JP7142208B2 - Characteristic measuring device, component mounting device, characteristic measuring method, and component mounting method - Google Patents

Description

The present invention relates to a characteristic measuring device for measuring electrical characteristics of an electronic component to be mounted on a substrate, a component mounting device provided with the characteristic measuring device, a characteristic measuring method, and a component mounting method.

As a component mounting apparatus for mounting electronic components on a board, there is known a device that includes a characteristic measuring device for measuring the electrical characteristics of the electronic component and measures the electrical characteristics of the electronic component when the electronic component is replenished. (See Patent Documents 1 and 2, for example). A characteristic measuring apparatus (characteristics inspection unit) described in Patent Document 1 measures an anisotropy on a measurement substrate (inspection substrate) on which electrodes are formed in an arrangement shape corresponding to the arrangement shape of terminals of an electronic component to be measured. A conductive sheet (anisotropic conductive rubber connector) is placed. Then, an electronic component is placed on the anisotropic conductive sheet, pressure is applied to the electronic component from above, and electrical characteristics are measured by a measuring device connected to the electrodes of the measurement substrate.

In the component mounting apparatus described in Patent Document 2, a characteristic measuring device (inspection device) is provided in the main body of the circuit board transporting and holding device through a trash can, and the inspection device detects electronic components between the stator and the mover. The electrical characteristics of an electronic component are measured by gripping it. After the measurement, the electronic parts are released from the grip and dropped into the lower opening by compressed air, and are stored in the trash bin through the L-shaped disposal passage.

Japanese Utility Model Laid-Open No. 5-34573 JP 2017-27971 A

By the way, it is necessary to replace the measurement substrate of the property measuring device according to the shape of the electronic component to be measured and the type of electrical property to be measured. However, Patent Document 1 does not disclose a method for connecting the electrodes of the measurement substrate and the measuring device or a method for exchanging the measurement substrate. However, there is still room for further improvement in order to easily measure the electrical characteristics of electronic components having various shapes.

SUMMARY OF THE INVENTION Accordingly, the present invention provides a characteristic measuring apparatus, a component mounting apparatus, a characteristic measuring method, and a component mounting method that can easily replace a measurement substrate on which measurement electrodes for measuring the electrical characteristics of an electronic component are formed. intended to

A characteristic measuring device according to the present invention includes a fixed portion having a plurality of fixed side contacts arranged on a mounting surface, and a measurement unit detachably mounted on the mounting surface. A plurality of unit sides that are formed with a plurality of electrodes electrically connected to an electronic component, and that are electrically connected to the plurality of electrodes and the plurality of fixed side contacts on a surface different from the one surface. It has a measurement substrate on which contacts are formed, and a substrate holding member in which a measurement opening is formed for placing the electronic component at a measurement position of the mounted measurement substrate.

A component mounting apparatus according to the present invention comprises a characteristic measuring apparatus according to any one of claims 1 to 9, a component supply unit that supplies electronic components, and an electronic component supplied by the component supply unit that is held and mounted on a board. and a mounting head, wherein the characteristic measuring device receives the electronic component held by the mounting head and measures the electrical characteristics of the electronic component.

A characteristic measuring method according to the present invention is a characteristic measuring method for measuring electrical characteristics of an electronic component using the characteristic measuring apparatus according to any one of claims 1 to 9, wherein the measuring substrate is mounted on a substrate holding member. a measurement unit mounting step of mounting the measurement unit on which the measurement substrate is mounted on the mounting surface and connecting the connection portion to the air ejection portion; and a component installation step of placing the electronic component at the measurement position; A pressurizing step of applying pressure between the electronic component placed at the measurement position and a plurality of electrodes, and a characteristic of measuring the electrical characteristics of the electronic component while the pressure is being applied in the pressurizing step. and a measuring step.

A component mounting method according to the present invention comprises: a characteristic measuring apparatus according to any one of claims 1 to 9; a component supply unit that supplies electronic components; A component mounting method for mounting an electronic component on a board by a component mounting apparatus comprising a mounting head that A measuring unit mounting step of mounting a measuring unit on a mounting surface and connecting a connection portion to an air ejection portion, a component picking step of picking out the electronic component supplied by the component supplying portion by the mounting head, and measuring the electronic component. a component placement step placed at a position; a pressing step applying pressure between the electronic component placed at the measurement position and a plurality of electrodes; and a characteristic measurement step of measuring the electrical characteristics of the.

According to the present invention, it is possible to easily replace the measurement substrate on which the measurement electrodes for measuring the electrical characteristics of the electronic component are formed.

1 is an explanatory diagram of the configuration of a component mounting system according to an embodiment of the present invention; FIG. 1 is a plan view showing the configuration of a component mounting apparatus according to one embodiment of the present invention; 1 is a side view of a probe unit provided in a characteristic measuring device according to an embodiment of the present invention; FIG. FIG. 2 is an explanatory diagram of the configuration of a probe unit provided in a characteristic measuring device according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of the configuration of a probe unit provided in a characteristic measuring device according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of the configuration of a probe unit provided in a characteristic measuring device according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of the configuration of a measurement unit included in a characteristic measurement device according to an embodiment of the present invention; (a) Plan view (b) Side view (c) Bottom view of a measurement substrate included in a characteristic measurement device according to an embodiment of the present invention. (a) Plan view (b) Side view (c) Front view (d) Rear view of the measurement unit provided in the characteristic measurement device according to one embodiment of the present invention (a) and (b) are explanatory diagrams of the function of an anisotropic conductive sheet provided in the characteristic measuring device according to one embodiment of the present invention. 1 is a perspective view of a collection box included in a characteristic measuring device according to an embodiment of the present invention; FIG. 1(a) is a plan view and (b) is a side view of a collection box provided in a characteristic measuring device according to an embodiment of the present invention. FIG. (a) and (b) are partial cross-sectional views of a probe unit included in a characteristic measuring device according to an embodiment of the present invention. (a) (b) (c) Explanatory diagrams for discarding electronic components in the probe unit provided in the characteristic measuring device according to one embodiment of the present invention. (a) Explanatory diagram of a plurality of measurement positions set in the characteristic measuring device according to one embodiment of the present invention (b) A diagram showing the relationship between the plurality of measurement positions and the size of the electronic component (a) and (b) are diagrams showing an example in which an electronic component to be measured is placed at a measurement position set in the characteristic measuring device according to one embodiment of the present invention. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 2 is a flow diagram of preparation for measurement in the characteristic measuring device according to one embodiment of the present invention; FIG. 2 is a flowchart of component mounting in the component mounting apparatus according to one embodiment of the present invention; FIG. 2 is a flowchart of characteristic measurement in the component mounting apparatus according to one embodiment of the present invention; (a), (b), and (c) process explanatory diagrams of characteristic measurement in the component mounting apparatus according to one embodiment of the present invention. (a), (b), (c), and (d) process explanatory diagrams of characteristic measurement in the component mounting apparatus according to one embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting system, the component mounting apparatus, and the characteristic measuring apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 2 and a part described later, the two axial directions orthogonal to each other in the horizontal plane are the X direction (horizontal direction in FIG. 2) of the substrate transport direction and the Y direction (vertical direction in FIG. 2) orthogonal to the substrate transport direction. is shown. In FIG. 3 and a part described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

First, a component mounting system 1 will be described with reference to FIG. The component mounting system 1 includes a component mounting device M1, a component mounting device M2, and a component mounting device M3 in order from the upstream side (left side in FIG. 1) in the board transfer direction. The component mounting apparatuses M1 to M3 are connected to the host computer CP by a wired or wireless communication network NW, and can transmit and receive data to and from the host computer CP. The host computer CP receives the status of each device and supervises the manufacture of the mounting board.

The component mounting apparatuses M1 to M3 constitute a component mounting line L that manufactures mounted boards by sequentially delivering the boards from upstream and mounting the components on the boards in order. The number of the component mounting apparatuses M1 to M3 constituting the component mounting line L does not need to be three, and may be one, two, four or more.

Next, referring to FIG. 2, the configuration of component mounting apparatuses M1 to M3 will be described. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described below. In FIG. 2, the substrate transfer mechanism 3 is installed in the X direction at the center of the base 2 . The board transport mechanism 3 transports the board B carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer mechanism 3 carries out the board B on which the component mounting work is completed to the downstream side. A component supply unit 4 is installed on each side of the board transfer mechanism 3 .

A plurality of tape feeders 5 are mounted in the component supply section 4 in parallel in the X direction. The tape feeder 5 pitch-feeds the carrier tape, in which pockets for storing electronic components are formed, from the outside of the component supply section 4 toward the substrate transport mechanism 3 (tape feeding direction), so that the mounting head feeds the electronic components. Electronic components are supplied to the component extraction position to be picked up. When the remaining number of electronic components supplied by the tape feeder 5 becomes less than a predetermined number, an operator performs splicing for splicing a new carrier tape to the trailing end of the carrier tape being supplied to the tape feeder 5 or a new carrier tape to the tape feeder 5 . Replenishment work is performed to insert the

In FIG. 2, a Y-axis table 6 having a linear driving mechanism is arranged at both ends of the upper surface of the base 2 in the X direction. A beam 7 similarly provided with a linear mechanism is coupled to the Y-axis table 6 so as to be movable in the Y direction. A mounting head 8 is attached to the beam 7 so as to be movable in the X direction. A suction nozzle 8a (see FIG. 21) for holding an electronic component is detachably attached to the lower end of the mounting head 8. As shown in FIG.

In FIG. 2, the Y-axis table 6 and the beam 7 constitute a mounting head moving mechanism 9 for moving the mounting head 8 in horizontal directions (X direction and Y direction). The mounting head moving mechanism 9 and the mounting head 8 hold the electronic component supplied to the component picking position of the tape feeder 5 attached to the component supply section 4 by vacuum suction with the suction nozzle 8a. A series of turns of the component mounting work of transferring and mounting the board B held by the board B to the mounting position is repeatedly executed.

In FIG. 2, the beam 7 is equipped with a head camera 10 positioned below the beam 7 and moving integrally with the mounting head 8 . As the mounting head 8 moves, the head camera 10 moves above the board B positioned at the mounting work position of the board transport mechanism 3 and picks up an image of a board mark (not shown) provided on the board B. to recognize the position of the substrate B. Further, the head camera 10 moves above the probe unit 13 to be described later, and images an electrode mark 64 (see FIG. 9) provided so as to be visible from the upper surface of the probe unit 13, thereby recognizing the position of the electrode mark 64. do.

A component recognition camera 11 is installed between the component supply unit 4 and the board transfer mechanism 3 . When the mounting head 8 picking up the electronic component from the component supply unit 4 moves above the component recognition camera 11, the component recognition camera 11 takes an image of the electronic component held by the mounting head 8 and recognizes the shape. In the component mounting operation of the electronic component on the board B by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the board B by the head camera 10 and the recognition result of the electronic component by the component recognition camera 11. FIG.

In FIG. 2, a touch panel 12 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatus M1. The touch panel 12 displays various information and warning information on its display section, and the operator uses operation buttons displayed on the display section to input data and operate the component mounting apparatus M1.

In FIG. 2, a probe unit 13 is installed between the component supply section 4 and the board transfer mechanism 3 and next to the component recognition camera 11 . The probe unit 13 has a plurality of electrodes electrically connected to terminals of electronic components. A plurality of electrodes of the probe unit 13 are connected to a measuring instrument 15 via cables 14 . The measuring instrument 15 measures electrical characteristics such as resistance, capacitance, and inductance of electronic components electrically connected to the electrodes of the probe unit 13 . A probe unit 13 having a plurality of electrodes electrically connected to terminals of an electronic component, a measuring instrument 15 for measuring electrical characteristics of the electronic component, and a cable 14 connecting the plurality of electrodes and the measuring instrument 15 are connected to the terminal of the electronic component. A characteristic measuring device 16 for measuring electrical characteristics is configured.

When the type of electronic component supplied by the tape feeder 5 is changed or when the tape feeder 5 is replenished with electronic components, the mounting head 8 picks up the electronic component to be measured from the tape feeder 5 and transfers it to the probe unit 13. , the electrical characteristics of the electronic component are measured by the measuring instrument 15 . The measurement result is transmitted to the device control unit 90 (see FIG. 17) provided in the component mounting device M1 or to the host computer CP, and whether or not the changed or replenished electronic component is correct or not is determined based on the measured electrical characteristics. be judged.

Next, the configuration of the probe unit 13 will be described with reference to FIGS. 3 to 6. FIG. In FIG. 3, the probe unit 13 has a fixed part 30, a measurement unit 50, and a collection box 70. As shown in FIG. The fixed part 30 is installed on the base 2 . The measurement unit 50 and the collection box 70 are detachably attached to the fixed portion 30 . FIG. 3 shows a side view of the probe unit 13. As shown in FIG. 4 shows a state in which the measurement unit 50 and the collection box 70 are attached to the fixed portion 30, FIG. 5 shows a state in which the collection box 70 is removed from the fixed portion 30, and FIG. It shows the state of being

The probe unit 13 is installed at a position where an operator can easily attach and detach the measurement unit 50 and the recovery box 70 from outside the component mounting apparatuses M1 to M3. Hereinafter, the side of the probe unit 13 where the operator works is referred to as the "front side", and the side opposite to the front side is referred to as the "rear side".

In FIG. 6 , a mounting surface 31 on which the measurement unit 50 is detachably mounted is provided on the upper portion of the fixing portion 30 . A plurality of pins 32 made of a conductor that is biased upward by an elastic body such as a spring are arranged on the upper surface of the mounting surface 31 . An upper portion of each pin 32 protrudes upward from the mounting surface 31 . That is, each pin 32 is urged in the direction of protruding from the mounting surface 31 . Each pin 32 is connected to measuring instrument 15 via cable 14 . Thus, the plurality of pins 32 are arranged on the mounting surface 31 and constitute a plurality of fixed side contacts connected to the measuring instrument 15 for measuring the electrical characteristics of the electronic component.

An air ejection part 33 to which the measurement unit 50 is connected is arranged on the rear side of the mounting surface 31 in the fixed part 30 . A projecting portion 33a projecting forward is formed in the center of the front surface of the air ejecting portion 33. As shown in FIG. A plurality of compressed air ejection ports 34 are formed on the front surface of the projecting portion 33a. A plurality of ejection ports 34 are formed side by side in the vertical direction (Z direction). That is, the air ejection portion 33 has a plurality of ejection ports 34 in the vertical direction. The plurality of ejection ports 34 are connected to a compressed air source (not shown) via air valves 35 . When the air valve 35 is opened, compressed air is jetted from the plurality of jet ports 34 .

In FIG. 6, a connecting portion 50a recessed forward is formed in the center of the rear surface of the measurement unit 50. As shown in FIG. When mounting the measurement unit 50 on the mounting surface 31, the operator moves the measurement unit 50 rearward so that the lower surface of the measurement unit 50 slides on the upper surface of the mounting surface 31, and pushes the measurement unit 50 rearward. As a result, the connection portion 50a of the measurement unit 50 is connected to the projecting portion 33a of the air ejection portion 33 (see FIG. 5). In this way, the measuring unit 50 is formed with a connection portion 50 a that is connected to the air ejection portion 33 .

3 to 5, the fixing portion 30 is provided with a pressing portion 36 that presses downward an electronic component placed at a measurement position set in the measurement unit 50 and described later. The pressing portion 36 includes a pressing member 37 that abuts on the electronic component from above, an elevating mechanism 38a that moves the pressing member 37 up and down (arrow a in FIG. 4) (arrow a in FIG. 4), and a horizontal direction (X direction). direction) and a reciprocating mechanism 38b for reciprocating (arrow b in FIG. 4). The pressing member 37 is made of an insulator such as hard plastic.

Thus, the lifting mechanism 38a and the reciprocating mechanism 38b constitute the pressing member moving mechanism 38 that moves the pressing member 37 up and down and reciprocates in at least one direction (X direction) in the horizontal plane. The pressing member moving mechanism 38 is controlled by a unit control section 39 (see FIG. 17) provided in the probe unit 13 . The pressing member moving mechanism 38 has pressure adjusting means 38c that presses the electronic component downward with a constant pressure regardless of the position (height) at which the pressing member 37 contacts the electronic component due to magnetic force or the like. The pressure adjusting means 38c may be realized by measuring the pressure applied to the pressing member 37 with a pressure sensor and adjusting the lowering amount of the lifting mechanism 38a by the unit control section 39. FIG.

In FIG. 5, a box holding part 40 for holding a collection box 70 is installed on the front side of the fixing part 30 . The box holding portion 40 has a pair of guide plates 41 that support both sides of the collection box 70 held by the box holding portion 40 from the outside. Each guide plate 41 is formed with a notch portion 41a that is cut obliquely upward toward the front side. A holding side slope 41b is formed on the front side of the notch 41a. A pair of flat connecting portions 71 are installed on both side surfaces of the collection box 70 . Each connecting portion 71 is formed with an insertion portion 71 a obliquely extending so as to be inserted into the notch portion 41 a of the guide plate 41 . A box-side slope 71b is formed on the front side of the insertion portion 71a.

At the center of the front surface of the measuring unit 50, an outlet 51 through which electronic components are discharged together with compressed air is formed so as to protrude forward. A recovery port 72 is formed on the upper rear surface of the recovery box 70 and is fitted to the discharge port 51 of the measurement unit 50 while the recovery box 70 is held by the box holding portion 40 (see FIG. 11). A detection sensor 42 having a light-emitting portion 42a for emitting detection light and a light-receiving portion 42b for receiving the detection light is installed at the center of the rear lower portion of the box holding portion 40. As shown in FIG. A detection signal from the detection sensor 42 is transmitted to the unit control section 39 . A dog 73 is provided at the bottom of the rear surface of the collection box 70 to block the detection light of the detection sensor 42 when the collection box 70 is held in the normal posture by the box holding portion 40 (see FIG. 11).

In FIG. 5 , when attaching the recovery box 70 to the box holding portion 40 , the operator slides the box-side slope 71 b of the recovery box 70 along the holding-side slope 41 b of the box holding portion 40 from diagonally above the front side. The insertion portion 71 a of the collection box 70 is inserted into the notch portion 41 a of the box holding portion 40 . When the collection box 70 is held in the normal posture by the box holding portion 40 , the discharge port 51 of the measurement unit 50 is fitted into the collection port 72 of the collection box 70 , and the dog 73 of the collection box 70 emits the detection light of the detection sensor 42 . shade the

As described above, the collection box 70 has the collection port 72 fitted to the discharge port 51 of the measurement unit 50 , and the boxes on both sides of the collection box 70 slide along the holding-side slopes 41 b of the box holding section 40 . Side slopes 71b are formed, respectively, and can be attached to and detached from the fixing portion 30 . Further, the box holding part 40 has a pair of guide plates 41 provided on the fixed part 30 and supporting both sides of the collection box 70 from the outside. Holding-side slopes 41 b are formed obliquely up toward the insertion side, and hold the recovery box 70 in a state where the recovery port 72 is fitted to the discharge port 51 . As a result, the collection box 70 can be attached to and detached from the probe unit 13 without using tools, and the operator can easily collect electronic components D discarded in the collection box 70 with the collection box 70 removed from the apparatus. can do.

The collection box 70 is provided with a dog 73 that shields the detection light when the box holding portion 40 holds the collection box 70 in a normal posture. Further, the box holding part 40 is provided with a detection sensor 42 having a light emitting part 42a for emitting detection light for detecting the collection box 70 held in a normal posture and a light receiving part 42b for receiving the detection light. . Thereby, it is possible to detect whether or not the collection box 70 is attached to the box holding portion 40 in a normal posture. The detection sensor 42 is not limited to an optical sensor, and may be, for example, a proximity sensor that detects the collection box 70 based on changes in magnetism or capacitance, or a limit switch that detects contact with the collection box 70. good too.

In FIG. 3 , the collection box 70 has a ceiling plate 74 formed above the collection port 72 so that the collection port 72 is fitted to the discharge port 51 of the measurement unit 50 and overlaps the discharge port 51 . The center of gravity G of the recovery box 70 is set at a position where the recovery port 72 side is lowered while being held by the box holding portion 40 . That is, the center of gravity G of the collection box 70 is set behind the fulcrum F of the collection box 70 between the pair of guide plates 41 of the box holding portion 40 . As a result, a force (arrow c) is generated in the collection box 70 so that the rear side of the collection box 70 rotates downward about the fulcrum F. As shown in FIG. As a result, the ceiling plate 74 is in close contact with the upper surface of the discharge port 51 , and electronic components discharged from the discharge port 51 can be prevented from jumping out of the collection port 72 .

Next, the configuration of the measuring unit 50 will be described with reference to FIGS. 7 to 9. FIG. In FIG. 7, the measurement unit 50 includes a substrate holding member 52, an anisotropic conductive sheet 53, and a measurement substrate 60. As shown in FIG. The function of the anisotropic conductive sheet 53 will be described later. 8, a plurality of (here, two) electrodes 61 electrically connected to the terminals Dt of the electronic component D (see FIG. 10) are formed on the upper surface 60a of the measurement substrate 60. As shown in FIG. A plurality of (here, two) unit side contacts 62 electrically connected to a plurality of pins 32 (fixed side contacts) arranged on the mounting surface 31 of the fixed portion 30 are provided on the lower surface 60 b of the measurement substrate 60 . formed. Each electrode 61 is electrically connected internally to the corresponding unit-side contact 62 via an internal electrode 63 .

That is, the measurement substrate 60 has a top surface 60a (one surface) formed with a plurality of electrodes 61 electrically connected to the electronic component D, and a bottom surface 60b (another surface different from the one surface) having a plurality of electrodes 61 formed thereon. A plurality of unit-side contacts 62 are formed that are electrically connected to the electrodes 61 and the plurality of fixed-side contacts (pins 32), respectively. A front substrate cutout portion 60 c is formed on the front side of the measurement substrate 60 , and a rear substrate cutout portion 60 d is formed on the rear side of the measurement substrate 60 . Two electrode marks 64 for recognizing the positions of the electrodes 61 are formed at diagonal positions on the upper surface 60 a (the surface on which the electrodes 61 are formed) of the measurement substrate 60 . A mounting hole 65 penetrating vertically is formed at a diagonal position different from the diagonal where the electrode mark 64 of the measurement substrate 60 is formed.

In FIG. 7, the measurement substrate 60 is attached to the lower part of the substrate holding member 52 from below with the anisotropic conductive sheet 53 placed thereon so as to cover the upper surfaces of the electrodes 61 . The measurement board 60 is fixed to the board holding member 52 by screws 54 inserted into the mounting holes 65 .

7 and 9, the substrate holding member 52 is formed with a measurement opening 52a penetrating upward from the electrodes 61 of the measurement substrate 60 mounted thereon. In the measurement unit 50, an electronic component D is placed with an anisotropic conductive sheet 53 interposed therebetween such that the terminals Dt of the electronic component D are opposed to the plurality of electrodes 61 of the measurement substrate 60 mounted on the substrate holding member 52. A measurement position P to be measured is set. That is, on the upper surface of the anisotropic conductive sheet 53 covering the plurality of electrodes 61 (the surface opposite to the plurality of electrodes 61) is set a measurement position P where an electronic component D whose electrical characteristics are to be measured is placed. A measurement opening 52a is formed through the substrate holding member 52 to the measurement position P. As shown in FIG.

The board holding member 52 is formed with a recognition opening 52b penetrating to the electrode mark 64 of the mounted measurement board 60 . When the measurement unit 50 is viewed from above, the electrode mark 64 of the measurement substrate 60 can be seen through the recognition opening 52b. On the other hand, since the anisotropic conductive sheet 53 is opaque, the electrode 61 of the measurement substrate 60 attached to the substrate holding member 52 cannot be seen through the measurement opening 52a. Therefore, with the measurement unit 50 attached to the attachment surface 31 of the fixed part 30, the position of the electrode 61 that cannot be directly recognized is calculated by capturing an image of the electrode mark 64 from above with the head camera 10 and performing recognition processing. can do.

In FIG. 9, a moving groove 52c is formed in the upper portion of the substrate holding member 52 so that the pressing member 37 of the pressing portion 36 moves from the measurement opening 52a to one side surface. When the reciprocating mechanism 38b is operated with the measurement unit 50 mounted on the mounting surface 31 of the fixing portion 30, the pressing member 37 reciprocates along the movement groove 52c from outside the measurement unit 50 to above the measurement opening 52a. do. A rear side holding notch 52d is formed in the center of the rear surface of the substrate holding member 52 . When the measurement substrate 60 is attached to the substrate holding member 52 , the rear holding cutout 52 d of the substrate holding member 52 and the rear substrate cutout 60 d of the measurement substrate 60 are integrated to form the connecting portion of the measurement unit 50 . 50a.

The substrate holding member 52 is formed with a rear through groove 52e penetrating from the measurement opening 52a to the rear surface of the rear holding notch 52d. The rear through groove 52e has a ceiling and side surfaces formed by the substrate holding member 52 and an open floor. When the measurement substrate 60 is mounted on the substrate holding member 52, the upper surface 60a of the measurement substrate 60 becomes a floor surface, and a through path is formed that encloses the substrate holding member 52 and the measurement substrate 60 vertically and horizontally. The substrate holding member 52 is formed with a front through-passage 52 f that penetrates the substrate holding member 52 from the measurement opening 52 a to the front surface of the discharge port 51 . The front substrate notch 60c of the measurement substrate 60 is formed integrally with the front through passage 52f.

In FIG. 9, in a state where the measurement substrate 60 is attached to the substrate holding member 52, the rear through groove 52e, the measurement opening 52a, and the front through passage 52f extend from the rear surface of the connection portion 50a to the measurement opening 52a. A discharge path 50b penetrating to the front surface of the discharge port 51 via the position P is configured. With the measurement unit 50 attached to the mounting surface 31 of the fixing portion 30, the discharge path 50b of the measurement unit 50 allows the compressed air ejected from the ejection port 34 of the air ejection portion 33 to flow from the connection portion 50a, thereby reaching the measurement position. The measurement unit 50 is horizontally passed through P to the outlet 51 (see also FIG. 14). The discharge path 50 b may be configured only by the substrate holding member 52 , combined with the measurement substrate 60 , or combined with the mounting surface 31 of the fixing portion 30 .

With the measurement substrate 60 attached to the substrate holding member 52 , the unit-side contacts 62 formed on the lower surface 60 b of the measurement substrate 60 are exposed from the bottom of the measurement unit 50 . When the measurement unit 50 is mounted on the mounting surface 31 of the fixed portion 30 , the unit side contact 62 is electrically connected to the pin 32 (fixed side contact) arranged on the mounting surface 31 . That is, the plurality of electrodes 61 formed on the upper surface 60 a of the measurement substrate 60 are connected to the measuring device 15 . By configuring the measurement unit 50 to be removable from the probe unit 13 in this way, the operator can easily replace the anisotropic conductive sheet 53 and the measurement substrate 60 with the measurement unit 50 removed. can do

Next, with reference to FIG. 10, the function of the anisotropic conductive sheet 53 placed so as to cover at least part of the plurality of electrodes 61 formed on the upper surface 60a of the measurement substrate 60 will be described. 10(a) and 10(b) are enlarged cross-sectional views including the electronic component D placed at the measurement position P on the AA cross section of the probe unit 13 shown in FIG. In this example, the electronic component D is a chip component having two terminals Dt, such as a resistor, capacitor, inductor, or the like. The electronic component D is placed at the measurement position P where the two terminals Dt face the two electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween. The anisotropic conductive sheet 53 has a characteristic that when pressure is applied, the conductivity in the direction of pressure decreases and the conductivity in the directions other than the pressure direction remains high.

10A shows a state where the pressing member 37 of the pressing portion 36 is above the electronic component D. FIG. In this state, no pressure is applied to the anisotropic conductive sheet 53, and the conductivity of the anisotropic conductive sheet 53 is high in all directions. FIG. 10(b) shows a state (arrow d) in which the elevating mechanism 38a of the pressing portion 36 operates to lower the pressing member 37 and press the electronic component D downward with a predetermined pressure. In this state, pressure is applied to the anisotropic conductive sheet 53 in the vertical direction from the terminals Dt of the electronic component D toward the electrodes 61 of the measurement substrate 60 .

That is, the pressure direction in FIG. 10B is the vertical direction, and the resistance R of the portion sandwiched between the opposing terminal Dt and the electrode 61 in the anisotropic conductive sheet 53 is lowered (the electrical conductivity is lowered). , between the terminals Dt adjacent to each other on the left and right, and between the electrodes 61 remain high resistance (high conductivity). In this state, the terminal Dt of the electronic component D is electrically connected to the measuring instrument 15 , and the electrical characteristics of the electronic component D can be measured by the measuring instrument 15 .

In this way, the pressing portion 36 pushes the electronic component D placed at the measurement position P where the terminals Dt of the electronic component D face the plurality of electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween, in the direction of the plurality of electrodes 61 . push. Then, in the characteristic measuring device 16, the electrical characteristic of the electronic component D placed at the measurement position P is measured by the measuring instrument 15 while pressure is applied between the terminal Dt of the electronic component D and the plurality of electrodes 61. . By inserting the anisotropic conductive sheet 53 between the electronic component D and the electrode 61, the connection between the terminal Dt of the electronic component D and the electrode 61 can be electrically stabilized even if the shape of the electronic component D varies. It is possible to connect and reduce variations in measurement results.

Next, referring to FIGS. 5 and 11 to 13, the internal structure of the collection box 70 will be described. 13(a) is a sectional view of the probe unit 13 including the collection box 70 in the BB section of FIG. 3, and FIG. 13(b) is a sectional view of the probe unit 13 including the collection box 70 in the CC section of FIG. is a cross-sectional view of.

In FIG. 13B, when the measurement unit 50 is mounted on the mounting surface 31 of the fixing portion 30 of the probe unit 13 in a normal posture, and the collection box 70 is held by the box holding portion 40 in a normal posture, measurement The rear side of the discharge path 50b of the unit 50 is connected to the air ejection portion 33, and the front side of the discharge path 50b is connected to the collection port 72 of the collection box 70. As shown in FIG. That is, the probe unit 13 includes an air ejection part 33 having an ejection port 34, a measurement area U in which a measurement position P is set in which an electronic component D whose electrical characteristics are to be measured is placed, and an air ejection part with the measurement position P interposed therebetween. and a collection box 70 positioned opposite the outlet 34 . In the measurement area U, a discharge path 50b is formed that extends horizontally from the ejection port 34 to the collection box 70 via the measurement position P. As shown in FIG.

In FIG. 13(b), a first air filter 75 that allows air to pass through but blocks the electronic component D from passing through is mounted on the front surface of the collection box 70 at a position facing the ejection port 34 with the measurement position P interposed therebetween. A first exhaust port 76 is provided. Inside the recovery box 70 and in front of the ejection port 34 side (recovery port 72 side) of the first air filter 75, there is an electronic component blown away from the measurement position P by the compressed air ejected from the ejection port 34. A component drop section V having a drop port 77a for dropping D downward is provided.

13(a) and 13(b), inside the recovery box 70 and below the component drop section V, a storage section 78 for storing the electronic components D dropped from the drop opening 77a is provided. there is The component drop portion V has a floor surface 79a and side surfaces 79b extending from the discharge path 50b, and an extension portion 79 extending to a position covering at least part of the upper portion of the drop port 77a is formed. . The component drop portion V is formed with a funnel-shaped drop wall 77 whose upper portion 77b is larger than the drop port 77a and whose diameter decreases toward the drop port 77a. A crescent-shaped upper opening 77c is formed between the extending portion 79 and the first air filter 75 in the component drop portion V (see also FIG. 12(a)). The electronic component D blown away from the measurement position P falls from the tip of the extending portion 79 into the upper opening 77c, and is received in the receiving portion 78 via the drop port 77a.

13(a) and 13(b), in the accommodating portion 78, a backflow prevention portion 80 is formed below the drop port 77a so as to protrude upward toward the drop port 77a. The backflow prevention part 80 has a cylindrical lower portion and a conical upper portion. A second exhaust port 82 is formed on the front surface of the collection box 70 and on the front surface of the housing portion 78, and is equipped with a second air filter 81 that allows air to pass through but prevents the electronic components D from passing through. The collection box 70 may also have an exhaust port with an air filter mounted on the side surface of the storage portion 78 . In this way, the collection box 70 has an exhaust port (first exhaust port 76) equipped with air filters (first air filter 75, second air filter 81) that allow air to pass through but do not allow electronic components D to pass through. , a second exhaust port 82).

12 and 13, the collection box 70 is provided with a parts drop section V having an extension 79 and a drop wall 77, and a first exhaust port 76 with a first air filter 75 attached to the discharge path 50b. It is composed of an upper collection portion 70a to be connected, and a lower collection portion 70b having a housing portion 78 having a second exhaust port 82 to which a backflow prevention portion 80 and a second air filter 81 are mounted. That is, the collection box 70 has a two-tiered structure of an upper collection section 70a and a lower collection section 70b, and the upper collection section 70a and the lower collection section 70b are connected by a drop port 77a.

Next, referring to FIGS. 13B and 14, in probe unit 13, compressed air is ejected from ejection port 34 of air ejection portion 33 to blow away electronic component D at measurement position P, thereby removing collection box 70. A process for discarding electronic components in the container 78 will be described. Assume that an electronic component D is placed at a measurement position P as shown in FIG. 13(b). In FIG. 14(a), when compressed air is ejected from the ejection port 34, the electronic component D blown away by the compressed air moves from the measurement area U (measurement unit 50) to the recovery box 70 through the discharge path 50b ( arrow e).

In FIG. 14(b), the electronic component D that has reached the front of the first air filter 75 through the extending portion 79 falls from the upper opening 77c into the falling wall 77, collides with the falling wall 77, and reaches the falling opening. 77a toward the accommodating portion 78 (arrow f). In FIG. 14(c), when the ejection of the compressed air from the ejection port 34 stops, the electronic component D that has reached the accommodation portion 78 stops there (arrow g). The compressed air ejected from the ejection port 34 is exhausted to the outside of the recovery box 70 from the first exhaust port 76 through the first air filter 75 or from the second exhaust port 82 through the second air filter 81. (FIGS. 14(a) and 14(b)).

The air ejection part 33 ejects compressed air from two (a plurality of) ejection ports 34 arranged vertically, so that electronic components D having different sizes (heights) can be reliably collected from the measurement position P. It can be blown towards box 70 . In addition, since the extension part 79 extends to a position covering a part of the upper part of the drop opening 77a, the discarded electronic component D can be reliably dropped from the upper opening 77c toward the accommodation part 78. . In addition, by arranging the backflow prevention portion 80 protruding upward below the drop port 77a, it is possible to prevent the electronic component D accommodated in the accommodation portion 78 from blowing up and flowing back from the drop port 77a to the component drop portion V. can do.

Next, with reference to FIGS. 15 and 16, the measurement position P at which the electronic component D whose electrical characteristics are to be measured is placed will be described. The length Q (the length in the horizontal direction of the drawing) of the opposing sides of the two opposing electrodes 61 formed on the measurement substrate 60 shown in FIG. It is longer than the component width W (the length of the electronic component) of the electronic component D, and nine measurement positions P1 to P9 are set in the direction along the opposite sides of the electrode 61 (the direction of the component width W). The measurement positions P1 to P9 where the electronic component D to be measured is placed are set based on the component width W of the electronic component D to be measured. In addition, in FIG. 15A, the anisotropic conductive sheet 53 installed so as to cover the electrode 61 is omitted for convenience.

FIG. 15(b) shows an example of the relationship between the component width W of the electronic component D to be measured and the measurement positions P1 to P9. A small-sized electronic component D (W≦W1) is placed at all nine measurement positions P1 to P9 (FIG. 16(a)). A medium-sized electronic component D (W1<W≦W2) is placed at three measurement positions P3, P5, and P7 (FIG. 16(b)). A large-sized electronic component D (W2<W≦W3) is placed at the central measurement position P5 (FIG. 15(a)).

In this way, the length Q of the facing sides of the plurality of facing electrodes 61 is the component width W of the electronic component D placed at the measurement positions P1 to P9 across the plurality of electrodes 61 ( A plurality of measurement positions P1 to P9 are set based on the component width W of the electronic component D in the direction along the opposite sides of the electrode 61 . Further, the electronic components D to be measured are placed at the respective measurement positions P1 to P9 so that the number of times they are placed is uniform. By dispersing and placing the electronic components D to be measured at a plurality of measurement positions P1 to P9, damage to the anisotropic conductive sheet 53 when placing the electronic components D is reduced, and anisotropic conductive Deterioration of the seat 53 can be suppressed.

Next, referring to FIG. 17, the configuration of the control system of component mounting apparatuses M1 to M3 will be described in detail. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described here. A device control unit 90 provided in the component mounting apparatus M1 includes a substrate transport mechanism 3, a component supply unit 4, a mounting head 8, a mounting head moving mechanism 9, a head camera 10, a component recognition camera 11, a touch panel 12, and a characteristic measuring device 16. It is connected. The device control unit 90 includes a mounting control unit 91, a measurement control unit 92, a recognition processing unit 93, a measurement position determination unit 94, a parts acceptance/rejection determination unit 95, a production data storage unit 96, a parts information storage unit 97, and a measurement information storage unit 98. It has

The production data storage unit 96 is a storage device, and stores production data including the component name (type) of the electronic component D, the mounting position (XY coordinates), etc., which are referenced when the electronic component D is mounted on the board B. The component information storage unit 97 is a storage device, and specifies the component name, size (component width W), standard value of electrical characteristics, and tape feeder 5 for supplying the electronic component D to be mounted on the board B. In addition to information, the remaining number of electronic components D, the measurement positions P1 to P9 placed when the characteristics are measured are stored. The measurement information storage unit 98 is a storage device, and stores the positions (XY coordinates) of the measurement positions P1 to P9 with the electrode mark 64 formed on the measurement substrate 60 as a base point. Further, the measurement information storage unit 98 stores the number of times the electronic component D whose characteristics have been measured is placed in association with the component name and the measurement positions P1 to P9.

In FIG. 17, the mounting control unit 91 controls the board transport mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, and the component recognition camera 11 to place the electronic component D on the board B. Execute the component mounting work to be mounted. Further, when the electronic component D is taken out from the tape feeder 5 , the mounting control section 91 subtracts the remaining number of the electronic component D stored in the component information storage section 97 . The measurement control unit 92 controls the component supply unit 4 , the mounting head 8 , the mounting head moving mechanism 9 , the head camera 10 , the component recognition camera 11 , and the characteristic measuring device 16 so that the suction nozzle 8 a of the mounting head 8 is removed from the tape feeder 5 . Takes out the electronic component D to be measured by , places it at the measurement position P, and controls a series of characteristic measurements in which the electrical characteristics are measured by the measuring instrument 15 .

The recognition processing unit 93 performs recognition processing on the image of the electronic component D held by the suction nozzle 8a captured by the component recognition camera 11, and recognizes the position of the electronic component D held by the suction nozzle 8a. The recognition processing unit 93 recognizes the position of the electrode mark 64 by recognizing the image of the electrode mark 64 on the measurement substrate 60 mounted on the measurement unit 50 captured by the head camera 10 . When placing the electronic component D sucked by the suction nozzle 8a at the measurement position P, the measurement control unit 92 determines the position of the electronic component D held by the suction nozzle 8a recognized by the recognition processing unit 93 and the position of the electrode mark 64. Based on this, the position where the electronic component D is placed is corrected. By correcting based on the position of the electrode mark 64, it is possible to accurately align the electrode 61, which is covered with the anisotropic conductive sheet 53 and cannot be seen directly.

The measurement position determination unit 94 determines the number of times the electronic component D is placed at one of the plurality of measurement positions P1 to P9 based on the number of times the electronic component D stored in the measurement information storage unit 98 is placed at each measurement position P1 to P9. The measurement positions P1 to P9 for placing the electronic component D to be measured are determined so that the The component pass/fail determination unit 95 compares the electrical characteristics of the electronic component D measured by the measuring instrument 15 with the standard values of the electrical characteristics of the electronic component D stored in the component information storage unit 97, and the tape feeder It is determined whether or not the electronic component D taken out from 5 is correct. If the electronic component D is incorrect, the component acceptance/rejection determination section 95 causes the touch panel 12 to notify that the electronic component D is incorrect.

In FIG. 17 , the characteristic measuring device 16 has a probe unit 13 and a measuring device 15 . The probe unit 13 includes a unit control section 39 , a pressing member moving mechanism 38 , a detection sensor 42 and an air valve 35 . The detection sensor 42 includes a light emitting portion 42a and a light receiving portion 42b. The unit control section 39 controls the pressing member moving mechanism 38 , the air valve 35 , and the measuring instrument 15 to integrate the characteristic measurement of the electronic component D in the characteristic measuring device 16 .

Specifically, when the electronic component D is placed at the measurement position P on the anisotropic conductive sheet 53, the unit control section 39 causes the pressing member 37 to interfere with the electronic component D held by the suction nozzle 8a or the like. The pressing member moving mechanism 38 is controlled so as to move to the retracted position. Further, when measuring the electrical characteristics of the electronic component D placed at the measurement position P, the unit control section 39 controls the pressing member moving mechanism 38 to move the pressing member 37 above the electronic component D. , and pressure is applied between the terminal Dt of the electronic component D and the electrode 61 by the pressing member 37 . Thus, the unit control section 39 is a control section that controls the pressing member moving mechanism 38 .

Further, the unit control section 39 controls the air valve 35 to eject compressed air from the ejection port 34 to discard the electronic component D at the measurement position P into the collection box 70 . Further, when the worker mounts the collection box 70 on the box holding section 40, the unit control section 39 determines whether the collection box 70 has been mounted on the box holding section 40 in a normal posture based on the detection result of the detection sensor 42. to judge. If the recovery box 70 is not properly mounted, the unit control section 39 causes the touch panel 12 of the component mounting apparatus M1 to notify that the posture of the recovery box 70 is abnormal.

In FIG. 17, the measurement result of the electrical characteristics by the measuring instrument 15 is transmitted to the apparatus control section 90 of the component mounting apparatus M1, and the electronic component D supplied by the tape feeder 5 is checked by the component acceptance/rejection determination section 95. is determined. It should be noted that the high-level computer CP may be provided with the component pass/fail determination unit 95, the measuring instrument 15 may transmit the measurement result to the high-level computer CP, and the high-level computer CP may determine whether the electronic component D is correct or not.

As described above, the component mounting apparatuses M1 to M3 of the present embodiment include the component supply unit 4 that supplies the electronic component D, and the mounting device that holds the electronic component D supplied by the component supply unit 4 and mounts it on the board B. A head 8 and a characteristic measuring device 16 for receiving the electronic component D held by the mounting head 8 and measuring the electrical characteristics of the electronic component D are provided. It should be noted that the mounting head 8 is not the only device that places the electronic component D at the measurement position P of the characteristic measuring device 16 . For example, the electronic component D may be placed at the measurement position P by a dedicated transfer means different from the mounting head 8 .

Next, measurement preparation for measuring the electrical characteristics of the electronic component D in the characteristics measuring device 16 will be described along the flow of FIG. 18 and with reference to FIGS. 5 to 7. FIG. In FIG. 18, first, after the anisotropic conductive sheet 53 is placed so as to cover the plurality of electrodes 61, the measurement substrate 60 is mounted on the substrate holding member 52 (ST1: measurement substrate mounting step) ( Figure 7). Next, the measurement unit 50 to which the measurement substrate 60 is attached is attached to the attachment surface 31 of the fixing portion 30, and the connection portion 50a of the measurement unit 50 is connected to the air ejection portion 33 (ST2: measurement unit attachment step) (Fig. 6).

Next, the collection box 70 is attached to the box holding portion 40, and the collection opening 72 of the collection box 70 is fitted to the discharge opening 51 of the measurement unit 50 (ST3: collection box mounting step) (FIG. 5). After the collection box mounting step (ST3), the detection sensor 42 detects whether or not the collection box 70 is mounted on the box holding portion 40 in a normal posture (ST4: collection box mounting posture detection step). If the collection box 70 is not mounted in the normal posture (No in ST4), the unit control section 39 causes the touch panel 12 to notify the abnormality (ST5: abnormality notification step). The worker who has recognized the abnormal posture reattaches the recovery box 70 to the box holding portion 40 (ST3). When the collection box 70 is mounted in the correct posture (Yes in ST4), preparation for measurement is completed.

Next, along the flow of FIG. 19, a component mounting method for mounting the electronic component D on the board B by the component mounting apparatuses M1 to M3 will be described. When the remaining number of electronic components D supplied by the tape feeder 5 decreases while the component mounting work is continued in the component mounting apparatuses M1 to M3, the operator supplies new carrier tape to the tape feeder 5. is performed (ST11). When the supply of the electronic components D continues from the replenished tape feeder 5 (No in ST12), and the first replenished electronic component D is supplied to the component pick-up position of the tape feeder 5 (Yes in ST12), the component A series of characteristic measurement steps (ST13) are executed in which the characteristic measurement device 16 measures the electrical characteristics of the electronic component D supplied to the take-out position.

When the electrical characteristics of the electronic component D are measured, the component acceptance/rejection determination unit 95 determines the standard value of the electrical characteristics of the electronic component D that is expected to be supplied from the tape feeder 5 and the characteristic measurement result of the electronic component D. are compared to determine whether or not the replenished electronic component D is correct (ST14: component acceptance/rejection determination step). If the replenished electronic component D is correct (Yes in ST14), component mounting work is resumed (ST15). If the supplied electronic component D is incorrect (No in ST14), the component acceptance/rejection determination unit 95 notifies the touch panel 12 that a different electronic component D has been supplied (ST16). The worker who recognizes the replenishment error performs the replenishment work again (ST11). This prevents the wrong electronic component D from being mounted on the board B. FIG.

Next, along the flow of FIG. 20, details of the characteristic measurement step (ST13) (characteristic measurement method) in the component mounting apparatuses M1 to M3 will be described with reference to FIGS. In FIG. 20, first, the electronic component D supplied by the component supply unit 4 (the first electronic component D supplied) is picked up by the suction nozzle 8a of the mounting head 8 (ST21: component picking step). Next, the head camera 10 (camera) that captures an image of the probe unit 13 (characteristic measuring device 16) from above moves above the measurement unit 50, captures an image of the electrode mark 64 with the head camera 10, and measures the electrode mark 64 based on the captured image. is recognized (ST22: electrode mark imaging step) (FIG. 21(a)).

Next, the measurement position determination unit 94 selects one of the plurality of measurement positions P1 to P9 based on the size (component width W) of the electronic component D and the number of times the electronic component D is placed at each measurement position P1 to P9. The measurement positions P1 to P9 of the electronic component D are determined so that the number of times they are placed is uniform (ST23: measurement position determination step). Next, the pressing member 37 moves to a retracted position where it does not interfere with the electronic component D held by the suction nozzle 8a of the mounting head 8 (ST24: pressing portion retracting step) (FIG. 21(b)). Thereby, the measurement opening 52a above the measurement position P is opened. Note that the pressing portion retracting step (ST24) may be executed in parallel with the measurement position determining step (ST23).

In FIG. 20, the electronic component D picked up by the suction nozzle 8a of the mounting head 8 is placed at one of the plurality of measurement positions P1 to P9 determined in the measurement position determination step (ST23) (ST25: component installation step). ) (FIG. 21(c)). That is, the electronic component D is placed at any one of the plurality of measurement positions P1 to P9 so that the number of times it is placed at the measurement positions P1 to P9 is uniform. In the component placement step (ST25), the position where the electronic component D is placed is corrected based on the imaging result of the electrode mark 64 in the substrate mark imaging step (ST22). Before placing the electronic component D at the measurement positions P1 to P9, the position of the electronic component D held by the suction nozzle 8a (absorption position deviation) is recognized by the component recognition camera 11, and the electronic component D is placed based on the recognition result. The position may be corrected (absorption position deviation corrected).

Next, the pressing member 37 is moved from the retracted position above the electronic component D (FIG. 22(a)), and the pressing member 37 is lowered so that the terminal Dt of the electronic component D placed at the measurement position P and the plurality of electrodes 61 are connected. Pressure is applied between them (ST26: pressure step) (FIG. 22(b)). While the pressure is being applied in the pressurizing step (ST26), the electrical characteristics of the electronic component D are measured by the measuring instrument 15 (ST27: characteristic measuring step).

When the characteristic measurement is completed, the number of times the electronic component D is placed at each of the measurement positions P1 to P9 stored in the measurement information storage unit 98 is updated based on the measurement positions P1 to P9 at which the electronic component D is placed. (ST28). Next, the pressing member 37 is raised (FIG. 22(c)). Next, compressed air is jetted from the jetting port 34 of the air jetting portion 33 to blow away the electronic component D at the measurement position P, which is then discharged from the discharge port 51 together with the compressed air through the discharge passage 50b and discarded in the storage portion 78 of the collection box 70. (ST29: electronic component disposal step) (FIG. 22(d)). The compressed air may be jetted continuously or intermittently multiple times. This completes the series of characteristic measurement steps (ST13).

In the characteristic measurement method shown in FIG. 20, the electronic component D placed at the measurement position P is pressed by the pressing member 37 during measurement of the electrical characteristics, but the method of pressing is limited to this. no. For example, after the electronic component D held by the suction nozzle 8a is placed at the measurement position P (ST25), the electronic component D is pushed downward by the suction nozzle 8a while the electronic component D is being held. You may make it pressure.

As described above, the characteristic measuring device 16 of the present embodiment includes a fixed portion 30 in which a plurality of fixed side contacts (pins 32) are arranged on the mounting surface 31, and a measuring device detachably mounted on the mounting surface 31. a unit 50; Measurement unit 50 has a plurality of electrodes 61 electrically connected to electronic component D formed on one surface (upper surface 60a), and a plurality of electrodes 61 and 61 on another surface (lower surface 60b) different from the one surface. A measurement substrate 60 formed with a plurality of unit side contacts 62 electrically connected to a plurality of fixed side contacts, respectively, and a measurement opening for placing an electronic component D at a measurement position P of the attached measurement substrate 60. and a substrate holding member 52 on which 52a is formed. Thereby, the measuring electrode 61 for measuring the electrical characteristics of the electronic component D can be easily replaced.

The characteristic measuring apparatus, the component mounting apparatus, the characteristic measuring method, and the component mounting method of the present invention are advantageous in that the measuring substrate on which the measuring electrodes for measuring the electrical characteristics of the electronic component are formed can be easily replaced. and is useful in the field of mounting electronic components on substrates.

4 component supply unit 8 mounting head 10 head camera (camera)
15 measuring instrument 16 characteristic measuring device 30 fixed part 31 mounting surface 32 pin (fixed side contact)
33 air ejection part 34 ejection port 36 pressing part 37 pressing member 38 pressing member moving mechanism 50 measurement unit 50a connection part 50b discharge path 52 substrate holding member 52a measurement opening 52b recognition opening 53 anisotropic conductive sheet 60 measurement substrate 60a upper surface 60b Lower surface 61 Electrode 62 Unit side contact 64 Electrode mark B Substrate D Electronic components M1 to M3 Component mounter P, P1 to P9 Measurement position

Claims (18)

a fixed part in which a plurality of fixed-side contacts are arranged on the mounting surface;
a measurement unit detachably mounted on the mounting surface,
The measurement unit
A plurality of electrodes electrically connected to the electronic component are formed on one surface, and the plurality of electrodes and the plurality of fixed side contacts are electrically connected to the other surface different from the one surface. a measurement board on which a plurality of unit-side contacts are formed;
and a substrate holding member having a measurement opening for placing the electronic component at a measurement position of the mounted measurement substrate. 2. The characteristic measuring device according to claim 1, wherein said plurality of fixed side contacts are a plurality of pins protruding from said mounting surface and biased in a protruding direction. 3. The characteristic measuring device according to claim 1, further comprising a measuring instrument connected to said plurality of fixed side contacts and measuring electrical characteristics of said electronic component. An air ejection portion connected to the measurement unit is arranged in the fixing portion,
4. The characteristic measuring device according to any one of claims 1 to 3, wherein said measuring unit is formed with a connecting portion connected to said air ejection portion. A compressed air ejection port is formed in the air ejection portion,
The measurement unit is formed with a discharge path through which the compressed air ejected from the ejection port flows from the connecting portion and passes horizontally through the measurement unit via the measurement position. Item 5. The characteristic measuring device according to item 4. electrode marks for recognizing the positions of the plurality of electrodes are formed on the one surface of the measurement substrate;
6. The characteristic measuring device according to claim 1, wherein said substrate holding member is formed with a recognition opening for recognizing said electrode mark of said mounted measurement substrate. The measurement substrate is mounted on the substrate holding member with an anisotropic conductive sheet placed thereon so as to cover at least a portion of the plurality of electrodes,
7. The characteristic measuring device according to claim 1, wherein the electrical characteristics of said electronic component are measured while applying pressure between said electronic component placed at said measurement position and said plurality of electrodes. The characteristic measuring device according to any one of claims 1 to 7, wherein the fixing section further includes a pressing section that presses the electronic component placed at the measurement position toward the plurality of electrodes. The pressing part is
a pressing member that contacts the electronic component;
9. The characteristic measuring device according to claim 8, further comprising a pressing member moving mechanism that moves the pressing member up and down and reciprocates in at least one direction in a horizontal plane. a characteristic measuring device according to any one of claims 1 to 9;
a component supply unit that supplies electronic components;
a mounting head that holds electronic components supplied by the component supply unit and mounts them on a board;
The component mounting apparatus, wherein the characteristic measuring device receives the electronic component held by the mounting head and measures the electrical characteristics of the electronic component. A characteristic measuring method for measuring electrical characteristics of an electronic component by the characteristic measuring device according to any one of claims 1 to 9,
a measurement substrate mounting step of mounting the measurement substrate on the substrate holding member;
a measurement unit mounting step of mounting the measurement unit on which the measurement substrate is mounted on the mounting surface and connecting the connection portion to the air ejection portion;
A component installation process for placing the electronic component at a measurement position;
a pressing step of applying pressure between the electronic component placed at the measurement position and a plurality of electrodes;
and a characteristic measuring step of measuring the electrical characteristics of the electronic component while the pressure is being applied in the pressing step. 12. The measurement substrate mounting step according to claim 11, wherein the measurement substrate is mounted on the substrate holding member after placing an anisotropic conductive sheet so as to cover at least part of the plurality of electrodes. Characteristic measurement method. 13. The method according to claim 11, wherein in said pressurizing step, said electronic component placed at said measurement position is pressed toward said plurality of electrodes by a pressing member to apply pressure between said electronic component and said plurality of electrodes. characteristic measurement method. 14. The characteristic measurement according to any one of claims 11 to 13, further comprising an electronic component discarding step of ejecting compressed air from an ejection port and discarding the electronic component at the measurement position through a discharge path after the characteristic measuring step. Method. A component comprising: the characteristic measuring device according to any one of claims 1 to 9; a component supply unit that supplies electronic components; and a mounting head that holds and mounts the electronic component supplied by the component supply unit onto a substrate. A component mounting method for mounting an electronic component on a substrate by a mounting device,
a measurement substrate mounting step of mounting the measurement substrate on the substrate holding member;
a measurement unit mounting step of mounting the measurement unit on which the measurement substrate is mounted on the mounting surface and connecting the connection portion to the air ejection portion;
a component taking-out step of taking out the electronic component supplied from the component supply unit by the mounting head;
a component installation step of placing the electronic component at a measurement position;
a pressing step of applying pressure between the electronic component placed at the measurement position and a plurality of electrodes;
and a characteristic measuring step of measuring electrical characteristics of the electronic component while the pressure is being applied in the pressing step. The component mounting device includes a camera that captures the characteristic measurement device,
Further comprising an electrode mark imaging step of imaging the electrode mark with the camera before the component installation step,
16. The component mounting method according to claim 15, wherein, in said component placement step, said electronic component is placed at said measurement position based on the imaging result of said electrode mark. 17. The component mounting method according to claim 15, further comprising, prior to said component installation step, a pressing portion retracting step of moving a pressing member to a position where it does not interfere with said electronic component held by said mounting head. 18. The component mounting according to any one of claims 15 to 17, further comprising an electronic component discarding step of ejecting compressed air from an ejection port and discarding the electronic component at the measurement position through a discharge path after the characteristic measuring step. Method.

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