JP7158846B2 - 半導体装置および機器 - Google Patents
半導体装置および機器 Download PDFInfo
- Publication number
- JP7158846B2 JP7158846B2 JP2017230988A JP2017230988A JP7158846B2 JP 7158846 B2 JP7158846 B2 JP 7158846B2 JP 2017230988 A JP2017230988 A JP 2017230988A JP 2017230988 A JP2017230988 A JP 2017230988A JP 7158846 B2 JP7158846 B2 JP 7158846B2
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- Prior art keywords
- conductor
- semiconductor device
- conductor portion
- semiconductor layer
- insulator
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- 239000004065 semiconductor Substances 0.000 title claims description 161
- 239000004020 conductor Substances 0.000 claims description 207
- 239000012212 insulator Substances 0.000 claims description 86
- 238000012545 processing Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 127
- 239000000758 substrate Substances 0.000 description 16
- 239000011229 interlayer Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910052814 silicon oxide Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 238000005498 polishing Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009416 shuttering Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
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- Engineering & Computer Science (AREA)
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- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
100 半導体層
200 半導体層
10 配線構造体
20 配線構造体
300 接合面
302 開口
304 特定部分
112 絶縁体部材
113 導電体部
215 絶縁体部材
216 導電体部
Claims (14)
- 第1方向に積層された第1半導体層および第2半導体層と、
前記第1半導体層と前記第2半導体層との間に配された第1構造体と、
前記第1構造体と前記第2半導体層との間に配された第2構造体と、
を備え、前記第1構造体と前記第2構造体とが互いに接合された半導体装置であって、
前記第2半導体層は開口を有し、
前記第1構造体は、第1導電体部と、前記第1方向に直交する第2方向において前記第1導電体部に並ぶ第4導電体部と、前記第1導電体部を囲む第1絶縁体部と、を有し、
前記第2構造体は前記開口によって外部に露出された面を有する電極と、前記第2方向において前記電極と並ぶ部分を有する第2絶縁体部と、第2導電体部と、前記第2導電体部に対し前記第2方向に並ぶ第3導電体部と、前記第2方向において前記第2導電体部と前記第3導電体部との間に位置する前記第2絶縁体部の一部と、を含み
前記第1方向における前記第1半導体層と前記開口との間において、前記第1導電体部と、前記第2導電体部と、が前記第1構造体と前記第2構造体との接合面で接合され、前記第3導電体部と前記第4導電体部と、が前記接合面で接合され、
前記電極と前記第2絶縁体部との間には溝が設けられ、前記溝が前記電極の前記外部に露出された面に対向する面よりも前記第1構造体側に達することを特徴とする半導体装置。 - 前記第3導電体部は前記第1絶縁体部に接触している、請求項1に記載の半導体装置。
- 前記第1導電体部と前記第4導電体部との間に位置する前記第1絶縁体部の一部が、前記第2導電体部と前記第3導電体部との間に位置する前記第2絶縁体部の一部に接触している、請求項1又は2に記載の半導体装置。
- 前記第1構造体には、前記第1方向において前記第1半導体層と前記開口との間に、配線が設けられている、請求項1乃至3のいずれか1項に記載の半導体装置。
- 前記配線は、前記第1導電体部および前記第4導電体部の一方に接続しており、前記第1導電体部および前記第4導電体部の他方には接続していない、請求項4に記載の半導体装置。
- 前記第1導電体部および前記第4導電体部の一方は、前記第2絶縁体部に接触している、請求項1乃至5のいずれか1項に記載の半導体装置。
- 前記電極は、前記第2導電体部および前記第3導電体部の一方に接続しており、前記第2導電体部および前記第3導電体部の他方には接続していない、請求項1乃至6のいずれか1項に記載の半導体装置。
- 前記第2方向における前記電極の幅が、前記第2方向における前記開口の幅よりも小さい、請求項1乃至7のいずれか1項に記載の半導体装置。
- 前記電極の主成分はアルミニウムであり、前記第1導電体部および前記第2導電体部の主成分は銅である、請求項1乃至8のいずれか1項に記載の半導体装置。
- 前記開口の中には導電部材が配置されている、請求項1乃至9のいずれか1項に記載の半導体装置。
- 前記第1半導体層は前記第2半導体層よりも厚い、請求項1乃至10のいずれか1項に記載の半導体装置。
- 前記第2半導体層にはフォトダイオードが設けられており、
前記第1半導体層にはトランジスタが設けられている、
請求項1乃至11のいずれか1項に記載の半導体装置。 - 前記溝が前記開口に連通することを特徴とする
請求項1乃至12のいずれか1項に記載の半導体装置。 - 請求項1乃至13のいずれか1項に記載の半導体装置を備える機器であって、
前記半導体装置に結像する光学系、前記半導体装置を制御する制御装置、前記半導体装置から出力された信号を処理する処理装置、前記半導体装置で得られた情報を表示する表示装置、および、前記半導体装置で得られた情報を記憶する記憶装置、および、前記半導体装置から出力され信号に基づいて制御される機械装置の少なくともいずれか、をさらに備えることを特徴とする機器。
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