipating members is ensured. The adhesive strength is preferably 50 N/25 mm or less, particularly preferably 40 N/25 mm or less, and more preferably 30 N/25 mm or less. As a result, good reworkability can be obtained, and re-bonding becomes possible even when a bonding error occurs. This adhesive strength basically refers to the adhesive strength measured by the 180-degree peeling method according to JIS Z0237:2009, and the specific measuring method is as shown in the test examples described later.

The heat dissipating member 2 with an adhesive layer according to the present embodiment is formed by bonding a heat-generating member, such as various semiconductor devices, LED light emitting elements, optical pickups, power transistors, and other electronic devices to a heat dissipating substrate or the like. Also, it is suitable for adhering a heat sink or the like to these heat-generating members. Also, the member that generates heat may be a battery, a battery, a motor, an engine, or the like, in addition to various electronic devices such as mobile terminals and wearable terminals. The material of the adherend may be metal, ceramics, glass, semiconductor, plastic, graphite, carbon nanofiber, or the like, but a material having heat conductivity is preferable.

The embodiments described above are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is meant to include all design changes and equivalents that fall within the technical scope of the present invention.

For example, one of the release sheets 22a and 22b in the heat dissipation member 2 with an adhesive layer may be omitted. Further, another layer may be interposed between the heat dissipating member 1 and the adhesive layers 21a and 21b in the heat dissipating member 2 with an adhesive layer.

EXAMPLES The present invention will be described in more detail with reference to Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

[Example 1]
1. Preparation of Composition for Forming Heat Dissipating Member 100 parts by mass of 2-hydroxyethyl acrylate as resin component (A) and alumina filler (manufactured by Showa Denko Co., Ltd., product name “AS-400”; average particle size 400 parts by mass of a mixture of a round filler with a diameter of 35 μm and an irregular shaped filler with an average particle size of 1.5 μm) and 3 parts by mass of 1-hydroxycyclohexylphenyl ketone as a photopolymerization initiator (C) are mixed, and dispersed. A composition for forming a heat radiating member was obtained by stirring for 1 minute.

2. Manufacture of heat dissipating member The composition for forming a heat dissipating member obtained in the above step 1 is used as a release sheet (first release sheet; manufactured by Lintec Corporation, product name "SP -PET751031") was coated with an applicator.

Next, the coating layer on the release sheet obtained above and a release sheet obtained by releasing a polyethylene terephthalate film on one side with a silicone release agent (second release sheet; product name "SP-PET751130" manufactured by Lintec Corporation). were laminated so that the release-treated surface of the release sheet was in contact with the coating layer, and pressure-bonded using a hand roller (1.25 kg).

After that, from each side of the two release sheets, the coating layer is irradiated with active energy rays (ultraviolet rays) once under the following conditions to cure the coating layer of the composition for forming a heat dissipating member. , a sheet-like heat dissipation member having a thickness of 150 μm was formed.
<Active energy ray irradiation conditions>
・Using a high-pressure mercury lamp ・Illuminance 180mW/cm ² , Light intensity 230mJ/cm ²
・Using “UVPF-A1” manufactured by Eye Graphics Co., Ltd. for UV illuminance and photometer

[Example 2]
A heat radiating member was produced in the same manner as in Example 1, except that 100 parts by mass of 4-hydroxybutyl acrylate was used as the resin component (A) instead of 100 parts by mass of 2-hydroxyethyl acrylate.

[Example 3]
In the same manner as in Example 1, except that 50 parts by mass of 4-hydroxybutyl acrylate and 50 parts by mass of 2-ethylhexyl acrylate were used instead of 100 parts by mass of 2-hydroxyethyl acrylate as the resin component (A). A heat dissipating member was manufactured.

[Example 4]
Polyether urethane acrylate having a weight average molecular weight of 9,900 as a urethane acrylate oligomer obtained by polymerizing 1 mol of polypropylene glycol having a weight average molecular weight of 9,200, 2 mol of isophorone diisocyanate, and 2 mol of 2-hydroxyethyl acrylate. got

The weight average molecular weights of polypropylene glycol and polyether urethane acrylate are standard polystyrene conversion values measured by gel permeation chromatography (GPC) under the following conditions.
<Measurement conditions>
・ Measuring device: HLC-8320 manufactured by Tosoh Corporation
・ GPC column (passed in the following order): TSK gel superH-H manufactured by Tosoh Corporation
TSK gel super HM-H
TSK gel super H2000
・Measurement solvent: tetrahydrofuran ・Measurement temperature: 40°C

As the resin component (A), instead of 100 parts by mass of 2-hydroxyethyl acrylate, 37 parts by mass of 4-hydroxybutyl acrylate, 35 parts by mass of 2-ethylhexyl acrylate, 12 parts by mass of isobornyl acrylate, and A heat dissipating member was manufactured in the same manner as in Example 1, except that 16 parts by mass of the polyether urethane acrylate obtained from the above was used.

[Example 5]
A heat radiating member was manufactured in the same manner as in Example 2, except that the amount of the alumina filler was changed to 667 parts by mass.

[Example 6]
As the filler (B), instead of the alumina filler of Example 1, an alumina filler (manufactured by Showa Denko Co., Ltd., product name “AS-40”; rounded filler with an average particle size of 28 μm and irregular shaped filler with an average particle size of 1.5 μm A heat dissipating member was manufactured in the same manner as in Example 2, except that a mixed product with ) was used.

[Example 7]
As the filler (B), instead of the alumina filler of Example 1, the same procedure as in Example 2 was performed except that an alumina filler (manufactured by Showa Denko Co., Ltd., product name "A20S"; spherical filler with an average particle size of 22 µm) was used. A heat dissipating member was manufactured.

[Example 8]
As the filler (B), instead of the alumina filler of Example 1, alumina filler (manufactured by Showa Denko Co., Ltd., product name "AS50"; rounded filler having an average particle size of 10 µm) was used in the same manner as in Example 2. A heat dissipating member was manufactured.

[Example 9]
A heat dissipating member was produced in the same manner as in Example 8, except that the thickness of the obtained heat dissipating member was adjusted to 30 μm by adjusting the applicator for applying the composition for forming a heat dissipating member.

[Example 10]
A pressure-sensitive adhesive sheet (manufactured by Lintec Corporation, product name: "MO-P011-15") were prepared.

The release sheets on both sides were peeled off from the heat dissipating member manufactured in Example 1, and the pressure-sensitive adhesive sheets were attached to both sides of the heat dissipating member via the acrylic pressure-sensitive adhesive layer. As a result, a heat-dissipating member with double-sided pressure-sensitive adhesive layers consisting of release sheet/adhesive layer/heat-dissipating member/adhesive layer/release sheet was obtained.

[Comparative Example 1]
As the filler, instead of 400 parts by mass of the alumina filler of Example 1, 227 parts by mass of boron nitride filler (manufactured by Showa Denko Co., Ltd., product name “UHP-2”; scale-like filler with an average particle size of 10 μm) is used. A heat radiating member was manufactured in the same manner as in Example 1. The 227 parts by mass of boron nitride is an amount that equalizes the volume ratio of the boron nitride and the resin component.

[Comparative Example 2]
A heat dissipating member was manufactured in the same manner as in Comparative Example 1, except that the amount of the boron nitride filler was changed to 80 parts by mass.

[Comparative Example 3]
A heat dissipating member was manufactured in the same manner as in Comparative Example 1, except that the amount of the boron nitride filler was changed to 57 parts by mass.

[Comparative Example 4]
A heat dissipating member was produced in the same manner as in Example 1, except that 100 parts by mass of 2-ethylhexyl acrylate was used as the resin component (A) instead of 100 parts by mass of 2-hydroxyethyl acrylate.

[Comparative Example 5]
A heat dissipating member was produced in the same manner as in Example 1, except that 100 parts by mass of n-butyl acrylate was used as the resin component (A) instead of 100 parts by mass of 2-hydroxyethyl acrylate.

[Test Example 1] (Evaluation of Viscosity)
Regarding the composition for forming a heat dissipating member prepared in Examples and Comparative Examples, whether the viscosity is low enough to allow stirring and mixing in the production line (○) or high enough to be unsuitable for the stirring and mixing (×), Judged using a stir bar. Table 1 shows the results.

[Test Example 2] (Evaluation of coatability)
Judgment of the state when the composition for forming a heat dissipating member prepared in Examples and Comparative Examples was applied with an applicator, and visually judged whether or not the coating layer obtained by coating with an applicator had streaks. did. Then, the coatability was evaluated based on the following criteria. Table 1 shows the results.
◯: A uniform surface without streaks was formed.
Δ: streaks occurred.
x: The composition for forming a heat radiating member had a high viscosity and could not be coated.

For Comparative Examples 1, 4, and 5, in which the composition for forming a heat radiating member could not be applied, no tests other than the measurement of the residual rate after solvent immersion were performed.

[Test Example 3] (Measurement of residual rate after solvent immersion)
The heat dissipating members obtained in Examples and Comparative Examples were cut into a size of 40 mm × 40 mm, the release sheets on both sides were peeled off, wrapped in a polyester mesh (mesh size 200), and the mass was weighed with a precision balance, By subtracting the mass of the mesh alone, the mass of the heat radiating member alone was calculated. Let the mass at this time be M1.

Next, the heat dissipating member wrapped in the polyester mesh was immersed in ethyl acetate at room temperature (23° C.) for 24 hours. After that, the heat radiating member was taken out and air-dried for 24 hours in an environment of a temperature of 23° C. and a relative humidity of 50%, and further dried in an oven of 80° C. for 12 hours. After drying, the mass was weighed with a precision balance, and the mass of the heat radiating member alone was calculated by subtracting the mass of the mesh alone. Let the mass at this time be M2. The residual rate (%) after solvent immersion is represented by (M2/M1)×100. From this, the residual ratio of the heat radiating member after immersion in the solvent was derived. Table 1 shows the results.

[Test Example 4] (Measurement of thermal conductivity)
For the heat dissipating members obtained in Examples and Comparative Examples, a thermal diffusivity/thermal conductivity measuring device (manufactured by i-Phase, product name “ai-phase mobile”) was measured in an environment of 23° C. and 50% RH. The thermal conductivity (W/m·K) was measured according to ISO 22007-3. Ten samples were measured, and the maximum value, the minimum value, and the difference (width) between the maximum value and the minimum value were determined. Table 1 shows the results.

[Test Example 5] (Evaluation of heat dissipation)
A heat dissipating member having a size of 10 mm×25 mm was cut out from the sample of the heat dissipating member according to each example in which the thermal conductivity measured in Test Example 4 showed the maximum value, and this was used as a sample. The above sample is placed on an aluminum plate with a thickness of 1 mm (manufactured by Paltec, product name “aluminum alloy plate A1050P”), and an LED light emitting element (LED headlamp bulb “H4 24V manufactured by IPF”) is placed on the sample. 6500K 34VHLB") was mounted.

Next, electricity with a voltage of 24 V and a current of 3 A was passed through the LED light emitting element to cause the LED light emitting element to emit light. At the same time, the aluminum plate was cooled by an air cooling fan (manufactured by Nidec, product name "D02X-05TS102") from a position 5 mm below the aluminum plate. Then, the temperature of the LED light emitting element 210 seconds after the light was emitted was measured from a position 35 cm above the LED light emitting element with a thermo camera (manufactured by Testo, product name: "testo 870-1 thermography"). If the measured temperature is 80° C. or less, it can be said that the heat dissipation is excellent. Table 1 shows the results.

For the heat dissipating member with double-sided pressure-sensitive adhesive layers obtained in Example 10, the release sheets on both sides were peeled off, and the LED light-emitting element was bonded to the aluminum plate via the exposed pressure-sensitive adhesive layers on both sides.

Further, as Comparative Example 6, an LED light emitting element was directly placed on an aluminum plate, and the temperature of the LED light emitting element was measured in the same manner as described above.

[Test Example 6] (Measurement of adhesive strength)
One release sheet was peeled off from the heat dissipation member with a double-sided adhesive layer obtained in Example 10, and the exposed adhesive layer was covered with a polyethylene terephthalate film having an easy-adhesion layer (manufactured by Toyobo Co., Ltd., product name "PET A4300", thickness: 25 μm). The laminate was cut to a width of 25 mm and a length of 100 mm, and this was used as a sample. Then, the other release sheet was peeled off from the sample, and the exposed adhesive layer was attached to a stainless steel plate (SUS304, polished #360).

Within 1 minute after application, the adhesive strength (N/25 mm) was measured using a tensile tester (manufactured by Orientec, product name "Tensilon") under the conditions of a peel speed of 300 mm/min and a peel angle of 180°. Conditions other than those described here were measured according to JIS Z0237:2009. As a result, the adhesive strength of the heat dissipating member with a double-sided adhesive layer of Example 10 was 10 N/25 mm.

[Test Example 7] (Evaluation of adhesion durability)
The heat dissipation member with the double-sided adhesive layer obtained in Example 10 was arranged in the same manner as in Test Example 5, and the LED light emitting element was allowed to emit light for 5 hours. After that, the aluminum plate/heat dissipation member with double-sided adhesive layer/LED light emitting element laminate was turned upside down, and in that state, it was confirmed that the heat dissipation member with double-sided adhesive layer and the LED light emitting element did not peel off from the aluminum plate.

As can be seen from Table 1, the compositions for forming a heat radiating member prepared in Examples had low viscosities and were excellent in coatability. Moreover, the heat dissipating member manufactured in the example was excellent in thermal conductivity and heat dissipation, and had little error between lots regarding thermal conductivity, and was excellent in reproducibility. Furthermore, the heat dissipating members produced in Examples had a high residual rate after being immersed in a solvent, and were excellent in reproducibility of thermal conductivity under repeated heating.

The heat dissipating member and the heat dissipating member with an adhesive layer according to the present invention can be suitably used, for example, to cool the electronic device by interposing it between a heat-generating electronic device and a heat dissipating substrate or heat sink. can. Moreover, the composition for forming a heat radiating member and the method for manufacturing a heat radiating member according to the present invention are suitable for manufacturing the above heat radiating member.

REFERENCE SIGNS LIST 1... Heat dissipation member 11a... First release sheet 11b... Second release sheet 2... Heat dissipation member with adhesive layer 21a, 21b... Adhesive layer 22a, 22b... Release sheet

Claims (8)

a curable resin component;
containing a filler made of metal oxide or metal hydroxide,
The resin component contains a polar monomer,
the polar monomer is 2-hydroxyethyl acrylate or 4-hydroxybutyl acrylate;
The ratio of the polar monomer in the resin component is 20% by mass or more ,
The filler is made of aluminum oxide,
Containing 85% by mass or more and 96% by mass or less of the filler
A composition for forming a heat dissipating member, characterized by: A heat dissipating member obtained by curing the composition for forming a heat dissipating member according to claim 1 . 3. The heat radiating member according to claim 2 , wherein the residual rate after being immersed in ethyl acetate at 23[deg.] C. for 24 hours is 90% by mass or more. 4. The heat dissipating member according to claim 2 , wherein the filler has an average particle size smaller than the thickness of the heat dissipating member. 5. The heat dissipating member according to claim 2 , wherein the heat dissipating member is in the form of a sheet. a step of applying the composition for forming a heat radiating member according to claim 1 to a first release sheet;
a step of laminating a second release sheet on the coating layer of the composition for forming a heat radiating member;
and a step of curing the composition for forming a heat dissipating member. 7. The method of manufacturing a heat dissipating member according to claim 6 , wherein the composition for forming a heat dissipating member is active energy ray-curable, and the composition for forming a heat dissipating member is cured by irradiation with an active energy ray. A heat dissipating member with an adhesive layer having an adhesive layer on at least one surface of the heat dissipating member according to any one of claims 2 to 5 .

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