JP7094689B2 - 電気絶縁システムおよび電気機械分野用絶縁部品 - Google Patents
電気絶縁システムおよび電気機械分野用絶縁部品 Download PDFInfo
- Publication number
- JP7094689B2 JP7094689B2 JP2017214267A JP2017214267A JP7094689B2 JP 7094689 B2 JP7094689 B2 JP 7094689B2 JP 2017214267 A JP2017214267 A JP 2017214267A JP 2017214267 A JP2017214267 A JP 2017214267A JP 7094689 B2 JP7094689 B2 JP 7094689B2
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- JP
- Japan
- Prior art keywords
- weight
- electrically insulating
- binder resin
- curable binder
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
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- C08J2481/06—Polysulfones; Polyethersulfones
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Description
[実施例]
材料:エポキシノボラック樹脂(DEN439)はDow Chemicalsから購入し、ビスフェノールAホルムアルデヒドノボラックはHexionから購入し、アルミニウムアセチルアセトネートはSigma Aldrichから購入し、メチルエチルケトン(MEK)溶媒およびビスフェノールA系エポキシ樹脂(Epon826)はShell Chemicals Coから購入した。強化剤ポリエーテルスルホン10200(VW(商標)10200)は、Virantage(登録商標)から購入し、強化剤アクリレートコアシェルゴムEXL2300G(パラロイド(商標)EXL2300G)、メチルメタクリレートブタジエンスチレンコアシェルゴム(パラロイド(商標)TMS-2670)およびポリオール誘導体(Fortegra(商標)100)は、Dow Chemicalsから購入し、強化剤シリコーンコアシェルゴム(Albidur(登録商標)EP2240)およびエポキシシリコーンコポリマー(Albiflex(登録商標))はエボニック(Evonik)から購入し、強化剤ポリメチルメタクリレート-ポリブチルアクリレートコポリマー(M51)はNanostrength(登録商標)から購入した。
エポキシ樹脂混合物と強化剤とを組み合わせることによって、硬化性バインダー樹脂組成物の異なるサンプルを作製した。エポキシ樹脂混合物は、約54.2重量%のDEN439、約23.3重量%のEpon826、約8.6重量%のビスフェノールAホルムアルデヒドノボラック、および約8.8重量%のEPON826を、フラスコ内で2.4%アルミニウムアセチルアセトネートおよび20%MEK(溶媒)に混合することによって作製した。アルミニウムアセチルアセトネート触媒サンプルは、アルミニウムアセチルアセトネートをEpon826の一部に添加することによって調製し、アルミニウムアセチルアセトネートの濃度は、Epon826/アルミニウムアセチルアセトネート混合物の2.4%であった。アルミニウムアセチルアセトネートの最終濃度は、アルミニウムアセチルアセトネートを含むEPON 826の全濃度が硬化性バインダー樹脂組成物の8.8重量%である場合、硬化性バインダー樹脂組成物の0.2重量%であった。このエポキシ樹脂混合物に約5重量%の強化剤を添加し、約90℃で加熱撹拌した。ロータリーエバポレーターを用いて真空下で溶媒を除去した。硬化性バインダー樹脂組成物を硬化用モールドに注入した。
様々な硬化剤を用いて、表1に列挙した異なる硬化性バインダー樹脂組成物サンプルを作製した。サンプルは、実施例1に記載したように調製し、硬化させた。強化剤AlbidurおよびAlbiflexの場合、最初にDEN439を90℃に加熱し、次いでフラスコに注ぎ、硬化性バインダー樹脂組成物の残りの成分(強化剤を除く)を添加した。140gのMEK溶媒を混合物に加え、続いて90℃で1時間混合した。混合物を実施例1に記載したように硬化させた。表1に列挙した各サンプル中の異なる成分の濃度は、重量%(wt%)で表される。各サンプルにおいて、強化剤の濃度は、サンプル3を除いて5重量%であり、強化剤(Albidur2240)の濃度は12重量%であった。強化剤を除いた対照サンプルは、強化剤以外はサンプル1と同じ成分を用いて同様の方法(実施例1)で調製した。
電気絶縁性マイカテープは、電気絶縁性マイカ紙と電気絶縁性マイカ紙の第1の表面に配置された繊維ガラスとの複合構造に、硬化性バインダー樹脂組成物を適用することによって形成した。硬化性バインダー樹脂組成物の適用は、電気絶縁性マイカテープのプリプレグ形態を形成する。電気絶縁性マイカテープのプリプレグ形態は可撓性で、ステータバーの導体のグループを巻くのに適しており、バー試験用のサンプルを提供する。アルミニウムバーの導体のグループに、プリプレグ電気絶縁性マイカテープを合計10~14層で巻き、電気絶縁性マイカテープはハーフラップで適用した。次に、10~14層の電気絶縁性マイカテープを含むアルミニウムバーをオートクレーブ内で熱硬化させて、電気絶縁ステータバーを作製した。硬化は、電気絶縁性マイカテープで巻いた導体を、真空サイクルの間約8時間かけて約0.14℃/分~約0.24℃/分の速度で約80℃~140℃に過熱することによって達成した。次に約8時間かけて温度を約165℃まで急速に上昇させて硬化させる。バー試験では、硬化性バインダー樹脂の異なる組成を用いて作製されたステータバーのサンプルをその物理的特性について試験した。
曲げ歪み試験は、ASTM規格D790に基づいていた。表1の硬化性バインダー樹脂サンプルの曲げ試験のために、サンプルを長方形のキャビティを有する長方形のアルミニウム型にキャストし、オーブン内で熱硬化させた。サンプルを硬化させた後、サンプルをASTM D790規格に従って曲げ試験のための最終寸法に研磨した。得られた硬化した硬化性バインダー樹脂組成物の各々について、図4に示すように、曲げ歪み破壊を測定した。表1に記載したサンプルC(対照)の1、2、5、6および7を使用して、硬化性バインダー樹脂組成物の曲げ歪み破壊を測定した。強化剤10200PESU(サンプル1)およびTMS2670(サンプル6)は、それぞれ約4.2%および3.8%の曲げ歪み破壊についてより高い値を示した。
サンプルを長方形のバー形状ではなく円形のディスク形状にキャストしたことを除いて、硬化性バインダー樹脂サンプルは上記のように準備した。より良好な電極接触のために、金電極を試験サンプル上にスパッタリングした。試験は60Hzの誘電分光計を用いて行った。図5は、20℃および155℃で試験した硬化性バインダー樹脂組成物の異なるサンプルについてのDF%を示す。表1に記載したサンプルCの1~2および5~7をDF分析した。サンプル2およびサンプル7は、閾値より高いDFを有する。強化剤M51(サンプル7)および強化剤EXL2300G(サンプル2)を含む硬化性バインダー樹脂組成物は、DF%の高値を示し、これらは本絶縁システムには適していないと考えられた。
BDSを決定するためのサンプル準備は、実施例4の方法と同一であった。5kvの試験電圧を1分間保持して、異なる硬化性バインダー樹脂サンプルの各工程に適用した。最終的な電気的破壊不良が起こるまで電圧を上昇させた。異なるサンプルをBDSについて試験したが、図6に示すように、サンプルの大部分が1500vpmの閾値を超えた。図6では、表1に記載したようにサンプルCの1~3および5~7を試験して、硬化性バインダー樹脂組成物のBDSを決定した。異なる濃度の様々な強化剤を含むサンプルを使用した。サンプル3は、BDSが閾値未満である。
表1の硬化性バインダー樹脂サンプルを長方形のキャビティを有する長方形のアルミニウム型にキャストし、実施例1に記載したようにオーブン内で熱硬化させた。硬化性バインダー樹脂サンプルを170℃で5時間インキュベートした。表2の2つのサンプル3および4は、それぞれ亀裂および亀裂形成の傾向を示した。
積層間試験は、ASTM試験規格D2344に基づいていた。試験サンプルは、実施例6に記載したように準備した。積層間試験用の各サンプルは、厚さ4mmの絶縁アルミニウムバーから切断し、最終寸法に研磨し、ASTM D2344規格に従って試験した。バーは3点曲げで載置した。この試験では、異なる層の間の界面結合強度を評価することによって絶縁バーの強度を決定した。異なるサンプルの結果を図10に示す。表3に記載したサンプルA、D、EおよびFを使用して、層間剪断強度を決定した。サンプルDは、サンプルA、サンプルEおよびサンプルFと比較してより高い層間剪断強度を示した。
12 電気絶縁性マイカ紙
14 第1の表面
16 第2の表面
18 繊維ガラス、繊維ガラスの裏打ちシート
22 追加の層
30 電気絶縁ステータバー
32 導電性(銅)ストランド
34 ストランド絶縁体
36 ストランドセパレータ
38 接地壁絶縁体
Claims (15)
- 電気絶縁システムであって、当該電気絶縁システムが、
(a)電気絶縁性マイカ紙(12)と、
(b)前記電気絶縁性マイカ紙(12)の第1の表面(14)に配置された繊維ガラス(18)と
を備えており、
前記電気絶縁性マイカ紙(12)及び前記繊維ガラス(18)が、硬化性バインダー樹脂組成物で含浸され、前記硬化性バインダー樹脂組成物が、
2.5のエポキシド官能価を有する21重量%~73重量%の固体又は半固体エポキシ樹脂と、
2のエポキシド官能価を有する0.8重量%~49重量%の液体エポキシ樹脂と、
4重量%~15重量%のビスフェノールA-ホルムアルデヒドノボラックと、
金属アセチルアセトネート触媒と、
ポリエーテルスルホン、メチルメタクリレートブタジエンスチレン及びこれらの組み合わせからなる群から選択される2.5重量%~15重量%の強化剤と
を含む、電気絶縁システム。 - 前記強化剤がポリエーテルスルホンであり、前記ポリエーテルスルホンの濃度が、前記硬化性バインダー樹脂組成物の5重量%~10重量%である、請求項1に記載の電気絶縁システム。
- 前記強化剤が前記メチルメタクリレートブタジエンスチレンであり、前記メチルメタクリレートブタジエンスチレンの濃度が前記硬化性バインダー樹脂組成物の10重量%~15重量%である、請求項1に記載の電気絶縁システム。
- 前記固体又は半固体エポキシ樹脂がエポキシノボラック樹脂であり、前記エポキシノボラック樹脂の濃度が前記硬化性バインダー樹脂組成物の53重量%~61重量%である、請求項1乃至請求項3のいずれか1項に記載の電気絶縁システム。
- 前記液体エポキシ樹脂がビスフェノールA系エポキシ樹脂であり、前記ビスフェノールA系エポキシ樹脂の濃度が、前記硬化性バインダー樹脂組成物の23重量%~26重量%である、請求項4に記載の電気絶縁システム。
- 前記金属アセチルアセトネート触媒がアルミニウムアセチルアセトネートであり、前記アルミニウムアセチルアセトネートの濃度が前記硬化性バインダー樹脂組成物の0.02重量%である、請求項5に記載の電気絶縁システム。
- 前記電気絶縁性マイカ紙(12)の第2の表面(16)に配置されたポリエチレンテレフタレート層をさらに備える、請求項1乃至請求項6のいずれか1項に記載の電気絶縁システム。
- ステータバー(30)であって、当該ステータバー(30)が、
グループで配設された複数の導体(32)と、
前記複数の導体(32)のグループを囲む接地壁絶縁体(38)と
を備えており、前記接地壁絶縁体(38)が、電気絶縁性マイカテープ(10)の1つ以上の層を備えており、前記電気絶縁性マイカテープ(10)が、
(a)電気絶縁性マイカ紙(12)と、
(b)前記電気絶縁性マイカ紙(12)の第1の表面(14)に配置された繊維ガラス(18)と
を備えており、
前記電気絶縁性マイカ紙(12)が、硬化性バインダー樹脂組成物の硬化形態を介して前記繊維ガラス(18)に結合され、前記硬化性バインダー樹脂組成物が、
2.5のエポキシド官能価を有する21重量%~73重量%の固体又は半固体エポキシ樹脂と、
2のエポキシド官能価を有する0.8重量%~49重量%の液体エポキシ樹脂と、
4重量%~15重量%のビスフェノールA-ホルムアルデヒドノボラックと、
金属アセチルアセトネート触媒と、
ポリエーテルスルホン、メチルメタクリレートブタジエンスチレン及びこれらの組み合わせからなる群から選択される2.5重量%~15重量%の強化剤と
を含む、ステータバー(30)。 - 前記強化剤がポリエーテルスルホンであって、前記ポリエーテルスルホンの濃度が、前記硬化性バインダー樹脂組成物の5重量%~10重量%の範囲であるか、或いは前記強化剤がメチルメタクリレートブタジエンスチレンであって、前記メチルメタクリレートブタジエンスチレンの濃度が前記硬化性バインダー樹脂組成物の11重量%~15重量%である、請求項8に記載のステータバー(30)。
- 前記固体又は半固体エポキシ樹脂がエポキシノボラック樹脂であり、前記エポキシノボラック樹脂の濃度が前記硬化性バインダー樹脂組成物の53重量%~61重量%である、請求項8又は請求項9に記載のステータバー(30)。
- 前記液体エポキシ樹脂がビスフェノールA系エポキシ樹脂であり、前記ビスフェノールA系エポキシ樹脂の濃度が前記硬化性バインダー樹脂組成物の23重量%~26重量%である、請求項10に記載のステータバー(30)。
- 前記接地壁絶縁体(38)が、0.4%~0.9%の範囲の曲げ歪み破壊を有する、請求項8乃至請求項11のいずれか1項に記載のステータバー(30)。
- 前記ステータバー(30)が、155℃で3%~6%の範囲の熱散逸係数を有する、請求項8乃至請求項12のいずれか1項に記載のステータバー(30)。
- 前記ステータバー(30)が、500VPM~2000VPMの範囲の電気的破壊強度を有する、請求項8乃至請求項13のいずれか1項に記載のステータバー(30)。
- 前記接地壁絶縁体(38)が、12~20層の電気絶縁性マイカテープ(10)を備える、請求項8乃至請求項14のいずれか1項に記載のステータバー(30)。
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CN109109342B (zh) * | 2018-08-16 | 2021-06-08 | 王新民 | 一种电绝缘层压制品的制造方法 |
CN111627591B (zh) * | 2020-05-18 | 2021-12-07 | 浙江博菲电气股份有限公司 | 制取高粘结性少胶云母带的方法 |
CN111584123B (zh) * | 2020-05-18 | 2022-02-08 | 浙江博菲电气股份有限公司 | 少胶云母带及其制取方法 |
DE102021201666A1 (de) * | 2021-02-22 | 2022-08-25 | Siemens Aktiengesellschaft | Nutisolationssystem für eine elektrische rotierende Maschine, Verfahren zur Herstellung eines Nutisolationssystems |
CN114496349B (zh) * | 2022-02-09 | 2023-09-26 | 浙江荣泰电工器材股份有限公司 | 一种超长耐高温云母带及其制备方法 |
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JP5166495B2 (ja) | 2010-08-11 | 2013-03-21 | 株式会社日立製作所 | ドライマイカテープ及びこれを用いた電気絶縁線輪 |
DE102011079489A1 (de) | 2011-07-20 | 2013-01-24 | Siemens Aktiengesellschaft | Verfahren zum Herstellen eines Bandes für ein elektrisches Isolationssystem |
DE102011083228A1 (de) | 2011-09-22 | 2013-03-28 | Siemens Aktiengesellschaft | Isoliersysteme mit verbesserter Teilentladungsbeständigkeit, Verfahren zur Herstellung dazu |
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CN105602202A (zh) * | 2015-12-30 | 2016-05-25 | 江苏恒神股份有限公司 | 一种树脂组合物及其预浸料和复合材料 |
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US10848027B2 (en) | 2020-11-24 |
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