JP7132928B2 - 圧電性高分子領域を含むフィルム - Google Patents

圧電性高分子領域を含むフィルム Download PDF

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JP7132928B2
JP7132928B2 JP2019540713A JP2019540713A JP7132928B2 JP 7132928 B2 JP7132928 B2 JP 7132928B2 JP 2019540713 A JP2019540713 A JP 2019540713A JP 2019540713 A JP2019540713 A JP 2019540713A JP 7132928 B2 JP7132928 B2 JP 7132928B2
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film
sheet
adhesive sheet
laminated
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JP2019530988A5 (enExample
JP2019530988A (ja
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フランク、メランジュオ
サナト、ワグレ
アノワルル、ハビブ
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ウニベルシテテット イ トロムソ－ノルゲス アークティスク ウニベルシテット
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Laminated Bodies (AREA)
JP2019540713A 2016-10-10 2017-10-06 圧電性高分子領域を含むフィルム Active JP7132928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1617171.2 2016-10-10
GBGB1617171.2A GB201617171D0 (en) 2016-10-10 2016-10-10 Piezoelectric films
PCT/GB2017/053040 WO2018069680A1 (en) 2016-10-10 2017-10-06 Film with piezoelectric polymer region

Publications (3)

Publication Number Publication Date
JP2019530988A JP2019530988A (ja) 2019-10-24
JP2019530988A5 JP2019530988A5 (enExample) 2020-11-05
JP7132928B2 true JP7132928B2 (ja) 2022-09-07

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JP2019540713A Active JP7132928B2 (ja) 2016-10-10 2017-10-06 圧電性高分子領域を含むフィルム

Country Status (6)

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US (2) US10797222B2 (enExample)
EP (1) EP3523833B1 (enExample)
JP (1) JP7132928B2 (enExample)
CA (1) CA3039437A1 (enExample)
GB (1) GB201617171D0 (enExample)
WO (1) WO2018069680A1 (enExample)

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GB201617171D0 (en) 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
US11666239B2 (en) 2017-03-14 2023-06-06 University Of Connecticut Biodegradable pressure sensor
US11826495B2 (en) 2019-03-01 2023-11-28 University Of Connecticut Biodegradable piezoelectric ultrasonic transducer system
US11678989B2 (en) * 2019-03-01 2023-06-20 University Of Connecticut Biodegradable piezoelectric nanofiber scaffold for bone or tissue regeneration
EP4031616B1 (en) 2019-09-16 2025-06-18 Apollo Tyres Global R&D B.V. Method for chemically adhering a diene rubber to a piezoelectric polymer
WO2021183626A1 (en) 2020-03-10 2021-09-16 University Of Connecticut Therapeutic bandage
US12491290B2 (en) 2020-06-08 2025-12-09 University Of Connecticut Biodegradable piezoelectric composite materials
CN113346005B (zh) * 2021-06-17 2024-07-02 太原工业学院 夹芯式薄膜传感器真空环境压合装置及方法
CN113432772B (zh) * 2021-06-17 2023-09-08 中北大学 物体表面冲击波测量高灵敏薄膜传感器及制作方法
CN113432763B (zh) * 2021-06-17 2023-07-21 中北大学 夹芯式pvdf压力计真空环境压制装置及方法
CN113432773B (zh) * 2021-06-17 2023-10-27 中北大学 适用于柔性物体表面冲击波压力测量传感器及制作方法
KR102675469B1 (ko) * 2021-09-29 2024-06-17 한국기술교육대학교 산학협력단 압전 필름 스피커 및 그 제조방법
US12431614B1 (en) 2024-02-05 2025-09-30 Rockwell Collins, Inc. Frequency tunable piezoelectric VLF antenna

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WO2013004541A1 (de) 2011-07-07 2013-01-10 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiger folienkörper
WO2014073628A1 (ja) 2012-11-08 2014-05-15 味の素株式会社 メンブレンスイッチおよびそれを用いてなる物品

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US11450800B2 (en) 2022-09-20
CA3039437A1 (en) 2018-04-19
US20190319181A1 (en) 2019-10-17
GB201617171D0 (en) 2016-11-23
WO2018069680A1 (en) 2018-04-19
JP2019530988A (ja) 2019-10-24
US20200373477A1 (en) 2020-11-26
EP3523833A1 (en) 2019-08-14
US10797222B2 (en) 2020-10-06
EP3523833B1 (en) 2022-11-16

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