JP7134066B2 - レジスト組成物及びレジストパターン形成方法 - Google Patents

レジスト組成物及びレジストパターン形成方法 Download PDF

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JP7134066B2
JP7134066B2 JP2018207774A JP2018207774A JP7134066B2 JP 7134066 B2 JP7134066 B2 JP 7134066B2 JP 2018207774 A JP2018207774 A JP 2018207774A JP 2018207774 A JP2018207774 A JP 2018207774A JP 7134066 B2 JP7134066 B2 JP 7134066B2
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carbon atoms
atom
acid
groups
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JP2020071466A (ja
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真人 矢萩
洋一 堀
達也 藤井
友貴 福村
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2018207774A priority Critical patent/JP7134066B2/ja
Priority to US16/600,811 priority patent/US11372329B2/en
Priority to TW108137431A priority patent/TWI814923B/zh
Priority to KR1020190134629A priority patent/KR102492349B1/ko
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/322Aqueous alkaline compositions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking

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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Emergency Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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TW108137431A TWI814923B (zh) 2018-11-02 2019-10-17 阻劑組成物及阻劑圖型形成方法
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Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
JP6999351B2 (ja) * 2017-10-05 2022-01-18 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、高分子化合物及び化合物
JP7292150B2 (ja) * 2019-08-22 2023-06-16 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、高分子化合物及び化合物
JP2021076650A (ja) * 2019-11-06 2021-05-20 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP7422532B2 (ja) * 2019-12-18 2024-01-26 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP7376433B2 (ja) 2020-07-07 2023-11-08 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
US11829068B2 (en) 2020-10-19 2023-11-28 Tokyo Ohka Kogyo Co., Ltd. Resist composition, method of forming resist pattern, compound, and resin
KR102587517B1 (ko) * 2020-10-28 2023-10-10 최상준 감광성 고분자 및 포토레지스트 조성물
JP2023169592A (ja) * 2022-05-17 2023-11-30 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、及び化合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095698A1 (ja) 2009-02-19 2010-08-26 Jsr株式会社 重合体及び感放射線性組成物並びに単量体
WO2012053527A1 (ja) 2010-10-22 2012-04-26 Jsr株式会社 パターン形成方法及び感放射線性組成物
JP2018004778A (ja) 2016-06-28 2018-01-11 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法、並びに、化合物及び酸発生剤
WO2020054275A1 (ja) 2018-09-13 2020-03-19 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5149236B2 (zh) 1971-09-16 1976-12-25
KR100998503B1 (ko) 2008-10-30 2010-12-07 금호석유화학 주식회사 방향족 환을 포함하는 산 발생제
JP5136792B2 (ja) * 2008-11-21 2013-02-06 信越化学工業株式会社 ポジ型レジスト材料及びパターン形成方法
JP5611907B2 (ja) * 2011-08-17 2014-10-22 信越化学工業株式会社 ポジ型レジスト組成物及びパターン形成方法
JP6134619B2 (ja) * 2013-09-13 2017-05-24 富士フイルム株式会社 パターン形成方法、及び、電子デバイスの製造方法
KR102554985B1 (ko) * 2015-01-16 2023-07-12 도오꾜오까고오교 가부시끼가이샤 레지스트 조성물 및 레지스트 패턴 형성 방법
JP6428389B2 (ja) * 2015-03-09 2018-11-28 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
US10324377B2 (en) * 2015-06-15 2019-06-18 Tokyo Ohka Kogyo Co., Ltd. Resist composition and method of forming resist pattern
JP7042551B2 (ja) * 2016-09-20 2022-03-28 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP2020095068A (ja) * 2017-03-31 2020-06-18 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法
JP6999351B2 (ja) * 2017-10-05 2022-01-18 東京応化工業株式会社 レジスト組成物、レジストパターン形成方法、高分子化合物及び化合物
JP6927176B2 (ja) * 2017-10-16 2021-08-25 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP7085835B2 (ja) * 2017-12-28 2022-06-17 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
JP6992166B2 (ja) 2018-03-30 2022-01-13 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
US11221557B2 (en) * 2018-05-28 2022-01-11 Tokyo Ohka Kogyo Co., Ltd. Resist composition, method of forming resist pattern, compound, and acid generator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095698A1 (ja) 2009-02-19 2010-08-26 Jsr株式会社 重合体及び感放射線性組成物並びに単量体
WO2012053527A1 (ja) 2010-10-22 2012-04-26 Jsr株式会社 パターン形成方法及び感放射線性組成物
JP2018004778A (ja) 2016-06-28 2018-01-11 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法、並びに、化合物及び酸発生剤
WO2020054275A1 (ja) 2018-09-13 2020-03-19 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法

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