CA3039437A1 - Film with piezoelectric polymer region - Google Patents
Film with piezoelectric polymer region Download PDFInfo
- Publication number
- CA3039437A1 CA3039437A1 CA3039437A CA3039437A CA3039437A1 CA 3039437 A1 CA3039437 A1 CA 3039437A1 CA 3039437 A CA3039437 A CA 3039437A CA 3039437 A CA3039437 A CA 3039437A CA 3039437 A1 CA3039437 A1 CA 3039437A1
- Authority
- CA
- Canada
- Prior art keywords
- film
- active region
- sheet
- adhesive sheet
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 79
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000002033 PVDF binder Substances 0.000 claims description 30
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000007822 coupling agent Substances 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 230000037452 priming Effects 0.000 claims description 2
- 238000003475 lamination Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 27
- 239000010410 layer Substances 0.000 description 26
- 239000012790 adhesive layer Substances 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 229920001166 Poly(vinylidene fluoride-co-trifluoroethylene) Polymers 0.000 description 5
- 229920002873 Polyethylenimine Polymers 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1617171.2 | 2016-10-10 | ||
| GBGB1617171.2A GB201617171D0 (en) | 2016-10-10 | 2016-10-10 | Piezoelectric films |
| PCT/GB2017/053040 WO2018069680A1 (en) | 2016-10-10 | 2017-10-06 | Film with piezoelectric polymer region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3039437A1 true CA3039437A1 (en) | 2018-04-19 |
Family
ID=57610592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3039437A Pending CA3039437A1 (en) | 2016-10-10 | 2017-10-06 | Film with piezoelectric polymer region |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10797222B2 (enExample) |
| EP (1) | EP3523833B1 (enExample) |
| JP (1) | JP7132928B2 (enExample) |
| CA (1) | CA3039437A1 (enExample) |
| GB (1) | GB201617171D0 (enExample) |
| WO (1) | WO2018069680A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201617171D0 (en) | 2016-10-10 | 2016-11-23 | Universitetet I Troms� - Norges Arktiske Universitet | Piezoelectric films |
| US11666239B2 (en) | 2017-03-14 | 2023-06-06 | University Of Connecticut | Biodegradable pressure sensor |
| US11826495B2 (en) | 2019-03-01 | 2023-11-28 | University Of Connecticut | Biodegradable piezoelectric ultrasonic transducer system |
| US11678989B2 (en) * | 2019-03-01 | 2023-06-20 | University Of Connecticut | Biodegradable piezoelectric nanofiber scaffold for bone or tissue regeneration |
| EP4031616B1 (en) | 2019-09-16 | 2025-06-18 | Apollo Tyres Global R&D B.V. | Method for chemically adhering a diene rubber to a piezoelectric polymer |
| WO2021183626A1 (en) | 2020-03-10 | 2021-09-16 | University Of Connecticut | Therapeutic bandage |
| US12491290B2 (en) | 2020-06-08 | 2025-12-09 | University Of Connecticut | Biodegradable piezoelectric composite materials |
| CN113346005B (zh) * | 2021-06-17 | 2024-07-02 | 太原工业学院 | 夹芯式薄膜传感器真空环境压合装置及方法 |
| CN113432772B (zh) * | 2021-06-17 | 2023-09-08 | 中北大学 | 物体表面冲击波测量高灵敏薄膜传感器及制作方法 |
| CN113432763B (zh) * | 2021-06-17 | 2023-07-21 | 中北大学 | 夹芯式pvdf压力计真空环境压制装置及方法 |
| CN113432773B (zh) * | 2021-06-17 | 2023-10-27 | 中北大学 | 适用于柔性物体表面冲击波压力测量传感器及制作方法 |
| KR102675469B1 (ko) * | 2021-09-29 | 2024-06-17 | 한국기술교육대학교 산학협력단 | 압전 필름 스피커 및 그 제조방법 |
| US12431614B1 (en) | 2024-02-05 | 2025-09-30 | Rockwell Collins, Inc. | Frequency tunable piezoelectric VLF antenna |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT375466B (de) | 1977-07-27 | 1984-08-10 | List Hans | Messwertaufnehmer mit einem piezoelektrischen messelement |
| AU544447B2 (en) | 1980-02-07 | 1985-05-30 | Toray Industries, Inc. | Vinylidene fluoride and ethylene trifluoride copolymer |
| JPS57126125A (en) | 1981-01-29 | 1982-08-05 | Tokyo Shibaura Electric Co | Piezoelectric or pyroelectric element |
| US5089739A (en) | 1990-03-19 | 1992-02-18 | Brother Kogyo Kabushiki Kaisha | Laminate type piezoelectric actuator element |
| US5288551A (en) | 1991-08-09 | 1994-02-22 | Kureha Kagaku Kogyo Kabushiki Kaisha | Flexible piezoelectric device |
| US6420819B1 (en) | 1994-01-27 | 2002-07-16 | Active Control Experts, Inc. | Packaged strain actuator |
| US5702629A (en) | 1996-03-21 | 1997-12-30 | Alliedsignal Inc. | Piezeoelectric ceramic-polymer composites |
| JP3575373B2 (ja) * | 1999-04-19 | 2004-10-13 | 株式会社村田製作所 | 外力検知センサの製造方法 |
| JP2001250993A (ja) | 2000-03-03 | 2001-09-14 | Matsushita Electric Ind Co Ltd | 可撓性圧電素子およびその製造方法 |
| US20040263483A1 (en) * | 2003-06-24 | 2004-12-30 | Aufderheide Brian E | Sensing device |
| JP5044196B2 (ja) | 2006-11-13 | 2012-10-10 | アイシン精機株式会社 | 圧電センサ及びその製造方法 |
| CN101714608B (zh) | 2009-12-01 | 2011-05-25 | 同济大学 | 压电聚合物薄膜传感器的封装方法 |
| WO2011121882A1 (ja) | 2010-03-31 | 2011-10-06 | コニカミノルタエムジー株式会社 | 積層型圧電体および積層型圧電体の製造方法ならびに前記積層型圧電体を用いた超音波トランスデューサおよび超音波診断装置 |
| US8585187B2 (en) | 2011-04-29 | 2013-11-19 | Xerox Corporation | High density electrical interconnect for printing devices using flex circuits and dielectric underfill |
| DE102011107421A1 (de) * | 2011-07-07 | 2013-01-10 | Leonhard Kurz Stiftung & Co. Kg | Mehrschichtiger Folienkörper |
| KR20150084035A (ko) * | 2012-11-08 | 2015-07-21 | 아지노모토 가부시키가이샤 | 멤브레인 스위치 및 그것을 이용하여 이루어지는 물품 |
| KR20140073201A (ko) | 2012-12-06 | 2014-06-16 | 한국전자통신연구원 | 압전 에너지 하베스팅 장치 및 그 제조 방법 |
| JP6415451B2 (ja) * | 2012-12-28 | 2018-10-31 | ダウ シリコーンズ コーポレーション | トランスデューサー用硬化性オルガノシロキサン組成物及び硬化性シリコーン組成物のトランスデューサーへの使用 |
| JP5686443B2 (ja) | 2013-01-10 | 2015-03-18 | 日本写真印刷株式会社 | 接着層付きフィルム状感圧センサとこれを用いたタッチパッド、タッチ入力機能付き保護パネル及び電子機器 |
| CN105190224B (zh) | 2013-03-21 | 2018-08-31 | 株式会社村田制作所 | 位移传感器、按压量检测传感器以及触摸式输入装置 |
| CN105765750B (zh) | 2013-11-21 | 2018-07-20 | 3M创新有限公司 | 多层压电聚合物膜装置和方法 |
| EP2894631B1 (en) * | 2013-12-20 | 2018-08-22 | Samsung Medison Co., Ltd. | Ultrasonic diagnostic apparatus and manufacturing method thereof |
| CN105027581B (zh) | 2014-02-27 | 2018-01-05 | 京瓷株式会社 | 压电致动器及具备其的压电振动装置、便携式终端、声音发生器、声音发生装置、电子设备 |
| WO2016002459A1 (ja) | 2014-07-02 | 2016-01-07 | 株式会社村田製作所 | タッチパネル |
| WO2016027667A1 (ja) | 2014-08-21 | 2016-02-25 | 株式会社村田製作所 | 振動体及び触覚提示キーボード |
| KR101612456B1 (ko) * | 2014-09-12 | 2016-04-14 | 한국세라믹기술원 | 압전 파이버 컴포지트 구조체 및 이를 이용한 압전 스피커 |
| GB201617171D0 (en) | 2016-10-10 | 2016-11-23 | Universitetet I Troms� - Norges Arktiske Universitet | Piezoelectric films |
| KR102640240B1 (ko) * | 2016-10-31 | 2024-02-22 | 엘지디스플레이 주식회사 | 접촉 감응 소자 및 이를 포함하는 표시 장치 |
| WO2018087342A1 (en) * | 2016-11-14 | 2018-05-17 | Koninklijke Philips N.V. | Stiffness control for electroactive actuators |
| US20190354222A1 (en) * | 2017-01-06 | 2019-11-21 | Sabic Global Technologies B.V. | Triboelectric sensor with haptic feedback |
-
2016
- 2016-10-10 GB GBGB1617171.2A patent/GB201617171D0/en not_active Ceased
-
2017
- 2017-10-06 WO PCT/GB2017/053040 patent/WO2018069680A1/en not_active Ceased
- 2017-10-06 CA CA3039437A patent/CA3039437A1/en active Pending
- 2017-10-06 EP EP17794039.2A patent/EP3523833B1/en active Active
- 2017-10-06 JP JP2019540713A patent/JP7132928B2/ja active Active
- 2017-10-06 US US16/340,614 patent/US10797222B2/en not_active Expired - Fee Related
-
2020
- 2020-02-28 US US16/805,301 patent/US11450800B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US11450800B2 (en) | 2022-09-20 |
| US20190319181A1 (en) | 2019-10-17 |
| GB201617171D0 (en) | 2016-11-23 |
| WO2018069680A1 (en) | 2018-04-19 |
| JP2019530988A (ja) | 2019-10-24 |
| US20200373477A1 (en) | 2020-11-26 |
| JP7132928B2 (ja) | 2022-09-07 |
| EP3523833A1 (en) | 2019-08-14 |
| US10797222B2 (en) | 2020-10-06 |
| EP3523833B1 (en) | 2022-11-16 |
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