JP7132928B2 - 圧電性高分子領域を含むフィルム - Google Patents

圧電性高分子領域を含むフィルム Download PDF

Info

Publication number
JP7132928B2
JP7132928B2 JP2019540713A JP2019540713A JP7132928B2 JP 7132928 B2 JP7132928 B2 JP 7132928B2 JP 2019540713 A JP2019540713 A JP 2019540713A JP 2019540713 A JP2019540713 A JP 2019540713A JP 7132928 B2 JP7132928 B2 JP 7132928B2
Authority
JP
Japan
Prior art keywords
film
sheet
adhesive sheet
laminated
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2019540713A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019530988A5 (enExample
JP2019530988A (ja
Inventor
フランク、メランジュオ
サナト、ワグレ
アノワルル、ハビブ
Original Assignee
ウニベルシテテット イ トロムソ－ノルゲス アークティスク ウニベルシテット
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウニベルシテテット イ トロムソ－ノルゲス アークティスク ウニベルシテット filed Critical ウニベルシテテット イ トロムソ－ノルゲス アークティスク ウニベルシテット
Publication of JP2019530988A publication Critical patent/JP2019530988A/ja
Publication of JP2019530988A5 publication Critical patent/JP2019530988A5/ja
Application granted granted Critical
Publication of JP7132928B2 publication Critical patent/JP7132928B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Ceramic Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Laminated Bodies (AREA)
JP2019540713A 2016-10-10 2017-10-06 圧電性高分子領域を含むフィルム Expired - Fee Related JP7132928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1617171.2A GB201617171D0 (en) 2016-10-10 2016-10-10 Piezoelectric films
GB1617171.2 2016-10-10
PCT/GB2017/053040 WO2018069680A1 (en) 2016-10-10 2017-10-06 Film with piezoelectric polymer region

Publications (3)

Publication Number Publication Date
JP2019530988A JP2019530988A (ja) 2019-10-24
JP2019530988A5 JP2019530988A5 (enExample) 2020-11-05
JP7132928B2 true JP7132928B2 (ja) 2022-09-07

Family

ID=57610592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019540713A Expired - Fee Related JP7132928B2 (ja) 2016-10-10 2017-10-06 圧電性高分子領域を含むフィルム

Country Status (6)

Country Link
US (2) US10797222B2 (enExample)
EP (1) EP3523833B1 (enExample)
JP (1) JP7132928B2 (enExample)
CA (1) CA3039437A1 (enExample)
GB (1) GB201617171D0 (enExample)
WO (1) WO2018069680A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201617171D0 (en) 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
EP3595515A4 (en) 2017-03-14 2020-12-30 University of Connecticut BIODEGRADABLE PRESSURE SENSOR
US11826495B2 (en) 2019-03-01 2023-11-28 University Of Connecticut Biodegradable piezoelectric ultrasonic transducer system
US11678989B2 (en) * 2019-03-01 2023-06-20 University Of Connecticut Biodegradable piezoelectric nanofiber scaffold for bone or tissue regeneration
EP4031616B1 (en) 2019-09-16 2025-06-18 Apollo Tyres Global R&D B.V. Method for chemically adhering a diene rubber to a piezoelectric polymer
WO2021183626A1 (en) 2020-03-10 2021-09-16 University Of Connecticut Therapeutic bandage
US12491290B2 (en) 2020-06-08 2025-12-09 University Of Connecticut Biodegradable piezoelectric composite materials
CN113432773B (zh) * 2021-06-17 2023-10-27 中北大学 适用于柔性物体表面冲击波压力测量传感器及制作方法
CN113432763B (zh) * 2021-06-17 2023-07-21 中北大学 夹芯式pvdf压力计真空环境压制装置及方法
CN113432772B (zh) * 2021-06-17 2023-09-08 中北大学 物体表面冲击波测量高灵敏薄膜传感器及制作方法
CN113346005B (zh) * 2021-06-17 2024-07-02 太原工业学院 夹芯式薄膜传感器真空环境压合装置及方法
KR102675469B1 (ko) * 2021-09-29 2024-06-17 한국기술교육대학교 산학협력단 압전 필름 스피커 및 그 제조방법
US12431614B1 (en) 2024-02-05 2025-09-30 Rockwell Collins, Inc. Frequency tunable piezoelectric VLF antenna
US12646848B1 (en) 2024-02-05 2026-06-02 Rockwell Collins, Inc. Arraying architecture of piezoelectric RF radiators
US12531330B1 (en) 2024-02-05 2026-01-20 Rockwell Collins, Inc. Oscillator integrated piezoelectric radiator

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714608A (zh) 2009-12-01 2010-05-26 同济大学 压电聚合物薄膜传感器的封装方法
WO2013004541A1 (de) 2011-07-07 2013-01-10 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiger folienkörper
WO2014073628A1 (ja) 2012-11-08 2014-05-15 味の素株式会社 メンブレンスイッチおよびそれを用いてなる物品

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT375466B (de) 1977-07-27 1984-08-10 List Hans Messwertaufnehmer mit einem piezoelektrischen messelement
DE3166101D1 (en) 1980-02-07 1984-10-25 Toray Industries Piezoelectric polymer material, process for producing the same and an ultrasonic transducer utilizing the same
JPS57126125A (en) 1981-01-29 1982-08-05 Tokyo Shibaura Electric Co Piezoelectric or pyroelectric element
US5089739A (en) 1990-03-19 1992-02-18 Brother Kogyo Kabushiki Kaisha Laminate type piezoelectric actuator element
DE69215599T2 (de) 1991-08-09 1997-06-19 Kureha Chemical Ind Co Ltd Biegsame piezoelektrische Vorrichtung
US6420819B1 (en) 1994-01-27 2002-07-16 Active Control Experts, Inc. Packaged strain actuator
US5702629A (en) 1996-03-21 1997-12-30 Alliedsignal Inc. Piezeoelectric ceramic-polymer composites
JP3575373B2 (ja) * 1999-04-19 2004-10-13 株式会社村田製作所 外力検知センサの製造方法
JP2001250993A (ja) 2000-03-03 2001-09-14 Matsushita Electric Ind Co Ltd 可撓性圧電素子およびその製造方法
US20040263483A1 (en) * 2003-06-24 2004-12-30 Aufderheide Brian E Sensing device
JP5044196B2 (ja) 2006-11-13 2012-10-10 アイシン精機株式会社 圧電センサ及びその製造方法
US9375754B2 (en) 2010-03-31 2016-06-28 Konica Minolta Medical & Graphic, Inc. Laminated piezoelectric body, laminated piezoelectric body manufacturing method, and ultrasound transducer and ultrasound diagnostic device using laminated piezoelectric body
US8585187B2 (en) 2011-04-29 2013-11-19 Xerox Corporation High density electrical interconnect for printing devices using flex circuits and dielectric underfill
KR20140073201A (ko) 2012-12-06 2014-06-16 한국전자통신연구원 압전 에너지 하베스팅 장치 및 그 제조 방법
KR101983010B1 (ko) * 2012-12-28 2019-09-10 다우 코닝 도레이 캄파니 리미티드 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용
JP5686443B2 (ja) 2013-01-10 2015-03-18 日本写真印刷株式会社 接着層付きフィルム状感圧センサとこれを用いたタッチパッド、タッチ入力機能付き保護パネル及び電子機器
EP2977718B1 (en) 2013-03-21 2019-08-07 Murata Manufacturing Co., Ltd. Displacement sensor, pushing amount detection sensor, and touch input device
US9904428B2 (en) 2013-11-21 2018-02-27 3M Innovative Properties Company Multi-layer piezoelectric polymer film devices and methods
EP2894631B1 (en) * 2013-12-20 2018-08-22 Samsung Medison Co., Ltd. Ultrasonic diagnostic apparatus and manufacturing method thereof
JP5730452B1 (ja) 2014-02-27 2015-06-10 京セラ株式会社 圧電アクチュエータおよびこれを備えた圧電振動装置、携帯端末、音響発生器、音響発生装置、電子機器
CN106489119B (zh) 2014-07-02 2020-02-18 株式会社村田制作所 触摸面板
WO2016027667A1 (ja) 2014-08-21 2016-02-25 株式会社村田製作所 振動体及び触覚提示キーボード
KR101612456B1 (ko) * 2014-09-12 2016-04-14 한국세라믹기술원 압전 파이버 컴포지트 구조체 및 이를 이용한 압전 스피커
GB201617171D0 (en) 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
KR102640240B1 (ko) * 2016-10-31 2024-02-22 엘지디스플레이 주식회사 접촉 감응 소자 및 이를 포함하는 표시 장치
JP6663081B2 (ja) * 2016-11-14 2020-03-11 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 電気活性アクチュエータの剛性制御
US20190354222A1 (en) * 2017-01-06 2019-11-21 Sabic Global Technologies B.V. Triboelectric sensor with haptic feedback

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714608A (zh) 2009-12-01 2010-05-26 同济大学 压电聚合物薄膜传感器的封装方法
WO2013004541A1 (de) 2011-07-07 2013-01-10 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiger folienkörper
US20140218663A1 (en) 2011-07-07 2014-08-07 Ovd Kinegram Ag Multi-Layered Foil Body
JP2014529752A (ja) 2011-07-07 2014-11-13 レオンハードクルツ シュティフトゥングウント コー． カーゲー 多層フィルム体
WO2014073628A1 (ja) 2012-11-08 2014-05-15 味の素株式会社 メンブレンスイッチおよびそれを用いてなる物品
US20150311012A1 (en) 2012-11-08 2015-10-29 Ajinomoto Co., Inc. Membrane switch and object employing same

Also Published As

Publication number Publication date
GB201617171D0 (en) 2016-11-23
CA3039437A1 (en) 2018-04-19
US11450800B2 (en) 2022-09-20
US20200373477A1 (en) 2020-11-26
US10797222B2 (en) 2020-10-06
WO2018069680A1 (en) 2018-04-19
EP3523833A1 (en) 2019-08-14
JP2019530988A (ja) 2019-10-24
EP3523833B1 (en) 2022-11-16
US20190319181A1 (en) 2019-10-17

Similar Documents

Publication Publication Date Title
US11450800B2 (en) Film with piezoelectric polymer region
JP7609950B2 (ja) 圧電素子
TW200934271A (en) Sound-generating device
GB2229855A (en) Laminated piezoelectric structures and process of forming the same
JP2013513230A (ja) 圧電性ポリマーフィルム素子、特にポリマー箔、およびその製造方法
KR20220007153A (ko) 고분자 복합 압전체 및 압전 필름
US20230127642A1 (en) Piezoelectric element
JP7259075B2 (ja) 圧電素子
CN116783902A (zh) 压电薄膜
JP7286790B2 (ja) 圧電素子
US20240206341A1 (en) Laminated piezoelectric element and electroacoustic transducer
TW202236704A (zh) 壓電薄膜
CN223168644U (zh) 一种31模式复合压电晶体及传感声头
JP2002026409A (ja) 可撓性圧電素子
TW202315175A (zh) 壓電元件及電聲轉換器
WO2023248696A1 (ja) 圧電フィルム、圧電素子および電気音響変換器、ならびに、圧電フィルムの製造方法
TW202315173A (zh) 壓電元件及電聲轉換器
KR20220080135A (ko) 적층 압전 소자

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200914

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200914

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210824

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210826

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20211119

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220517

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220523

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220628

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220727

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220826

R150 Certificate of patent or registration of utility model

Ref document number: 7132928

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees