JP7126614B2 - RESIN MOLDED PRODUCT AND RESIN MOLDED PRODUCTION METHOD - Google Patents

RESIN MOLDED PRODUCT AND RESIN MOLDED PRODUCTION METHOD Download PDF

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JP7126614B2
JP7126614B2 JP2021524808A JP2021524808A JP7126614B2 JP 7126614 B2 JP7126614 B2 JP 7126614B2 JP 2021524808 A JP2021524808 A JP 2021524808A JP 2021524808 A JP2021524808 A JP 2021524808A JP 7126614 B2 JP7126614 B2 JP 7126614B2
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resin
metal terminal
resin flow
groove
flow direction
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JPWO2020246373A1 (en
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俊 佐藤
充 須藤
暁 上ノ段
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Hitachi Astemo Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/12Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/504Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24Assembling by moulding on contact members

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

本発明は金属端子を内部に備える樹脂成形体に関する。 TECHNICAL FIELD The present invention relates to a resin molding having metal terminals inside.

本発明に係る背景技術として、特開2006-229090号公報(特許文献1)に記載されたモールド部品(樹脂成形体)が知られている。特許文献1には、段落0029に、樹脂複合成形体が以下のように構成されることが記載されている。 BACKGROUND ART As a background art related to the present invention, there is known a molded part (resin molded body) described in Japanese Unexamined Patent Application Publication No. 2006-229090 (Patent Document 1). Patent Document 1 describes in paragraph 0029 that the resin composite molded body is configured as follows.

「一次成形モールド品1はインサート品として複数本の金属製からなる電気的接続用端子2を平行に配置し、さらに一次成形モールド品1の複数本並行に並べた電気的接続用端子2間の中央部に前記電気的接続用端子2と同方向に並ぶ配置でゴム材もしくはエラストマー材など一次成形モールド樹脂3より軟らかな低弾性材( 応力吸収構造)4を形成し、一次成形モールド樹脂(第1樹脂部)3で一体的に構成されている。この一次成形モールド品1を構成している一次成形モールド樹脂3は、ガラスフィラ30~40%充填したPBT樹脂で構成されており、第1主面32とそれに対向した第2主面34を備えている。前記電気的接続用端子2には、外部との電気的接続を行うため接触面2bとボンディング接合面(金属部)2aを有しており、これらは一次成形モールド樹脂3より表面(第1主面32)に露出している。」
なお上記記載における符号は、特許文献1に記載された符号であり、本明細書で使用する符号とは関係がない。
"The primary molded product 1 has a plurality of metal electrical connection terminals 2 arranged in parallel as an insert, and furthermore, the primary molded product 1 has a plurality of electrical connection terminals 2 arranged in parallel. A low-elasticity material (stress absorbing structure) 4 softer than the primary molding resin 3, such as a rubber material or an elastomer material, is formed in the central portion so as to be aligned in the same direction as the electrical connection terminals 2. 1 resin part) 3. The primary molding resin 3 constituting the primary molding product 1 is composed of PBT resin filled with 30 to 40% glass filler. It has a main surface 32 and a second main surface 34 opposite thereto The electrical connection terminal 2 has a contact surface 2b and a bonding surface (metal portion) 2a for electrical connection with the outside. , and these are exposed to the surface (first main surface 32) from the primary molding mold resin 3."
Note that the reference numerals in the above description are the reference numerals described in Patent Document 1 and have nothing to do with the reference numerals used in this specification.

特開2006-229090号公報Japanese Patent Application Laid-Open No. 2006-229090

電気的接続用端子(以下、金属端子という)を内部に備える樹脂複合成形体においては、樹脂を金型内に射出注入する際に、樹脂流動の力で金属端子が変形する。従来の成形工法では、樹脂流動による金属端子の変形を防止する為に、金属端子を金型で挟み固定する方法が広く用いられる。 In a resin composite molded body having therein terminals for electrical connection (hereinafter referred to as metal terminals), the metal terminals are deformed by the force of resin flow when resin is injected into a mold. In the conventional molding method, in order to prevent deformation of the metal terminal due to resin flow, a method of sandwiching and fixing the metal terminal between metal molds is widely used.

金属端子を金型で挟む従来の方法を用いた成形工法には以下の問題点がある。金属端子を挟み固定する部位(以下、固定部位という)において金属端子を外気に暴露する露出形状が形成される為、露出部の封止や気密性を確保する部品の組み付けなどの2次工程が必要になる。例えば、封止剤を用いて露出部を封止する工程や、カバーなどの気密性を確保する部品を組み付けて封止する工程などである。従って、従来の成形工法の場合、製造に要する工程が増加する問題を伴う。 The molding method using the conventional method of sandwiching metal terminals between metal molds has the following problems. Since the part where the metal terminal is sandwiched and fixed (hereafter referred to as the fixing part) has an exposed shape that exposes the metal terminal to the outside air, secondary processes such as sealing the exposed part and assembling parts to ensure airtightness are required. become necessary. For example, there is a process of sealing the exposed portion using a sealant, and a process of assembling and sealing parts such as a cover that ensure airtightness. Therefore, in the case of the conventional molding method, there is a problem that the steps required for manufacturing are increased.

また、固定部位によって形成される露出形状は、金属端子を固定する周囲樹脂の剛性低下や樹脂による金属端子の保持力低下を引き起こす。樹脂による金属端子の保持力低下は樹脂と金属端子との間に隙間(界面隙間)を生じさせる。金属端子と回路基板とをワイヤボンディングなどで接合する際の超音波振動により金属端子が共振すると、樹脂と金属端子との接合に必要な摩擦力が減少する。金属端子の周囲樹脂の剛性低下及び樹脂と金属端子との間の界面隙間は、樹脂と金属端子との接合強度を不安定にする。 In addition, the exposed shape formed by the fixing portion causes a decrease in the rigidity of the surrounding resin that fixes the metal terminal and a decrease in the holding force of the resin for the metal terminal. A decrease in the holding force of the metal terminal due to the resin causes a gap (interface gap) between the resin and the metal terminal. When the metal terminal resonates due to ultrasonic vibrations when the metal terminal and the circuit board are bonded by wire bonding or the like, the frictional force required for bonding the resin and the metal terminal decreases. A reduction in the rigidity of the resin surrounding the metal terminal and an interfacial gap between the resin and the metal terminal destabilize the bonding strength between the resin and the metal terminal.

金属端子を金型で挟む方法を用いずに成形を行う場合、固定部位に形成される露出部の封止工程の削減が可能であり、またワイヤボンディングの接合強度も安定する。しかし、非固定状態の金属端子は、樹脂流動の力によって押し流されるように動き、変位又は変形した状態で樹脂が固化する。金属端子の変位又は変形は、ワイヤボンディングなどの用途のために樹脂から露出させる金属端子の面(以下、露出面という)に当てられた金型と金属端子との間に隙間を生じさせる。この隙間に樹脂が流入することにより、金属端子の露出面に樹脂被りが発生する。 When molding is performed without using a method of sandwiching the metal terminal between dies, it is possible to reduce the sealing process of the exposed portion formed in the fixed portion, and the bonding strength of wire bonding is stabilized. However, the metal terminal in the unfixed state moves as if it is washed away by the force of resin flow, and the resin solidifies in a displaced or deformed state. Displacement or deformation of the metal terminal creates a gap between the metal terminal and the mold applied to the surface of the metal terminal exposed from the resin for purposes such as wire bonding (hereinafter referred to as the exposed surface). When the resin flows into this gap, resin covering occurs on the exposed surface of the metal terminal.

本発明の目的は、樹脂成形時に金属端子の変位又は変形を生じ難く、金属端子の露出面に樹脂被りが発生し難い樹脂成形体を提供することにある。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a molded resin article in which the metal terminals are less likely to be displaced or deformed during resin molding, and the exposed surfaces of the metal terminals are less likely to be covered with resin.

上記目的を達成するために、本発明の樹脂成形体は、
金属端子と、
前記金属端子をインサート固定する樹脂部材と、
前記樹脂部材に形成されるゲート部と、を備え、
前記金属端子は、前記樹脂部材から露出する露出面を有し、
前記樹脂部材は、前記金属端子がインサート固定される第1主面と、前記第1主面に対する裏面となる第2主面と、前記第2主面に形成され傾斜面を有する溝形状部と、を有し、
前記傾斜面は、前記露出面に垂直な方向に前記露出面を前記第2主面に投影した投影領域内に、少なくとも前記傾斜面の一部分が形成され、
さらに前記傾斜面は、樹脂流れ方向に沿って樹脂流れの下流側に向かうに従って、前記金属端子に近づくように傾斜し、
前記溝形状部は、樹脂流れ方向を横切る方向に2列に分かれて互い違いに配置されている。
In order to achieve the above object, the resin molding of the present invention is
a metal terminal;
a resin member for insert-fixing the metal terminal;
a gate portion formed in the resin member,
The metal terminal has an exposed surface exposed from the resin member,
The resin member has a first principal surface to which the metal terminal is inserted and fixed, a second principal surface which is a back surface of the first principal surface, and a groove-shaped portion formed on the second principal surface and having an inclined surface. , has
at least a portion of the inclined surface is formed within a projection area obtained by projecting the exposed surface onto the second principal surface in a direction perpendicular to the exposed surface;
Further, the inclined surface is inclined so as to approach the metal terminal as it goes downstream along the resin flow direction,
The groove-shaped portions are alternately arranged in two rows in a direction transverse to the resin flow direction.

本発明によれば、傾斜面に沿った樹脂流動の作用により、金属端子の露出面が金型に押し付けられ、金属端子の変位又は変形を抑制する。これにより金属端子の露出面への樹脂被りが防止され、金属端子全体の変形が抑制される。
上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。
According to the present invention, the exposed surface of the metal terminal is pressed against the mold due to the effect of resin flow along the inclined surface, thereby suppressing displacement or deformation of the metal terminal. As a result, the exposed surface of the metal terminal is prevented from being covered with resin, and deformation of the entire metal terminal is suppressed.
Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

本発明の一実施例に係る樹脂成形体の全体外観の平面図である。1 is a plan view of the overall external appearance of a resin molded body according to an example of the present invention; FIG. 図1Aの樹脂成形体について、図1Aの紙面に垂直な方向の一断面を示す断面図である。FIG. 1B is a cross-sectional view showing one cross-section of the resin molded body of FIG. 1A in a direction perpendicular to the paper surface of FIG. 1A; 図1AのII-II断面図である。FIG. 1B is a cross-sectional view taken along the line II-II of FIG. 1A; 図2Aに示す複数の溝の一つと、この溝に対応する金属端子の近傍を拡大して示す断面図である。2B is an enlarged sectional view showing one of the plurality of grooves shown in FIG. 2A and the vicinity of the metal terminal corresponding to this groove; FIG. 金型内における溝の効果を説明する平面図である。FIG. 4 is a plan view for explaining the effect of grooves in the mold; 溝に平面部を設けた溝の変形例(第1変形例)を示す斜視図である。It is a perspective view which shows the modification (1st modification) of the groove|channel which provided the flat part in the groove|channel. 図4Aに示す複数の溝の一つと、この溝に対応する金属端子の近傍を拡大して示す断面図である。4B is an enlarged sectional view showing one of the plurality of grooves shown in FIG. 4A and the vicinity of the metal terminal corresponding to this groove; FIG. 図4Aに示す複数の溝の配置を変更した変形例(第2変形例)を示す斜視図である。FIG. 4B is a perspective view showing a modified example (second modified example) in which the arrangement of the plurality of grooves shown in FIG. 4A is changed; 図4Aに示す複数の溝の配置を変更した変形例(第3変形例)を示す斜視図である。FIG. 4B is a perspective view showing a modified example (third modified example) in which the arrangement of the plurality of grooves shown in FIG. 4A is changed;

以下、本発明に係る実施例について図面を参照して詳細に説明する。各図において、共通する構成には同じ符号を付し、説明を省略する。なお、以下の実施例及びその変更例においては、金属端子2a、溝5A,5B及び金型突起7aの各断面形状を説明するが、この断面形状は、樹脂流れ方向A1に垂直で、且つ樹脂部1aの表面(第1主面)1aa及び裏面(第2主面)1ab、或いは表面1aa及び裏面1abを形成する金型面に平行な方向から見た断面形状である。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. In each figure, the same code|symbol is attached|subjected to the common structure, and description is abbreviate|omitted. In the following embodiments and modifications thereof, the cross-sectional shapes of the metal terminals 2a, the grooves 5A and 5B, and the mold projections 7a will be described. It is a cross-sectional shape seen from a direction parallel to a mold surface forming a front surface (first main surface) 1aa and a back surface (second main surface) 1ab of a portion 1a, or a front surface 1aa and a back surface 1ab.

図1Aは、本発明の一実施例に係る樹脂成形体1の全体外観の平面図である。図1Bは、図1Aの樹脂成形体1について、図1Aの紙面に垂直な方向の一断面を示す断面図である。 FIG. 1A is a plan view of the overall appearance of a resin molded body 1 according to one embodiment of the present invention. FIG. 1B is a cross-sectional view showing one cross-section of the resin molding 1 of FIG. 1A in a direction perpendicular to the paper surface of FIG. 1A.

樹脂成形体1は、インサート部品である金属端子(電気導体)2a,2bを樹脂モールドすることにより形成される。このため樹脂成形体1は、樹脂複合成形体と呼ばれることもある。本実施例の樹脂成形体1は、空気流量計側装置として構成されるが、空気流量計側装置に限定される訳ではない。樹脂成形体1は、外部装置から電力を受けると共に、外部装置と電気信号をやり取りするコネクタ3を備えている。金属端子2a及び金属端子2bは一部材で構成されており、金属端子2bがコネクタ3内に露出して外部装置からのコネクタに接続される接続端子を構成する。 The resin molded body 1 is formed by resin-molding metal terminals (electrical conductors) 2a and 2b, which are insert parts. For this reason, the resin molded body 1 is sometimes called a resin composite molded body. Although the resin molding 1 of this embodiment is configured as an air flow meter side device, it is not limited to the air flow meter side device. The resin molding 1 receives power from an external device and includes a connector 3 for exchanging electrical signals with the external device. The metal terminal 2a and the metal terminal 2b are formed as one member, and the metal terminal 2b is exposed in the connector 3 and constitutes a connection terminal to be connected to a connector from an external device.

図2Aは、図1AのII-II断面図である。 FIG. 2A is a cross-sectional view taken along line II-II of FIG. 1A.

矢印A1は、樹脂の全体的な流れに沿う方向(以下、樹脂流れ方向という)を示す。樹脂を注入するゲート17(図1参照)は、樹脂流れの上流側に位置し、図2Aの右方(図の外側)に位置している。 Arrow A1 indicates the direction along the overall flow of resin (hereinafter referred to as resin flow direction). A gate 17 (see FIG. 1) for injecting resin is located upstream of the resin flow and is located on the right side of FIG. 2A (outside of the figure).

樹脂成形体1は、一部が樹脂部(樹脂部材)1aに埋設された金属端子2aと、樹脂部1aに形成された溝(溝形状部)5Aとを有する。溝5Aは、金属端子2aが配置された樹脂部1aの表面1aaとは反対側の裏面1abに、複数の金属端子2aのそれぞれに対応するように設けられている。溝5Aは、樹脂部1aの裏面1abから窪んだ凹形状部を構成する。 The resin molded body 1 has a metal terminal 2a partially embedded in a resin portion (resin member) 1a and a groove (groove-shaped portion) 5A formed in the resin portion 1a. The grooves 5A are provided on the back surface 1ab opposite to the surface 1aa of the resin portion 1a on which the metal terminals 2a are arranged so as to correspond to the plurality of metal terminals 2a. 5 A of groove|channels comprise the concave-shaped part hollowed from the back surface 1ab of the resin part 1a.

本実施例では、金属端子2a及び溝5Aは4組設けられているが、4組より少なくてもよいし、4組より多くてもよい。 In this embodiment, four sets of metal terminals 2a and grooves 5A are provided, but the number of sets may be less than four or more than four.

図2Bは、図2Aに示す複数の溝5Aの一つと、この溝5Aに対応する金属端子2aの近傍を拡大して示す断面図である。 FIG. 2B is an enlarged sectional view showing one of the plurality of grooves 5A shown in FIG. 2A and the vicinity of the metal terminal 2a corresponding to this groove 5A.

金属端子2aは、図2Bの紙面上における断面が矩形状に形成され、4つの面2aa,2ab,2ac,2adを有する。面2aaは、ワイヤボンディング等により電気配線が接続される電気配線接続面を構成し、樹脂部1aの外側に露出する露出面として構成される。面2abは面2aaの対辺を構成し、樹脂部1aに埋設されている。面2ac,2adは矩形状の2つの対辺を成す面2aaと面2abと接続する面(側面)を構成する。面2acは樹脂流れ方向A1において上流側に位置し、面2adは樹脂流れ方向A1において下流側に位置する。すなわち、面2acはゲート17からの樹脂流れに沿う方向A1においてゲート17側に位置し、面2adはゲート17からの樹脂流れに沿う方向A1においてゲート17側とは反対側に位置する。 The metal terminal 2a has a rectangular cross section on the paper surface of FIG. 2B, and has four surfaces 2aa, 2ab, 2ac, and 2ad. The surface 2aa constitutes an electrical wiring connection surface to which electrical wiring is connected by wire bonding or the like, and is configured as an exposed surface exposed to the outside of the resin portion 1a. The surface 2ab constitutes the opposite side of the surface 2aa and is embedded in the resin portion 1a. The surfaces 2ac and 2ad constitute surfaces (side surfaces) connected to the surfaces 2aa and 2ab which form two opposite sides of the rectangular shape. The surface 2ac is located on the upstream side in the resin flow direction A1, and the surface 2ad is located on the downstream side in the resin flow direction A1. That is, the surface 2ac is located on the gate 17 side in the direction A1 along the resin flow from the gate 17, and the surface 2ad is located on the opposite side to the gate 17 side in the direction A1 along the resin flow from the gate 17.

なお、金属端子2aの断面形状は矩形に限定される訳ではなく、台形或いはその他の形状であってもよい。金属端子2aの断面形状は、四角形であることが好ましく、金属端子2aの製造の容易性及びコストの観点から、矩形又は台形がより好ましい。 Note that the cross-sectional shape of the metal terminal 2a is not limited to a rectangle, and may be a trapezoid or other shape. The cross-sectional shape of the metal terminal 2a is preferably quadrangular, and more preferably rectangular or trapezoidal from the viewpoints of ease of manufacturing the metal terminal 2a and cost.

溝5Aは、傾斜面5aと側面5bとを有し、樹脂流れ方向A1に垂直で、且つ樹脂部1aの表面1aa及び裏面1abに平行な方向から見た断面形状が、三角形状を成す溝形状部として構成されている。傾斜面5aは、樹脂流れ方向A1に沿って下流側に向かうに従って、漸次、金属端子2aに接近するように、傾斜している。側面5bは金属端子2aの側面2ac,2adに平行で、樹脂流れ方向A1に垂直な面として形成されており、溝内側において傾斜面5aと側面5bとの間に構成される角度θ5は鋭角である。 The groove 5A has an inclined surface 5a and a side surface 5b, and has a triangular cross-sectional shape when viewed from a direction perpendicular to the resin flow direction A1 and parallel to the front surface 1aa and the rear surface 1ab of the resin portion 1a. It is organized as a part. The inclined surface 5a is inclined so as to gradually approach the metal terminal 2a toward the downstream side along the resin flow direction A1. The side surface 5b is parallel to the side surfaces 2ac and 2ad of the metal terminal 2a and is formed as a surface perpendicular to the resin flow direction A1. be.

傾斜面5aは樹脂流れ方向A1において溝5Aの上流側に位置する側面であり、側面5bは樹脂流れ方向A1において溝5Aの下流側に位置する側面である。本実施例では、溝5Aは、樹脂流れ方向A1において、金属端子2aと重複する範囲に設けられている。 The inclined surface 5a is a side surface located on the upstream side of the groove 5A in the resin flow direction A1, and the side surface 5b is a side surface located on the downstream side of the groove 5A in the resin flow direction A1. In this embodiment, the groove 5A is provided in a range overlapping with the metal terminal 2a in the resin flow direction A1.

すなわち本実施例の樹脂成形体1は、金属端子2aと、金属端子2aをインサート固定する樹脂部(樹脂部材)1aと、樹脂部1aに形成されるゲート部17と、を備える。金属端子2aは、樹脂部1aから露出する露出面2aaを有する。樹脂部1aは、金属端子2aがインサート固定される第1主面(表面)1aaと、第1主面1aaに対する裏面となる第2主面1abと、第2主面1abに形成され傾斜面5aを有する溝形状部5A,5Bと、を有する。傾斜面5aは、露出面2aaに垂直な方向に露出面2aaを第2主面1abに投影した投影領域L2a内に、少なくとも傾斜面5aの一部分が形成される。さらに傾斜面5aは、樹脂流れ方向A1に沿って樹脂流れの下流側に向かうに従って、金属端子2aに近づくように傾斜している。 That is, the resin molding 1 of this embodiment includes a metal terminal 2a, a resin portion (resin member) 1a for inserting and fixing the metal terminal 2a, and a gate portion 17 formed in the resin portion 1a. The metal terminal 2a has an exposed surface 2aa exposed from the resin portion 1a. The resin portion 1a includes a first main surface (front surface) 1aa to which the metal terminal 2a is inserted and fixed, a second main surface 1ab which is a rear surface of the first main surface 1aa, and an inclined surface 5a formed on the second main surface 1ab. and groove shape portions 5A and 5B having At least a portion of the inclined surface 5a is formed within a projection area L2a obtained by projecting the exposed surface 2aa onto the second main surface 1ab in a direction perpendicular to the exposed surface 2aa. Further, the inclined surface 5a is inclined so as to approach the metal terminal 2a toward the downstream side of the resin flow along the resin flow direction A1.

傾斜面5bの樹脂流れ方向A1における下流側の端部(傾斜面5aの最深部)5cは、金属端子2aの樹脂流れ方向A1における中央2Cよりも下流側に位置するとよい。また、傾斜面5aの樹脂流れ方向A1における下流側の端部5cは、投影領域L2a内に位置していることが好ましい。また、金属端子2aの樹脂流れ方向A1における上流側の側面2acは、傾斜面5aの樹脂流れ方向A1における上流側の端部5a1よりも、樹脂流れ方向A1における上流側に位置していることが好ましい。 A downstream end portion (the deepest portion of the inclined surface 5a) 5c of the inclined surface 5b in the resin flow direction A1 is preferably located downstream of the center 2C of the metal terminal 2a in the resin flow direction A1. Further, it is preferable that the downstream end 5c of the inclined surface 5a in the resin flow direction A1 be positioned within the projection area L2a. Further, the upstream side surface 2ac of the metal terminal 2a in the resin flow direction A1 is located upstream in the resin flow direction A1 from the upstream end portion 5a1 of the inclined surface 5a in the resin flow direction A1. preferable.

本実施例では側面5bが樹脂流れ方向A1に垂直な面として形成されているため、側面5bにおける樹脂部1aの裏面1ab側(溝5Aの開口側)の端部(端縁)5b1も樹脂流れ方向A1において金属端子2aの面2adよりも上流側に位置する。 In this embodiment, since the side surface 5b is formed as a surface perpendicular to the resin flow direction A1, the end portion (edge) 5b1 of the side surface 5b on the side of the back surface 1ab of the resin portion 1a (the opening side of the groove 5A) also causes resin flow. It is located upstream of the surface 2ad of the metal terminal 2a in the direction A1.

溝5Aは、傾斜面5aが樹脂流れ方向A1において金属端子2aと重複する位置に設けられればよい。すなわち溝5Aは、傾斜面5aの樹脂流れ方向A1における少なくとも一部が、樹脂流れ方向A1において金属端子2aが樹脂部1aに埋設されている範囲L2aの内側に、設けられていればよい。従って溝5Aは、図2Bに点線5A’,5A”で示すように配置されてもよい。 The groove 5A may be provided at a position where the inclined surface 5a overlaps the metal terminal 2a in the resin flow direction A1. That is, at least a portion of the inclined surface 5a in the resin flow direction A1 should be provided inside the range L2a in which the metal terminal 2a is embedded in the resin portion 1a in the resin flow direction A1. The grooves 5A may thus be arranged as indicated by the dashed lines 5A', 5A'' in Figure 2B.

図3は、金型6,7内における溝5Aの効果を説明する平面図である。図3は、樹脂成形体1の成形工程(樹脂モールド工程)時の状態を示している。図3において、矢印A2,A5は局所的な樹脂流動を示し、矢印A3,A4は金属端子2aに作用する力を示している。なお図3の溝5Aは、図2A,2Bの位置からずらして配置した状態を示している。 FIG. 3 is a plan view for explaining the effects of the grooves 5A in the molds 6 and 7. FIG. FIG. 3 shows the state of the resin molding 1 during the molding process (resin molding process). In FIG. 3, arrows A2 and A5 indicate local resin flow, and arrows A3 and A4 indicate forces acting on the metal terminal 2a. Note that the groove 5A in FIG. 3 shows a state in which it is displaced from the position in FIGS. 2A and 2B.

樹脂成形体1の成形工程時においては、金属端子2b(図1B参照)はコネクタ部3を形成する図示しないスライド駒により固定される。一方、金属端子2aはスライド駒による固定は行わず、非固定の状態である。図3に示すように、金属端子2aは上金型6との嵌合部6aでのみ固定されており、樹脂流動A2は金属端子2aの側面2acの上流側の部分Dで流体圧力を高める。この流体圧力は側面2acの上金型6から露出した部分に作用し、さらに樹脂流動A2による大きな流体摩擦力を金属端子2aに生じさせる。このような樹脂流動A2の作用により、金属端子2aには下方向(上金型6から引き離す方向)に動かす力A3が作用し、金属端子2aは変位又は変形する可能性がある。 During the molding process of the resin molded body 1, the metal terminal 2b (see FIG. 1B) is fixed by a slide piece (not shown) that forms the connector portion 3. As shown in FIG. On the other hand, the metal terminal 2a is not fixed by the slide piece and is in an unfixed state. As shown in FIG. 3, the metal terminal 2a is fixed only at the fitting portion 6a with the upper mold 6, and the resin flow A2 increases the fluid pressure at the upstream portion D of the side surface 2ac of the metal terminal 2a. This fluid pressure acts on the portion of the side surface 2ac exposed from the upper mold 6, and further causes a large fluid frictional force due to the resin flow A2 to the metal terminal 2a. Due to the action of the resin flow A2, a force A3 acts on the metal terminal 2a to move it downward (to separate it from the upper die 6), and the metal terminal 2a may be displaced or deformed.

金属端子2aが変位又は変形すると、露出面2aaと上金型6との接触面に隙間が生じ、この隙間に樹脂が流入することで金属端子2aの露出面2aaに樹脂被りが発生する。
露出面2aaは、ワイヤボンディングなどの用途から、樹脂モールド後に樹脂部1aから露出している必要がある。本実施例では、金属端子2aの露出面2aaの他に側面2acの一部が樹脂部1aから露出する構成としているが、露出面2aa以外の全ての面2ab,2ac,2adが金属端子2aを固定する樹脂部1aに完全に覆われる場合、すなわち金属端子2aと上金型6の嵌合部6aがない樹脂成形体1の場合においても同様に、樹脂被りが発生する。
When the metal terminal 2a is displaced or deformed, a gap is formed between the exposed surface 2aa and the contact surface of the upper mold 6, and the resin flows into this gap, causing the exposed surface 2aa of the metal terminal 2a to be covered with resin.
The exposed surface 2aa needs to be exposed from the resin portion 1a after resin molding for purposes such as wire bonding. In this embodiment, in addition to the exposed surface 2aa of the metal terminal 2a, a part of the side surface 2ac is exposed from the resin portion 1a. In the case where the resin molded body 1 is completely covered with the fixed resin portion 1a, that is, in the case where the metal terminal 2a and the upper mold 6 do not have the fitting portion 6a, the resin covering occurs similarly.

以下、金属端子2aの変位又は変形、及び金属端子2aの露出面2aaへの樹脂被りを防止するメカニズムについて説明する。 A mechanism for preventing the displacement or deformation of the metal terminal 2a and the resin covering of the exposed surface 2aa of the metal terminal 2a will be described below.

本実施例の下金型7は金型突起(突起部)7aを有する。金型突起8は樹脂流れ方向の上流側に傾斜面7aaを有する。 The lower mold 7 of this embodiment has a mold protrusion (protrusion) 7a. The mold protrusion 8 has an inclined surface 7aa on the upstream side in the resin flow direction.

金型突起7aは、傾斜面7aaと側面7abとを有し、樹脂流れ方向A1に垂直で、且つ樹脂部1aの表面(第1主面)1aa及び裏面(第2主面)1abを形成する金型面に平行な方向から見た断面形状が、三角形状を成す凸形状部として構成されている。傾斜面7aaは、樹脂流れ方向A1に沿って下流側に向かうに従って、漸次、上金型6及び金属端子2aに接近するように、傾斜している。下金型7の内側において傾斜面7aaと側面7abとの間に構成される角度θ7aは鋭角である。 The mold protrusion 7a has an inclined surface 7aa and a side surface 7ab, is perpendicular to the resin flow direction A1, and forms a front surface (first main surface) 1aa and a rear surface (second main surface) 1ab of the resin portion 1a. The cross-sectional shape seen from the direction parallel to the mold surface is configured as a convex portion having a triangular shape. The inclined surface 7aa is inclined so as to gradually approach the upper mold 6 and the metal terminal 2a toward the downstream side along the resin flow direction A1. An angle θ7a formed between the inclined surface 7aa and the side surface 7ab inside the lower mold 7 is an acute angle.

傾斜面7aaは樹脂流れ方向A1において金型突起7aの上流側に位置する側面であり、側面7abは樹脂流れ方向A1において金型突起7aの下流側に位置する側面である。
金型突起7aの頂部7aa2は溝5A及び傾斜面5aの最深部を形成する。金型突起7aは、傾斜面7aa及び側面7abが図2Bで説明した溝5Aの傾斜面5a及び側面5bに対応するように、配置されるとよい。
The inclined surface 7aa is a side surface located on the upstream side of the mold projection 7a in the resin flow direction A1, and the side surface 7ab is a side surface located on the downstream side of the mold projection 7a in the resin flow direction A1.
The top portion 7aa2 of the mold projection 7a forms the deepest portion of the groove 5A and the inclined surface 5a. The mold protrusion 7a is preferably arranged such that the inclined surface 7aa and the side surface 7ab correspond to the inclined surface 5a and the side surface 5b of the groove 5A described in FIG. 2B.

金型突起7aは、傾斜面7aaが樹脂流れ方向A1において上金型6の嵌合部6a及び金属端子2aと重複する位置に設けられていればよい。すなわち、金型6,7に電気導体2aを配置して樹脂を注入する樹脂成形体1の製造を行うために、金型6,7は樹脂流れ方向A1において上流側に傾斜面7aaを有する金型突起(突起部)7aを備える。傾斜面7aaは、樹脂流れ方向A1に沿って樹脂流れの下流側に向かうに従って、電気導体2a(の裏面2ab)に近づくように、傾斜している。金属端子(電気導体)2aは、傾斜面7aaの樹脂流れ方向A1における少なくとも一部分が、電気導体2aの樹脂1aから露出する露出面2aaの裏面2abと対向するように、金型6,7の内側に配置される。 The mold projection 7a may be provided at a position where the inclined surface 7aa overlaps the fitting portion 6a of the upper mold 6 and the metal terminal 2a in the resin flow direction A1. That is, in order to manufacture the resin molding 1 by arranging the electric conductor 2a in the molds 6 and 7 and injecting the resin, the molds 6 and 7 are metal molds having an inclined surface 7aa on the upstream side in the resin flow direction A1. A die projection (projection) 7a is provided. The inclined surface 7aa is inclined so as to approach (the back surface 2ab of) the electric conductor 2a toward the downstream side of the resin flow along the resin flow direction A1. The metal terminal (electrical conductor) 2a is arranged inside the molds 6 and 7 so that at least a part of the inclined surface 7aa in the resin flow direction A1 faces the back surface 2ab of the exposed surface 2aa of the electric conductor 2a exposed from the resin 1a. placed in

金属端子(電気導体)2aは、傾斜面7aaの樹脂流れ方向A1における下流側の端部(金型突起7aの頂部)7aa2が、金属端子2a(の裏面2ab)と対向する位置となるように、金型6,7の内側に配置されるとよい。さらに金属端子(電気導体)2aは、傾斜面7aaの樹脂流れ方向A1における上流側の端部7aa1が、電気導体2aの樹脂流れ方向における上流側の側面2acよりも、樹脂流れ方向A1における下流側に位置するように、金型6,7の内側に配置されるとよい。 The metal terminal (electrical conductor) 2a is arranged such that the downstream end portion (the top portion of the mold protrusion 7a) 7aa2 of the inclined surface 7aa in the resin flow direction A1 faces the metal terminal 2a (the back surface 2ab thereof). , may be arranged inside the molds 6,7. Further, in the metal terminal (electrical conductor) 2a, the upstream end portion 7aa1 of the inclined surface 7aa in the resin flow direction A1 is positioned downstream in the resin flow direction A1 from the upstream side surface 2ac of the electric conductor 2a in the resin flow direction. It is preferably arranged inside the molds 6 and 7 so as to be positioned at .

上述した金型突起7aに対する金属端子(電気導体)2aの配置は、以下で説明する樹脂流動A5を効果的に発生させる。 The arrangement of the metal terminal (electrical conductor) 2a with respect to the mold protrusion 7a described above effectively generates a resin flow A5 described below.

充填中の樹脂材料は、樹脂流動A5に示すように、金型突起7aの傾斜面7aaに沿って、金属端子2aに向けて流動する。この樹脂材料の流動作用は、金属端子2aの露出面2aaを上金型96に押し付ける力A4を発生させる。この押し付け力a4を、金属端子2aを下方向に動かす力A3よりも大きくすることで、金属端子2aの露出面2aaは上金型6に押し付けられる。これにより、金属端子2aの変位又は変形が抑制され、露出面2aaと上金型6との接触面に隙間が生じることが抑制される。その結果、金属端子2aの露出面2aaへの樹脂被りが防止される。 The resin material during filling flows toward the metal terminal 2a along the inclined surface 7aa of the mold protrusion 7a, as indicated by resin flow A5. This flow action of the resin material generates a force A4 that presses the exposed surface 2aa of the metal terminal 2a against the upper mold 96. As shown in FIG. The exposed surface 2aa of the metal terminal 2a is pressed against the upper die 6 by making the pressing force a4 larger than the force A3 that moves the metal terminal 2a downward. As a result, the displacement or deformation of the metal terminal 2a is suppressed, and the formation of a gap between the exposed surface 2aa and the upper die 6 is suppressed. As a result, the exposed surface 2aa of the metal terminal 2a is prevented from being covered with resin.

溝5Aは樹脂流れ方向A1における上流側に傾斜面5aを有する形状が望ましく、傾斜面5aの角度θ5aは樹脂流れ方向A1に対して鈍角に形成する。溝5Aに傾斜面5aを設けない場合、すなわち傾斜面5aを側面5bのように樹脂流れ方向A1に直交する面とした場合、金属端子2aを上金型96に押し付ける力A4を発生させることはできるものの、金属端子2aの側面2acの上流側の部分Dにおける流体圧力を高めることになる。
その結果、金属端子2aに作用する下向き(上金型6から引き離す向き)の力A3が大きくなる。本実施例における溝5Aの傾斜面5aは、金属端子2aに作用する下向きの力A3を小さくし、金属端子2aの変位又は変形を抑制する。
The groove 5A preferably has a shape having an inclined surface 5a on the upstream side in the resin flow direction A1, and the angle θ5a of the inclined surface 5a is formed at an obtuse angle with respect to the resin flow direction A1. If the groove 5A is not provided with the inclined surface 5a, that is, if the inclined surface 5a is a surface perpendicular to the resin flow direction A1 like the side surface 5b, the force A4 that presses the metal terminal 2a against the upper mold 96 cannot be generated. Although it can be done, it increases the fluid pressure in the upstream portion D of the side surface 2ac of the metal terminal 2a.
As a result, the downward force A3 acting on the metal terminal 2a (in the direction of separating it from the upper mold 6) increases. The inclined surface 5a of the groove 5A in this embodiment reduces the downward force A3 acting on the metal terminal 2a, thereby suppressing the displacement or deformation of the metal terminal 2a.

傾斜面5aを有する溝5Aの断面形状として、図2Bに示すような三角形がある。なお三角形の角部には面取りを設けてもよい。角部に面取りを有する三角形状を含め、本実施例では略三角形状と呼ぶことにする。 A cross-sectional shape of the groove 5A having the inclined surface 5a is triangular as shown in FIG. 2B. Note that the corners of the triangle may be chamfered. In this embodiment, the term "substantially triangular shape" includes a triangular shape having chamfered corners.

傾斜面5aは下金型7の製造の容易性の観点から直線形状(平面形状)が望ましいが、傾斜面5aが湾曲形状、または複数の角を有している場合においても、金属端子2aの変形を抑制し、金属端子2aの露出面2aaへの樹脂被りを防止することができる。 The inclined surface 5a preferably has a linear shape (planar shape) from the viewpoint of ease of manufacturing the lower mold 7. Deformation can be suppressed, and resin covering on the exposed surface 2aa of the metal terminal 2a can be prevented.

なお溝5Aの傾斜面5aは、樹脂流れ方向A1における少なくとも一部が、金属端子2aの露出面2aaに垂直な両側面2ac, 2adの内側領域L2aに位置するように配置される。これにより、金属端子2aを上金型96に押し付ける力A4を金属端子2aに作用させることができる。 At least a portion of the inclined surface 5a of the groove 5A in the resin flow direction A1 is positioned in the inner area L2a of the side surfaces 2ac and 2ad perpendicular to the exposed surface 2aa of the metal terminal 2a. Thereby, the force A4 that presses the metal terminal 2a against the upper mold 96 can be applied to the metal terminal 2a.

上述したように、傾斜面5aの最深部5cは、樹脂流れ方向A1における金属端子2aの中央2Cよりも、下流側に位置するように配置することが望ましい。このために、樹脂成形体1の成形工程において、電気導体2aは、傾斜面7aaの樹脂流れ方向A1における下流側の端部7aa2が、電気導体2aの樹脂流れ方向A1における中央2Cよりも下流側に位置するように、金型6,7の内側に配置されるとよい。これにより、金属端子2aの中央2Cよりも上流側の部分に、金属端子2aを上金型96に押し付ける力A4を、より効果的に金属端子2aに作用させることができる。 As described above, the deepest portion 5c of the inclined surface 5a is desirably located downstream of the center 2C of the metal terminal 2a in the resin flow direction A1. For this reason, in the molding process of the resin molded body 1, the end portion 7aa2 of the inclined surface 7aa on the downstream side in the resin flow direction A1 of the electric conductor 2a is located on the downstream side of the center 2C of the electric conductor 2a in the resin flow direction A1. It is preferably arranged inside the molds 6 and 7 so as to be positioned at . As a result, the force A4 that presses the metal terminal 2a against the upper mold 96 can be applied more effectively to the portion of the metal terminal 2a on the upstream side of the center 2C.

溝5Aの最深部5cから、金属端子2aの露出面2aaに対向する面2abまでの垂直な距離l(図2B参照)は、1.0mm~2.0mm程度(1.0mm≦l≦2.0mm)が望ましい。距離lが1.0mm未満の場合、溝5Aの最深部5cと金属端子2aの露出面2aaに対向する面2abとの間の樹脂部材が薄くなり、樹脂部材にクラックが生じる恐れがある。また、距離lが2.0mmより大きい場合、金属端子2aを上金型96に押し付ける力A4が小さくなり、溝5Aによる金属端子2aの変形を抑制し金属端子2aの露出面2aaへの樹脂被りを防止する効果が減少する可能性がある。 The vertical distance l (see FIG. 2B) from the deepest portion 5c of the groove 5A to the surface 2ab facing the exposed surface 2aa of the metal terminal 2a is about 1.0 mm to 2.0 mm (1.0 mm≦l≦2.0 mm). 0 mm) is desirable. If the distance l is less than 1.0 mm, the resin member between the deepest portion 5c of the groove 5A and the surface 2ab facing the exposed surface 2aa of the metal terminal 2a is thinned, and cracks may occur in the resin member. Further, when the distance l is larger than 2.0 mm, the force A4 for pressing the metal terminal 2a against the upper mold 96 becomes small, suppressing the deformation of the metal terminal 2a by the groove 5A and preventing the exposed surface 2aa of the metal terminal 2a from being covered with resin. may be less effective in preventing

溝5Aの樹脂流流れ方向A1における下流側の側面5bは、金属端子2aの露出面2aaに対して垂直であっても、或いは露出面2aaに対して傾斜した面であってもよい。或いは側面5bは、複数の角を有する面であってもよく、湾曲形状を成す面あってもよい。 The downstream side surface 5b of the groove 5A in the resin flow direction A1 may be perpendicular to the exposed surface 2aa of the metal terminal 2a or may be inclined with respect to the exposed surface 2aa. Alternatively, the side surface 5b may be a surface having a plurality of corners or a curved surface.

溝5Aの樹脂流流れ方向A1における下流側の側面5bは、金属端子2aの側面2adを含む仮想平面上に形成するか、この仮想平面に対して下流側の位置に形成するか、或いはこの仮想平面に対して上流側の位置に形成することができる。なお溝5Aの下流側の側面5bが配置される位置は金属端子2aや樹脂成形体1の形状により調整することが可能である。 The downstream side surface 5b of the groove 5A in the resin flow direction A1 may be formed on a virtual plane including the side surface 2ad of the metal terminal 2a, may be formed at a downstream position with respect to this virtual plane, or may be formed on this virtual plane. It can be formed at a position on the upstream side with respect to the plane. The position where the side surface 5b on the downstream side of the groove 5A is arranged can be adjusted by the shape of the metal terminal 2a and the resin molding 1. FIG.

[変更例1]
本変更例は、上述した実施例における、傾斜面5aを有する溝5Aの断面形状を、台形に変更したものである。なお、この台形形状は角部の面取りを含むものであてもよい。
[Modification 1]
This modification is obtained by changing the cross-sectional shape of the groove 5A having the inclined surface 5a in the above-described embodiment to a trapezoid. The trapezoidal shape may include chamfered corners.

図4A,4Bを用いて、断面形状が台形形状を成す溝5Bを有する樹脂成形体1について説明する。図4Aは、溝5Aに平面部5dを設けた溝5Aの変形例(第1変形例)5Bを示す斜視図である。図4Bは、図4Aに示す複数の溝5Bの一つと、この溝5Bに対応する金属端子2aの近傍を拡大して示す断面図である。 4A and 4B, resin molding 1 having groove 5B having a trapezoidal cross-sectional shape will be described. FIG. 4A is a perspective view showing a modified example (first modified example) 5B of the groove 5A in which the flat portion 5d is provided in the groove 5A. FIG. 4B is an enlarged sectional view showing one of the plurality of grooves 5B shown in FIG. 4A and the vicinity of the metal terminal 2a corresponding to this groove 5B.

本変更例の溝(溝形状部)5Bは、上述した実施例の溝5Aの傾斜面5aの最深部5cから下流側に、金属端子2aの露出面2aaと平行な平面部5dを有し、断面形状が台形形状を成している。角部に面取りを有する台形形状を含め、本実施例では略台形形状と呼ぶことにする。 The groove (groove-shaped portion) 5B of this modified example has a flat portion 5d parallel to the exposed surface 2aa of the metal terminal 2a downstream from the deepest portion 5c of the inclined surface 5a of the groove 5A of the above-described embodiment, It has a trapezoidal cross-sectional shape. In this embodiment, the trapezoidal shape including the chamfered corners is referred to as a substantially trapezoidal shape.

本変更例は、上述した実施例の溝5Aに対して平面部5dが形成されている点で相違し、その他の構成は上述した実施例と同様であり、上述した実施例と同様な作用効果を奏する。なお本変更例では、上述した実施例の傾斜面5a及び溝5Aの最深部5cは、溝5Bの平面部5d或いは平面部5dと傾斜面5aとの接続部によって構成される。 This modification differs from the groove 5A of the above-described embodiment in that a flat portion 5d is formed, and the rest of the configuration is the same as that of the above-described embodiment. play. In this modified example, the inclined surface 5a and the deepest portion 5c of the groove 5A in the above-described embodiment are formed by the flat portion 5d of the groove 5B or the connection portion between the flat portion 5d and the inclined surface 5a.

平面部5dを備えることで、金属端子2aの露出面2aaに垂直な両側面2ac,2adの間の領域L5d内で、流動する樹脂材料が継続的に金属端子2aを上金型6に押し付ける力A4を発生させる。この為、金属端子2aの変形を抑制する、より高い効果が得られる。 By providing the flat portion 5d, the force of the flowing resin material continuously pressing the metal terminal 2a against the upper mold 6 in the region L5d between the side surfaces 2ac and 2ad perpendicular to the exposed surface 2aa of the metal terminal 2a. Generate A4. Therefore, a higher effect of suppressing deformation of the metal terminal 2a can be obtained.

本変更例の溝5Bは平面部5dを有することにより、溝5Bの最深部5cは樹脂流れ方向A1において平面部5dの長さL5dに相当する長さを有する。そのため、溝5Aの傾斜面5aの最深部5cは、溝5Bでは傾斜面5aと平面部5dとの接続部と考えればよい。 Since the groove 5B of this modified example has the flat portion 5d, the deepest portion 5c of the groove 5B has a length corresponding to the length L5d of the flat portion 5d in the resin flow direction A1. Therefore, the deepest portion 5c of the inclined surface 5a of the groove 5A can be considered as a connecting portion between the inclined surface 5a and the flat portion 5d in the groove 5B.

その他平面部5dを除く、傾斜面5a、側面5b、金属端子2a及び樹脂部1aの構成及び作用効果は、上述した実施例で説明した内容と同様である。 Except for the plane portion 5d, the configuration and effects of the inclined surface 5a, the side surface 5b, the metal terminal 2a, and the resin portion 1a are the same as those described in the above embodiment.

上述した実施例及び本変更例では、複数の金属端子2aを備えた構成について説明したが、金属端子2aは一つであってもよく、図2A,4Aに図示した以外の個数にすることができる。 In the above-described embodiment and this modified example, the configuration provided with a plurality of metal terminals 2a was described, but the number of metal terminals 2a may be one, and the number of metal terminals 2a may be other than those shown in FIGS. 2A and 4A. can.

なお、平面部5dを形成するために、図3に示す下金型7の金型突起7aに平面部を設けるとよい。 In order to form the flat portion 5d, it is preferable to provide a flat portion on the mold protrusion 7a of the lower mold 7 shown in FIG.

[変更例2]
溝5A,5Bの数が増えるに従い、樹脂流動の摩擦抵抗や圧力抵抗が増加する為、樹脂流動の下流側に配置された金属端子2aに作用する力A4は低下する傾向があり、金属端子2aの変形を抑制する作用が小さくなる可能性がある。本変更例では、樹脂流動の下流側に配置された金属端子2aの変形を抑制する効果が効率的に得られる形状を説明する。
[Modification 2]
As the number of grooves 5A and 5B increases, the frictional resistance and pressure resistance of the resin flow increase, so the force A4 acting on the metal terminal 2a arranged on the downstream side of the resin flow tends to decrease. There is a possibility that the effect of suppressing the deformation of In this modified example, a shape that effectively suppresses deformation of the metal terminal 2a arranged on the downstream side of the resin flow will be described.

図5は、図4Aに示す複数の溝5Bの配置を変更した変形例(第2変形例)を示す斜視図である。本変更例では、説明の便宜上、金属端子2a及び溝5Bの符号に1~5の数字を付加しているが、構成及び作用効果は上述した金属端子2a及び溝5Bと変わりない。
なお本変更例の樹脂成形体1では、第1変更例の溝5Bを用いて構成しているが、溝5Aを用いて構成してもよい。
FIG. 5 is a perspective view showing a modification (second modification) in which the arrangement of the plurality of grooves 5B shown in FIG. 4A is changed. In this modified example, for convenience of explanation, numerals 1 to 5 are added to the reference numerals of the metal terminals 2a and the grooves 5B, but the configuration and effects are the same as those of the metal terminals 2a and the grooves 5B described above.
Although the resin molding 1 of this modified example is configured using the grooves 5B of the first modified example, it may be configured using the grooves 5A.

本変更例では、金属端子2a-1~2a-5の周囲に樹脂材料が流動しやすいように、溝5B-1~5B-5を互い違いに配置する。具体的に説明すると、溝5B-1~5B-5は樹脂流れ方向A1を横切る方向に2列L1,L2に分かれて整列するように配置される。一方の列L1には溝5B-1,5B-3,5B-5が配置され、他方の列5B-2,5B-4が配置される。溝5B-1,5B-3,5B-5は金属端子2a-1,2a-3,2a-5に対応するように、樹脂流れ方向A1において金属端子2a-1,2a-3,2a-5と重複する位置に設けられている。溝5B-2,5B-4は金属端子2a-2,2a-4に対応するように、樹脂流れ方向A1において金属端子2a-2,2a-4と重複する位置に設けられている。 In this modification, the grooves 5B-1 to 5B-5 are alternately arranged so that the resin material can easily flow around the metal terminals 2a-1 to 2a-5. Specifically, the grooves 5B-1 to 5B-5 are arranged so as to be divided into two rows L1 and L2 in a direction crossing the resin flow direction A1. The grooves 5B-1, 5B-3 and 5B-5 are arranged in one row L1, and the other rows 5B-2 and 5B-4 are arranged. The grooves 5B-1, 5B-3, 5B-5 correspond to the metal terminals 2a-1, 2a-3, 2a-5 in the resin flow direction A1. It is located in a position that overlaps with the The grooves 5B-2 and 5B-4 are provided at positions overlapping the metal terminals 2a-2 and 2a-4 in the resin flow direction A1 so as to correspond to the metal terminals 2a-2 and 2a-4.

すなわち、一方の列L1の溝5B-1,5B-3,5B-5は、樹脂流れ方向A1に並んだ複数の金属端子2a-1~2a-5のうち、一つと飛ばしに配置された金属端子2a-1,2a-3,2a-5に対応するように設けられ、他方の列L2の溝5B-2,5B-4は、樹脂流れ方向A1に並んだ複数の金属端子2a-1~2a-5のうち、一つと飛ばしに配置された残る金属端子2a-2,2a-4に対応するように設けられる。言い換えると、樹脂流れ方向A1沿って順番に配置される複数の金属端子2a-1~2a-5は、第1列L1と第2列L2とに、交互に振り分けられる。 That is, the grooves 5B-1, 5B-3, and 5B-5 in one row L1 are metal terminals that are arranged without one out of the plurality of metal terminals 2a-1 to 2a-5 arranged in the resin flow direction A1. The grooves 5B-2 and 5B-4 of the other row L2 are provided to correspond to the terminals 2a-1, 2a-3 and 2a-5, and the plurality of metal terminals 2a-1 to 2a-4 arranged in the resin flow direction A1. It is provided so as to correspond to the remaining metal terminals 2a-2 and 2a-4 which are arranged alternately among the 2a-5. In other words, the plurality of metal terminals 2a-1 to 2a-5 arranged in order along the resin flow direction A1 are alternately distributed to the first row L1 and the second row L2.

[変更例3]
図6は、図4Aに示す複数の溝5Bの配置を変更した変形例(第3変形例)を示す斜視図である。本変更例では、説明の便宜上、金属端子2aの符号に1~5の数字を付加しているが、構成及び作用効果は上述した金属端子2aと変わりない。なお本変更例の樹脂成形体1では、第1変更例の溝5Bを用いて構成しているが、溝5Aを用いて構成してもよい。
[Modification 3]
FIG. 6 is a perspective view showing a modification (third modification) in which the arrangement of the plurality of grooves 5B shown in FIG. 4A is changed. In this modified example, for convenience of explanation, numerals 1 to 5 are added to the reference numerals of the metal terminals 2a, but the configuration and effects are the same as those of the metal terminals 2a described above. Although the resin molding 1 of this modified example is configured using the grooves 5B of the first modified example, it may be configured using the grooves 5A.

本変更例では、樹脂流動の最も上流側に位置する金属端子2a-1に対し、溝5Bを配置し、他の金属端子2a-2~2a-5に対しては溝5Bを配置しない。 In this modified example, the groove 5B is arranged for the metal terminal 2a-1 located on the most upstream side of the resin flow, and the groove 5B is not arranged for the other metal terminals 2a-2 to 2a-5.

樹脂流動の最も上流側に位置する金属端子2a-1は樹脂流動A2による流体摩擦を強く受け、金属端子2a-1を下方向に動かす力A3は樹脂流動の下流側に位置する金属端子2a-2~2a-5を下方向に動かす力A3より強く、金属端子2a-1は大きく変形する傾向にある。 The metal terminal 2a-1 located on the most upstream side of the resin flow is strongly subjected to fluid friction due to the resin flow A2, and the force A3 that moves the metal terminal 2a-1 downward is applied to the metal terminal 2a-1 located on the downstream side of the resin flow. 2 to 2a-5 is stronger than the force A3 that moves 2 to 2a-5 downward, and the metal terminal 2a-1 tends to be greatly deformed.

上述した理由から、溝5B又は5Aを樹脂流動の最も上流側に位置にする金属端子2a-1に対して設けることで、金属端子2aの変位及び変形を抑制する作用が得られる。なお、溝5B又は5Aを設ける金属端子2aは樹脂流動の最も上流側に位置する金属端子2aに限定される訳でなく、金属端子2aの構成に応じて溝5B又は5Aを配置する金属端子2aの数を調整することができ、最も上流側から連続する複数の金属端子2aに対して溝5B又は5Aを設けてもよい。 For the reason described above, by providing the groove 5B or 5A for the metal terminal 2a-1 located on the most upstream side of the resin flow, the effect of suppressing the displacement and deformation of the metal terminal 2a can be obtained. The metal terminal 2a provided with the groove 5B or 5A is not limited to the metal terminal 2a located on the most upstream side of the resin flow, and the metal terminal 2a on which the groove 5B or 5A is arranged according to the structure of the metal terminal 2a. can be adjusted, and grooves 5B or 5A may be provided for a plurality of metal terminals 2a that are continuous from the most upstream side.

本変更例では、溝5B又は5Aを形成する数を複数の金属端子2aの数よりも少なくすることで、溝部に形成される薄肉部が減り、樹脂部1aの強度の向上が期待できる。 In this modification, the number of grooves 5B or 5A formed is smaller than the number of metal terminals 2a, so that the number of thin portions formed in the grooves is reduced, and an improvement in the strength of the resin portion 1a can be expected.

上述した実施例及び変更例では、傾斜面5a,7aaに沿った樹脂流動の作用により、金属端子2aの露出面2aaが金型に押し付けられ、金属端子2aの変位が抑制される。
これにより露出面2aaへの樹脂被りや金属端子全体の変形が防止される。また金属端子2aを挟み固定する工法によって生じる露出部の封止工程や、気密性を確保する為の部品の組み付け工程を削減可能である。また、金属端子2aを挟み固定する工法の場合に生じる露出部が形成されないため、樹脂による金属端子2aの固定強度が向上し、ワイヤボンディングが安定する。このためワイヤボンディングの接合強度が向上する。
In the embodiment and modification described above, the exposed surface 2aa of the metal terminal 2a is pressed against the mold due to the effect of resin flow along the inclined surfaces 5a and 7aa, thereby suppressing the displacement of the metal terminal 2a.
As a result, covering of the exposed surface 2aa with resin and deformation of the entire metal terminal are prevented. In addition, it is possible to eliminate the process of sealing the exposed portion caused by the method of clamping and fixing the metal terminal 2a and the process of assembling parts for ensuring airtightness. In addition, since no exposed portion is formed in the method of clamping and fixing the metal terminal 2a, the fixing strength of the metal terminal 2a by the resin is improved, and wire bonding is stabilized. Therefore, the bonding strength of wire bonding is improved.

なお、本発明は上記した各実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも全ての構成を備えるものに限定されるものではない。また、ある実施例の構成の一部を他の実施例の構成に置き換えることが可能であり、また、ある実施例の構成に他の実施例の構成を加えることも可能である。また、各実施例の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 It should be noted that the present invention is not limited to the above-described embodiments, and includes various modifications. For example, the above-described embodiments are detailed descriptions for easy understanding of the present invention, and are not necessarily limited to those having all the configurations. In addition, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Moreover, it is possible to add, delete, or replace a part of the configuration of each embodiment with another configuration.

1…樹脂成形体、1a…樹脂部(樹脂部材)、1aa…樹脂部材1aの表面(第1主面)、1ab…樹脂部材1aの裏面(第2主面)、2a…金属端子(電気導体)、2aa…金属端子2aの表面(露出面)、2ab…金属端子2aの裏面、2ac…金属端子2aの上流側の側面、2C…電気導体2aの中央、5A…三角形状の溝形状部、5a…溝形状部5A,5Bの傾斜面、5B…台形形状の溝形状部、5c…傾斜面5aの下流側の端部(最深部)、6…上金型、7…下金型、7a…突起部、7aa…突起部7aの傾斜面、7aa1…傾斜面7aaの上流側の端部、7aa2…傾斜面7aaの下流側の端部、9…ワイヤボンディング、10…流量測定用の回路基板、17…ゲート部、A1…樹脂流れ方向、L1,L2…溝形状部が配置された列、L2a…露出面2aaに垂直な方向に露出面2aaを第2主面1abに投影した投影領域。 DESCRIPTION OF SYMBOLS 1... Resin molding, 1a... Resin part (resin member), 1aa... Front surface (first main surface) of resin member 1a, 1ab... Back surface (second main surface) of resin member 1a, 2a... Metal terminal (electric conductor ), 2aa... the surface (exposed surface) of the metal terminal 2a, 2ab... the back surface of the metal terminal 2a, 2ac... the upstream side surface of the metal terminal 2a, 2C... the center of the electrical conductor 2a, 5A... the triangular grooved portion, 5a... Inclined surfaces of groove-shaped parts 5A and 5B, 5B... Trapezoidal groove-shaped part, 5c... Downstream end (deepest part) of inclined surface 5a, 6... Upper die, 7... Lower die, 7a Projection 7aa Inclined surface of projection 7a 7aa1 Upstream end of inclined surface 7aa 7aa2 Downstream end of inclined surface 7aa 9 Wire bonding 10 Circuit board for flow rate measurement , 17 -- gate section, A1 -- resin flow direction, L1, L2 -- row in which groove-shaped portions are arranged, L2a -- projection area obtained by projecting exposed surface 2aa onto second main surface 1ab in a direction perpendicular to exposed surface 2aa.

Claims (6)

金属端子と、
前記金属端子をインサート固定する樹脂部材と、
前記樹脂部材に形成されるゲート部と、を備え、
前記金属端子は、前記樹脂部材から露出する露出面を有し、
前記樹脂部材は、前記金属端子がインサート固定される第1主面と、前記第1主面に対する裏面となる第2主面と、前記第2主面に形成され傾斜面を有する溝形状部と、を有し、
前記傾斜面は、前記露出面に垂直な方向に前記露出面を前記第2主面に投影した投影領域内に、少なくとも前記傾斜面の一部分が形成され、
さらに前記傾斜面は、樹脂流れ方向に沿って樹脂流れの下流側に向かうに従って、前記金属端子に近づくように傾斜し
前記溝形状部は、樹脂流れ方向を横切る方向に2列に分かれて互い違いに配置されている樹脂成形体。
a metal terminal;
a resin member for insert-fixing the metal terminal;
a gate portion formed in the resin member,
The metal terminal has an exposed surface exposed from the resin member,
The resin member has a first principal surface to which the metal terminal is inserted and fixed, a second principal surface which is a back surface of the first principal surface, and a groove-shaped portion formed on the second principal surface and having an inclined surface. , has
at least a portion of the inclined surface is formed in a projection area obtained by projecting the exposed surface onto the second principal surface in a direction perpendicular to the exposed surface;
Further, the inclined surface is inclined so as to approach the metal terminal as it goes toward the downstream side of the resin flow along the resin flow direction ,
The resin molded body , wherein the groove-shaped portions are alternately arranged in two rows in a direction transverse to the resin flow direction .
前記傾斜面の樹脂流れ方向における下流側の端部は、前記金属端子の樹脂流れ方向における中央よりも下流側に位置する請求項に記載の樹脂成形体。 2. The molded resin article according to claim 1 , wherein a downstream end portion of said inclined surface in the direction of resin flow is located downstream of a center of said metal terminal in the direction of resin flow. 前記傾斜面の樹脂流れ方向における下流側の端部は、前記投影領域内にある請求項に記載の樹脂成形体。 2. The molded resin article according to claim 1 , wherein a downstream end portion of said inclined surface in the direction of resin flow is within said projected area. 前記金属端子の樹脂流れ方向における上流側の側面は、前記傾斜面の樹脂流れ方向における上流側の端部よりも、樹脂流れ方向における上流側に位置している請求項に記載の樹脂成形体。 2. The molded resin article according to claim 1 , wherein an upstream side surface of the metal terminal in the resin flow direction is positioned upstream in the resin flow direction from an upstream end portion of the inclined surface in the resin flow direction. . 前記溝形状部の断面形状は略三角形状である請求項に記載の樹脂成形体。 2. The resin molding according to claim 1 , wherein the cross-sectional shape of said groove-shaped portion is substantially triangular. 前記溝形状部の断面形状は略台形形状である請求項に記載の樹脂成形体。 2. The resin molding according to claim 1 , wherein the cross-sectional shape of said groove-shaped portion is substantially trapezoidal.
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