JP7088640B2 - Semiconductor devices and their manufacturing methods - Google Patents

Description

The present invention relates to a semiconductor device and a method for manufacturing the same.

There are various semiconductor packaging methods in semiconductor devices. As a semiconductor packaging method, for example, a packaging method in which a semiconductor chip is covered with a sealing material (mold resin) to form an element encapsulant, and further, a rewiring layer electrically connected to the semiconductor chip is formed is used. be. Among the semiconductor packaging methods, in recent years, a semiconductor packaging method called Fan-Out has become the mainstream.

In a funout type semiconductor package, a chip encapsulant larger than the chip size of the semiconductor chip is formed by covering the semiconductor chip with a sealing material. Further, a rewiring layer extending to the area of the semiconductor chip and the encapsulant is formed. The rewiring layer is formed with a thin film thickness. Further, since the rewiring layer can be formed up to the area of the sealing material, the number of external connection terminals can be increased.

For example, the following Patent Document 1 is known as a funout type semiconductor device.

Japanese Unexamined Patent Publication No. 2011-129767

A funout type semiconductor device is required to have high adhesion between the interlayer insulating film in the rewiring layer and the sealing material. However, in the conventional funout type semiconductor device, the adhesion between the interlayer insulating film in the rewiring layer and the sealing material is not sufficient.

The present invention has been made in view of such a point, and an object of the present invention is to provide a semiconductor device having excellent adhesion between the interlayer insulating film in the rewiring layer and the sealing material, and a method for manufacturing the same.

One aspect of the semiconductor device according to the present embodiment includes a semiconductor chip, a sealing material for covering the semiconductor chip, and a rewiring layer having a larger area than the semiconductor chip in a plan view, and the sealing material . Is characterized by containing a cured epoxy resin and having a 5% weight loss temperature of the interlayer insulating film of the rewiring layer of 300 ° C. or lower.

In one aspect of the semiconductor device of the present invention, it is preferable that the sealing material is in direct contact with the interlayer insulating film.

In one aspect of the semiconductor device of the present invention, the interlayer insulating film preferably contains at least one selected from polyimide, polybenzoxazole, and a polymer having a phenolic hydroxyl group.

In one aspect of the semiconductor device of the present invention, the interlayer insulating film preferably contains a polyimide containing the structure of the following general formula (1).

（一般式（１）中、Ｘ^１は４価の有機基であり、Ｙ^１は２価の有機基であり、ｍは１以上の整数である。）

(In the general formula (1), X ¹ is a tetravalent organic group, Y ¹ is a divalent organic group, and m is an integer of 1 or more.)

In one aspect of the semiconductor device of the present invention, X ¹ in the general formula (1) is a tetravalent organic group containing an aromatic ring, and Y ¹ in the general formula (1) is an aromatic ring. It is preferably a divalent organic group containing.

In one aspect of the semiconductor device of the present invention, it is preferable that X ¹ in the general formula (1) includes at least one structure represented by the following general formulas (2) to (4).

（一般式（４）中、Ｒ₉は酸素原子、硫黄原子、または２価の有機基である。）

(In the general formula (4), R ₉ is an oxygen atom, a sulfur atom, or a divalent organic group.)

In one aspect of the semiconductor device of the present invention, it is preferable that X ¹ in the general formula (1) includes a structure represented by the following general formula (5).

In one aspect of the semiconductor device of the present invention, it is preferable that Y1 in the general formula ( ¹ ) includes at least one structure represented by the following general formulas (6) to (8).

（Ｒ_１０、Ｒ_１１、Ｒ_１２及びＲ_１３は、水素原子、炭素数が１～５の１価の脂肪族基又は水酸基であり、同一であっても異なっていてもよい。）

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms, monovalent aliphatic groups or hydroxyl groups having 1 to 5 carbon atoms, and may be the same or different.)

（Ｒ_１４～Ｒ_２１は、水素原子、ハロゲン原子、炭素数が１～５の１価の有機基又は水酸基であり、互いに異なっていても、同一であってもよい。）

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, monovalent organic groups or hydroxyl groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

（Ｒ_２２は２価の基であり、Ｒ_２３～Ｒ_３０は、水素原子、ハロゲン原子、炭素数が１～５の１価の脂肪族基又は水酸基であり、同一であっても異なっていてもよい。）

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are a hydrogen atom, a halogen atom, a monovalent aliphatic group having 1 to 5 carbon atoms or a hydroxyl group, and they are the same but different. May be good.)

In one aspect of the semiconductor device of the present invention, it is preferable that Y1 in the general formula ( ¹ ) includes a structure represented by the following general formula (9).

In one aspect of the semiconductor device of the present invention, it is preferable that the interlayer insulating film contains polybenzoxazole containing the structure of the following general formula (10).

（一般式（１０）中、ＵとＶは、２価の有機基である。）

(In the general formula (10), U and V are divalent organic groups.)

In one aspect of the semiconductor device of the present invention, the U of the general formula (10) is preferably a divalent organic group having 1 to 30 carbon atoms.

In one aspect of the semiconductor device of the present invention, the U of the general formula (10) is preferably a chain alkylene group having 1 to 8 carbon atoms and having a part or all of hydrogen atoms substituted with fluorine atoms. ..

In one aspect of the semiconductor device of the present invention, V in the general formula (10) is preferably a divalent organic group containing an aromatic group.

In one aspect of the semiconductor device of the present invention, the V of the general formula (10) preferably contains at least one structure represented by the following general formulas (6) to (8).

（Ｒ_１０、Ｒ_１１、Ｒ_１２及びＲ_１３は、水素原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms and monovalent aliphatic groups having 1 to 5 carbon atoms, and may be the same or different.)

（Ｒ_１４～Ｒ_２１は、水素原子、ハロゲン原子、炭素数が１～５の１価の有機基であり、互いに異なっていても、同一であってもよい。）

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, and monovalent organic groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

（Ｒ_２２は２価の基であり、Ｒ_２３～Ｒ_３０は、水素原子、ハロゲン原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are hydrogen atoms, halogen atoms, and monovalent aliphatic groups having 1 to 5 carbon atoms, which may be the same or different. .)

In one aspect of the semiconductor device of the present invention, it is preferable that V of the general formula (10) includes a structure represented by the following general formula (9).

In one aspect of the semiconductor device of the present invention, V in the general formula (10) is preferably a divalent organic group having 1 to 40 carbon atoms.

In one aspect of the semiconductor device of the present invention, V in the general formula (10) is preferably a divalent chain aliphatic group having 1 to 20 carbon atoms.

In one aspect of the semiconductor device of the present invention, it is preferable that the polymer having a phenolic hydroxyl group contains a novolak type phenol resin.

In one aspect of the semiconductor device of the present invention, it is preferable that the polymer having a phenolic hydroxyl group contains a phenol resin having no unsaturated hydrocarbon group and a modified phenol resin having an unsaturated hydrocarbon group.

In one aspect of the semiconductor device of the present invention, the rewiring layer has a first interlayer insulating film layer, a second interlayer insulating film layer, and the first interlayer when the rewiring layer is viewed in cross section. It is preferable to include the insulating film layer and an intermediate layer provided between the first interlayer insulating film layer and the second interlayer insulating film layer, which is a layer different from the second interlayer insulating film layer.

In one aspect of the semiconductor device of the present invention, the first interlayer insulating film layer is in contact with the sealing material, and the 5% weight loss temperature of the first interlayer insulating film layer is 300 ° C. or lower. Is preferable.

In one aspect of the semiconductor device of the present invention, it is preferable that the second interlayer insulating film layer has a composition different from that of the first interlayer insulating film layer.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the second interlayer insulating film layer is preferably different from the 5% weight loss temperature of the first interlayer insulating film layer.

In one aspect of the semiconductor device of the present invention, it is preferable that the semiconductor device is a fan-out type wafer level chip size package type semiconductor device.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 280 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 260 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 240 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 220 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 200 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 80 ° C. or higher.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 100 ° C. or lower.

In one aspect of the semiconductor device of the present invention, the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is preferably 150 ° C. or lower.

In one aspect of the method for manufacturing a semiconductor device of the present invention, a step of covering a semiconductor chip with a sealing material and a step of forming a rewiring layer having a larger area than the semiconductor chip in a plan view and including an interlayer insulating film. The sealing material contains a cured epoxy resin, and the interlayer insulating film has a 5% weight loss temperature of 300 ° C. or lower.

In one aspect of the method for manufacturing a semiconductor device of the present invention, the interlayer insulating film is formed of a photosensitive resin composition capable of forming at least one compound of polyimide, polybenzoxazole, and a polymer having a phenolic hydroxyl group. It is preferable to include a film forming step.

In one aspect of the method for manufacturing a semiconductor device of the present invention, the interlayer insulating film forming step is the photosensitive resin composition adjusted with an additive so that the 5% weight loss temperature of the interlayer insulating film is 300 ° C. or lower. It is preferable to include a step of forming the interlayer insulating film with an object.

According to the present invention, it is possible to provide a semiconductor device having excellent adhesion between the interlayer insulating film in the rewiring layer and the sealing material, and a method for manufacturing the same.

It is sectional drawing of the semiconductor device of this embodiment. It is a plan view of the semiconductor device of this embodiment. This is an example of the manufacturing process of the semiconductor device of the present embodiment. It is a comparison diagram of the flip chip BGA and the fan-out type WLCSP.

Hereinafter, an embodiment of the semiconductor device of the present invention (hereinafter, abbreviated as “embodiment”) will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments, and can be variously modified and implemented within the scope of the gist thereof.

(Semiconductor device)
FIG. 1 is a schematic cross-sectional view of the semiconductor device of the present embodiment. As shown in FIG. 1, the semiconductor device (semiconductor IC) 1 includes a semiconductor chip 2, a sealing material (mold resin) 3 that covers the semiconductor chip 2, and a rewiring layer that is in close contact with the semiconductor chip 2 and the sealing material 3. 4 and.

As shown in FIG. 1, the encapsulant 3 covers the surface of the semiconductor chip 2 and is formed in an area larger than the region of the semiconductor chip 2 in a plan view (arrow view A).

The rewiring layer 4 includes a plurality of wirings 5 electrically connected to a plurality of terminals 2a provided on the semiconductor chip 2 and an interlayer insulating film 6 that fills the space between the wirings 5. The plurality of terminals 2a provided on the semiconductor chip 2 and the wiring 5 in the rewiring layer 4 are electrically connected. One end of the wiring 5 is connected to the terminal 2a, and the other end is connected to the external connection terminal 7. The wiring 5 between the terminal 2a and the external connection terminal 7 is covered with an interlayer insulating film 6 over the entire surface.

As shown in FIG. 1, the rewiring layer 4 is formed larger than the semiconductor chip 2 in a plan view (arrow view A). The semiconductor device 1 shown in FIG. 1 is a fan-out type wafer level chip size package (WLCSP) type semiconductor device. In the funout type semiconductor device, the interlayer insulating film 6 in the rewiring layer 4 is in close contact with not only the semiconductor chip 2 but also the encapsulant 3. The semiconductor chip 2 is made of a semiconductor such as silicon, and a circuit is formed therein.

(Rewiring layer)
The rewiring layer 4 is mainly composed of the wiring 5 and the interlayer insulating film 6 that covers the wiring 5. The interlayer insulating film 6 is preferably a member having high insulating properties from the viewpoint of preventing unintended conduction with the wiring 5.

Here, the "rewiring layer 4" in the present embodiment is a thin film layer having the wiring 5 and the interlayer insulating film 6 as described above, and does not include an interposer or a printed wiring board. FIG. 4 is a comparison diagram of a flip chip BGA and a fan-out type WLCSP. Since the semiconductor device (semiconductor IC) 1 (see FIG. 1) uses the rewiring layer 4, as shown in FIG. 4, it is thinner than the semiconductor device in which an interposer such as a flip chip BGA is used.

In the present embodiment, the film thickness of the rewiring layer 4 can be set to about 3 to 30 μm. The film thickness of the rewiring layer 4 may be 1 μm or more, 5 μm or more, or 10 μm or more. Further, the film thickness of the rewiring layer 4 may be 40 μm or less, 30 μm or less, or 20 μm or less.

When the semiconductor device 1 is viewed in a plan view (viewed by an arrow A), the result is as shown in FIG. 2 below. FIG. 2 is a schematic plan view of the semiconductor device of the present embodiment. The sealing material 3 is omitted.

The semiconductor device 1 (see FIG. 1) shown in FIG. 2 is configured such that the area S1 of the rewiring layer 4 is larger than the area S2 of the semiconductor chip 2. The area S1 of the rewiring layer 4 is not particularly limited, but the area S1 of the rewiring layer 4 is 1.05 times or more the area S2 of the semiconductor chip 2 from the viewpoint of increasing the number of external connection terminals. Is preferable, 1.1 times or more is preferable, 1.2 times or more is more preferable, and 1.3 times or more is particularly preferable. The upper limit is not particularly limited, but the area S1 of the rewiring layer 4 may be 50 times or less, 25 times or less, or 10 times or less the area S2 of the semiconductor chip 2. Well, it may be 5 times or less. In FIG. 2, the area of the portion of the rewiring layer 4 covered with the semiconductor chip 2 is also included in the area S1 of the rewiring layer 4.

Further, the outer shapes of the semiconductor chip 2 and the rewiring layer 4 may be the same or different. In FIG. 2, the outer shapes of the semiconductor chip 2 and the rewiring layer 4 are both rectangular similar figures, but the shape may be other than the rectangular shape.

The rewiring layer 4 may be one layer or two or more layers. The rewiring layer 4 includes a wiring 5 and an interlayer insulating film 6 that fills the space between the wirings 5, but the rewiring layer 4 includes a layer composed of only the interlayer insulating film 6 and a layer composed of only the wiring 5. May be included.

The wiring 5 is not particularly limited as long as it is a member having high conductivity, but copper is generally used.

(Encapsulant)
The material of the sealing material 3 is not particularly limited, but an epoxy resin is preferable from the viewpoint of heat resistance and adhesion to the interlayer insulating film.

As shown in FIG. 1, it is preferable that the sealing material 3 is in direct contact with the semiconductor chip 2 and the rewiring layer 4. Thereby, the sealing property from the surface of the semiconductor chip 2 to the surface of the rewiring layer 4 can be effectively improved.

The sealing material 3 may be a single layer or may have a structure in which a plurality of layers are laminated. When the sealing material 3 has a laminated structure, it may be a laminated structure of the same type of material or a laminated structure of different materials.

(Interlayer insulating film)
The present embodiment is characterized in that the 5% weight loss temperature of the interlayer insulating film 6 is 300 ° C. or lower. Hereinafter, the "5% weight loss temperature" is simply referred to as the "weight loss temperature". When the weight reduction temperature is 300 ° C. or lower, the adhesion between the interlayer insulating film 6 and the sealing material 3 during high-temperature treatment is excellent. The reason is not clear, but the present inventors speculate as follows.

In the manufacturing process of the funout type semiconductor device 1 (see FIG. 1), in order to form the rewiring layer 4, a photosensitive resin composition is placed on a chip encapsulant composed of a semiconductor chip 2 and an encapsulant 3. Is applied. Subsequently, the photosensitive resin composition is exposed to light containing i-rays. Then, by developing and curing the photosensitive resin composition, a portion of the photosensitive resin composition having a cured product and a portion without the cured product are selectively formed. The cured product of the photosensitive resin composition is the interlayer insulating film 6. Further, the wiring 5 is formed in the portion of the photosensitive resin composition where there is no cured product. Usually, the rewiring layer 4 is often multi-layered. That is, the photosensitive resin composition is further applied, exposed, developed, and cured on the interlayer insulating film 6 and the wiring 5.

By the way, the step of forming the interlayer insulating film 6 and the wiring 5 may include a reflow step depending on the manufacturing method, and when heat is applied to the sealing material 3 for a long time, gas is generated from the sealing material 3. there is a possibility. When the density of the interlayer insulating film 6 is high, that is, when the weight reduction temperature of the interlayer insulating film 6 is high, the gas generated from the sealing material 3 is difficult to escape to the outside. Therefore, gas accumulates at the interface between the sealing material 3 and the interlayer insulating film 6, and the sealing material 3 and the interlayer insulating film 6 are easily peeled off. In particular, epoxy resin tends to generate gas. Therefore, when an epoxy resin is used for the sealing material 3, it is considered that the deterioration of the adhesion between the interlayer insulating film 6 and the sealing material 3 is promoted.

The interlayer insulating film 6 of the present embodiment has a low weight reduction temperature of 300 ° C. or lower. Therefore, in the present embodiment, even under the condition that the gas is easily released from the interlayer insulating film and the gas is easily generated from the sealing material 3, the interlayer insulating film 6 and the sealing material 3 are less likely to be peeled off, and the high temperature treatment is performed. It is presumed that the adhesion of time is high.

The weight reduction temperature of the interlayer insulating film 6 is preferably 300 ° C. or lower, preferably 295 ° C. or lower, preferably 290 ° C. or lower, and 285 ° C. from the viewpoint of adhesion between the interlayer insulating film 6 and the sealing material 3 after high-temperature treatment. The following is preferable, 280 ° C. or lower is preferable, 275 ° C. or lower is preferable, 270 ° C. or lower is preferable, 260 ° C. or lower is preferable, 250 ° C. or lower is preferable, 240 ° C. or lower is preferable, and 230 ° C. or lower is preferable.

The lower limit of the weight reduction temperature of the interlayer insulating film 6 is not particularly limited, but may be 80 ° C. or higher, 100 ° C. or higher, 120 ° C. or higher, 150 ° C. or higher. It may be.

Further, the interlayer insulating film 6 in the rewiring layer 4 may be a multilayer. That is, the rewiring layer 4 has a first interlayer insulating film layer, a second interlayer insulating film layer, a first interlayer insulating film layer, and the second interlayer when the rewiring layer 4 is viewed in cross section. A layer different from the insulating film layer may include an intermediate layer provided between the first interlayer insulating film layer and the second interlayer insulating film layer. The intermediate layer is, for example, wiring 5.

The first interlayer insulating film layer and the second interlayer insulating film layer may have the same composition or different compositions. The first interlayer insulating film layer and the second interlayer insulating film layer may have the same weight loss temperature or different weight loss temperatures. The first interlayer insulating film layer and the second interlayer insulating film layer may have the same film thickness or different film thicknesses. When the first interlayer insulating film layer and the second interlayer insulating film layer have different compositions, different weight reduction temperatures, and different film thicknesses, it is possible to give different properties to each interlayer insulating film layer, which is preferable.

When the interlayer insulating film 6 is multi-layered, the weight reduction temperature of at least one of the plurality of layers may be 300 ° C. or lower. However, since the space between the sealing material 3 and the interlayer insulating film layer is easily peeled off by the gas, the weight reduction temperature of the interlayer insulating film 6 of the interlayer insulating film layer in contact with the sealing material 3 is preferably 300 ° C. or lower. .. When the weight reduction temperature of the interlayer insulating film 6 of the interlayer insulating film layer in contact with the sealing material 3 is 300 ° C. or lower, the gas generated in the sealing material 3 can be efficiently removed. The preferable weight reduction temperature of each interlayer insulating film layer is the same as the preferable weight reduction temperature of the interlayer insulating film 6.

(Composition of interlayer insulating film)
The composition of the interlayer insulating film 6 is not particularly limited, but is preferably a film containing at least one compound selected from, for example, polyimide, polybenzoxazole, or a polymer having a phenolic hydroxyl group.

(Resin composition forming an interlayer insulating film)
The resin composition used for forming the interlayer insulating film 6 is not particularly limited as long as it is a photosensitive resin composition, but is selected from a polyimide precursor, a polybenzoxazole precursor, or a polymer having a phenolic hydroxyl group. A photosensitive resin composition containing at least one compound is preferable. The resin composition used for forming the interlayer insulating film 6 may be in the form of a liquid or a film. Further, the resin composition used for forming the interlayer insulating film 6 may be a negative type photosensitive resin composition or a positive type photosensitive resin composition.

In the present embodiment, the pattern after the photosensitive resin composition is exposed and developed is referred to as a relief pattern, and the pattern obtained by heating and curing the relief pattern is referred to as a cured relief pattern. This cured relief pattern becomes the interlayer insulating film 6.

<Polyimide precursor composition>
(A) Photosensitive Resin Examples of the photosensitive resin used in the polyimide precursor composition include polyamides and polyamic acid esters. For example, as the polyamic acid ester, a polyamic acid ester containing a repeating unit represented by the following general formula (11) can be used.

Ｒ^１及びＲ^２は、それぞれ独立に、水素原子、炭素数１～３０の飽和脂肪族基、芳香族基、炭素炭素不飽和二重結合を有する一価の有機基、又は、炭素炭素不飽和二重結合を有する一価のイオンである。Ｘ^１は４価の有機基であり、Ｙ^１は２価の有機基であり、ｍは１以上の整数である。ｍは２以上が好ましく、５以上がより好ましい。

R ¹ and R ² are independently hydrogen atoms, saturated aliphatic groups having 1 to 30 carbon atoms, aromatic groups, monovalent organic groups having carbon-carbon unsaturated double bonds, or carbon-carbon unsaturated groups. It is a monovalent ion having a double bond. X ¹ is a tetravalent organic group, Y ¹ is a divalent organic group, and m is an integer of 1 or more. m is preferably 2 or more, and more preferably 5 or more.

When R ¹ and R ² of the above general formula (11) exist as monovalent cations, O is negatively charged (exists as −O ⁻ ). Further, X ¹ and Y ¹ may contain a hydroxyl group.

R ¹ and R ² in the general formula (11) are more preferably a monovalent organic group represented by the following general formula (12) or a monovalent organic represented by the following general formula (13). It is a structure having an ammonium ion at the end of the group.

（一般式（１２）中、Ｒ₃、Ｒ₄及びＲ₅は、それぞれ独立に、水素原子又は炭素数１～５の有機基であり、そしてｍ₁は、１～２０の整数である。）

(In the general formula (12), R ₃ , R ₄ and R ₅ are independently hydrogen atoms or organic groups having 1 to 5 carbon atoms, and m ₁ is an integer of 1 to 20.)

（一般式（１３）中、Ｒ₆、Ｒ₇及びＲ₈は、それぞれ独立に、水素原子又は炭素数１～５の有機基であり、そしてｍ₂は、１～２０の整数である。）

(In general formula (13), R ₆ , R ₇ and R ₈ are independently hydrogen atoms or organic groups having 1 to 5 carbon atoms, and m ₂ is an integer of 1 to 20.)

A plurality of polyamic acid esters represented by the general formula (11) may be mixed. Further, a polyamic acid ester obtained by copolymerizing the polyamic acid esters represented by the general formula (11) may be used.

Although X ¹ is not particularly limited, it is preferable that X ¹ is a tetravalent organic group containing an aromatic group from the viewpoint of adhesion between the interlayer insulating film 6 and the sealing material 3. Specifically, X ¹ is preferably a tetravalent organic group containing at least one structure represented by the following general formulas (2) to (4).

（一般式（４）中、Ｒ₉は酸素原子、硫黄原子、２価の有機基のいずれかである。）

(In the general formula (4), R ₉ is either an oxygen atom, a sulfur atom, or a divalent organic group.)

R ₉ in the general formula (4) is, for example, a divalent organic group having 1 to 40 carbon atoms or a halogen atom. R ₉ may contain a hydroxyl group.

From the viewpoint of the adhesion between the interlayer insulating film 6 and the sealing material 3, X ¹ is particularly preferably a tetravalent organic group containing a structure represented by the following general formula (5).

Although Y ¹ is not particularly limited, it is preferable that Y ¹ is a divalent organic group containing an aromatic group from the viewpoint of adhesion between the interlayer insulating film 6 and the sealing material 3. Specifically, Y ¹ is preferably a divalent organic group containing at least one structure represented by the following general formulas (6) to (8).

（Ｒ_１０、Ｒ_１１、Ｒ_１２及びＲ_１３は、水素原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms and monovalent aliphatic groups having 1 to 5 carbon atoms, and may be the same or different.)

（Ｒ_１４～Ｒ_２１は、水素原子、ハロゲン原子、炭素数が１～５の１価の有機基であり、互いに異なっていても、同一であってもよい。）

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, and monovalent organic groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

（Ｒ_２２は２価の基であり、Ｒ_２３～Ｒ_３０は、水素原子、ハロゲン原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are hydrogen atoms, halogen atoms, and monovalent aliphatic groups having 1 to 5 carbon atoms, which may be the same or different. .)

R ₂₂ in the general formula (8) is, for example, a divalent organic group having 1 to 40 carbon atoms or a halogen atom.

From the viewpoint of the adhesion between the interlayer insulating film 6 and the sealing material 3, Y1 is particularly preferably ^a divalent organic group containing a structure represented by the following general formula (9).

In the above polyamic acid ester, X ¹ in the repeating unit is derived from the tetracarboxylic acid dianhydride used as a raw material, and Y ¹ is derived from the diamine used as a raw material.

Examples of the tetracarboxylic acid dianhydride used as a raw material include pyromellitic anhydride, diphenyl ether-3,3', 4,4'-tetracarboxylic acid dianhydride, benzophenone-3,3', 4,4'-. Tetracarboxylic acid dianhydride, biphenyl-3,3', 4,4'-tetracarboxylic acid dianhydride, diphenylsulfone-3,3', 4,4'-tetracarboxylic acid dianhydride, diphenylmethane-3, 3', 4,4'-tetracarboxylic acid dianhydride, 2,2-bis (3,4-anhydride) propane, 2,2-bis (3,4-anhydride) -1,1,1 1,3,3,3-hexafluoropropane and the like can be mentioned, but the present invention is not limited thereto. Further, these may be used alone or in combination of two or more.

Examples of the diamine used as a raw material include p-phenylenediamine, m-phenylenediamine, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl. Sulfur, 3,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4 '-Diaminobiphenyl, 3,4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 4,4'- Diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-Aminophenoxy) benzene, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, 4,4-bis (4-aminophenoxy) biphenyl, 4 , 4-bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether, 1,4-bis (4-aminophenyl) ) Benzene, 1,3-bis (4-aminophenyl) benzene, 9,10-bis (4-aminophenyl) anthracene, 2,2-bis (4-aminophenyl) propane, 2,2-bis (4-aminophenyl) Aminophenyl) Hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl) propane, 2,2-bis [4- (4-aminophenoxy) phenyl) hexafluoropropane, 1,4-bis Examples thereof include (3-aminopropyldimethylsilyl) benzene, ortho-trizine sulfone, 9,9-bis (4-aminophenyl) fluorene and the like. Further, a part of hydrogen atoms on these benzene rings may be substituted. Further, these may be used alone or in combination of two or more.

In the synthesis of the polyamic acid ester (A), usually, a method of subjecting the tetracarboxylic acid diester obtained by performing the esterification reaction of the tetracarboxylic acid dianhydride described later to the condensation reaction with the diamine as it is can be preferably used. ..

The alcohols used in the esterification reaction of the above tetracarboxylic acid dianhydride are alcohols having an olefinic double bond. Specific examples thereof include, but are not limited to, 2-hydroxyethyl methacrylate, 2-methacryloyloxyethyl alcohol, glycerin diacrylate, and glycerin dimethacrylate. These alcohols can be used alone or in combination of two or more.

As a specific method for synthesizing the polyamic acid ester (A) used in the present embodiment, a conventionally known method can be adopted. As the synthesis method, for example, the method shown in International Publication No. 00/4439 can be mentioned. That is, the tetracarboxylic acid diester is once converted into a tetracarboxylic acid diester dilate, and the tetracarboxylic acid diester diate and diamine are subjected to a condensation reaction in the presence of a basic compound, and the polyamic acid ester (A) is subjected to a condensation reaction. Can be mentioned as a method of manufacturing. Further, a method for producing a polyamic acid ester (A) by subjecting a tetracarboxylic acid diester and a diamine to a condensation reaction in the presence of an organic dehydrating agent can be mentioned.

Examples of organic dehydrating agents include dicyclohexylcarbodiimide (DCC), diethylcarbodiimide, diisopropylcarbodiimide, ethylcyclohexylcarbodiimide, diphenylcarbodiimide, 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide, 1-cyclohexyl-3- (3). -Dimethylaminopropyl) Carbodiimide hydrochloride and the like.

The weight average molecular weight of the polyamic acid ester (A) used in the present embodiment is preferably 6000 to 150,000, more preferably 7,000 to 50,000, and even more preferably 7,000 to 20,000.

(B1) Photoinitiator When the resin composition used for forming the interlayer insulating film 6 is a negative type photosensitive resin, a photoinitiator is added. Examples of the photoinitiator include benzophenone derivatives such as benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4'-methyldiphenylketone, dibenzylketone, and fluorenone, 2,2'-diethoxyacetophenone, and 2 -Acetphenone derivatives such as hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenyl ketone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, and thioxanthone derivatives such as diethylthioxanthone, benzyl, benzyldimethylketal and benzyl- A benzyl derivative such as β-methoxyethyl acetal, a benzoin derivative such as benzoin methyl ether, 2,6-di (4'-diazidobenzal) -4-methylcyclohexanone, and 2,6'-di (4'-diazidobenzal) cyclohexanone and the like. Azides, 1-phenyl-1,2-butandion-2- (O-methoxycarbonyl) oxime, 1-phenylpropandion-2- (O-methoxycarbonyl) oxime, 1-phenylpropandion-2- (O) -Ethoxycarbonyl) oxime, 1-phenylpropanedione-2- (O-benzoyl) oxime, 1,3-diphenylpropanthrion-2- (O-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrion-2 -Oximes such as (O-benzoyl) oxime, N-arylglycines such as N-phenylglycine, peroxides such as benzoylperoxide, aromatic biimidazoles, titanosen and the like are used. Of these, the above-mentioned oximes are preferable in terms of light sensitivity.

The amount of these photoinitiators added is preferably 1 to 40 parts by mass, more preferably 2 to 20 parts by mass with respect to 100 parts by mass of the polyamic acid ester (A). By adding 1 part by mass or more of the photoinitiator to 100 parts by mass of the polyamic acid ester (A), the light sensitivity is excellent. Further, by adding 40 parts by mass or less, the thick film curability is excellent.

(B2) Photoacid generator When the resin composition used for forming the interlayer insulating film 6 is a positive photosensitive resin, a photoacid generator is added. By containing the photoacid generator, acid is generated in the ultraviolet exposed portion, and the solubility of the exposed portion in the alkaline aqueous solution is increased. Thereby, it can be used as a positive photosensitive resin composition.

Examples of the photoacid generator include quinonediazide compounds, sulfonium salts, phosphonium salts, diazonium salts, iodonium salts and the like. Among these, the quinone diazide compound is preferably used because it exhibits an excellent dissolution inhibitory effect and a highly sensitive positive photosensitive resin composition can be obtained. Further, two or more photoacid generators may be contained.

(C) Additive The weight reduction temperature of the interlayer insulating film 6 can be adjusted by the type and amount of the additive. By using an additive that easily volatilizes, the density of the interlayer insulating film can be lowered and the weight loss temperature can be lowered. As the additive for lowering the weight loss temperature, for example, polyethylene glycol, polypropylene glycol and the like can be used. The amount of the additive may be appropriately adjusted according to the target weight loss temperature. In addition, the weight reduction temperature of the interlayer insulating film 6 can be lowered by lowering the thermosetting temperature of the relief pattern.

(D) Solvent There is no particular limitation as long as each component is a solvent that can be dissolved or dispersed. For example, N-methyl-2-pyrrolidone, γ-butyrolactone, acetone, methyl ethyl ketone, dimethyl sulfoxide and the like can be mentioned. These solvents can be used in the range of 30 to 1500 parts by mass with respect to 100 parts by mass of the (A) photosensitive resin, depending on the coating film thickness and viscosity.

(E) Others The polyimide precursor composition may contain a cross-linking agent. As the cross-linking agent, (A) a cross-linking agent capable of cross-linking the photosensitive resin or a cross-linking agent itself capable of forming a cross-linking network is used when the polyimide precursor composition is exposed and developed and then heat-cured. be able to. By using a cross-linking agent, the heat resistance and chemical resistance of the cured film (interlayer insulating film) can be further enhanced.

In addition, a sensitizer for improving the photosensitivity, an adhesive aid for improving the adhesiveness to the substrate, and the like may be contained.

(developing)
After exposing the polyimide precursor composition, the unnecessary portion is washed away with a developing solution. The developer to be used is not particularly limited, but in the case of a polyimide precursor composition developed with a solvent, N, N-dimethylformamide, dimethyl sulfoxide, N, N-dimethylacetamide, N-methyl-2. -A good solvent such as pyrrolidone, cyclopentanone, γ-butyrolactone and acetic acid esters, a mixed solvent of these good solvents and a poor solvent such as lower alcohol, water and aromatic hydrocarbons is used. After development, rinse with a poor solvent or the like if necessary.

In the case of a polyimide precursor composition developed with an alkaline aqueous solution, an aqueous solution of tetramethylammonium hydroxide, diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, An aqueous solution of an alkaline compound such as dimethylamine, dimethylaminoethyl acetate, dimethylaminoethanol, dimethylaminoethylmethacrylate, cyclohexylamine, ethylenediamine and hexamethylenediamine is preferable.

(Thermosetting)
After development, the polyimide precursor composition after exposure is heated to close the ring of the polyimide precursor to form a polyimide. This polyimide becomes a cured relief pattern, that is, an interlayer insulating film 6.

The heating temperature for thermosetting the polyimide precursor composition is not particularly limited, but the heating temperature is preferably a low temperature from the viewpoint of the influence on other members. The heating temperature is preferably 250 ° C. or lower, more preferably 230 ° C. or lower, more preferably 200 ° C. or lower, and particularly preferably 180 ° C. or lower.

<Polyimide>
The structure of the cured relief pattern formed from the polyimide precursor composition is the following general formula (1).

X 1, Y ¹ , and m in the general formula (1) are, like X ¹ , Y ¹ , and m in the general formula (11), X ¹ is a tetravalent organic group and Y ¹ is ^a divalent organic group. It is an organic group, and m is an integer of 1 or more. The preferred X ¹ , Y ¹ , and m in the general formula (11) are also preferable in the polyimide of the general formula (1) for the same reason.

In the case of alkali-soluble polyimide, the end of the polyimide may be a hydroxyl group.

<Polybenzoxazole precursor composition>
(A) Photosensitive Resin As the photosensitive resin used in the polybenzoxazole precursor composition, poly (o-hydroxyamide) containing a repeating unit represented by the following general formula (14) can be used.

（一般式（１４）中、ＵとＶは２価の有機基である。）

(In the general formula (14), U and V are divalent organic groups.)

From the viewpoint of adhesion between the interlayer insulating film 6 and the encapsulant 3, U is preferably a divalent organic group having 1 to 30 carbon atoms, and is a chain alkylene group having 1 to 15 carbon atoms (provided that it is a chain alkylene group having 1 to 15 carbon atoms). The hydrogen atom of the chain alkylene may be substituted with a halogen atom)), and a chain alkylene group having 1 to 8 carbon atoms and having a part or all of the hydrogen atom substituted with a fluorine atom is particularly preferable. ..

Further, from the viewpoint of adhesion between the interlayer insulating film 6 and the sealing material 3, V is preferably a divalent organic group containing an aromatic group, and more preferably the following general formulas (6) to general formulas. It is preferably a divalent organic group containing at least one structure represented by (8).

（Ｒ_１０、Ｒ_１１、Ｒ_１２及びＲ_１３は、水素原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms and monovalent aliphatic groups having 1 to 5 carbon atoms, and may be the same or different.)

（Ｒ_１４～Ｒ_２１は、水素原子、ハロゲン原子、炭素数が１～５の１価の有機基であり、互いに異なっていても、同一であってもよい。）

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, and monovalent organic groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

（Ｒ_２２は２価の基であり、Ｒ_２３～Ｒ_３０は、水素原子、ハロゲン原子、炭素数が１～５の１価の脂肪族基であり、同一であっても異なっていてもよい。）

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are hydrogen atoms, halogen atoms, and monovalent aliphatic groups having 1 to 5 carbon atoms, which may be the same or different. .)

R ₂₂ in the general formula (8) is, for example, a divalent organic group having 1 to 40 carbon atoms or a halogen atom.

From the viewpoint of the adhesion between the interlayer insulating film 6 and the sealing material 3, V is particularly preferably a divalent organic group containing a structure represented by the following general formula (9).

From the viewpoint of adhesion between the interlayer insulating film 6 and the sealing material 3, V is preferably a divalent organic group having 1 to 40 carbon atoms, and more preferably a divalent chain aliphatic group having 1 to 40 carbon atoms. A divalent chain aliphatic group having 1 to 20 carbon atoms is preferable, and a divalent chain aliphatic group is particularly preferable.

Polybenzoxazole precursors can generally be synthesized from dicarboxylic acid derivatives and hydroxy group-containing diamines. Specifically, it can be synthesized by converting a dicarboxylic acid derivative into a dihalide derivative and then reacting with diamines. As the dihalide derivative, a dichloride derivative is preferable.

The dichloride derivative can be synthesized by allowing a halogenating agent to act on the dicarboxylic acid derivative. As the halogenating agent, thionyl chloride, phosphoryl chloride, phosphorus oxychloride, phosphorus pentachloride and the like, which are used in the acid chloride reaction of a normal carboxylic acid, can be used.

As a method for synthesizing the dichloride derivative, it can be synthesized by a method of reacting the dicarboxylic acid derivative with the above-mentioned halogenating agent in a solvent, a method of reacting in an excess halogenating agent, and then a method of distilling off the excess.

Examples of the dicarboxylic acid used for the dicarboxylic acid derivative include isophthalic acid, terephthalic acid, 2,2-bis (4-carboxyphenyl) -1,1,1,3,3,3-hexafluoropropane, 4,4. '-Dicarboxybiphenyl, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxytetraphenylsilane, bis (4-carboxyphenyl) sulfone, 2,2-bis (p-carboxyphenyl) propane, 5- tert-butylisophthalic acid, 5-bromoisophthalic acid, 5-fluoroisophthalic acid, 5-chloroisophthalic acid, 2,6-naphthalenedicarboxylic acid, malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n -Butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methylsuccinic acid, 2,2-dimethylsuccinic acid, 2,3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2 -Methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, 3,3-dimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoroadipic acid, 3-methyladipic acid , Octafluoroadipic acid, pimelic acid, 2,2,6,6-tetramethylpimeric acid, suberic acid, dodecafluorosveric acid, azelaic acid, sevacinic acid, hexadecafluorosevacinic acid, 1,9-nonanedioic acid , Dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecandioic acid, eikosandioic acid, heneicosanedioic acid, docosanedioic acid, tricosanedioic acid, tetracosane Examples thereof include diacid, pentacosandioic acid, hexacosandioic acid, heptacosandioic acid, octacosandioic acid, nonakosandioic acid, triacontanedioic acid, hentoriacontanedioic acid, dotoriacontanedioic acid and diglycolic acid. These may be mixed and used.

Examples of the hydroxy group-containing diamine include 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, and bis (3-amino-4-hydroxyphenyl). Propane, bis (4-amino-3-hydroxyphenyl) propane, bis (3-amino-4-hydroxyphenyl) sulfone, bis (4-amino-3-hydroxyphenyl) sulfone, 2,2-bis (3-amino) -4-Hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane, 2,2-bis (4-amino-3-hydroxyphenyl) -1,1,1,3,3,3 -Hexafluoropropane and the like can be mentioned. These may be mixed and used.

(B2) Photoacid generator The photoacid generator has a function of increasing the solubility of an alkaline aqueous solution in a light-irradiated portion. Examples of the photoacid generator include a diazonaphthoquinone compound, an aryldiazonium salt, a diallyliodonium salt, a triarylsulfonium salt and the like. Of these, the diazonaphthoquinone compound is preferable because of its high sensitivity.

(C) Additives The types and amounts of the preferable additives are the same as those described in the item of the polyimide precursor composition.

(D) Solvent The solvent is not particularly limited as long as it can dissolve or disperse each component.

(E) Others The polybenzoxazole precursor composition may contain a cross-linking agent, a sensitizer, an adhesive aid, a thermoacid generator and the like.

(developing)
After exposing the polybenzoxazole precursor composition, the unnecessary portions are washed away with a developer. The developing solution to be used is not particularly limited, but for example, an alkaline aqueous solution such as sodium hydroxide, potassium hydroxide, sodium silicate, ammonia, ethylamine, diethylamine, triethylamine, triethanolamine, and tetramethylammonium hydroxide is preferable. Is mentioned as.

In the above description, the positive type polybenzoxazole precursor composition has been mainly described, but a negative type polybenzoxazole precursor composition may be used.

(Thermosetting)
After development, the polybenzoxazole precursor composition is heated to close the ring of the polybenzoxazole precursor to form polybenzoxazole. This polybenzoxazole forms a cured relief pattern, that is, an interlayer insulating film 6.

The heating temperature for thermosetting the polybenzoxazole precursor composition is not particularly limited, but the heating temperature is preferably a low temperature from the viewpoint of the influence on other members. The heating temperature is preferably 250 ° C. or lower, more preferably 230 ° C. or lower, more preferably 200 ° C. or lower, and particularly preferably 180 ° C. or lower.

<Polybenzoxazole>
The structure of the cured relief pattern formed from the polybenzoxazole precursor composition is the following general formula (10).

The U and V in the general formula (10) are the same as the U and V in the general formula (14). The preferred U and V in the general formula (14) are also preferred in the polybenzoxazole of the general formula (10) for the same reason.

<Polymer with phenolic hydroxyl group>
(A) Photosensitive resin A resin having a phenolic hydroxyl group in the molecule, which is soluble in alkali. Specific examples thereof include vinyl polymers containing a monomer unit having a phenolic hydroxyl group such as poly (hydroxystyrene), phenol resins, poly (hydroxyamide), poly (hydroxyphenylene) ethers, and polynaphthols.

Among these, phenolic resins are preferable, and novolak-type phenolic resins are particularly preferable because of their low cost and small volume shrinkage during curing.

Phenol resin is a polycondensation product of phenol or its derivatives and aldehydes. Polycondensation is performed in the presence of a catalyst such as an acid or base. The phenol resin obtained when an acid catalyst is used is particularly called a novolak type phenol resin.

Examples of the phenol derivative include phenol, cresol, ethylphenol, propylphenol, butylphenol, amylphenol, benzylphenol, adamantanphenol, benzyloxyphenol, xylenol, catechol, resorcinol, ethylresorcinol, hexylresolsinol, hydroquinone, pyrogallol, and fluorolog. Lucinol, 1,2,4-trihydroxybenzene, pararosolic acid, biphenol, bisphenol A, bisphenol AF, bisphenol B, bisphenol F, bisphenol S, dihydroxydiphenylmethane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1, 4-Bis (3-hydroxyphenoxybenzene), 2,2-bis (4-hydroxy-3-methylphenyl) propane, α, α'-bis (4-hydroxyphenyl) -1,4-diisopropylbenzene, 9, 9-bis (4-hydroxy-3-methylphenyl) phenolene, 2,2-bis (3-cyclohexyl-4-hydroxyphenyl) propane, 2,2-bis (2-hydroxy-5-biphenylyl) propane, dihydroxy Examples include benzoic acid.

Aldehyde compounds include formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, pivalaldehyde, butylaldehyde, pentanal, hexanal, trioxane, glioxal, cyclohexylaldehyde, diphenylacetaldehyde, ethylbutylaldehyde, benzaldehyde, glyoxylic acid, 5-norbornen-2. -Carboxyaldehyde, malondialdehyde, succindialdehyde, glutaaldehyde, salicylaldehyde, naphthoaldehyde, terephthalaldehyde and the like can be mentioned.

The component (A) preferably contains (a) a phenol resin having no unsaturated hydrocarbon group and (b) a modified phenol resin having an unsaturated hydrocarbon group. It is more preferable that the component (b) is further modified by the reaction between the phenolic hydroxyl group and the polybasic acid anhydride.

Further, as the component (b), a phenol resin modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms is used from the viewpoint of further improving mechanical properties (break elongation, elastic modulus and residual stress). Is preferable.

(B) The modified phenol resin having an unsaturated hydrocarbon group is generally a phenol or a derivative thereof and a compound having an unsaturated hydrocarbon group (preferably one having 4 to 100 carbon atoms) (hereinafter, in some cases, simply "unsaturated". A reaction product with a saturated hydrocarbon group-containing compound (referred to as "unsaturated hydrocarbon group-containing compound") (hereinafter referred to as "unsaturated hydrocarbon group-modified phenol derivative") and a condensed polymer product of aldehydes, or a phenol resin and unsaturated hydrocarbon. It is a reaction product with a group-containing compound.

As the phenol derivative referred to here, the same phenol derivative as described above can be used as the raw material of the phenol resin as the component (A).

The unsaturated hydrocarbon group of the unsaturated hydrocarbon group-containing compound preferably contains two or more unsaturated groups from the viewpoint of adhesion of the resist pattern and thermal shock resistance. Further, from the viewpoint of compatibility when used as a resin composition and flexibility of the cured film, the unsaturated hydrocarbon group-containing compound preferably has 8 to 80 carbon atoms, and more preferably 10 to 60 carbon atoms. preferable.

Examples of the unsaturated hydrocarbon group-containing compound include unsaturated hydrocarbons having 4 to 100 carbon atoms, polybutadiene having a carboxyl group, epoxidized polybutadiene, linolyl alcohol, oleyl alcohol, unsaturated fatty acids and unsaturated fatty acid esters. .. Suitable unsaturated fatty acids include crotonic acid, myristolenic acid, palmitoleic acid, oleic acid, ellagic acid, bacsenic acid, gadrain acid, erucic acid, nervonic acid, linoleic acid, α-linolenic acid, eleostearic acid and stearidone. Acids, arachidonic acid, eikosapentaenoic acid, sardine acid and docosahexaenoic acid can be mentioned. Among these, esters of unsaturated fatty acids having 8 to 30 carbon atoms and monovalent to trivalent alcohols having 1 to 10 carbon atoms are more preferable, and unsaturated fatty acids having 8 to 30 carbon atoms and trihydric alcohols are more preferable. Esters with glycerin are particularly preferred.

Esters of unsaturated fatty acids having 8 to 30 carbon atoms and glycerin are commercially available as vegetable oils. Vegetable oils include non-drying oils having an iodine value of 100 or less, semi-drying oils having an iodine value of more than 100 and less than 130, or dry oils having an iodine value of 130 or more. Examples of the non-drying oil include olive oil, asagao seed oil, kashu seed oil, sazanka oil, brim oil, castor oil and peanut oil. Examples of the semi-drying oil include corn oil, cottonseed oil and sesame oil. Examples of the dry oil include tung oil, flaxseed oil, soybean oil, peach oil, safflower oil, sunflower oil, sardine oil and mustard oil. Moreover, you may use the processed vegetable oil obtained by processing these vegetable oils.

Among the above vegetable oils, it is preferable to use a non-drying oil from the viewpoint of preventing gelation due to the progress of an excessive reaction and improving the yield in the reaction between phenol or a derivative thereof or a phenol resin and the vegetable oil. On the other hand, it is preferable to use a drying oil from the viewpoint of improving the adhesion of the resist pattern, the mechanical properties and the heat impact resistance. Among the dry oils, tung oil, linseed oil, soybean oil, peach oil and safflower oil are preferable, and tung oil and linseed oil are more preferable, because the effect of the present invention can be more effectively and surely exhibited.

These unsaturated hydrocarbon group-containing compounds may be used alone or in combination of two or more.

(B) In preparing the component, first, the above-mentioned phenol derivative is reacted with the above-mentioned unsaturated hydrocarbon group-containing compound to prepare an unsaturated hydrocarbon group-modified phenol derivative. The reaction is preferably carried out at 50 to 130 ° C. The reaction ratio between the phenol derivative and the unsaturated hydrocarbon group-containing compound is 1 to 100 for the unsaturated hydrocarbon group-containing compound with respect to 100 parts by mass of the phenol derivative from the viewpoint of improving the flexibility of the cured film (resist pattern). It is preferably parts by mass, more preferably 5 to 50 parts by mass. If the amount of the unsaturated hydrocarbon group-containing compound is less than 1 part by mass, the flexibility of the cured film tends to decrease, and if it exceeds 100 parts by mass, the heat resistance of the cured film tends to decrease. In the above reaction, p-toluenesulfonic acid, trifluoromethanesulfonic acid and the like may be used as a catalyst, if necessary.

By polycondensing the unsaturated hydrocarbon group-modified phenol derivative produced by the above reaction with aldehydes, a phenol resin modified with an unsaturated hydrocarbon group-containing compound is produced. As the aldehydes, the same aldehydes as those described above can be used as the aldehydes used to obtain the phenol resin.

The reaction between the aldehydes and the unsaturated hydrocarbon group-modified phenol derivative is a polycondensation reaction, and conventionally known phenol resin synthesis conditions can be used. The reaction is preferably carried out in the presence of a catalyst such as an acid or a base, and more preferably an acid catalyst is used. Examples of the acid catalyst include hydrochloric acid, sulfuric acid, formic acid, acetic acid, p-toluenesulfonic acid and oxalic acid. These acid catalysts can be used alone or in combination of two or more.

The above reaction is usually preferably carried out at a reaction temperature of 100 to 120 ° C. The reaction time varies depending on the type and amount of the catalyst used, but is usually 1 to 50 hours. After completion of the reaction, the reaction product is dehydrated under reduced pressure at a temperature of 200 ° C. or lower to obtain a phenol resin modified with an unsaturated hydrocarbon group-containing compound. A solvent such as toluene, xylene, or methanol can be used for the reaction.

The phenolic resin modified with the unsaturated hydrocarbon group-containing compound can also be obtained by polycondensing the above-mentioned unsaturated hydrocarbon group-modified phenol derivative with aldehydes together with a compound other than phenol such as m-xylene. .. In this case, the molar ratio of the compound other than phenol to the compound obtained by reacting the phenol derivative with the unsaturated hydrocarbon group-containing compound is preferably less than 0.5.

The component (b) can also be obtained by reacting the phenol resin of the component (a) with an unsaturated hydrocarbon group-containing compound.

As the unsaturated hydrocarbon group-containing compound to be reacted with the phenol resin, the same unsaturated hydrocarbon group-containing compound as described above can be used.

The reaction between the phenol resin and the unsaturated hydrocarbon group-containing compound is usually preferably carried out at 50 to 130 ° C. Further, the reaction ratio between the phenol resin and the unsaturated hydrocarbon group-containing compound is such that the unsaturated hydrocarbon group-containing compound 1 is relative to 100 parts by mass of the phenol resin from the viewpoint of improving the flexibility of the cured film (resist pattern). It is preferably up to 100 parts by mass, more preferably 2 to 70 parts by mass, and even more preferably 5 to 50 parts by mass.
If the amount of the unsaturated hydrocarbon group-containing compound is less than 1 part by mass, the flexibility of the cured film tends to decrease, and if it exceeds 100 parts by mass, the possibility of gelation during the reaction increases and the curing tends to occur. The heat resistance of the film tends to decrease. At this time, p-toluenesulfonic acid, trifluoromethanesulfonic acid, or the like may be used as a catalyst, if necessary. A solvent such as toluene, xylene, methanol, or tetrahydrofuran can be used for the reaction.

The polybasic acid anhydride is further reacted with the phenolic hydroxyl group remaining in the phenolic resin modified with the unsaturated hydrocarbon group-containing compound produced by the above method. Thereby, the acid-modified phenol resin can also be used as the component (b). By acid denaturation with polybasic acid anhydride, a carboxy group is introduced, and the solubility of the component (b) in an alkaline aqueous solution (developer) is further improved.

The polybasic acid anhydride is not particularly limited as long as it has an acid anhydride group formed by dehydration condensation of carboxy groups of a polybasic acid having a plurality of carboxy groups. Examples of the polybasic acid anhydride include phthalic anhydride, succinic anhydride, octenyl succinic anhydride, pentadodecenyl succinic anhydride, maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Dibasic acid anhydrides such as acid, methylhexahydroanhydride, nagicic acid, 3,6-endomethylenetetrahydroanhydride, methylendomethylenetetrahydroanhydride, tetrabromoanhydride and trimellitic anhydride, biphenyl. Tetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, diphenyl ether tetracarboxylic acid dianhydride, butanetetracarboxylic acid dianhydride, cyclopentanetetracarboxylic acid dianhydride, pyromellitic anhydride and benzophenone tetracarboxylic dianhydride. Examples thereof include aromatic tetrabasic acid dianhydrides such as anhydrides. These may be used individually by 1 type or in combination of 2 or more type. Among these, the polybasic acid anhydride is preferably a dibasic acid anhydride, and more preferably one or more selected from the group consisting of tetrahydrophthalic anhydride, succinic anhydride and hexahydrophthalic anhydride. .. In this case, there is an advantage that a resist pattern having a better shape can be formed.

Further, the alkali-soluble resin having (A) a phenolic hydroxyl group can further contain an acid-modified phenol resin obtained by reacting with polybasic acid anhydride. By containing the phenol resin in which the component (A) is acid-modified with polybasic acid anhydride, the solubility of the component (A) in an alkaline aqueous solution (developer) is further improved.

Examples of the polybasic acid anhydride include phthalic anhydride, succinic anhydride, octenyl succinic anhydride, pentadodecenyl succinic anhydride, maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methyltetrahydroanhydride. Dibasic acid anhydrides such as phthalic acid, methylhexahydroanhydride, nagicic acid, 3,6-endomethylenetetrahydroanhydride, methylendomethylenetetrahydroanhydride, tetrabromoanhydride, trimellitic anhydride, etc. Biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, diphenyl ether tetracarboxylic acid dianhydride, butanetetracarboxylic acid dianhydride, cyclopentanetetracarboxylic acid dianhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid. Examples thereof include aliphatics such as dianhydrides and aromatic tetrabasic acid dianhydrides. These may be used individually by 1 type or in combination of 2 or more type. Among these, the polybasic acid anhydride is preferably a dibasic acid anhydride, and is, for example, one or more selected from the group consisting of tetrahydrophthalic anhydride, succinic anhydride and hexahydrophthalic anhydride. More preferred.

(B2) Photoacid generator Examples of the photoacid generator include a diazonaphthoquinone compound, an aryldiazonium salt, a diallyliodonium salt, a triarylsulfonium salt and the like. Of these, the diazonaphthoquinone compound is preferable because of its high sensitivity.

(C) Additives The types and amounts of the preferable additives are the same as those described in the item of the polyimide precursor composition.

(D) Solvent The solvent is not particularly limited as long as it can dissolve or disperse each component.

(E) Others may contain a thermal cross-linking agent, a sensitizer, an adhesive aid, a dye, a surfactant, a dissolution accelerator, a cross-linking accelerator and the like. Of these, by containing the heat-crosslinking agent, when the photosensitive resin film after pattern formation is heated and cured, the heat-crosslinking agent component reacts with the component (A) to form a bridging structure. This enables curing at a low temperature, and prevents brittleness of the film and melting of the film. Specifically, as the heat-crosslinking agent component, a compound having a phenolic hydroxyl group, a compound having a hydroxymethylamino group, and a compound having an epoxy group can be preferably used.

(developing)
After exposing the polymer having a phenolic hydroxyl group, the unnecessary portion is washed away with a developing solution. The developer to be used is not particularly limited, but is an alkaline aqueous solution such as sodium hydroxide, potassium hydroxide, sodium silicate, ammonia, ethylamine, diethylamine, triethylamine, triethanolamine, tetramethylammonium hydroxide (TMAH) and the like. Is preferably used.

(Thermosetting)
After development, the polymers having phenolic hydroxyl groups are thermally crosslinked with each other by heating the polymers having phenolic hydroxyl groups. The polymer after the cross-linking becomes a cured relief pattern, that is, an interlayer insulating film 6.

The heating temperature for thermosetting the polymer having a phenolic hydroxyl group is not particularly limited, but the heating temperature is preferably a low temperature from the viewpoint of the influence on other members. The heating temperature is preferably 250 ° C. or lower, more preferably 230 ° C. or lower, more preferably 200 ° C. or lower, and particularly preferably 180 ° C. or lower.

(Manufacturing method of semiconductor device)
The manufacturing method of the semiconductor device in this embodiment will be described with reference to FIG. FIG. 3 is an example of a manufacturing process of the semiconductor device of the present embodiment. In FIG. 3A, the pre-processed wafer 10 is prepared. Then, in FIG. 3B, the pre-processed wafer 10 is diced to form a plurality of semiconductor chips 2. The semiconductor chip 2 may be a purchased item. As shown in FIG. 3C, the semiconductor chips 2 prepared in this way are attached onto the support 11 at predetermined intervals.

Subsequently, the mold resin 12 is applied from the semiconductor chip 2 to the support 11, and the mold is sealed as shown in FIG. 3D. Subsequently, the support 11 is peeled off and the mold resin 12 is inverted (see FIG. 3E). As shown in FIG. 3E, the semiconductor chip 2 and the mold resin 12 appear on substantially the same plane. Subsequently, in the step shown in FIG. 3F, the photosensitive resin composition 13 is applied onto the semiconductor chip 2 and the mold resin 12. Then, the applied photosensitive resin composition 13 is exposed and developed to form a relief pattern (relief pattern forming step). The photosensitive resin composition 13 may be either a positive type or a negative type. Further, the relief pattern is heated to form a cured relief pattern (interlayer insulating film forming step). Further, wiring is formed at a portion where the cured relief pattern is not formed (wiring forming step).

In this embodiment, the relief pattern forming step, the interlayer insulating film forming step, and the wiring forming step are combined to form a rewiring layer forming step for forming a rewiring layer to be connected to the semiconductor chip 2.

The interlayer insulating film in the rewiring layer may be a multilayer. Therefore, the rewiring layer forming step may include a plurality of relief pattern forming steps, a plurality of interlayer insulating film forming steps, and a plurality of wiring forming steps.

Then, in FIG. 3G, a plurality of external connection terminals 7 corresponding to each semiconductor chip 2 are formed (bump formation), and dicing is performed between the semiconductor chips 2. As a result, as shown in FIG. 3H, the semiconductor device (semiconductor IC) 1 can be obtained. In the present embodiment, a plurality of funout-type semiconductor devices 1 can be obtained by the manufacturing method shown in FIG.

In the present embodiment, the weight reduction temperature of the cured relief pattern (interlayer insulating film) formed through the above steps can be set to 300 ° C. or lower. Here, the i-ray transmittance of the interlayer insulating film can be adjusted by the amount of the additive.

In the present embodiment, in the above-mentioned interlayer insulating film forming step, the interlayer insulating film can be formed of a photosensitive resin composition capable of forming at least one compound of polyimide, polybenzoxazole, and a polymer having a phenolic hydroxyl group. preferable.

Hereinafter, examples carried out for clarifying the effects of the present invention will be described. In the examples, the following materials and measurement methods were used.

(Polymer A-1: Synthesis of polyimide precursor)
4,4'-Oxydiphthalic acid dianhydride (ODPA) as tetracarboxylic acid dianhydride was placed in a 2 liter volume separable flask. Further, 2-hydroxyethyl methacrylate (HEMA) and γ-butyrolactone were added and stirred at room temperature, and pyridine was added while stirring to obtain a reaction mixture. After the heat generated by the reaction was completed, the mixture was allowed to cool to room temperature and left for 16 hours.

Next, under ice-cooling, a solution of dicyclohexylcarbodiimide (DCC) dissolved in γ-butyrolactone was added to the reaction mixture over 40 minutes with stirring. Subsequently, 4,4'-diaminodiphenyl ether (DADPE) suspended in γ-butyrolactone as a diamine was added over 60 minutes with stirring. Further, after stirring at room temperature for 2 hours, ethyl alcohol was added and the mixture was stirred for 1 hour, and then γ-butyrolactone was added. The precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution.

The obtained reaction solution was added to ethyl alcohol to form a precipitate composed of a crude polymer. The produced crude polymer was filtered off and dissolved in tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was added dropwise to water to precipitate the polymer, and the obtained precipitate was filtered off and then vacuum dried to obtain a powdery polymer (polyimide precursor (polymer A-1)). .. The mass of the compound used in the component A-1 is as shown in Table 1 below.

(Synthesis of polymers A-2 to A-4)
The reaction was carried out in the same manner as described in the above-mentioned polymer A-1 except that the tetracarboxylic acid dianhydride and the diamine were changed as shown in Table 1 below, and the polyimide precursors (polymers A-2 to A-4) were subjected to the reaction. Got

(Polymer B-1: Synthesis of polybenzoxazole precursor)
In a 0.5 liter flask equipped with a stirrer and a thermometer, 15.48 g of 4,4'-diphenyl ether dicarboxylic acid and N-methylpyrrolidone were charged as dicarboxylic acids. After cooling the flask to 5 ° C., thionyl chloride was added dropwise and the reaction was carried out for 30 minutes to obtain a solution of the dicarboxylic acid chloride. Next, N-methylpyrrolidone was placed in a 0.5 liter flask equipped with a stirrer and a thermometer. As bis-aminophenol, 18.30 g of bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 2.18 g of m-aminophenol were stirred and dissolved, and then pyridine was added. Then, while keeping the temperature at 0 to 5 ° C., the solution of the dicarboxylic acid chloride was added dropwise over 30 minutes, and then stirring was continued for 30 minutes. The solution was poured into 3 liters of water, the precipitate was recovered, washed with pure water three times, and then dried under reduced pressure to obtain a polymer (polybenzoxazole precursor (polymer B-1)). The masses of the compounds used in Polymer B-1 are shown in Table 1 below.

(Synthesis of polymers B-2 to B-3)
The reaction was carried out in the same manner as described in the above-mentioned polymer B-1 except that the dicarboxylic acid and bisaminophenol were changed as shown in Table 1 below, and the polybenzoxazole precursor (polymers B-2 to B-) was carried out. 3) was obtained.

(Polymer C-1: Synthesis of phenolic resin)
A phenol resin containing 85 g of the C1 resin shown below and 15 g of the C2 resin shown below was prepared as the polymer C-1.
C1: Cresol novolak resin (cresol / formaldehyde novolak resin, m-cresol / p-cresol (molar ratio) = 60/40, polystyrene-equivalent weight average molecular weight = 12,000, manufactured by Asahi Organic Materials Industry Co., Ltd., trade name "EP4020G" )

C2: C2 was synthesized as follows.
<C2: Synthesis of phenol resin modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms>
100 parts by mass of phenol, 43 parts by mass of linseed oil and 0.1 part by mass of trifluoromethanesulfonic acid were mixed and stirred at 120 ° C. for 2 hours to obtain a vegetable oil-modified phenol derivative (a). Next, 130 g of the vegetable oil-modified phenol derivative (a), 16.3 g of paraformaldehyde and 1.0 g of oxalic acid were mixed, and the mixture was stirred at 90 ° C. for 3 hours. Then, the temperature was raised to 120 ° C. and the mixture was stirred under reduced pressure for 3 hours, 29 g of succinic anhydride and 0.3 g of triethylamine were added to the reaction solution, and the mixture was stirred at 100 ° C. for 1 hour under atmospheric pressure. The reaction solution was cooled to room temperature to obtain a phenol resin (hereinafter referred to as "C2 resin") modified with a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms, which is a reaction product (acid value 120 mgKOH). / G).

(Synthesis of polymer C-2)
The following 100 g of C1 resin was prepared as polymer C-2.

[Examples 1 to 11, Comparative Examples 1 to 2]
The mixture was blended as shown in Table 2 below to obtain a solution of the photosensitive resin composition. The unit in Table 2 is a mass part.

Using the compounds shown in Table 2, the photosensitive resin compositions of Examples 1 to 11 and Comparative Examples 1 and 2 were prepared in the blending amounts shown in Tables 3 and 4.

The prepared photosensitive resin composition was subjected to (1) a 5% weight loss temperature measurement test, (2) a reflow resistance test of the encapsulant, and (3) an adhesion test with the encapsulant. The results of each test are shown in Table 3 below.

(1) 5% Weight Reduction Temperature Measurement Test Using the photosensitive resin compositions prepared in Examples and Comparative Examples, a funout type wafer level chip size package type semiconductor device was produced. An interlayer insulating film having a thickness of 10 μm was taken out from the manufactured semiconductor device as cleanly as possible. The removed interlayer insulating film was measured at a temperature rise rate of 10 ° C./min under a nitrogen atmosphere using a DTG-60A apparatus manufactured by Shimadzu Corporation, and a 5% weight loss temperature was measured.

(2) Reflow resistance test of encapsulant R4000 series manufactured by Nagase Chemtex Co., Ltd. was prepared as an epoxy-based encapsulant. Next, the encapsulant was spin-coated on the aluminum-sputtered silicone wafer so as to have a thickness of about 150 μm, and thermoset at 130 ° C. to cure the epoxy encapsulant.

The photosensitive resin compositions prepared in Examples and Comparative Examples were applied onto the epoxy-based cured film so that the final film thickness was 10 μm. The coated photosensitive resin compositions were used in Examples 1 to 4, 10; Comparative Example 1 was 200 mJ / cm ² , Examples 5 to 7 and 11, Comparative Example 2 was 500 mJ / cm ² , and Examples 8 and 9 were 700 mJ / cm. After exposing the entire surface under the exposure condition of cm ² , it was heat-cured at 180 ° C. for 2 hours to prepare a first-layer cured film having a thickness of 10 μm.

The photosensitive resin composition used for forming the cured film of the first layer is applied onto the cured film of the first layer, and the entire surface is exposed under the same conditions as when the cured film of the first layer is formed, and then heat-cured. , A second cured film having a thickness of 10 μm was prepared.

The test piece after forming the second layer of the cured film was subjected to simulated solder reflow conditions using a mesh belt type continuous firing furnace (model name 6841-20AMC-36 manufactured by Koyo Thermo System Co., Ltd.) under a nitrogen atmosphere and a peak temperature. It was heated to 260 ° C. The simulated reflow condition is a solder reflow condition that conforms to the solder reflow condition described in Section 7.6 of IPC / JEDEC J-STD-020A, which is a standard of the US semiconductor industry group regarding the evaluation method of semiconductor devices. It was standardized assuming a high temperature of 220 ° C.

The degree of deterioration was evaluated by checking the presence or absence of voids in the epoxy portion after cutting a cross section of the cured film treated under the above simulated reflow conditions with a FIB device (JIB-4000, manufactured by JEOL Ltd.). .. Those with no voids were marked with ◯, and those with even one void were marked with x.

(3) Adhesion test with encapsulant A pin is placed on the photosensitive resin cured film of the sample prepared in the test of (2), and the adhesion is set using a take-up tester (Quad Group, Sebastian Type 5). A test was performed.
Evaluation: Adhesive strength 70 MPa or more ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Adhesive strength ◎
50 MPa or more and less than -70 MPa ... Adhesion strength ○
30 MPa or more and less than -50 MPa ... Adhesion strength △
Less than 30MPa ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Adhesion strength ×

As is clear from Tables 3 and 4, when the 5% weight loss temperature is 300 ° C. or lower from the results of the tests (1) to (3) performed on the photosensitive resin compositions of Examples 1 to 11. It was confirmed that no void was found in the epoxy part in the reflow resistance test of the encapsulant, and that the adhesion evaluation of the encapsulant was ⊚, ◯, or Δ in the adhesion test with the encapsulant.

On the other hand, as is clear from Tables 3 and 4, when the 5% weight loss temperature exceeds 300 ° C. from the results of the tests (1) to (3) performed on the photosensitive resin compositions of Comparative Examples 1 and 2. In the reflow resistance test of the encapsulant, voids were found in the epoxy part, and it was confirmed that the adhesion evaluation of the encapsulant was x in the adhesion test with the encapsulant.

When the fan-out type wafer level chip size package type semiconductor device containing the epoxy resin in the mold resin was produced using the photosensitive resin compositions of Examples 1 to 11, it operated without any problem.

INDUSTRIAL APPLICABILITY The present invention is preferably applied to a semiconductor device having a semiconductor chip and a rewiring layer connected to the semiconductor chip, particularly a fan-out type wafer level chip size package type semiconductor device.

1 Semiconductor device 2 Semiconductor chip 3 Encapsulant 4 Rewiring layer 5 Wiring 6 Interlayer insulating film 7 External connection terminal 10 Wafer 11 Support 12 Mold resin 13 Photosensitive resin composition

Claims (35)

With semiconductor chips
The encapsulant that covers the semiconductor chip and
A rewiring layer having a larger area than the semiconductor chip in a plan view is provided.
The encapsulant contains a cured epoxy resin and contains
A semiconductor device characterized in that the 5% weight loss temperature of the interlayer insulating film of the rewiring layer is 300 ° C. or lower. The semiconductor device according to claim 1, wherein the sealing material is in direct contact with the interlayer insulating film. The semiconductor device according to any one of claims 1 to 2 , wherein the interlayer insulating film contains at least one selected from polyimide, polybenzoxazole, and a polymer having a phenolic hydroxyl group. The semiconductor device according to claim 3 , wherein the interlayer insulating film contains a polyimide containing the structure of the following general formula (1).

(In the general formula (1), X ¹ is a tetravalent organic group, Y ¹ is a divalent organic group, and m is an integer of 1 or more.) X1 in the general formula ( ¹ ) is a tetravalent organic group containing an aromatic ring.
The semiconductor device according to claim 4 , wherein Y ¹ in the general formula (1) is a divalent organic group containing an aromatic ring. The semiconductor according to claim 4 or 5 , wherein X ¹ in the general formula (1) includes at least one structure represented by the following general formulas (2) to (4). Device.

(In the general formula (4), R ₉ is an oxygen atom, a sulfur atom, or a divalent organic group.) The semiconductor device according to claim 6 , wherein X ¹ in the general formula (1) includes a structure represented by the following general formula (5).

One of claims 4 to 7 , wherein Y ¹ in the general formula (1) includes at least one structure represented by the following general formulas (6) to (8). The semiconductor device described.

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms, monovalent aliphatic groups or hydroxyl groups having 1 to 5 carbon atoms, and may be the same or different.)

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, monovalent organic groups or hydroxyl groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are a hydrogen atom, a halogen atom, a monovalent aliphatic group having 1 to 5 carbon atoms or a hydroxyl group, and they are the same but different. May be good.) The semiconductor device according to claim 8 , wherein Y ¹ in the general formula (1) includes a structure represented by the following general formula (9).

The semiconductor device according to claim 3 , wherein the interlayer insulating film contains a polybenzoxazole containing the structure of the following general formula (10).

(In the general formula (10), U and V are divalent organic groups.) The semiconductor device according to claim 10, wherein the U of the general formula (10) is a divalent organic group having 1 to 30 carbon atoms. The semiconductor according to claim 11, wherein U of the general formula (10) is a chain alkylene group having 1 to 8 carbon atoms and having a part or all of hydrogen atoms substituted with fluorine atoms. Device. The semiconductor device according to any one of claims 10 to 12, wherein V of the general formula (10) is a divalent organic group containing an aromatic group. The semiconductor device according to claim 13 , wherein the V of the general formula (10) includes at least one structure represented by the following general formulas (6) to (8).

(R ₁₀ , R ₁₁ , R ₁₂ and R ₁₃ are hydrogen atoms and monovalent aliphatic groups having 1 to 5 carbon atoms, and may be the same or different.)

(R ₁₄ to R ₂₁ are hydrogen atoms, halogen atoms, and monovalent organic groups having 1 to 5 carbon atoms, and may be different from each other or the same.)

(R ₂₂ is a divalent group, and R ₂₃ to R ₃₀ are hydrogen atoms, halogen atoms, and monovalent aliphatic groups having 1 to 5 carbon atoms, which may be the same or different. .) The semiconductor device according to claim 14 , wherein V of the general formula (10) includes a structure represented by the following general formula (9).

The semiconductor device according to any one of claims 10 to 12, wherein V of the general formula (10) is a divalent organic group having 1 to 40 carbon atoms. The semiconductor device according to claim 16 , wherein V of the general formula (10) is a divalent chain aliphatic group having 1 to 20 carbon atoms. The semiconductor device according to claim 3 , wherein the polymer having a phenolic hydroxyl group contains a novolak type phenol resin. The semiconductor device according to claim 3 , wherein the polymer having a phenolic hydroxyl group contains a phenol resin having no unsaturated hydrocarbon group and a modified phenol resin having an unsaturated hydrocarbon group. When the rewiring layer is viewed in cross section, the rewiring layer includes a first interlayer insulating film layer, a second interlayer insulating film layer, the first interlayer insulating film layer, and the second interlayer insulating film. Any of claims 1 to 19 , wherein the layer is different from the film layer and includes an intermediate layer provided between the first interlayer insulating film layer and the second interlayer insulating film layer. The semiconductor device described in the above. The 20th aspect of the present invention, wherein the first interlayer insulating film layer is in contact with the sealing material, and the 5 % weight loss temperature of the first interlayer insulating film layer is 300 ° C. or lower. Semiconductor device. The semiconductor device according to claim 20 or 21, wherein the second interlayer insulating film layer has a composition different from that of the first interlayer insulating film layer. The 5% weight loss temperature of the second interlayer insulating film layer is different from the 5 % weight loss temperature of the first interlayer insulating film layer according to any one of claims 20 to 22. The semiconductor device described. The semiconductor device according to any one of claims 1 to 23 , wherein the semiconductor device is a fan-out type wafer level chip size package type semiconductor device. The semiconductor device according to any one of claims 1 to 24 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 280 ° C. or lower. The semiconductor device according to claim 25 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 260 ° C. or lower. The semiconductor device according to claim 25 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 240 ° C. or lower. The semiconductor device according to claim 25 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 220 ° C. or lower. The semiconductor device according to claim 25 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 200 ° C. or lower. The semiconductor device according to any one of claims 1 to 29 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 80 ° C. or higher. The semiconductor device according to claim 30 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 100 ° C. or lower. The semiconductor device according to claim 30 , wherein the interlayer insulating film of the rewiring layer has a 5% weight loss temperature of 150 ° C. or lower. The process of covering the semiconductor chip with a sealing material and
Including a step of forming a rewiring layer having a larger area than the semiconductor chip in a plan view and including an interlayer insulating film.
The encapsulant contains a cured epoxy resin and contains.
A method for manufacturing a semiconductor device, characterized in that the 5% weight loss temperature of the interlayer insulating film is 300 ° C. or lower. 33. The interlayer insulating film is formed by forming the interlayer insulating film with a photosensitive resin composition capable of forming at least one compound of polyimide, polybenzoxazole, and a polymer having a phenolic hydroxyl group. 33 . The method for manufacturing a semiconductor device according to the above. The interlayer insulating film forming step includes a step of forming the interlayer insulating film with the photosensitive resin composition adjusted with an additive so that the 5% weight loss temperature of the interlayer insulating film is 300 ° C. or lower. 34. The method for manufacturing a semiconductor device according to claim 34 .

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