GB201617171D0 - Piezoelectric films - Google Patents

Piezoelectric films

Info

Publication number
GB201617171D0
GB201617171D0 GBGB1617171.2A GB201617171A GB201617171D0 GB 201617171 D0 GB201617171 D0 GB 201617171D0 GB 201617171 A GB201617171 A GB 201617171A GB 201617171 D0 GB201617171 D0 GB 201617171D0
Authority
GB
United Kingdom
Prior art keywords
piezoelectric films
piezoelectric
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1617171.2A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitetet I Tromso UIT
Original Assignee
Universitetet I Tromso UIT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitetet I Tromso UIT filed Critical Universitetet I Tromso UIT
Priority to GBGB1617171.2A priority Critical patent/GB201617171D0/en
Publication of GB201617171D0 publication Critical patent/GB201617171D0/en
Priority to CA3039437A priority patent/CA3039437A1/en
Priority to PCT/GB2017/053040 priority patent/WO2018069680A1/en
Priority to JP2019540713A priority patent/JP7132928B2/ja
Priority to EP17794039.2A priority patent/EP3523833B1/en
Priority to US16/340,614 priority patent/US10797222B2/en
Priority to US16/805,301 priority patent/US11450800B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Laminated Bodies (AREA)
GBGB1617171.2A 2016-10-10 2016-10-10 Piezoelectric films Ceased GB201617171D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GBGB1617171.2A GB201617171D0 (en) 2016-10-10 2016-10-10 Piezoelectric films
CA3039437A CA3039437A1 (en) 2016-10-10 2017-10-06 Film with piezoelectric polymer region
PCT/GB2017/053040 WO2018069680A1 (en) 2016-10-10 2017-10-06 Film with piezoelectric polymer region
JP2019540713A JP7132928B2 (ja) 2016-10-10 2017-10-06 圧電性高分子領域を含むフィルム
EP17794039.2A EP3523833B1 (en) 2016-10-10 2017-10-06 Laminated device comprising a film with piezoelectric polymer region
US16/340,614 US10797222B2 (en) 2016-10-10 2017-10-06 Film with piezoelectric polymer region
US16/805,301 US11450800B2 (en) 2016-10-10 2020-02-28 Film with piezoelectric polymer region

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1617171.2A GB201617171D0 (en) 2016-10-10 2016-10-10 Piezoelectric films

Publications (1)

Publication Number Publication Date
GB201617171D0 true GB201617171D0 (en) 2016-11-23

Family

ID=57610592

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1617171.2A Ceased GB201617171D0 (en) 2016-10-10 2016-10-10 Piezoelectric films

Country Status (6)

Country Link
US (2) US10797222B2 (enExample)
EP (1) EP3523833B1 (enExample)
JP (1) JP7132928B2 (enExample)
CA (1) CA3039437A1 (enExample)
GB (1) GB201617171D0 (enExample)
WO (1) WO2018069680A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201617171D0 (en) 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
US11666239B2 (en) 2017-03-14 2023-06-06 University Of Connecticut Biodegradable pressure sensor
US11826495B2 (en) 2019-03-01 2023-11-28 University Of Connecticut Biodegradable piezoelectric ultrasonic transducer system
US11678989B2 (en) * 2019-03-01 2023-06-20 University Of Connecticut Biodegradable piezoelectric nanofiber scaffold for bone or tissue regeneration
EP4031616B1 (en) 2019-09-16 2025-06-18 Apollo Tyres Global R&D B.V. Method for chemically adhering a diene rubber to a piezoelectric polymer
WO2021183626A1 (en) 2020-03-10 2021-09-16 University Of Connecticut Therapeutic bandage
US12491290B2 (en) 2020-06-08 2025-12-09 University Of Connecticut Biodegradable piezoelectric composite materials
CN113346005B (zh) * 2021-06-17 2024-07-02 太原工业学院 夹芯式薄膜传感器真空环境压合装置及方法
CN113432772B (zh) * 2021-06-17 2023-09-08 中北大学 物体表面冲击波测量高灵敏薄膜传感器及制作方法
CN113432763B (zh) * 2021-06-17 2023-07-21 中北大学 夹芯式pvdf压力计真空环境压制装置及方法
CN113432773B (zh) * 2021-06-17 2023-10-27 中北大学 适用于柔性物体表面冲击波压力测量传感器及制作方法
KR102675469B1 (ko) * 2021-09-29 2024-06-17 한국기술교육대학교 산학협력단 압전 필름 스피커 및 그 제조방법
US12431614B1 (en) 2024-02-05 2025-09-30 Rockwell Collins, Inc. Frequency tunable piezoelectric VLF antenna

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT375466B (de) 1977-07-27 1984-08-10 List Hans Messwertaufnehmer mit einem piezoelektrischen messelement
AU544447B2 (en) 1980-02-07 1985-05-30 Toray Industries, Inc. Vinylidene fluoride and ethylene trifluoride copolymer
JPS57126125A (en) 1981-01-29 1982-08-05 Tokyo Shibaura Electric Co Piezoelectric or pyroelectric element
US5089739A (en) 1990-03-19 1992-02-18 Brother Kogyo Kabushiki Kaisha Laminate type piezoelectric actuator element
US5288551A (en) 1991-08-09 1994-02-22 Kureha Kagaku Kogyo Kabushiki Kaisha Flexible piezoelectric device
US6420819B1 (en) 1994-01-27 2002-07-16 Active Control Experts, Inc. Packaged strain actuator
US5702629A (en) 1996-03-21 1997-12-30 Alliedsignal Inc. Piezeoelectric ceramic-polymer composites
JP3575373B2 (ja) * 1999-04-19 2004-10-13 株式会社村田製作所 外力検知センサの製造方法
JP2001250993A (ja) 2000-03-03 2001-09-14 Matsushita Electric Ind Co Ltd 可撓性圧電素子およびその製造方法
US20040263483A1 (en) * 2003-06-24 2004-12-30 Aufderheide Brian E Sensing device
JP5044196B2 (ja) 2006-11-13 2012-10-10 アイシン精機株式会社 圧電センサ及びその製造方法
CN101714608B (zh) 2009-12-01 2011-05-25 同济大学 压电聚合物薄膜传感器的封装方法
WO2011121882A1 (ja) 2010-03-31 2011-10-06 コニカミノルタエムジー株式会社 積層型圧電体および積層型圧電体の製造方法ならびに前記積層型圧電体を用いた超音波トランスデューサおよび超音波診断装置
US8585187B2 (en) 2011-04-29 2013-11-19 Xerox Corporation High density electrical interconnect for printing devices using flex circuits and dielectric underfill
DE102011107421A1 (de) * 2011-07-07 2013-01-10 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiger Folienkörper
KR20150084035A (ko) * 2012-11-08 2015-07-21 아지노모토 가부시키가이샤 멤브레인 스위치 및 그것을 이용하여 이루어지는 물품
KR20140073201A (ko) 2012-12-06 2014-06-16 한국전자통신연구원 압전 에너지 하베스팅 장치 및 그 제조 방법
JP6415451B2 (ja) * 2012-12-28 2018-10-31 ダウ シリコーンズ コーポレーション トランスデューサー用硬化性オルガノシロキサン組成物及び硬化性シリコーン組成物のトランスデューサーへの使用
JP5686443B2 (ja) 2013-01-10 2015-03-18 日本写真印刷株式会社 接着層付きフィルム状感圧センサとこれを用いたタッチパッド、タッチ入力機能付き保護パネル及び電子機器
CN105190224B (zh) 2013-03-21 2018-08-31 株式会社村田制作所 位移传感器、按压量检测传感器以及触摸式输入装置
CN105765750B (zh) 2013-11-21 2018-07-20 3M创新有限公司 多层压电聚合物膜装置和方法
EP2894631B1 (en) * 2013-12-20 2018-08-22 Samsung Medison Co., Ltd. Ultrasonic diagnostic apparatus and manufacturing method thereof
CN105027581B (zh) 2014-02-27 2018-01-05 京瓷株式会社 压电致动器及具备其的压电振动装置、便携式终端、声音发生器、声音发生装置、电子设备
WO2016002459A1 (ja) 2014-07-02 2016-01-07 株式会社村田製作所 タッチパネル
WO2016027667A1 (ja) 2014-08-21 2016-02-25 株式会社村田製作所 振動体及び触覚提示キーボード
KR101612456B1 (ko) * 2014-09-12 2016-04-14 한국세라믹기술원 압전 파이버 컴포지트 구조체 및 이를 이용한 압전 스피커
GB201617171D0 (en) 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
KR102640240B1 (ko) * 2016-10-31 2024-02-22 엘지디스플레이 주식회사 접촉 감응 소자 및 이를 포함하는 표시 장치
WO2018087342A1 (en) * 2016-11-14 2018-05-17 Koninklijke Philips N.V. Stiffness control for electroactive actuators
US20190354222A1 (en) * 2017-01-06 2019-11-21 Sabic Global Technologies B.V. Triboelectric sensor with haptic feedback

Also Published As

Publication number Publication date
US11450800B2 (en) 2022-09-20
CA3039437A1 (en) 2018-04-19
US20190319181A1 (en) 2019-10-17
WO2018069680A1 (en) 2018-04-19
JP2019530988A (ja) 2019-10-24
US20200373477A1 (en) 2020-11-26
JP7132928B2 (ja) 2022-09-07
EP3523833A1 (en) 2019-08-14
US10797222B2 (en) 2020-10-06
EP3523833B1 (en) 2022-11-16

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)