CN111033902A - Connector with a locking member - Google Patents
Connector with a locking member Download PDFInfo
- Publication number
- CN111033902A CN111033902A CN201880054672.7A CN201880054672A CN111033902A CN 111033902 A CN111033902 A CN 111033902A CN 201880054672 A CN201880054672 A CN 201880054672A CN 111033902 A CN111033902 A CN 111033902A
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- Prior art keywords
- resin
- bus bar
- bus
- bus bars
- primary
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- 229920005989 resin Polymers 0.000 claims abstract description 130
- 239000011347 resin Substances 0.000 claims abstract description 130
- 238000000465 moulding Methods 0.000 claims abstract description 17
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/02—Open installations
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The present invention provides a connector (1) comprising: a housing (10) having a primary resin (30) formed by primary molding and a secondary resin (40) formed by secondary molding; and a bus bar group (20) embedded in the secondary resin (40) in a state where a plurality of bus bars (21, 22, 23) formed integrally with the primary resin (30) are overlapped, the primary resin (30) including: an outer layer section (CL) which is disposed in contact with the outer side surfaces (20F, 20B) of the bus bar group (20) in the overlapping direction and is exposed from the secondary resin (40); and an intermediate layer portion (ML) sandwiched between the adjacent two bus bars (21, 22, 23) in a state of being in contact with the adjacent two bus bars (21, 22, 23).
Description
Technical Field
The technology disclosed in this specification relates to connectors.
Background
Conventionally, as a connector which is insert-molded by a terminal fitting, for example, a connector of patent document 1 is known. The housing of the connector includes a molded body made of synthetic resin, a core made of the same synthetic resin, and a plurality of terminal parts. The core is formed in advance before the housing is molded, and a plurality of terminal through holes penetrating in the front-rear direction are formed.
When the housing is molded, the terminal fitting and the core are positioned in the mold by press-fitting the terminal fitting through the terminal through-hole of the core and fitting the lower end of the terminal fitting into the fixed mold of the mold. Then, a molten resin is injected into the cavity of the mold at a high pressure through the gate, and the molded body is molded in a state of being integrated with the core portion and the terminal fitting.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-174697
Disclosure of Invention
Problems to be solved by the invention
However, in this technique, since the terminal fitting is fitted to the fixed mold of the mold when the housing is molded, a portion of the terminal fitting fitted to the fixed mold of the mold is easily damaged. Further, since the core is positioned in the mold by the terminal fitting, the terminal fitting is deformed by the pressure applied to the core from the molten resin, and there is a problem that the terminals come into contact with each other in a state where the housing is completed.
Means for solving the problems
A connector according to the technology disclosed in the present specification is characterized by comprising: a housing having a primary resin formed by primary molding and a secondary resin formed by secondary molding; a bus bar group embedded in the secondary resin in a state where a plurality of bus bars integrally formed with the primary resin are overlapped, the primary resin including: an outer layer portion disposed in contact with an outer side surface of the bus bar group in the overlapping direction and exposed from the secondary resin; and an intermediate layer portion sandwiched between the adjacent two bus bars in a state of being in contact with the adjacent two bus bars.
According to this configuration, since the intermediate layer portion made of the primary resin is sandwiched in contact with the adjacent two bus bars, the distance between the bus bars can be kept constant in the case. Further, since the outer layer portion is disposed on the outer side surface in the direction in which the bus bar group is superimposed, the bus bar can be fixed in the mold by sandwiching the outer layer portions with the mold when the secondary resin is secondarily molded. Therefore, the bus bar group does not need to be fixed on the mold, so the bus bar is not damaged by the mold.
As an embodiment of the technology disclosed in the present specification, the following configuration is preferable.
(1) The outer layer portion includes: a contact portion exposed from the secondary resin; and a tapered portion that approaches the bus bar as it spreads from the peripheral edge of the contact portion toward the outer periphery.
According to this configuration, when the contact portion is brought into contact with the mold at the time of secondary molding of the secondary resin and the molten resin is injected from the direction intersecting the overlapping direction of the bus bars, the molten resin reaches the tapered portion of the outer layer portion and flows so as to surround the tapered portion, and therefore the pressure received by the outer layer portion from the molten resin can be relaxed.
(2) The intermediate layer portion includes: a fitting recess provided in a recessed manner on one side of the two bus bars; and a fitting protrusion protruding from the other side of the two bus bars and fitted into the fitting recess, thereby preventing positional displacement of the two bus bars.
According to this configuration, the fitting recess on the one busbar side is fitted to the fitting projection on the other busbar side, whereby positional displacement of the two busbars due to the pressure of the molten resin when the secondary resin is formed can be eliminated.
Effects of the invention
According to the technique disclosed in the present specification, it is possible to provide a connector in which positional displacement of the bus bar in the secondary molding is eliminated and the bus bar is not damaged.
Drawings
Fig. 1 is a front view showing a connector of the embodiment.
Fig. 2 is a plan view showing the connector.
Fig. 3 is a sectional view a-a of fig. 1.
Fig. 4 is a sectional view B-B of fig. 1.
Fig. 5 is a perspective view showing the primary resin and the bus bar.
Fig. 6 is a perspective view showing the primary resin and the bus bar.
Fig. 7 is a plan view showing the primary resin and the bus bar.
Fig. 8 is a plan view showing the primary resin and the bus bar set.
Fig. 9 is a diagram showing the first bus bar.
Fig. 10 is a diagram showing the second bus bar.
Fig. 11 is a diagram showing a third bus bar.
Detailed Description
< embodiment >
An embodiment of the technology disclosed in the present specification will be described with reference to fig. 1 to 11. The connector 1 of the present embodiment is a relay connector used in an inverter case. In the following description, the near side in fig. 1 is referred to as the front side, the right side as the right side, and the upper side as the upper side.
In the external views shown in fig. 1 and 2, the connector 1 includes a substantially rectangular plate-shaped housing 10 that is long in the left-right direction, and six terminals 14. In the following, only three of the six terminals 14 will be described and illustrated, and the description and illustration of the other three terminals will be omitted.
The front surface of the housing 10 (hereinafter referred to as the housing front surface 10F) includes three front step surfaces 10F-1, 10F-2, and 10F-3 that are continuous in the left-right direction. Most of the step surfaces 10F-1 to 3 are covered with the secondary resin 40, and the primary resin 30 (contact part CL-C described later) embedded in the secondary resin 40 is flush with and exposed from the secondary resin 40. Similarly, the rear surface 10B of the case 10 also includes three rear-side stepped surfaces 10B-1, 10B-2, and 10B-3, and of the two rear-side stepped surfaces 10B-2 and 10B-3, the primary resin 30 (contact portion CL-C described later) is flush with the secondary resin 40 and exposed from the secondary resin 40.
As shown in fig. 2, the terminals 14 protrude forward from the housing front surface 10F. Each terminal 14 is formed of a metal plate material, and is formed in an elongated strip shape. The terminals 14 are arranged on the housing front surface 10F so as to be dispersed in the left-right direction and the up-down direction without contacting each other.
On the other hand, as shown in fig. 3 and 4, the primary resin 30 and the bus bar group 20 are embedded in the housing 10, the bus bar group 20 includes the first bus bar 21, the second bus bar 22, and the third bus bar 23, and the primary resin 30 is integrally formed on each of the bus bars 21 to 23. The first to third bus bars 21 to 23 are overlapped with the primary resin 30 interposed therebetween. Hereinafter, the primary resin 30 sandwiched between the bus bars 21 to 23 is referred to as an intermediate layer portion ML, and the primary resin 30 disposed on the front surface 20F and the rear surface 20B of the bus bar group 20 is referred to as an outer layer portion CL. Specifically, a layer portion sandwiched between first bus bar 21 and second bus bar 22 in intermediate layer portion ML is referred to as a first intermediate layer portion ML1, and a layer portion sandwiched between second bus bar 22 and third bus bar 23 is referred to as a second intermediate layer portion ML 2. In addition, the layer portion disposed on the front surface 20F of the bus-bar group 20 in the outer layer portion CL is referred to as a first outer layer portion CL1, and the layer portion disposed on the rear surface 20B of the bus-bar group 20 is referred to as a second outer layer portion CL 2.
As shown in fig. 5 and 6, the first to third bus bars 21 to 23 are each formed in a plate shape elongated in the left-right direction. As shown in fig. 7, the first bus bar 21 and the second bus bar 22 are overlapped so that the right end of the second bus bar 22 is shifted to the right from the right end of the first bus bar 21. Similarly, the second bus bar 22 and the third bus bar 23 are overlapped so that the right end of the third bus bar 23 is shifted rightward from the right end of the second bus bar 22. In the following, as shown in fig. 9 to 11, a region where three of the first bus bar 21, the second bus bar 22, and the third bus bar 23 overlap is referred to as a first region P1, a region where two of the second bus bar 22 and the third bus bar 23 overlap is referred to as a second region P2, and a region where only the third bus bar 23 overlaps is referred to as a third region P3. A region where the first bus bar 21 and the second bus bar 22 overlap each other is referred to as a fourth region P4, and a region only where the first bus bar 21 overlaps is referred to as a fifth region P5.
As shown in fig. 5, the six terminals 14 of the bus bar group 20 are provided one by one on each of the first bus bar 21, the second bus bar 22, and the third bus bar 23. The bus bars 21, 22, and 23 and the terminals 14 are integrally formed by press working or the like from a single metal plate material, and protrude forward in a horizontal posture from both end portions of the bus bars 2, 22, and 23.
The first bus bar 21 has a first escape slit 21A formed in an elongated slit shape and penetrating in the front-rear direction. A second relief slit 22A having the same shape as the first relief slit 21A is formed in the second bus bar 22 so as to penetrate forward and backward at a position overlapping the first relief slit 21A in front view. The terminal 14 (hereinafter referred to as a through terminal 14A) provided on the third bus bar 23 is disposed at a position visible through the first relief slit 21A and the second relief slit 22A in the front view, and extends forward while penetrating through the second relief slit 22A and the second relief slit 21A.
As shown in fig. 9 to 11, the primary resin 30 is dispersed in each of the first to third bus bars 21 to 23. The primary resins 30 are formed integrally with the bus bars 21 to 23 in one-step molding of the connector 1.
Specifically, the first front resin 31F protrudes forward from the front surface 21F of the first bus bar 21 (fig. 9 a), and the first back resin 31B protrudes rearward from the back surface 21B (fig. 9B). As shown in fig. 7, the projecting end portions of the primary resins 31F and 31B are flat surfaces parallel to the first bus bar 21.
Similarly, a second front resin 32F (fig. 10 a) protrudes forward from the front surface 22F of the second bus bar 22, and a second back resin 32B (fig. 10B) protrudes rearward from the back surface 22B of the second bus bar 22. The projecting end portions of the primary resins 32F and 32B form flat surfaces parallel to the second bus bar 22.
Similarly, a third front resin 33F (fig. 11 a) protrudes forward from the front surface 23F of the third bus bar 23, and a third back resin 33B (fig. 11B) protrudes rearward from the back surface 23B of the third bus bar 23. The projecting end portions of the primary resins 33F and 33B are flat surfaces parallel to the third bus bar 23.
As shown in fig. 7, the height of the primary resins 31F and 31B protruding from the first bus bar 21, the height of the primary resins 32F, 32B, and 33F protruding from the second bus bar 22, and the height of the primary resins 33F and 33B protruding from the third bus bar 23 are all the same.
The first back-side resin 31B disposed in the region P1 and the region P4 as shown in fig. 9B and the portion of the second front-side resin 32F disposed in the region P1 and the region P4 (hereinafter referred to as the second front-side intermediate resin 32F-ML) as shown in fig. 10 a are the first intermediate layer portion ML1 described above in a state where the three bus bars 21, 22, and 23 overlap each other to form the bus bar group 20.
The first back-side intermediate resin 31B-ML and the second front-side intermediate resin 32F-ML are disposed at positions that do not overlap each other in the main perspective when they are disposed opposite to each other as shown in fig. 7. Therefore, in a state where they are combined from the front and rear to form the first intermediate layer portion ML1, as shown in fig. 8(B), the protruding end portions ML-C of the second front intermediate resin 32F-ML are in surface contact with the rear surface 21B of the first bus bar 21. First bus bar 21 and second bus bar 22 are disposed so as to be separated from each other with first intermediate layer portion ML1 interposed therebetween.
Similarly, as shown in fig. 10B, the portion of the second back resin 32B disposed in the region P1 and the region P2 (hereinafter referred to as the second back intermediate resin 32B-ML) and the portion of the third front resin 33F disposed in the region P1 and the region P2 (hereinafter referred to as the third front intermediate resin 33F-ML) shown in fig. 11 a form the second intermediate layer portion ML2 in a state of being the bus bar group 20.
The second back-side intermediate resin 32B-ML and the third front-side intermediate resin 33F-ML are disposed at positions that do not overlap each other in the main perspective when they are disposed opposite to each other as shown in fig. 7. Therefore, in a state where they are combined from the front and rear to form the second intermediate layer portion ML2, the protruding end portion ML-C of the second back-side intermediate resin 32B-ML is in surface contact with the front surface 23F of the third bus bar 23 as shown in fig. 8 (C). The second bus bar 22 and the third bus bar 23 are disposed so as to be separated from each other with the second intermediate layer portion ML2 interposed therebetween.
As shown in fig. 9B and 10 a, although the first intermediate layer portion ML1(31B, 32F-ML) is disposed between the first bus bar 21 and the second bus bar 22 (the region P1 and the region P4) in most parts, as shown in fig. 9B and 10 a, the first intermediate layer portion ML1 is not disposed on the left and lower sides of the first escape slit 21A and the through terminal 14A, and a space for allowing the internal space of the first escape slit 21A to communicate with the outside is left. During the secondary molding of the connector 1, the molten resin flows in the space and fills the space between the first relief slit 21A and the through-terminal 14A.
The second intermediate layer portion ML2 is disposed so as to fill substantially the entirety of the space between the second bus bar 22 and the third bus bar 23 (the region P1 and the region P2), but as shown in fig. 10B, the left side of the second relief slit 22A is a space where the third bus bar 23 is not overlapped with the region P4 and the second backside resin 32B is not provided. During the secondary molding of the connector 1, the molten resin is filled between the second relief slit 22A and the through terminal 14A from the back surface 22B side of the second bus bar 22.
On the other hand, the first front-side resin 31F of the primary resin 30, which is disposed in the first region P1 and the fourth region P4 as shown in fig. 9 a, the portion of the second front-side resin 32F disposed in the second region P2 (hereinafter referred to as the second front-side outer layer resin 32F-CL) as shown in fig. 10 a, and the portion of the third front-side resin 33F disposed in the third region P3 (hereinafter referred to as the third front-side outer layer resin 33F-CL) as shown in fig. 11 a constitute the first outer layer section CL 1.
Similarly, the portion of the second back resin 32B disposed in the fourth region P4 (hereinafter referred to as the second back outer layer resin 32B-CL) as shown in fig. 10B and the third back resin 33B disposed in the first to third regions P1 to P3 as shown in fig. 11B become the second outer layer CL 2.
That is, in the bus-bar group 20, in any one of the first to fourth regions P1 to P4, the first outer layer section CL1 is provided on the front surface 20F, and the second outer layer section CL2 is provided on the rear surface 20B. In each of the first to fourth regions P1 to P4, at least a part of the first outer layer section CL1 and at least a part of the second outer layer section CL2 overlap each other in a main perspective view. In particular, in the first region P1, the first outer layer section CL1-S (see fig. 9 a) and the second outer layer section CL2-S (see fig. 11B) disposed near the upper end and near the lower end of the bus bar group 20 overlap each other with the three bus bars 21 to 23 and the intermediate layer sections ML1 and ML2 in the main perspective.
Each outer layer section CL (the first outer layer section CL1 and the second outer layer section CL2) is formed by one or a plurality of left and right elongated protrusions in each of the regions P1 to P3. Gaps which become flow paths of molten resin during secondary molding are ensured between the plurality of protrusions arranged in a vertical row.
As shown in fig. 8(a), at the time of secondary molding of the connector 1, the projecting end portions of the outer layer sections CL come into contact with the contact portions CL-C of the unillustrated mold disposed in front of and behind the bus bar group 20 in each of the first to fourth regions P1 to P4 of the bus bar group 20. As a result, in the post-secondary-molding state, as shown in fig. 1, the contact portions CL-C are exposed flush with the secondary resin 40 on the case front surface 10F, and are also exposed flush with the secondary resin 40 on the back surface 10B, not shown.
In the present embodiment, in order to prevent the positional deviation of the bus bar group 20 in the mold, as shown in fig. 8 a and 8B, the projecting side portion of the outer layer section CL includes an outer layer tapered portion CL-T (an example of a tapered portion) that is closer to each of the bus bars 21 to 23 as it spreads from the peripheral edge of the contact portion CL-C to the outer periphery. The outer-layer tapered portion CL-T is disposed on the first front-side resin 31F, the second front-side outer-layer resin 32F-CL, the third front-side outer-layer resin 33F-CL, the second back-side outer-layer resin 32B-CL, and the third back-side resin 33B.
Similarly, in the bus bar group 20, in order to prevent the second bus bar 22 from being displaced from the first bus bar 21 and the third bus bar 23, as shown in fig. 10(a) to 10(C), the protruding side portion of the intermediate layer portion ML includes an intermediate layer tapered portion ML-T that approaches each of the bus bars 21 to 23 as it extends from the peripheral edge of the protruding end portion to the outer periphery. The intermediate layer tapered portion ML-T is provided in the second front intermediate resin 32F-ML (see fig. 10 a) and the second back intermediate resin 32B-ML (see fig. 10B) constituting the left end of the second intermediate layer portion ML 2.
In the bus bar group 20, in order to prevent the second bus bar 22 from being displaced from the first bus bar 21 and the third bus bar 23, in the present embodiment, a fitting concave portion ML-H having a circular concave shape is formed in one of the two intermediate resins constituting the intermediate layer portion ML, and a fitting convex portion ML-P having a truncated conical shape, protruding toward the fitting concave portion ML-H, and fitted into the fitting concave portion ML-H is formed in the other. Three fitting recesses ML-H are formed in the second front-side intermediate resin 32F-ML (see fig. 10 a), and two fitting recesses ML-H are formed in the second back-side intermediate resin 32B-ML (see fig. 10B). The first back-side intermediate resin 31B-ML has three fitting projections ML-P (see fig. 9B), and the third front-side intermediate resin 33F-ML has two fitting projections ML-P (see fig. 11 a). In a state where the bus bars are assembled to form the bus bar group 20, as shown in fig. 8(B) and 8(C), the fitting projections ML-P are fitted into the fitting recesses ML-H, respectively.
Next, a method of forming the connector 1 of the present embodiment is illustrated.
First, by one-shot molding, the first front-side resin 31F and the first back-side resin 31B are formed on the first bus bar 21, the second front-side resin 32F and the second back-side resin 32B are formed on the second bus bar 22, and the third front-side resin 33F and the third back-side resin 33B are formed on the third bus bar 23.
Next, the right ends of the second bus bar 22 and the third bus bar 23 are shifted to the right from the front bus bars 21 and 22, respectively, and are overlapped with each other behind the first bus bar 21. Then, the fitting projections ML-P are fitted to the fitting recesses ML-H, and the first back-side intermediate resin 31B-ML and the second front-side intermediate resin 32F-ML are combined with each other, and the second back-side intermediate resin 32B-ML and the third front-side intermediate resin 33F-ML are combined with each other, thereby forming intermediate layer portions ML1 and ML2, respectively. Thus, the following bus-bar set 20 is obtained: the bus bars 21, 22, and 23 are overlapped with the intermediate layers ML1 and ML2 interposed therebetween, and the first outer layer CL1 is disposed on the front surface 20F and the second outer layer CL2 is disposed on the rear surface 20B.
Next, the bus bar group 20 is placed in a pair of molds, not shown, and the molds are closed from the front and rear of the bus bar group 20, and the molds are brought into contact with the outer layer section CL in each of the first to fourth zones P4. Then, the bus bar group 20 is fixed in the mold with the outer layer portions CL sandwiched between the front and rear sides of each of the regions P1 to P4.
Next, the molten resin is injected from a gate, not shown, provided on the left side of the bus bar group 20 in the mold. Then, the molten resin reaches the outer layer tapered portion CL-T of the outer layer portion CL and the intermediate layer tapered portion ML-T of the intermediate layer portion ML, and flows away from the gate in a manner surrounding them. When the mold is opened when the molten resin is filled in the mold and solidified to become the secondary resin 40, the primary resin 30 and the bus bar group 20 are embedded in the secondary resin 40, and the contact portion CL-C of the outer layer portion CL is flush with the secondary resin 40 and exposed to the outside, thereby obtaining the connector 1.
According to the above configuration, since the intermediate layer portion ML made of the primary resin is disposed in the gap between the two adjacent bus bars 21 and 22(22 and 23) in a state of being in contact with the two bus bars 21 and 22(22 and 23), the distance separating the bus bars 21 and 22(22 and 23) from each other can be kept constant in the case 10. Further, since the outer layer portions CL are disposed on the outer side surfaces 20F, 20B of the bus bar group 20 in the overlapping direction, the bus bar group 20 can be fixed in the mold by bringing the outer layer portions CL into contact with the mold when the secondary resin 40 is secondarily molded. Therefore, the bus bars 21 to 23 are not damaged by the mold since there is no need to abut the bus bar group 20 itself to the mold.
Further, when the contact portion CL-C is brought into contact with the mold and the molten resin is injected from the direction intersecting the overlapping direction of the bus-bar group 20 at the time of secondary molding of the secondary resin 40, the molten resin reaches the tapered portion CL-T of the outer layer portion CL and flows so as to surround them, and therefore, the pressure received by the outer layer portion CL from the molten resin can be alleviated.
Further, the positional displacement of the bus bars 21, 22, 23 can be eliminated by the pressure of the molten resin when the secondary resin 40 is formed by fitting the fitting concave portions ML-H of the one bus bar 22 to the fitting convex portions ML-P of the other bus bars 21, 23.
In the present embodiment, as described above, the through terminal 14A of the third bus bar 23 extends forward while penetrating through the second relief slit 22A and the first relief slit 21A. When the through terminal 14A arranged as described above is provided, if the first to third bus bars 21 to 23 are displaced from each other during the secondary molding, the through terminal 14A comes into contact with the opening edge portions of the relief slits 22A and 21A, and is likely to be a defective product in which the bus bars are electrically short-circuited. In contrast, in the present embodiment, the outer layer tapered portion CL-T and the intermediate layer tapered portion ML-T are provided as described above, and the intermediate layer portion ML is provided with the fitting concave portion ML-H and the fitting projection portion ML-P fitted to the fitting concave portion ML-H. These positional displacement restricting means can dispose the through terminal 14A through the clearance slits 22A and 21A without contacting them, and can significantly improve the degree of freedom in the layout design of the terminal 14.
< other embodiment >
The technique disclosed in the present specification is not limited to the embodiments described above and illustrated in the drawings, and can be implemented, for example, in the following manner.
(1) In the above embodiment, the bus bar group 20 is configured by three bus bars 21 to 23, but the number of bus bars is not limited thereto, and may be two or four or more.
(2) In the above embodiment, the outer layer section CL is configured to have the outer layer tapered section CL-T having a tapered shape, but instead, the outer layer section may be configured to have an inverted tapered section, or the outer layer section may be configured to have no tapered section or no inverted tapered section.
(3) In the above embodiment, the fitting concave portions ML-H are provided on the front surface 22F side and the back surface 22B side of the second bus bar 22, respectively, and the fitting convex portions ML-P are provided on the back surface 21B side of the first bus bar 21 and the front surface 23F side of the third bus bar 23, respectively, but the arrangement of the fitting concave portions and the fitting convex portions is not limited thereto, and the fitting concave portions may be provided on the back surface side of the first bus bar and the front surface side of the third bus bar, and the fitting convex portions may be provided on the front surface side and the back surface side of the second bus bar. Alternatively, the fitting recess and the fitting projection may not be provided. In short, the bus bars may be fixed between the molds without causing positional deviation therebetween.
(4) In the above embodiment, the intermediate layer ML is formed by the primary resin 30 provided on the front surfaces 21F, 22F, 23F and the rear surfaces 21B, 22B, 23B of the bus bars 21, 22, 23, respectively, but is not limited thereto, and for example, the intermediate layer ML may be formed by only the primary resin provided on the rear surface of the first bus bar and the front surface of the third bus bar without providing the primary resin on both the front surface and the rear surface of the second bus bar. In short, the intermediate layer portion may be formed between two adjacent bus bars.
Description of the reference numerals
30: primary resin
40: secondary resin
10: shell body
20: bus group
20F: front surface (outer side surface) of bus group
20B: back face (outer side face) of bus group
21. 22, 23: bus bar
CL: outer layer part
CL-C: contact part
CL-T: outer taper (taper)
ML: intermediate layer part
ML-H: fitting recess
ML-P: fitting protrusion
Claims (3)
1. A connector is provided with:
a housing having a primary resin formed by primary molding and a secondary resin formed by secondary molding; and
a bus bar group embedded in the secondary resin in a state where a plurality of bus bars integrally formed with the primary resin are overlapped,
the primary resin comprises:
an outer layer portion disposed in contact with an outer side surface of the bus bar group in the overlapping direction and exposed from the secondary resin; and
and an intermediate layer portion sandwiched between the adjacent two bus bars in a state of being in contact with the adjacent two bus bars.
2. The connector of claim 1,
the outer layer portion includes: a contact portion exposed from the secondary resin; and a tapered portion that approaches the bus bar as it spreads from the peripheral edge of the contact portion toward the outer periphery.
3. The connector according to claim 1 or 2,
the intermediate layer portion includes: a fitting recess provided in a recessed manner on one side of the two bus bars; and a fitting protrusion protruding from the other side of the two bus bars and fitted into the fitting recess, thereby preventing positional displacement of the two bus bars.
Applications Claiming Priority (3)
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JP2017168320 | 2017-09-01 | ||
JP2017-168320 | 2017-09-01 | ||
PCT/JP2018/031293 WO2019044681A1 (en) | 2017-09-01 | 2018-08-24 | Connector |
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CN111033902A true CN111033902A (en) | 2020-04-17 |
CN111033902B CN111033902B (en) | 2021-07-06 |
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JP (1) | JP6849077B2 (en) |
CN (1) | CN111033902B (en) |
WO (1) | WO2019044681A1 (en) |
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JP7391819B2 (en) * | 2020-02-04 | 2023-12-05 | 東海興業株式会社 | Injection molded products and their manufacturing method |
Citations (5)
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US6076258A (en) * | 1996-04-23 | 2000-06-20 | Yazaki Corporation | Method for insert molding and method for producing a connector |
CN101106247A (en) * | 2006-07-13 | 2008-01-16 | 住友电装株式会社 | Method of producing insert-molded product and insert-molding die |
US20090029594A1 (en) * | 2007-07-26 | 2009-01-29 | Sumitomo Wiring Systems, Ltd. | Device connector |
CN102683964A (en) * | 2011-03-15 | 2012-09-19 | 住友电装株式会社 | Device connector and manufacture method thereof |
CN102683963A (en) * | 2011-03-15 | 2012-09-19 | 住友电装株式会社 | Device connector and method of producing it |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0720849Y2 (en) * | 1989-08-24 | 1995-05-15 | 矢崎総業株式会社 | Busbar interconnection structure |
JP3078860B2 (en) * | 1991-02-18 | 2000-08-21 | 株式会社デンソー | Resin insert molding method for metal members |
JP3654564B2 (en) * | 1999-03-02 | 2005-06-02 | 矢崎総業株式会社 | Manufacturing method of molded connector |
-
2018
- 2018-08-24 CN CN201880054672.7A patent/CN111033902B/en active Active
- 2018-08-24 JP JP2019539442A patent/JP6849077B2/en active Active
- 2018-08-24 WO PCT/JP2018/031293 patent/WO2019044681A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6076258A (en) * | 1996-04-23 | 2000-06-20 | Yazaki Corporation | Method for insert molding and method for producing a connector |
CN101106247A (en) * | 2006-07-13 | 2008-01-16 | 住友电装株式会社 | Method of producing insert-molded product and insert-molding die |
US20090029594A1 (en) * | 2007-07-26 | 2009-01-29 | Sumitomo Wiring Systems, Ltd. | Device connector |
CN102683964A (en) * | 2011-03-15 | 2012-09-19 | 住友电装株式会社 | Device connector and manufacture method thereof |
CN102683963A (en) * | 2011-03-15 | 2012-09-19 | 住友电装株式会社 | Device connector and method of producing it |
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WO2019044681A1 (en) | 2019-03-07 |
CN111033902B (en) | 2021-07-06 |
JP6849077B2 (en) | 2021-03-24 |
JPWO2019044681A1 (en) | 2020-04-16 |
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