JP7101096B2 - プラズマ処理方法及びプラズマ処理装置 - Google Patents
プラズマ処理方法及びプラズマ処理装置 Download PDFInfo
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- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
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- 230000001276 controlling effect Effects 0.000 description 2
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Description
Claims (8)
- 第1の周波数を有する第1の高周波電力と前記第1の周波数よりも高い第2の周波数を有する第2の高周波電力とを用いてプラズマ処理チャンバにおいて基板支持台上に配置された基板を処理するプラズマ処理方法であり、前記基板支持台は下部電極を含み、該プラズマ処理方法は、
(a)第1の期間において第1のプラズマ処理を実行する工程であり、前記第1のプラズマ処理は、前記第1の高周波電力を供給することなく前記第2の高周波電力をパルス状に供給することを含む、該工程と、
(b)前記第1の期間とは異なる第2の期間において第2のプラズマ処理を実行する工程であり、前記第2の期間は複数の周期を含み、該複数の周期の各々は第1の電圧出力期間及び該第1の電圧出力期間とは異なる第2の電圧出力期間を含み、前記第2のプラズマ処理は、前記複数の周期の各々において前記第1の高周波電力を前記下部電極に供給すること、前記第1の電圧出力期間において前記第2の高周波電力を供給すること、及び、前記第2の電圧出力期間において前記第2の高周波電力を停止すること、を含む、該工程と、
(c)前記(a)と前記(b)とを繰り返す工程と、
を含み、
前記第2の高周波電力は、前記第2の期間においてパルス状に供給され、前記第2の高周波電力は、前記第1の期間内と前記第2の期間内で同じ周期でパルス状に供給される、
プラズマ処理方法。 - 前記第1の高周波電力は、前記第1の電圧出力期間において負の電位を有する、請求項1に記載のプラズマ処理方法。
- 前記第1の高周波電力は、前記第1の電圧出力期間において正の電位を有する、請求項1に記載のプラズマ処理方法。
- (d)前記(a)及び(b)の後に、前記第1の高周波電力及び前記第2の高周波電力を停止し、前記チャンバを排気する工程を更に含み、
前記(c)は、前記(a)、前記(b)、及び前記(d)を繰り返すことを含む、
請求項1に記載のプラズマ処理方法。 - 前記第1のプラズマ処理と前記第2のプラズマ処理は同一の処理ガスを用いて行われる、請求項1に記載のプラズマ処理方法。
- 第1の周波数を有する第1の高周波電力と前記第1の周波数よりも高い第2の周波数を有する第2の高周波電力とを用いてプラズマ処理チャンバにおいて基板支持台上に配置された基板を処理するプラズマ処理方法であり、前記基板支持台は下部電極を含み、該プラズマ処理方法は、
(a)第1の期間において第1のプラズマ処理を実行する工程であり、前記第1のプラズマ処理は、前記第1の高周波電力を供給することなく前記第2の高周波電力を連続的に又はパルス状に供給することを含む、該工程と、
(b)前記第1の期間とは異なる第2の期間において第2のプラズマ処理を実行する工程であり、前記第2の期間は複数の周期を含み、該複数の周期の各々は第1の電圧出力期間及び該第1の電圧出力期間とは異なる第2の電圧出力期間を含み、前記第2のプラズマ処理は、前記複数の周期の各々において前記第1の高周波電力を前記下部電極に供給すること、前記第1の電圧出力期間において前記第2の高周波電力を供給すること、及び、前記第2の電圧出力期間において前記第2の高周波電力を停止すること、を含む、該工程と、
(c)前記(a)と前記(b)とを繰り返す工程と、
を含み、
前記第1のプラズマ処理と前記第2のプラズマ処理は同一の処理ガスを用いて行われる、プラズマ処理方法。 - プラズマ処理チャンバと、
下部電極を含み、前記チャンバ内に設けられた基板支持台と、
第1の周波数を有する第1の高周波電力を前記下部電極に供給するように構成された第1の高周波電源部と、
前記プラズマ処理チャンバにおいてプラズマを生成するために前記第1の周波数よりも高い第2の周波数を有する第2の高周波電力を供給するように構成された第2の高周波電源部と、
制御部と、
を備え、
前記制御部は、
(a)第1の期間において第1のプラズマ処理を実行し、
(b)前記第1の期間とは異なる第2の期間において第2のプラズマ処理を実行し、
(c)前記(a)と前記(b)とを繰り返す
ように、前記第1の高周波電源部及び前記第2の高周波電源部を制御するように構成され、
前記第1のプラズマ処理は、前記第1の高周波電力を供給することなく前記第2の高周波電力をパルス状に供給することを含み、
前記第2の期間は、複数の周期を含み、該複数の周期の各々は、第1の電圧出力期間及び前記第1の電圧出力期間とは異なる第2の電圧出力期間を含み、
前記第2のプラズマ処理は、前記複数の周期の各々において前記第1の高周波電力を前記下部電極に供給すること、前記第1の電圧出力期間において前記第2の高周波電力を供給すること、及び、前記第2の電圧出力期間において前記第2の高周波電力を停止すること、を含み、
前記第2の高周波電力は、前記第2の期間においてパルス状に供給され、前記第2の高周波電力は、前記第1の期間内と前記第2の期間内で同じ周期でパルス状に供給される、
プラズマ処理装置。 - プラズマ処理チャンバと、
下部電極を含み、前記チャンバ内に設けられた基板支持台と、
第1の周波数を有する第1の高周波電力を前記下部電極に供給するように構成された第1の高周波電源部と、
前記プラズマ処理チャンバにおいてプラズマを生成するために前記第1の周波数よりも高い第2の周波数を有する第2の高周波電力を供給するように構成された第2の高周波電源部と、
制御部と、
を備え、
前記制御部は、
(a)第1の期間において第1のプラズマ処理を実行し、
(b)前記第1の期間とは異なる第2の期間において第2のプラズマ処理を実行し、
(c)前記(a)と前記(b)とを繰り返す
ように、前記第1の高周波電源部及び前記第2の高周波電源部を制御するように構成され、
前記第1のプラズマ処理は、前記第1の高周波電力を供給することなく前記第2の高周波電力を連続的又はパルス状に供給することを含み、
前記第2の期間は、複数の周期を含み、該複数の周期の各々は、第1の電圧出力期間及び前記第1の電圧出力期間とは異なる第2の電圧出力期間を含み、
前記第2のプラズマ処理は、前記複数の周期の各々において前記第1の高周波電力を前記下部電極に供給すること、前記第1の電圧出力期間において前記第2の高周波電力を供給すること、及び、前記第2の電圧出力期間において前記第2の高周波電力を停止すること、を含み、
前記第1のプラズマ処理と前記第2のプラズマ処理は同一の処理ガスを用いて行われる、
プラズマ処理装置。
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