JP7113830B2 - イメージセンサための読み出し装置、イメージ・センサ・システム、およびイメージセンサの読み出し方法 - Google Patents

イメージセンサための読み出し装置、イメージ・センサ・システム、およびイメージセンサの読み出し方法 Download PDF

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JP7113830B2
JP7113830B2 JP2019538626A JP2019538626A JP7113830B2 JP 7113830 B2 JP7113830 B2 JP 7113830B2 JP 2019538626 A JP2019538626 A JP 2019538626A JP 2019538626 A JP2019538626 A JP 2019538626A JP 7113830 B2 JP7113830 B2 JP 7113830B2
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analog
image sensor
memory
readout device
values
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JP2020507957A (ja
JP2020507957A5 (cg-RX-API-DMAC10.html
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イェンス ドゥーガ
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フラウンホッファー-ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー.ファオ
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/445—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by skipping some contiguous pixels within the read portion of the array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/47—Image sensors with pixel address output; Event-driven image sensors; Selection of pixels to be read out based on image data
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Image Input (AREA)
  • Facsimile Heads (AREA)
JP2019538626A 2017-01-18 2018-01-18 イメージセンサための読み出し装置、イメージ・センサ・システム、およびイメージセンサの読み出し方法 Active JP7113830B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP17152077.8 2017-01-18
EP17152077 2017-01-18
EP17152299.8 2017-01-19
EP17152299 2017-01-19
PCT/EP2018/051231 WO2018134317A1 (de) 2017-01-18 2018-01-18 Ausleseanordnung für einen bildsensor, bildsensor-system und verfahren zum auslesen eines bildsensors

Publications (3)

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JP2020507957A JP2020507957A (ja) 2020-03-12
JP2020507957A5 JP2020507957A5 (cg-RX-API-DMAC10.html) 2021-05-20
JP7113830B2 true JP7113830B2 (ja) 2022-08-05

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US (1) US11115613B2 (cg-RX-API-DMAC10.html)
EP (2) EP4283983A3 (cg-RX-API-DMAC10.html)
JP (1) JP7113830B2 (cg-RX-API-DMAC10.html)
KR (1) KR102310054B1 (cg-RX-API-DMAC10.html)
CN (1) CN110431839B (cg-RX-API-DMAC10.html)
WO (1) WO2018134317A1 (cg-RX-API-DMAC10.html)

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US11514294B2 (en) 2017-02-24 2022-11-29 Untether Ai Corporation System and method for energy-efficient implementation of neural networks
US20230229450A1 (en) * 2018-02-23 2023-07-20 Untether Ai Corporation Computational memory
WO2019175734A1 (en) * 2018-03-14 2019-09-19 Insightness Ag Event-based vision sensor with direct memory control
JP2020030873A (ja) * 2018-08-21 2020-02-27 キオクシア株式会社 メモリシステム
US10638075B1 (en) * 2019-05-17 2020-04-28 Omnivision Technologies, Inc. Counter design with various widths for image sensor
JP7322552B2 (ja) * 2019-07-01 2023-08-08 株式会社リコー 光電変換装置、ラインセンサ、画像読取装置、及び画像形成装置
CN111464764B (zh) * 2020-03-02 2022-10-14 上海集成电路研发中心有限公司 一种基于忆阻器的图像传感器及其进行卷积运算的方法
US11303838B2 (en) * 2020-05-07 2022-04-12 Shenzhen GOODIX Technology Co., Ltd. Using pixel readout reordering to reduce pattern noise in image sensor
JP7583562B2 (ja) * 2020-09-11 2024-11-14 キヤノン株式会社 光電変換装置及び撮像システム
CN115318682A (zh) * 2022-08-01 2022-11-11 泉州市汉威机械制造有限公司 一种次品分类剔除控制方式
CN118839603B (zh) * 2024-07-04 2025-02-28 中国船舶集团有限公司第七一九研究所 一种多次冲击下复合材料结构风险评估方法及装置
DE102024136878A1 (de) * 2024-12-10 2026-06-11 IP Ventures UG (haftungsbeschränkt) Verfahren zum betreiben eines cmos-bildsensors sowie cmos-bildsensor und dessen verwendung

Citations (4)

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JP2003169251A (ja) 2001-09-20 2003-06-13 Sony Corp 固体撮像装置及びその制御方法
JP2014209103A (ja) 2013-03-20 2014-11-06 コグネクス コーポレイション マシーンビジョン3dラインスキャンイメージ取得及び処理
JP2016541191A (ja) 2013-12-06 2016-12-28 レイセオン カンパニー 高レートでの関心領域処理及びイベント駆動型フォレンジック・ルックバック機能を備える電気光学(eo)/赤外線(ir)凝視型焦点面
JP2017533640A (ja) 2014-09-30 2017-11-09 クアルコム,インコーポレイテッド 画像内の低電力物体検出のためのハードウェアにおけるスキャニングウィンドウ

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US5909026A (en) * 1996-11-12 1999-06-01 California Institute Of Technology Integrated sensor with frame memory and programmable resolution for light adaptive imaging
GB2424781B (en) * 2005-03-30 2007-11-28 Micron Technology Inc High density row ram for column parallel CMOS image sensors
KR102009165B1 (ko) * 2013-01-24 2019-10-21 삼성전자 주식회사 이미지 센서, 멀티 칩 패키지, 및 전자 장치
FR3010603A1 (fr) * 2013-09-10 2015-03-13 Commissariat Energie Atomique Dispositif d'acquisition compressive d'une image
US9489750B2 (en) * 2014-06-26 2016-11-08 Qualcomm Incorporated Exposure metering based on background pixels
US9838635B2 (en) * 2014-09-30 2017-12-05 Qualcomm Incorporated Feature computation in a sensor element array
US9635325B2 (en) * 2015-05-29 2017-04-25 Semiconductor Components Industries, Llc Systems and methods for detecting ultraviolet light using image sensors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003169251A (ja) 2001-09-20 2003-06-13 Sony Corp 固体撮像装置及びその制御方法
JP2014209103A (ja) 2013-03-20 2014-11-06 コグネクス コーポレイション マシーンビジョン3dラインスキャンイメージ取得及び処理
JP2016541191A (ja) 2013-12-06 2016-12-28 レイセオン カンパニー 高レートでの関心領域処理及びイベント駆動型フォレンジック・ルックバック機能を備える電気光学(eo)/赤外線(ir)凝視型焦点面
JP2017533640A (ja) 2014-09-30 2017-11-09 クアルコム,インコーポレイテッド 画像内の低電力物体検出のためのハードウェアにおけるスキャニングウィンドウ

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Publication number Publication date
JP2020507957A (ja) 2020-03-12
KR20190107111A (ko) 2019-09-18
EP4283983A2 (de) 2023-11-29
EP4283983A3 (de) 2024-02-21
KR102310054B1 (ko) 2021-10-08
CN110431839A (zh) 2019-11-08
WO2018134317A1 (de) 2018-07-26
CN110431839B (zh) 2022-07-05
US20190342513A1 (en) 2019-11-07
EP3571836B1 (de) 2023-09-27
EP3571836A1 (de) 2019-11-27
US11115613B2 (en) 2021-09-07

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